TWI353279B - Methods for processing holes by moving precisely t - Google Patents
Methods for processing holes by moving precisely t Download PDFInfo
- Publication number
- TWI353279B TWI353279B TW094126325A TW94126325A TWI353279B TW I353279 B TWI353279 B TW I353279B TW 094126325 A TW094126325 A TW 094126325A TW 94126325 A TW94126325 A TW 94126325A TW I353279 B TWI353279 B TW I353279B
- Authority
- TW
- Taiwan
- Prior art keywords
- target
- laser
- entry
- segment
- center
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims description 77
- 238000012545 processing Methods 0.000 title claims description 29
- 230000033001 locomotion Effects 0.000 claims description 53
- 230000001133 acceleration Effects 0.000 claims description 49
- 239000000463 material Substances 0.000 claims description 43
- 230000002093 peripheral effect Effects 0.000 claims description 10
- 239000000758 substrate Substances 0.000 claims description 5
- 239000000835 fiber Substances 0.000 claims description 3
- 239000002689 soil Substances 0.000 claims description 2
- 238000005530 etching Methods 0.000 claims 2
- 230000000644 propagated effect Effects 0.000 claims 2
- 229910000831 Steel Inorganic materials 0.000 claims 1
- 239000010959 steel Substances 0.000 claims 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 1
- 238000005553 drilling Methods 0.000 description 11
- 230000008859 change Effects 0.000 description 9
- 238000010586 diagram Methods 0.000 description 9
- 230000007704 transition Effects 0.000 description 8
- 239000000523 sample Substances 0.000 description 7
- 230000008569 process Effects 0.000 description 6
- 230000004807 localization Effects 0.000 description 5
- 238000003860 storage Methods 0.000 description 5
- 230000009471 action Effects 0.000 description 4
- 238000005520 cutting process Methods 0.000 description 4
- 238000013459 approach Methods 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- 238000010304 firing Methods 0.000 description 3
- 101100388126 Caenorhabditis elegans dpy-2 gene Proteins 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 230000001934 delay Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 230000000977 initiatory effect Effects 0.000 description 2
- 238000012544 monitoring process Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 230000001052 transient effect Effects 0.000 description 2
- 102100040428 Chitobiosyldiphosphodolichol beta-mannosyltransferase Human genes 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 206010012335 Dependence Diseases 0.000 description 1
- 240000001931 Ludwigia octovalvis Species 0.000 description 1
- 101150093954 Nrep gene Proteins 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 241000425571 Trepanes Species 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 244000145845 chattering Species 0.000 description 1
- 230000036461 convulsion Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 239000011532 electronic conductor Substances 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 210000000887 face Anatomy 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- VIKNJXKGJWUCNN-XGXHKTLJSA-N norethisterone Chemical compound O=C1CC[C@@H]2[C@H]3CC[C@](C)([C@](CC4)(O)C#C)[C@@H]4[C@@H]3CCC2=C1 VIKNJXKGJWUCNN-XGXHKTLJSA-N 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 230000037361 pathway Effects 0.000 description 1
