TWI385825B - 光電元件及其製造方法 - Google Patents
光電元件及其製造方法 Download PDFInfo
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- TWI385825B TWI385825B TW097116327A TW97116327A TWI385825B TW I385825 B TWI385825 B TW I385825B TW 097116327 A TW097116327 A TW 097116327A TW 97116327 A TW97116327 A TW 97116327A TW I385825 B TWI385825 B TW I385825B
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| DE102008030815A1 (de) | 2008-06-30 | 2009-12-31 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung einer Vielzahl von optoelektronischen Bauelementen |
| GB2464102A (en) * | 2008-10-01 | 2010-04-07 | Optovate Ltd | Illumination apparatus comprising multiple monolithic subarrays |
| JP5590837B2 (ja) * | 2009-09-15 | 2014-09-17 | キヤノン株式会社 | 機能性領域の移設方法 |
| JP5534763B2 (ja) * | 2009-09-25 | 2014-07-02 | 株式会社東芝 | 半導体発光装置の製造方法及び半導体発光装置 |
| DE102009048401A1 (de) * | 2009-10-06 | 2011-04-07 | Osram Opto Semiconductors Gmbh | Verfahren zum Herstellen eines optoelektronischen Halbleiterbauteils und optoelektronisches Halbleiterbauteil |
| KR101601622B1 (ko) * | 2009-10-13 | 2016-03-09 | 삼성전자주식회사 | 발광다이오드 소자, 발광 장치 및 발광다이오드 소자의 제조방법 |
| DE102010009015A1 (de) * | 2010-02-24 | 2011-08-25 | OSRAM Opto Semiconductors GmbH, 93055 | Verfahren zum Herstellen einer Mehrzahl von optoelektronischen Halbleiterchips |
| GB2484713A (en) | 2010-10-21 | 2012-04-25 | Optovate Ltd | Illumination apparatus |
| US8227271B1 (en) * | 2011-01-27 | 2012-07-24 | Himax Technologies Limited | Packaging method of wafer level chips |
| US8241932B1 (en) * | 2011-03-17 | 2012-08-14 | Tsmc Solid State Lighting Ltd. | Methods of fabricating light emitting diode packages |
| KR101766298B1 (ko) * | 2011-03-30 | 2017-08-08 | 삼성전자 주식회사 | 발광소자 및 그 제조방법 |
| US8907362B2 (en) | 2012-01-24 | 2014-12-09 | Cooledge Lighting Inc. | Light-emitting dies incorporating wavelength-conversion materials and related methods |
| US8896010B2 (en) | 2012-01-24 | 2014-11-25 | Cooledge Lighting Inc. | Wafer-level flip chip device packages and related methods |
| WO2013112435A1 (en) | 2012-01-24 | 2013-08-01 | Cooledge Lighting Inc. | Light - emitting devices having discrete phosphor chips and fabrication methods |
| US9269873B2 (en) * | 2012-03-13 | 2016-02-23 | Citizen Holdings Co., Ltd. | Semiconductor light emitting device and method for manufacturing same |
| US9847445B2 (en) * | 2012-04-05 | 2017-12-19 | Koninklijke Philips N.V. | LED thin-film device partial singulation prior to substrate thinning or removal |
| US20140048824A1 (en) * | 2012-08-15 | 2014-02-20 | Epistar Corporation | Light-emitting device |
| US9356070B2 (en) | 2012-08-15 | 2016-05-31 | Epistar Corporation | Light-emitting device |
| US20140151630A1 (en) * | 2012-12-04 | 2014-06-05 | Feng-Hsu Fan | Protection for the epitaxial structure of metal devices |
| DE102013103079A1 (de) * | 2013-03-26 | 2014-10-02 | Osram Opto Semiconductors Gmbh | Optoelektronischer Halbleiterchip und Verfahren zur Herstellung eines optoelektronischen Halbleiterchips |
| DE102013107531A1 (de) * | 2013-07-16 | 2015-01-22 | Osram Opto Semiconductors Gmbh | Optoelektronischer Halbleiterchip |
| DE102013111496A1 (de) * | 2013-10-18 | 2015-04-23 | Osram Opto Semiconductors Gmbh | Verfahren zum Herstellen von optoelektronischen Halbleiterbauelementen und optoelektronisches Halbleiterbauelement |
| DE102014100542A1 (de) * | 2014-01-20 | 2015-07-23 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung einer lateral strukturierten Schicht und optoelektronisches Halbleiterbauteil mit einer solchen Schicht |
| WO2015119858A1 (en) | 2014-02-05 | 2015-08-13 | Cooledge Lighting Inc. | Light-emitting dies incorporating wavelength-conversion materials and related methods |
| US20160020131A1 (en) * | 2014-07-20 | 2016-01-21 | X-Celeprint Limited | Apparatus and methods for micro-transfer-printing |
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Also Published As
| Publication number | Publication date |
|---|---|
| TW200905930A (en) | 2009-02-01 |
| DE102007043877A1 (de) | 2009-01-08 |
| EP2162927B1 (de) | 2018-10-24 |
| EP2162927A1 (de) | 2010-03-17 |
| CN101681964A (zh) | 2010-03-24 |
| JP5334966B2 (ja) | 2013-11-06 |
| KR101433423B1 (ko) | 2014-08-27 |
| JP2010532089A (ja) | 2010-09-30 |
| CN101681964B (zh) | 2013-05-08 |
| US20100171215A1 (en) | 2010-07-08 |
| WO2009003435A1 (de) | 2009-01-08 |
| KR20100045980A (ko) | 2010-05-04 |
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