TWI390086B - Non-cyanide electrolytic gold plating bath for bump formation - Google Patents

Non-cyanide electrolytic gold plating bath for bump formation Download PDF

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Publication number
TWI390086B
TWI390086B TW095134070A TW95134070A TWI390086B TW I390086 B TWI390086 B TW I390086B TW 095134070 A TW095134070 A TW 095134070A TW 95134070 A TW95134070 A TW 95134070A TW I390086 B TWI390086 B TW I390086B
Authority
TW
Taiwan
Prior art keywords
plating bath
gold plating
electrolytic gold
bump
gold
Prior art date
Application number
TW095134070A
Other languages
English (en)
Chinese (zh)
Other versions
TW200724729A (en
Inventor
Hiroshi Nakamura
Original Assignee
Metalor Technologies Japan Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Metalor Technologies Japan Corp filed Critical Metalor Technologies Japan Corp
Publication of TW200724729A publication Critical patent/TW200724729A/zh
Application granted granted Critical
Publication of TWI390086B publication Critical patent/TWI390086B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/48—Electroplating: Baths therefor from solutions of gold
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/11—Manufacturing methods

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrodes Of Semiconductors (AREA)
TW095134070A 2005-09-30 2006-09-14 Non-cyanide electrolytic gold plating bath for bump formation TWI390086B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005286147A JP4713289B2 (ja) 2005-09-30 2005-09-30 バンプ形成用非シアン系電解金めっき浴

Publications (2)

Publication Number Publication Date
TW200724729A TW200724729A (en) 2007-07-01
TWI390086B true TWI390086B (zh) 2013-03-21

Family

ID=37978198

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095134070A TWI390086B (zh) 2005-09-30 2006-09-14 Non-cyanide electrolytic gold plating bath for bump formation

Country Status (4)

Country Link
JP (1) JP4713289B2 (ja)
KR (1) KR101319745B1 (ja)
CN (1) CN1944716B (ja)
TW (1) TWI390086B (ja)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4925792B2 (ja) * 2006-11-07 2012-05-09 メタローテクノロジーズジャパン株式会社 バンプ形成用非シアン系電解金めっき浴
JP5336785B2 (ja) * 2007-08-07 2013-11-06 メタローテクノロジーズジャパン株式会社 バンプ形成用非シアン系電解金めっき浴及びバンプ形成方法
JP2009062584A (ja) * 2007-09-06 2009-03-26 Ne Chemcat Corp バンプ形成用非シアン系電解金めっき浴及びバンプ形成方法
JP5629065B2 (ja) * 2009-07-02 2014-11-19 メタローテクノロジーズジャパン株式会社 電極形成用金めっき浴及びそれを用いた電極形成方法
CN103290440B (zh) * 2012-02-22 2016-12-14 美泰乐科技(日本)股份有限公司 金凸点形成用非氰系电解镀金浴及金凸点形成方法
CN102543101A (zh) * 2012-03-16 2012-07-04 新乡医学院 一种硬盘磁头焊盘及其制备方法
KR20150020686A (ko) * 2012-10-04 2015-02-26 니혼 엘렉트로플레이팅 엔지니어스 가부시키가이샤 비시안계 전해 금도금액
CN105401181A (zh) * 2015-12-23 2016-03-16 苏州市金星工艺镀饰有限公司 一种环保无氰镀金电镀液的电镀方法
CN110699720A (zh) * 2019-10-30 2020-01-17 深圳市金百泰珠宝实业有限公司 黄金电铸液、黄金电铸液制备方法及电铸方法
CN113913879B (zh) * 2021-09-30 2022-08-09 深圳市联合蓝海黄金材料科技股份有限公司 无氰电镀金镀液及其应用和电镀制金凸块的方法以及金凸块和电子部件
KR102477921B1 (ko) 2021-11-11 2022-12-14 마츠다 산교 가부시끼가이샤 무시안 전해 금 도금액

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56108892A (en) * 1980-01-31 1981-08-28 Electroplating Eng Of Japan Co Plating solution with pure gold
JP2793864B2 (ja) * 1989-12-02 1998-09-03 エヌ・イーケムキヤツト株式会社 金めつき液およびめつき方法
JP2927142B2 (ja) * 1993-03-26 1999-07-28 上村工業株式会社 無電解金めっき浴及び無電解金めっき方法
JPH1150295A (ja) * 1997-07-28 1999-02-23 Daiwa Kasei Kenkyusho:Kk めっき浴
JP2003013278A (ja) * 2001-06-26 2003-01-15 Japan Pure Chemical Co Ltd 金めっき液
JP4129363B2 (ja) * 2002-03-15 2008-08-06 エヌ・イーケムキャット株式会社 電解金めっき液及び金めっき方法
JP3989795B2 (ja) * 2002-08-09 2007-10-10 エヌ・イーケムキャット株式会社 電解硬質金めっき液及びそれを用いためっき方法
CN100351433C (zh) * 2004-11-19 2007-11-28 大连理工大学 一种工业纯钛的镀金工艺

Also Published As

Publication number Publication date
JP2007092156A (ja) 2007-04-12
KR20070037312A (ko) 2007-04-04
TW200724729A (en) 2007-07-01
KR101319745B1 (ko) 2013-10-17
CN1944716A (zh) 2007-04-11
JP4713289B2 (ja) 2011-06-29
CN1944716B (zh) 2011-12-14

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