- 230000010363 phase shift Effects 0.000 description 1
- 210000001747 pupil Anatomy 0.000 description 1
- 230000003252 repetitive effect Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000009987 spinning Methods 0.000 description 1
- 235000013547 stew Nutrition 0.000 description 1
- 230000001960 triggered effect Effects 0.000 description 1
- 238000009827 uniform distribution Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
- B23K26/389—Removing material by boring or cutting by boring of fluid openings, e.g. nozzles, jets
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laser Beam Processing (AREA)
- Sampling And Sample Adjustment (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/912,525 US7259354B2 (en) | 2004-08-04 | 2004-08-04 | Methods for processing holes by moving precisely timed laser pulses in circular and spiral trajectories |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200610605A TW200610605A (en) | 2006-04-01 |
| TWI353279B true TWI353279B (en) | 2011-12-01 |
Family
ID=35756401
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW094126325A TWI353279B (en) | 2004-08-04 | 2005-08-03 | Methods for processing holes by moving precisely t |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US7259354B2 (OSRAM) |
| JP (4) | JP2008509006A (OSRAM) |
| KR (1) | KR101242143B1 (OSRAM) |
| CN (1) | CN101035645B (OSRAM) |
| DE (1) | DE112005001893T5 (OSRAM) |
| GB (1) | GB2431371A (OSRAM) |
| TW (1) | TWI353279B (OSRAM) |
| WO (1) | WO2006017583A2 (OSRAM) |
Families Citing this family (74)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080287935A1 (en) * | 2002-11-13 | 2008-11-20 | Josef Bille | System and method for photoablation using multiple focal points using cyclical phase modulation |
| US7259354B2 (en) * | 2004-08-04 | 2007-08-21 | Electro Scientific Industries, Inc. | Methods for processing holes by moving precisely timed laser pulses in circular and spiral trajectories |
| JP2007268576A (ja) * | 2006-03-31 | 2007-10-18 | Hitachi Via Mechanics Ltd | レーザ加工方法 |
| JP4917361B2 (ja) * | 2006-06-13 | 2012-04-18 | 株式会社ディスコ | ビアホールの加工方法 |
| JP4787091B2 (ja) * | 2006-06-27 | 2011-10-05 | 株式会社ディスコ | ビアホールの加工方法 |
| JP2008126252A (ja) * | 2006-11-17 | 2008-06-05 | Disco Abrasive Syst Ltd | レーザー加工装置 |
| ITPD20070201A1 (it) * | 2007-06-08 | 2008-12-09 | Helios Technology Societa A Re | Macchina per la rimozione di superfici di semiconduttori, ed in particolare di superfici con circuiti integrati |
| US20090118716A1 (en) * | 2007-11-07 | 2009-05-07 | Intralase, Inc. | System and method for scanning a pulsed laser beam |
| US8142423B2 (en) * | 2007-11-07 | 2012-03-27 | Amo Development, Llc. | System and method for incising material |
| US8231612B2 (en) * | 2007-11-19 | 2012-07-31 | Amo Development Llc. | Method of making sub-surface photoalterations in a material |
| US9101446B2 (en) * | 2008-01-02 | 2015-08-11 | Intralase Corp. | System and method for scanning a pulsed laser beam |
| US9108270B2 (en) * | 2008-01-02 | 2015-08-18 | Amo Development, Llc | System and method for scanning a pulsed laser beam |
| DE102008011425A1 (de) * | 2008-02-27 | 2009-09-03 | Mtu Aero Engines Gmbh | Optimiertes Bearbeiten einer Kontur mittels gepulstem Werkzueg |
| US8173038B2 (en) * | 2008-04-18 | 2012-05-08 | Corning Incorporated | Methods and systems for forming microstructures in glass substrates |
