JPS5617384A - Production of display device - Google Patents

Production of display device

Info

Publication number
JPS5617384A
JPS5617384A JP9168179A JP9168179A JPS5617384A JP S5617384 A JPS5617384 A JP S5617384A JP 9168179 A JP9168179 A JP 9168179A JP 9168179 A JP9168179 A JP 9168179A JP S5617384 A JPS5617384 A JP S5617384A
Authority
JP
Japan
Prior art keywords
production
display device
display
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9168179A
Other languages
Japanese (ja)
Inventor
Tetsuo Sadamasa
Osamu Ichikawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP9168179A priority Critical patent/JPS5617384A/en
Publication of JPS5617384A publication Critical patent/JPS5617384A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/83001—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector involving a temporary auxiliary member not forming part of the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Led Device Packages (AREA)
JP9168179A 1979-07-20 1979-07-20 Production of display device Pending JPS5617384A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9168179A JPS5617384A (en) 1979-07-20 1979-07-20 Production of display device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9168179A JPS5617384A (en) 1979-07-20 1979-07-20 Production of display device

Publications (1)

Publication Number Publication Date
JPS5617384A true JPS5617384A (en) 1981-02-19

Family

ID=14033228

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9168179A Pending JPS5617384A (en) 1979-07-20 1979-07-20 Production of display device

Country Status (1)

Country Link
JP (1) JPS5617384A (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02503775A (en) * 1988-03-15 1990-11-08 オセ　プリンテイング　システムズ　ゲゼルシヤフト　ミツト　ベシユレンクテル　ハフツング Assembly method for making light emitting diode rows
NL1029688C2 (en) * 2005-08-05 2007-02-06 Lemnis Lighting Ip Gmbh Reactive circuit for lighting device, lights-up space by loading several LEDs with full correction current
WO2009003435A1 (en) * 2007-06-29 2009-01-08 Osram Opto Semiconductors Gmbh Method for producing optoelectronic components, and optoelectronic component
GB2463954A (en) * 2008-10-01 2010-04-07 Optovate Ltd LED array fabrication
JP2011071273A (en) * 2009-09-25 2011-04-07 Toshiba Corp Method for manufacturing semiconductor light-emitting device and semiconductor light-emitting device
WO2015006000A1 (en) * 2013-07-08 2015-01-15 LuxVue Technology Corporation Micro light emitting diode device with post
JP2018508971A (en) * 2014-12-19 2018-03-29 グロ アーベーＧｌｏ Ａｂ Method for generating a light emitting diode array on a backplane
EP3328162A4 (en) * 2015-07-23 2019-05-01 Seoul Semiconductor Co., Ltd. Display device and method for manufacturing same
JP2019527471A (en) * 2016-06-29 2019-09-26 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ System and method for movement of microdevices

Cited By (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02503775A (en) * 1988-03-15 1990-11-08 オセ　プリンテイング　システムズ　ゲゼルシヤフト　ミツト　ベシユレンクテル　ハフツング Assembly method for making light emitting diode rows
NL1029688C2 (en) * 2005-08-05 2007-02-06 Lemnis Lighting Ip Gmbh Reactive circuit for lighting device, lights-up space by loading several LEDs with full correction current
WO2007052241A2 (en) * 2005-08-05 2007-05-10 Lemnis Lighting Ip Gmbh Method for preparing an electric comprising multiple leds
WO2007052241A3 (en) * 2005-08-05 2007-08-16 Lemnis Lighting Ip Gmbh Method for preparing an electric comprising multiple leds
TWI385825B (en) * 2007-06-29 2013-02-11 Osram Opto Semiconductors Gmbh Method for producing optoelectronic components, and optoelectronic component
WO2009003435A1 (en) * 2007-06-29 2009-01-08 Osram Opto Semiconductors Gmbh Method for producing optoelectronic components, and optoelectronic component
KR101433423B1 (en) * 2007-06-29 2014-08-27 오스람 옵토 세미컨덕터스 게엠베하 Method for producing optoelectronic components, and optoelectronic component
JP2010532089A (en) * 2007-06-29 2010-09-30 オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング Photoelectric component manufacturing method and photoelectric component
GB2463989A (en) * 2008-10-01 2010-04-07 Optovate Ltd LED array fabrication
GB2463989B (en) * 2008-10-01 2010-10-27 Optovate Ltd Illumination apparatus
US8985810B2 (en) 2008-10-01 2015-03-24 Optovate Limited Illumination apparatus
GB2463954A (en) * 2008-10-01 2010-04-07 Optovate Ltd LED array fabrication
JP2011071273A (en) * 2009-09-25 2011-04-07 Toshiba Corp Method for manufacturing semiconductor light-emitting device and semiconductor light-emitting device
US9035279B2 (en) 2013-07-08 2015-05-19 LuxVue Technology Corporation Micro device with stabilization post
US9209348B2 (en) 2013-07-08 2015-12-08 LuxVue Technology Corporation Micro device with stabilization post
US9379092B2 (en) 2013-07-08 2016-06-28 Apple Inc. Micro device with stabilization post
US9620695B2 (en) 2013-07-08 2017-04-11 Apple Inc. Micro device with stabilization post
WO2015006000A1 (en) * 2013-07-08 2015-01-15 LuxVue Technology Corporation Micro light emitting diode device with post
JP2020004978A (en) * 2014-12-19 2020-01-09 グロ アーベーＧｌｏ Ａｂ Method of forming light emission diode array on back plane
JP2018508971A (en) * 2014-12-19 2018-03-29 グロ アーベーＧｌｏ Ａｂ Method for generating a light emitting diode array on a backplane
US10833057B2 (en) 2015-07-23 2020-11-10 Seoul Semiconductor Co., Ltd. Display apparatus and manufacturing method thereof
EP3328162A4 (en) * 2015-07-23 2019-05-01 Seoul Semiconductor Co., Ltd. Display device and method for manufacturing same
US11417640B2 (en) 2015-07-23 2022-08-16 Seoul Semiconductor Co., Ltd. Display apparatus and manufacturing method thereof
US11817440B2 (en) 2015-07-23 2023-11-14 Seoul Semiconductor Co., Ltd. Display apparatus and manufacturing method thereof
JP2019527471A (en) * 2016-06-29 2019-09-26 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ System and method for movement of microdevices
US10692923B2 (en) 2016-06-29 2020-06-23 Applied Materials, Inc. Systems and methods for transfer of micro-devices
JP2021108372A (en) * 2016-06-29 2021-07-29 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ Systems and methods for transfer of micro-devices
US11251226B2 (en) 2016-06-29 2022-02-15 Applied Materials, Inc. Systems and methods for transfer of micro-devices
US11843025B2 (en) 2016-06-29 2023-12-12 Applied Materials, Inc. Methods for transfer of micro-devices

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