TWI349309B - Formation of high quality dielectric films of silicon dioxide for sti: usage of different siloxane-based precursors for harp ii-remote plasma enhanced deposition processes - Google Patents
Formation of high quality dielectric films of silicon dioxide for sti: usage of different siloxane-based precursors for harp ii-remote plasma enhanced deposition processesInfo
- Publication number
- TWI349309B TWI349309B TW096138739A TW96138739A TWI349309B TW I349309 B TWI349309 B TW I349309B TW 096138739 A TW096138739 A TW 096138739A TW 96138739 A TW96138739 A TW 96138739A TW I349309 B TWI349309 B TW I349309B
- Authority
- TW
- Taiwan
- Prior art keywords
- harp
- sti
- usage
- formation
- silicon dioxide
- Prior art date
Links
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 title 2
- 230000015572 biosynthetic process Effects 0.000 title 1
- 238000005137 deposition process Methods 0.000 title 1
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 title 1
- 239000002243 precursor Substances 0.000 title 1
- 235000012239 silicon dioxide Nutrition 0.000 title 1
- 239000000377 silicon dioxide Substances 0.000 title 1
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- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
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- H01L21/02211—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition the precursor containing a compound comprising Si the compound being a silane, e.g. disilane, methylsilane or chlorosilane
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
- H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
- H01L21/02263—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase
- H01L21/02271—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition
- H01L21/0228—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition deposition by cyclic CVD, e.g. ALD, ALE, pulsed CVD
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/931—Silicon carbide semiconductor
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US11/549,930 US7498273B2 (en) | 2006-05-30 | 2006-10-16 | Formation of high quality dielectric films of silicon dioxide for STI: usage of different siloxane-based precursors for harp II—remote plasma enhanced deposition processes |
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EP2503022A1 (en) | 2012-09-26 |
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KR20130114269A (ko) | 2013-10-16 |
CN101528974A (zh) | 2009-09-09 |
KR20090081396A (ko) | 2009-07-28 |
US7498273B2 (en) | 2009-03-03 |
TW200828437A (en) | 2008-07-01 |
JP5444406B2 (ja) | 2014-03-19 |
EP2082078A2 (en) | 2009-07-29 |
CN101528974B (zh) | 2013-07-17 |
JP2010507259A (ja) | 2010-03-04 |
KR101329285B1 (ko) | 2013-11-14 |
US20070281495A1 (en) | 2007-12-06 |
WO2008048862A3 (en) | 2008-10-09 |
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