| US20090312859A1 (en) * | 2008-06-16 | 2009-12-17 | Electro Scientific Industries, Inc. | Modifying entry angles associated with circular tooling actions to improve throughput in part machining |
| US8230664B2 (en) * | 2008-07-28 | 2012-07-31 | Sonoco Development, Inc. | Pouch opening feature and method for making the same |
| US20110150371A1 (en) * | 2008-07-28 | 2011-06-23 | Sonoco Development, Inc. | Flexible Pouch With Easy-Opening Features |
| US8525074B2 (en) * | 2008-12-26 | 2013-09-03 | Denso Corporation | Machining method and machining system for micromachining a part in a machine component |
| JP2011045906A (ja) * | 2009-08-26 | 2011-03-10 | Denso Corp | 機構部品における微細加工部の加工方法および加工装置 |
| JP4595018B2 (ja) * | 2009-02-23 | 2010-12-08 | 株式会社新川 | 半導体装置の製造方法およびボンディング装置 |
| US8736026B2 (en) | 2009-02-27 | 2014-05-27 | Picodrill Sa | Method of generating a hole or recess or well in a substrate |
| US20100252959A1 (en) * | 2009-03-27 | 2010-10-07 | Electro Scientific Industries, Inc. | Method for improved brittle materials processing |
| DE102009044316B4 (de) | 2009-10-22 | 2015-04-30 | Ewag Ag | Verfahren zur Herstellung einer Fläche und/oder einer Kante an einem Rohling sowie Laserbearbeitungsvorrichtung zur Durchführung des Verfahrens |
| JP2011110598A (ja) * | 2009-11-30 | 2011-06-09 | Panasonic Corp | レーザ加工方法およびレーザ加工装置 |
| DE102010011508B4 (de) | 2010-03-15 | 2015-12-10 | Ewag Ag | Verfahren zur Herstellung zumindest einer Spannut und zumindest einer Schneidkante und Laserbearbeitungsvorrichtung |
| JP5975026B2 (ja) | 2011-06-03 | 2016-08-23 | 住友電気工業株式会社 | 光源装置および加工方法 |
| US9289858B2 (en) * | 2011-12-20 | 2016-03-22 | Electro Scientific Industries, Inc. | Drilling holes with minimal taper in cured silicone |
| US9931712B2 (en) | 2012-01-11 | 2018-04-03 | Pim Snow Leopard Inc. | Laser drilling and trepanning device |
| JP2013146780A (ja) * | 2012-01-23 | 2013-08-01 | Mitsuboshi Diamond Industrial Co Ltd | 脆性材料基板のレーザ加工方法 |
| US8716625B2 (en) * | 2012-02-03 | 2014-05-06 | Trumpf Werkzeugmaschinen Gmbh + Co. Kg | Workpiece cutting |
| EP2812149A1 (en) * | 2012-02-10 | 2014-12-17 | Asahi Glass Company, Limited | A device for drilling a substrate using a plurality of dc voltage output; method of drilling a substrate using such device |
| JP2013248624A (ja) * | 2012-05-30 | 2013-12-12 | Disco Corp | レーザー加工装置 |
| DE102012111771B4 (de) * | 2012-12-04 | 2020-12-03 | Ewag Ag | Verfahren zur Bearbeitung eines Werkstücks unter Verwendung einer Laserbearbeitungsvorrichtung zur Herstellung eines Schneidwerkzeugs |
| WO2014110276A1 (en) | 2013-01-11 | 2014-07-17 | Electro Scientific Industries, Inc. | Laser pulse energy control systems and methods |
| EP2754524B1 (de) | 2013-01-15 | 2015-11-25 | Corning Laser Technologies GmbH | Verfahren und Vorrichtung zum laserbasierten Bearbeiten von flächigen Substraten, d.h. Wafer oder Glaselement, unter Verwendung einer Laserstrahlbrennlinie |
| KR102245810B1 (ko) | 2013-03-15 | 2021-04-30 | 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 | Aod 라우트 프로세싱을 위한 레이저 시스템들 및 방법들 |
| KR102245812B1 (ko) * | 2013-03-15 | 2021-04-30 | 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 | Aod 이동 저감을 위한 aod 툴 정착을 위한 레이저 시스템 및 방법 |
| EP2781296B1 (de) * | 2013-03-21 | 2020-10-21 | Corning Laser Technologies GmbH | Vorrichtung und verfahren zum ausschneiden von konturen aus flächigen substraten mittels laser |
| JP5574008B2 (ja) * | 2013-04-26 | 2014-08-20 | 株式会社デンソー | 機構部品における微細加工部の加工方法および加工装置 |
| US10335887B2 (en) * | 2013-11-14 | 2019-07-02 | Lincoln Global, Inc. | Methods and systems for plasma cutting holes and contours in workpieces |
| US11556039B2 (en) | 2013-12-17 | 2023-01-17 | Corning Incorporated | Electrochromic coated glass articles and methods for laser processing the same |
| US10293436B2 (en) | 2013-12-17 | 2019-05-21 | Corning Incorporated | Method for rapid laser drilling of holes in glass and products made therefrom |
| KR102445217B1 (ko) | 2014-07-08 | 2022-09-20 | 코닝 인코포레이티드 | 재료를 레이저 가공하는 방법 및 장치 |
| LT3169477T (lt) | 2014-07-14 | 2020-05-25 | Corning Incorporated | Skaidrių medžiagų apdorojimo sistema ir būdas, naudojant lazerio pluošto židinio linijas, kurių ilgis ir skersmuo yra reguliuojami |
| WO2016138367A1 (en) | 2015-02-27 | 2016-09-01 | Electro Scientific Industries, Inc. | Fast beam manipulation for cross-axis micromachining |
| WO2016154284A1 (en) | 2015-03-24 | 2016-09-29 | Corning Incorporated | Laser cutting and processing of display glass compositions |
| CN104722932B (zh) * | 2015-03-28 | 2016-09-14 | 大族激光科技产业集团股份有限公司 | 一种非晶硅太阳电池玻璃基底的激光钻孔方法 |
| KR102781391B1 (ko) | 2015-09-09 | 2025-03-17 | 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 | 작업물들을 레이저 가공하기 위한 레이저 가공 장치, 방법들 및 관련된 배열들 |
| JP6671145B2 (ja) * | 2015-10-30 | 2020-03-25 | 株式会社レーザーシステム | 加工樹脂基板の製造方法およびレーザー加工装置 |
| JP6552948B2 (ja) * | 2015-11-27 | 2019-07-31 | 株式会社ディスコ | ウエーハの加工方法、及び加工装置 |
| WO2018064409A1 (en) | 2016-09-30 | 2018-04-05 | Corning Incorporated | Apparatuses and methods for laser processing transparent workpieces using non-axisymmetric beam spots |
| LT3529214T (lt) | 2016-10-24 | 2021-02-25 | Corning Incorporated | Substrato apdorojimo stotis lakšto formos stiklo substratų lazeriniam mašininiam apdorojimui |
| US11260472B2 (en) | 2016-12-30 | 2022-03-01 | Electro Scientific Industries, Inc. | Method and system for extending optics lifetime in laser processing apparatus |
| JP2018134678A (ja) * | 2017-02-23 | 2018-08-30 | ローランドディー．ジー．株式会社 | 加工方法 |
| CN110785257B (zh) * | 2017-06-29 | 2021-08-27 | 松下知识产权经营株式会社 | 激光加工系统以及激光加工系统的控制方法 |
| CN107520545B (zh) * | 2017-09-01 | 2019-06-21 | 大族激光科技产业集团股份有限公司 | 激光钻孔方法 |
| CN112074370B (zh) | 2018-06-05 | 2023-03-14 | 伊雷克托科学工业股份有限公司 | 激光加工设备、其操作方法以及使用其加工工件的方法 |
| DE112018008110T5 (de) * | 2018-12-03 | 2021-08-19 | Mitsubishi Electric Corporation | Laserbearbeitungsverfahren und Laserbearbeitungsvorrichtung |
| TWI892641B (zh) | 2019-01-31 | 2025-08-01 | 美商伊雷克托科學工業股份有限公司 | 光學系統 |
| JP7325194B2 (ja) * | 2019-02-19 | 2023-08-14 | 三菱重工業株式会社 | 溶接物製造方法、溶接物製造システム及び溶接物 |
| US20220168847A1 (en) | 2019-06-10 | 2022-06-02 | Electro Scientific Industries, Inc. | Laser processing apparatus, methods of operating the same, and methods of processing workpieces using the same |
| CN111151898A (zh) * | 2020-01-07 | 2020-05-15 | 深圳市吉祥云科技有限公司 | 一种呈螺旋方向上升且振幅盘绕的打孔方法及打孔系统 |
| KR102864252B1 (ko) * | 2020-03-04 | 2025-09-26 | 삼성디스플레이 주식회사 | 전자 장치 제조 방법 |
| CN111370220A (zh) * | 2020-03-11 | 2020-07-03 | 大族激光科技产业集团股份有限公司 | 一种充电线圈加工方法及无线充电装置 |
| CN111901971B (zh) * | 2020-08-01 | 2021-11-16 | 生益电子股份有限公司 | 一种电路板及其制造方法 |
| CN116761655A (zh) | 2020-08-26 | 2023-09-15 | 阿尔法能源技术公司 | 用于中子束生成的目标表面上的离子束路径 |
| EP4046741B1 (fr) | 2021-02-23 | 2023-11-01 | DM Surfaces SA | Procede d'usinage laser d'un composant horloger |
| CN113727526B (zh) * | 2021-08-31 | 2023-05-26 | 深圳市大族数控科技股份有限公司 | 线路板保护层开窗方法 |
| CN114131222B (zh) * | 2021-12-27 | 2024-12-20 | 浙江华工光润智能装备技术有限公司 | 一种玻璃异形孔加工方法 |
| WO2023167873A1 (en) | 2022-03-02 | 2023-09-07 | Tae Technologies, Inc. | Ion beam exclusion paths on the target surface to optimize neutron beam performance |
| CN114682932B (zh) * | 2022-04-14 | 2024-02-09 | 强一半导体(苏州)股份有限公司 | 一种适用于生瓷片的激光加工通孔的方法 |
| CN115502585B (zh) * | 2022-09-02 | 2023-05-09 | 广州添利电子科技有限公司 | 一种大孔径镭射孔的加工方法 |
| CN116393835A (zh) * | 2023-03-02 | 2023-07-07 | 深圳市吉祥云科技有限公司 | 碳纤维增强复合材料激光切割方法、系统、设备及介质 |
| CN119901315B (zh) * | 2025-01-14 | 2025-11-07 | 华能信息技术有限公司 | 防止车辆上车载定位设备被拆除的监控方法、装置和设备 |
Family Cites Families (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS564391A (en) * | 1979-06-21 | 1981-01-17 | Toshiba Corp | Laser working method |
| JPH02169194A (ja) * | 1988-12-23 | 1990-06-29 | Shin Meiwa Ind Co Ltd | 穴あけ切断方法 |
| JP3162255B2 (ja) * | 1994-02-24 | 2001-04-25 | 三菱電機株式会社 | レーザ加工方法及びその装置 |
| US5856649A (en) * | 1994-02-25 | 1999-01-05 | Fanuc Ltd. | Laser beam machine |
| JP3372339B2 (ja) * | 1994-02-25 | 2003-02-04 | ファナック株式会社 | レーザ加工装置 |
| JPH0810972A (ja) * | 1994-06-27 | 1996-01-16 | Hitachi Constr Mach Co Ltd | パルスレーザ加工装置 |
| US5841099A (en) * | 1994-07-18 | 1998-11-24 | Electro Scientific Industries, Inc. | Method employing UV laser pulses of varied energy density to form depthwise self-limiting blind vias in multilayered targets |
| JP3515838B2 (ja) * | 1995-10-02 | 2004-04-05 | ファナック株式会社 | レーザ加工装置、レーザ加工方法、及びプログラム作成装置 |
| JPH1080783A (ja) * | 1996-09-06 | 1998-03-31 | Amada Co Ltd | 熱切断機における丸穴切断方法およびその装置 |
| US5841102A (en) * | 1996-11-08 | 1998-11-24 | W. L. Gore & Associates, Inc. | Multiple pulse space processing to enhance via entrance formation at 355 nm |
| KR20020021100A (ko) * | 1999-05-24 | 2002-03-18 | 야마사키 노리쓰카 | 배선판용 수지 필름의 레이저 가공방법 및 배선판의제조방법 |
| JP2001244604A (ja) * | 2000-02-28 | 2001-09-07 | Mitsubishi Gas Chem Co Inc | 炭酸ガスレーザーによる孔あけ方法 |
| JP2001332867A (ja) * | 2000-05-24 | 2001-11-30 | Hitachi Chem Co Ltd | プリント配線板の製造法およびその方法によって製造したプリント配線板 |
| TW503143B (en) * | 2000-10-06 | 2002-09-21 | Hitachi Via Mechanics Ltd | Method and apparatus for drilling printed wiring boards |
| JP5028722B2 (ja) * | 2001-07-31 | 2012-09-19 | 三菱電機株式会社 | レーザ加工方法及びレーザ加工機 |
| US6897405B2 (en) * | 2001-11-30 | 2005-05-24 | Matsushita Electric Industrial Co., Ltd. | Method of laser milling using constant tool path algorithm |
| CN1295052C (zh) * | 2001-11-30 | 2007-01-17 | 松下电器产业株式会社 | 激光铣削方法及系统 |
| US6706998B2 (en) * | 2002-01-11 | 2004-03-16 | Electro Scientific Industries, Inc. | Simulated laser spot enlargement |
| DE10207288B4 (de) * | 2002-02-21 | 2005-05-04 | Newson Engineering Nv | Verfahren zum Bohren von Löchern mittels eines Laserstrahls in einem Substrat, insbesondere in einem elektrischen Schaltungsubstrat |
| US20040112881A1 (en) * | 2002-04-11 | 2004-06-17 | Bloemeke Stephen Roger | Circle laser trepanning |
| US6749285B2 (en) * | 2002-07-25 | 2004-06-15 | Matsushita Electric Industrial Co., Ltd. | Method of milling repeatable exit holes in ink-jet nozzles |
| JP3720034B2 (ja) * | 2003-05-26 | 2005-11-24 | 住友重機械工業株式会社 | 穴あけ加工方法 |
| US7259354B2 (en) * | 2004-08-04 | 2007-08-21 | Electro Scientific Industries, Inc. | Methods for processing holes by moving precisely timed laser pulses in circular and spiral trajectories |
-
2004
- 2004-08-04 US US10/912,525 patent/US7259354B2/en not_active Expired - Lifetime
-
2005
- 2005-08-01 JP JP2007524948A patent/JP2008509006A/ja active Pending
- 2005-08-01 WO PCT/US2005/027584 patent/WO2006017583A2/en not_active Ceased
- 2005-08-01 KR KR1020077002761A patent/KR101242143B1/ko not_active Expired - Fee Related
- 2005-08-01 CN CN2005800304241A patent/CN101035645B/zh not_active Expired - Fee Related
- 2005-08-01 DE DE112005001893T patent/DE112005001893T5/de not_active Withdrawn
- 2005-08-03 TW TW094126325A patent/TWI353279B/zh not_active IP Right Cessation
-
2007
- 2007-01-31 GB GB0701804A patent/GB2431371A/en not_active Withdrawn
-
2011
- 2011-12-20 JP JP2011277880A patent/JP5581303B2/ja not_active Expired - Fee Related
-
2012
- 2012-11-09 JP JP2012247224A patent/JP6014465B2/ja not_active Expired - Fee Related
-
2016
- 2016-04-07 JP JP2016077636A patent/JP2016153142A/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| JP5581303B2 (ja) | 2014-08-27 |
| JP2012066308A (ja) | 2012-04-05 |
| WO2006017583A3 (en) | 2006-03-30 |
| CN101035645A (zh) | 2007-09-12 |
| DE112005001893T5 (de) | 2007-09-06 |
| GB2431371A (en) | 2007-04-25 |
| US7259354B2 (en) | 2007-08-21 |
| JP2016153142A (ja) | 2016-08-25 |
| CN101035645B (zh) | 2010-12-15 |
| TW200610605A (en) | 2006-04-01 |
| JP2013091102A (ja) | 2013-05-16 |
| US20060027544A1 (en) | 2006-02-09 |
| JP2008509006A (ja) | 2008-03-27 |
| WO2006017583A2 (en) | 2006-02-16 |
| JP6014465B2 (ja) | 2016-10-25 |
| KR20070039582A (ko) | 2007-04-12 |
| KR101242143B1 (ko) | 2013-03-12 |
| GB0701804D0 (en) | 2007-03-14 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101035645B (zh) | 通过以圆形和螺旋形轨迹精确移动定时激光脉冲来加工孔的方法 | |
| JP2013091102A5 (OSRAM) | ||
| JP2587129B2 (ja) | 機械加工装置 | |
| US7521649B2 (en) | Laser processing apparatus and laser processing method | |
| EP2828028B1 (en) | Method and apparatus for forming fine scale structures in dielectric substrate | |
| TW458834B (en) | Laser drilling method and device thereof | |
| EP1166948B1 (en) | Laser processing apparatus and method | |
| JP2004066327A5 (OSRAM) | ||
| CN100342760C (zh) | 激光钻孔,尤其是采用孔板的激光钻孔方法 | |
| US20100252959A1 (en) | Method for improved brittle materials processing | |
| TW200950918A (en) | Method and apparatus for laser drilling holes with gaussian pulses | |
| JP6773822B2 (ja) | Ａｏｄラウト加工用レーザシステム及び方法 | |
| JPH02182390A (ja) | レーザーを用いた孔加工方法 | |
| CN107150168A (zh) | 激光处理设备和经由激光工具操作而处理工件的方法 | |
| TW201043373A (en) | Improved method and apparatus for laser machining | |
| US6696665B2 (en) | Method for introducing plated-through holes into an electrically insulating base material having a metal layer on each side | |
| CN100448594C (zh) | 利用激光加工电路基片的方法 | |
| TW200305473A (en) | Laser processing system and laser processing method | |
| JP2007038287A (ja) | レーザ加工方法及びレーザ加工装置 | |
| JP2002035976A (ja) | 紫外レーザを用いた孔開け方法 | |
| Corbett et al. | Laser direct exposure of photodefinable polymer masks using shaped-beam optics | |
| JP2003211278A (ja) | レーザ加工装置 | |
| TW201026417A (en) | Method for laser drilling of holes in a substrate with varying simultaneity | |
| JP3137074B2 (ja) | レーザ加工装置 | |
| JPS6082285A (ja) | ビーム加工方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |