JP2009539268A - シリコン含有前駆物質と原子酸素を用いた高品質流動状二酸化シリコンの化学気相堆積 - Google Patents
シリコン含有前駆物質と原子酸素を用いた高品質流動状二酸化シリコンの化学気相堆積 Download PDFInfo
- Publication number
- JP2009539268A JP2009539268A JP2009513437A JP2009513437A JP2009539268A JP 2009539268 A JP2009539268 A JP 2009539268A JP 2009513437 A JP2009513437 A JP 2009513437A JP 2009513437 A JP2009513437 A JP 2009513437A JP 2009539268 A JP2009539268 A JP 2009539268A
- Authority
- JP
- Japan
- Prior art keywords
- precursor
- annealing
- silicon
- chamber
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/40—Oxides
- C23C16/401—Oxides containing silicon
- C23C16/402—Silicon dioxide
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/448—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials
- C23C16/452—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials by activating reactive gas streams before their introduction into the reaction chamber, e.g. by ionisation or addition of reactive species
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/56—After-treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02123—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon
- H01L21/02126—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material containing Si, O, and at least one of H, N, C, F, or other non-metal elements, e.g. SiOC, SiOC:H or SiONC
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02123—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon
- H01L21/02164—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material being a silicon oxide, e.g. SiO2
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02205—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition
- H01L21/02208—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition the precursor containing a compound comprising Si
- H01L21/02214—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition the precursor containing a compound comprising Si the compound comprising silicon and oxygen
- H01L21/02216—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition the precursor containing a compound comprising Si the compound comprising silicon and oxygen the compound being a molecule comprising at least one silicon-oxygen bond and the compound having hydrogen or an organic group attached to the silicon or oxygen, e.g. a siloxane
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
- H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
- H01L21/02263—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase
- H01L21/02271—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition
- H01L21/02274—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition in the presence of a plasma [PECVD]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02296—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer
- H01L21/02299—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer pre-treatment
- H01L21/02312—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer pre-treatment treatment by exposure to a gas or vapour
- H01L21/02315—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer pre-treatment treatment by exposure to a gas or vapour treatment by exposure to a plasma
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02296—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer
- H01L21/02318—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer post-treatment
- H01L21/02337—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer post-treatment treatment by exposure to a gas or vapour
Abstract
【選択図】 図1
Description
[0026]図1は、発明の実施形態に従って基板上に酸化物層を形成する方法100におけるステップを含むフローチャートを示す図である。方法100には、堆積チャンバ102に基板を準備するステップが含まれる。基板は、半導体ウエハ(例えば、約300mm以下の直径を持つシリコンウエハ;100mm、150mm、200mm、300mm、400mmの直径を持つシリコンウエハ等)であり、以前のプロセスで形成された、構造、デバイス要素等が含まれ得る。例えば、基板には、高さと幅の高アスペクト比(例えば、5:1以上、6:1以上、7:1以上、8:1以上、9:1以上、10:1以上、11:1以上、12:1以上等のアスペクト比)を持つギャップ、トレンチ等が含まれ得る。
[0048]本発明の実施形態を実施することができる堆積システムは、他の種類のシステムの中でも、高密度プラズマ化学気相堆積(HDP-CVD)システム、プラズマ増強型化学気相堆積(PECVD)システム、大気圧未満化学気相堆積(SACVD)システム、熱化学気相堆積システムが含まれ得る。本発明の実施形態を実施することができるCVDシステムの具体例としては、カリフォルニア州サンタクララのアプライドマテリアルズから入手できるCENTURAULTIMATMHDP-CVDチャンバ/システム、PRODUCERTMPECVDチャンバ/システムが含まれる。
Claims (31)
- 基板上に酸化シリコン層を堆積させる方法であって、
堆積チャンバに基板を準備するステップと、
該堆積チャンバの外部で原子酸素前駆物質を生成させ、且つ該原子酸素前駆物質を該チャンバへ導入するステップと、
該堆積チャンバにシリコン前駆物質を導入するステップであって、該シリコン前駆物質と該原子酸素前駆物質を最初に該チャンバ内で混合する前記ステップと、
該シリコン前駆物質と該原子酸素前駆物質を反応させて、該基板上に該酸化シリコン層を形成するステップと、
堆積した該酸化シリコン層をアニールするステップと、
を含む前記方法。 - 該基板が約300mm以下の直径を有するシリコンウエハを備えている、請求項1記載の方法。
- 複数の構造が該基板の表面上に形成され、ここで、該構造には高さと幅のアスペクト比が7:1以上のギャップとトレンチが含まれる、請求項1記載の方法。
- 該原子酸素前駆物質が、
アルゴンを含むガス混合物からプラズマを形成するステップと、
該プラズマに酸素前駆物質を導入するステップであって、該酸素前駆物質が解離して該原子酸素を形成する前記ステップと、
によって形成される、請求項1記載の方法。 - 該酸素前駆物質が、分子酸素、オゾン、水蒸気(H2O)、及び二酸化窒素からなる群より選ばれる、請求項4記載の方法。
- 該原子酸素前駆物質が、
酸素前駆物質を光解離チャンバへ導入するステップと、
該酸素前駆物質を紫外光にさらすステップであって、該紫外光が該酸素前駆物質を解離して原子酸素を形成する前記ステップと、
によって形成される、請求項1記載の方法。 - 該酸素前駆物質が、分子酸素、オゾン、及び二酸化窒素からなる群より選ばれる、請求項6記載の方法。
- 該シリコン前駆物質が、シラン、ジメチルシラン、トリメチルシラン、テトラメチルシラン、ジエチルシラン、テトラメチルオルトシリケート(TMOS)、テトラエチルオルトシリケート(TEOS)、オクタメチルトリシロキサン(OMTS)、オクタメチルシクロテトラシロキサン(OMCTS)、テトラメチルジメチルジメトキシジシラン、テトラメチルシクロテトラシロキサン(TOMCATS)、DMDMOS、DEMS、メチルトリエトキシシラン(MTES)、フェニルジメチルシラン、及びフェニルシランからなる群より選ばれる、請求項1記載の方法。
- 該シリコン前駆物質が、ヘリウムを含むキャリヤガスと混合される、請求項1記載の方法。
- 該堆積チャンバが基板を支持するウエハペデスタルを備え、ここで、該酸化シリコン層が形成されるにつれて該基板が該ウエハペデスタルによって約0℃〜約150℃に調整される、請求項1記載の方法。
- 該酸化シリコン層が形成されるにつれて該堆積チャンバが約0.1トール〜約10トールの圧力を有する、請求項1記載の方法。
- 該酸化シリコン層が約250オングストローム/分〜約2μm/分の速度で形成される、請求項1記載の方法。
- 堆積された該酸化シリコンアニールステップが、熱アニール、スチ−ムアニール、プラズマアニール、紫外光アニール、eビームアニール、又はマイクロ波アニールを含む、請求項1記載の方法。
- 堆積された該酸化シリコン層の該アニールが、
スチ−ムの存在下に第一アニール温度で該基板を加熱するステップと、
乾燥窒素中第二アニール温度で該基板を加熱するステップと、
を含む、請求項1記載の方法。 - 該第一アニール温度が約950℃までであり、該第二アニール温度が約900℃である、請求項14記載の方法。
- 該方法が、該原子酸素前駆物質又はシリコン前駆物質を該堆積チャンバに導入する前に該基板を前処理プラズマにさらすステップを含む、請求項1記載の方法。
- 該前処理プラズマが、アルゴン、ヘリウム、水素(H2)、キセノン、又はアンモニアを含む高密度プラズマである、請求項16記載の方法。
- 該堆積チャンバが高密度プラズマ化学気相堆積(HDPCVD)システムの一部である、請求項1記載の方法。
- 基板上に酸化シリコン層を形成する方法であって、
反応チャンバにシリコンウエハ基板を準備するステップと、
高密度アルゴンプラズマにおける分子酸素の解離から原子酸素前駆物質を生成させるステップであって、該反応チャンバの外部のリモートプラズマ生成チャンバ内で該原子酸素前駆物質が生成される前記ステップと、
該原子酸素前駆物質とシリコン前駆物質とを反応チャンバ内で混合するステップであって、該原子酸素前駆物質と該シリコン前駆物質が該反応チャンバに達する前には混合されない前記ステップと、
該基板上に該酸化シリコンを堆積させるステップであって、該酸化シリコン層が該原子酸素と該シリコン前駆物質との反応からの反応生成物を含む、前記ステップと、
を含む、前記方法。 - 該方法が、更に、堆積された該酸化シリコン層をアニールするステップを含む、請求項19記載の方法。
- 堆積された該酸化シリコンアニールステップが、熱アニール、スチ−ムアニール、プラズマアニール、紫外光アニール、eビームアニール、又はマイクロ波アニールを含む、請求項20記載の方法。
- 該シリコン前駆物質が、シラン、ジメチルシラン、トリメチルシラン、テトラメチルシラン、ジエチルシラン、テトラメチルオルトシリケート(TMOS)、テトラエチルオルトシリケート(TEOS)、フェニルジメチルシラン、及びフェニルシランからなる群より選ばれる、請求項19記載の方法。
- 基板上に酸化シリコン層を堆積させるシステムであって、
該基板が保持される堆積チャンバと、
該堆積チャンバに結合されたリモートプラズマ生成システムであって、該プラズマ生成システムが原子酸素前駆物質を生成させるために用いられる前記リモートプラズマ生成システムと、
該堆積チャンバにシリコン前駆物質を供給するために用いられるシリコン前駆物質源と、
該原子酸素前駆物質と該シリコン前駆物質のフローを該堆積チャンバへ送るために用いられる前駆物質処理システムであって、該前駆物質処理システムが、該原子酸素とシリコン前駆物質が該堆積チャンバに入る前に混合することを防止する、前記前駆物質処理システムと、
を備えている前記システム。 - 該リモートプラズマ生成システムが、高密度プラズマ生成システムである、請求項23記載のシステム。
- 該システムが、該リモートプラズマ生成システムに結合されたアルゴンガス源と分子酸素ガス源を備えている、請求項24記載のシステム。
- キャリヤガス源からのキャリヤガスが、該堆積チャンバに入る前に該シリコン前駆物質と混合される、請求項23記載のシステム。
- 該前駆物質処理システムが、該堆積チャンバ内に形成された第一注入口と第二注入口を備え、ここで、該第一注入口と第二注入口が互いに直交方向に位置し、該原子酸素前駆物質が該第一注入口を通って該チャンバに入り、該シリコン前駆物質が該第二注入口を通って該チャンバに入る、請求項23記載のシステム。
- 該システムが、該酸化シリコン層をアニールするアニールシステムを備えている、請求項23記載のシステム。
- 該アニールシステムが、熱アニールシステム、スチ−ムアニールシステム、プラズマアニールシステム、紫外光アニールシステム、eビームアニールシステム、又はマイクロ波アニールシステムを備えている、請求項28記載のシステム。
- 該酸化シリコン層が、該堆積チャンバ内でアニールされる、請求項28記載の方法。
- 該システムが、高密度プラズマ化学気相堆積(HDPCVD)システムを備えている、請求項23記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US80348306P | 2006-05-30 | 2006-05-30 | |
US11/754,440 US7825038B2 (en) | 2006-05-30 | 2007-05-29 | Chemical vapor deposition of high quality flow-like silicon dioxide using a silicon containing precursor and atomic oxygen |
PCT/US2007/069999 WO2007140424A2 (en) | 2006-05-30 | 2007-05-30 | Chemical vapor deposition of high quality flow-like silicon dioxide using a silicon containing precursor and atomic oxygen |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2009539268A true JP2009539268A (ja) | 2009-11-12 |
Family
ID=38779452
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009513437A Pending JP2009539268A (ja) | 2006-05-30 | 2007-05-30 | シリコン含有前駆物質と原子酸素を用いた高品質流動状二酸化シリコンの化学気相堆積 |
Country Status (3)
Country | Link |
---|---|
EP (1) | EP2024532A4 (ja) |
JP (1) | JP2009539268A (ja) |
WO (1) | WO2007140424A2 (ja) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010103495A (ja) * | 2008-09-29 | 2010-05-06 | Adeka Corp | 半導体デバイス、その製造装置及び製造方法 |
WO2012165166A1 (ja) * | 2011-06-03 | 2012-12-06 | 株式会社日立国際電気 | 半導体装置の製造方法、基板処理方法および基板処理装置 |
JP2013513235A (ja) * | 2009-12-02 | 2013-04-18 | アプライド マテリアルズ インコーポレイテッド | 非炭素ラジカル成分cvd膜向けの酸素ドーピング |
JP2013515355A (ja) * | 2009-12-21 | 2013-05-02 | アプライド マテリアルズ インコーポレイテッド | 流動性cvd処理から形成された誘電体材料上で実行される湿式酸化処理 |
JP2015046469A (ja) * | 2013-08-28 | 2015-03-12 | 株式会社東芝 | 半導体装置の製造方法 |
JP2017216335A (ja) * | 2016-05-31 | 2017-12-07 | 株式会社日立国際電気 | 半導体装置の製造方法、基板処理装置、およびプログラム |
JP2019503590A (ja) * | 2015-12-21 | 2019-02-07 | バーサム マテリアルズ ユーエス,リミティド ライアビリティ カンパニー | ケイ素含有膜の堆積のための組成物及びそれを用いた方法 |
Families Citing this family (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9257302B1 (en) | 2004-03-25 | 2016-02-09 | Novellus Systems, Inc. | CVD flowable gap fill |
US7498273B2 (en) * | 2006-05-30 | 2009-03-03 | Applied Materials, Inc. | Formation of high quality dielectric films of silicon dioxide for STI: usage of different siloxane-based precursors for harp II—remote plasma enhanced deposition processes |
US9245739B2 (en) | 2006-11-01 | 2016-01-26 | Lam Research Corporation | Low-K oxide deposition by hydrolysis and condensation |
US7541297B2 (en) | 2007-10-22 | 2009-06-02 | Applied Materials, Inc. | Method and system for improving dielectric film quality for void free gap fill |
US7964040B2 (en) | 2007-11-08 | 2011-06-21 | Applied Materials, Inc. | Multi-port pumping system for substrate processing chambers |
KR101880838B1 (ko) * | 2008-08-04 | 2018-08-16 | 더 트러스티즈 오브 프린스턴 유니버시티 | 박막 트랜지스터용 하이브리드 유전 재료 |
US8557712B1 (en) * | 2008-12-15 | 2013-10-15 | Novellus Systems, Inc. | PECVD flowable dielectric gap fill |
US8278224B1 (en) | 2009-09-24 | 2012-10-02 | Novellus Systems, Inc. | Flowable oxide deposition using rapid delivery of process gases |
US9285168B2 (en) | 2010-10-05 | 2016-03-15 | Applied Materials, Inc. | Module for ozone cure and post-cure moisture treatment |
US9719169B2 (en) | 2010-12-20 | 2017-08-01 | Novellus Systems, Inc. | System and apparatus for flowable deposition in semiconductor fabrication |
US10283321B2 (en) | 2011-01-18 | 2019-05-07 | Applied Materials, Inc. | Semiconductor processing system and methods using capacitively coupled plasma |
US20120180954A1 (en) | 2011-01-18 | 2012-07-19 | Applied Materials, Inc. | Semiconductor processing system and methods using capacitively coupled plasma |
US8466073B2 (en) | 2011-06-03 | 2013-06-18 | Applied Materials, Inc. | Capping layer for reduced outgassing |
US9404178B2 (en) | 2011-07-15 | 2016-08-02 | Applied Materials, Inc. | Surface treatment and deposition for reduced outgassing |
US8617989B2 (en) | 2011-09-26 | 2013-12-31 | Applied Materials, Inc. | Liner property improvement |
US8551891B2 (en) | 2011-10-04 | 2013-10-08 | Applied Materials, Inc. | Remote plasma burn-in |
US8846536B2 (en) | 2012-03-05 | 2014-09-30 | Novellus Systems, Inc. | Flowable oxide film with tunable wet etch rate |
GB201209693D0 (en) * | 2012-05-31 | 2012-07-18 | Dow Corning | Silicon wafer coated with a passivation layer |
US8889566B2 (en) | 2012-09-11 | 2014-11-18 | Applied Materials, Inc. | Low cost flowable dielectric films |
US9847222B2 (en) | 2013-10-25 | 2017-12-19 | Lam Research Corporation | Treatment for flowable dielectric deposition on substrate surfaces |
US9412581B2 (en) | 2014-07-16 | 2016-08-09 | Applied Materials, Inc. | Low-K dielectric gapfill by flowable deposition |
US10049921B2 (en) | 2014-08-20 | 2018-08-14 | Lam Research Corporation | Method for selectively sealing ultra low-k porous dielectric layer using flowable dielectric film formed from vapor phase dielectric precursor |
US9916977B2 (en) | 2015-11-16 | 2018-03-13 | Lam Research Corporation | Low k dielectric deposition via UV driven photopolymerization |
US10388546B2 (en) | 2015-11-16 | 2019-08-20 | Lam Research Corporation | Apparatus for UV flowable dielectric |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1992012535A1 (en) * | 1991-01-08 | 1992-07-23 | Fujitsu Limited | Process for forming silicon oxide film |
JPH0982696A (ja) * | 1995-09-18 | 1997-03-28 | Toshiba Corp | 半導体装置の製造方法および半導体製造装置 |
JPH09251997A (ja) * | 1996-03-18 | 1997-09-22 | Toshiba Corp | シリコン酸化膜の形成方法 |
JPH09260369A (ja) * | 1996-03-25 | 1997-10-03 | Toshiba Corp | 絶縁膜の形成方法 |
JPH10154706A (ja) * | 1996-11-13 | 1998-06-09 | Applied Materials Inc | 浅いトレンチ分離のための方法及び装置 |
JPH10321619A (ja) * | 1997-05-21 | 1998-12-04 | Nec Corp | 酸化シリコン膜およびその形成方法と成膜装置 |
JP2000311893A (ja) * | 1999-02-17 | 2000-11-07 | Applied Materials Inc | 原子ガスから材料層を形成する方法と装置 |
JP2001077105A (ja) * | 1999-09-01 | 2001-03-23 | Canon Sales Co Inc | 絶縁膜の膜質改善方法 |
JP2001148382A (ja) * | 1999-06-22 | 2001-05-29 | Applied Materials Inc | 有機珪素化合物とヒドロキシル形成化合物との反応による液状シリカ層の形成 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6141763A (ja) * | 1984-04-24 | 1986-02-28 | Anelva Corp | 薄膜作成装置 |
US5873781A (en) * | 1996-11-14 | 1999-02-23 | Bally Gaming International, Inc. | Gaming machine having truly random results |
US7080528B2 (en) * | 2002-10-23 | 2006-07-25 | Applied Materials, Inc. | Method of forming a phosphorus doped optical core using a PECVD process |
-
2007
- 2007-05-30 WO PCT/US2007/069999 patent/WO2007140424A2/en active Application Filing
- 2007-05-30 JP JP2009513437A patent/JP2009539268A/ja active Pending
- 2007-05-30 EP EP07797890.6A patent/EP2024532A4/en not_active Withdrawn
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1992012535A1 (en) * | 1991-01-08 | 1992-07-23 | Fujitsu Limited | Process for forming silicon oxide film |
JPH0982696A (ja) * | 1995-09-18 | 1997-03-28 | Toshiba Corp | 半導体装置の製造方法および半導体製造装置 |
JPH09251997A (ja) * | 1996-03-18 | 1997-09-22 | Toshiba Corp | シリコン酸化膜の形成方法 |
JPH09260369A (ja) * | 1996-03-25 | 1997-10-03 | Toshiba Corp | 絶縁膜の形成方法 |
JPH10154706A (ja) * | 1996-11-13 | 1998-06-09 | Applied Materials Inc | 浅いトレンチ分離のための方法及び装置 |
JPH10321619A (ja) * | 1997-05-21 | 1998-12-04 | Nec Corp | 酸化シリコン膜およびその形成方法と成膜装置 |
JP2000311893A (ja) * | 1999-02-17 | 2000-11-07 | Applied Materials Inc | 原子ガスから材料層を形成する方法と装置 |
JP2001148382A (ja) * | 1999-06-22 | 2001-05-29 | Applied Materials Inc | 有機珪素化合物とヒドロキシル形成化合物との反応による液状シリカ層の形成 |
JP2001077105A (ja) * | 1999-09-01 | 2001-03-23 | Canon Sales Co Inc | 絶縁膜の膜質改善方法 |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010103495A (ja) * | 2008-09-29 | 2010-05-06 | Adeka Corp | 半導体デバイス、その製造装置及び製造方法 |
JP2013513235A (ja) * | 2009-12-02 | 2013-04-18 | アプライド マテリアルズ インコーポレイテッド | 非炭素ラジカル成分cvd膜向けの酸素ドーピング |
JP2013515355A (ja) * | 2009-12-21 | 2013-05-02 | アプライド マテリアルズ インコーポレイテッド | 流動性cvd処理から形成された誘電体材料上で実行される湿式酸化処理 |
WO2012165166A1 (ja) * | 2011-06-03 | 2012-12-06 | 株式会社日立国際電気 | 半導体装置の製造方法、基板処理方法および基板処理装置 |
JPWO2012165166A1 (ja) * | 2011-06-03 | 2015-02-23 | 株式会社日立国際電気 | 半導体装置の製造方法、基板処理方法および基板処理装置 |
KR101509453B1 (ko) * | 2011-06-03 | 2015-04-07 | 가부시키가이샤 히다치 고쿠사이 덴키 | 반도체 장치의 제조 방법, 기판 처리 방법 및 기판 처리 장치 |
US9006116B2 (en) | 2011-06-03 | 2015-04-14 | Hitachi Kokusai Electric Inc. | Method of manufacturing semiconductor device, substrate processing method and substrate processing apparatus |
JP2015046469A (ja) * | 2013-08-28 | 2015-03-12 | 株式会社東芝 | 半導体装置の製造方法 |
JP2019503590A (ja) * | 2015-12-21 | 2019-02-07 | バーサム マテリアルズ ユーエス,リミティド ライアビリティ カンパニー | ケイ素含有膜の堆積のための組成物及びそれを用いた方法 |
JP2017216335A (ja) * | 2016-05-31 | 2017-12-07 | 株式会社日立国際電気 | 半導体装置の製造方法、基板処理装置、およびプログラム |
Also Published As
Publication number | Publication date |
---|---|
EP2024532A2 (en) | 2009-02-18 |
WO2007140424A3 (en) | 2008-02-21 |
EP2024532A4 (en) | 2014-08-06 |
WO2007140424A2 (en) | 2007-12-06 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5225268B2 (ja) | 二酸化シリコンの膜質を高める新規な堆積プラズマ硬化サイクルプロセス | |
US7825038B2 (en) | Chemical vapor deposition of high quality flow-like silicon dioxide using a silicon containing precursor and atomic oxygen | |
JP2009539268A (ja) | シリコン含有前駆物質と原子酸素を用いた高品質流動状二酸化シリコンの化学気相堆積 | |
US7902080B2 (en) | Deposition-plasma cure cycle process to enhance film quality of silicon dioxide | |
US7825044B2 (en) | Curing methods for silicon dioxide multi-layers | |
KR101161074B1 (ko) | 기판상에 실리콘 옥사이드 층을 형성시키는 방법 | |
US7498273B2 (en) | Formation of high quality dielectric films of silicon dioxide for STI: usage of different siloxane-based precursors for harp II—remote plasma enhanced deposition processes | |
US9404178B2 (en) | Surface treatment and deposition for reduced outgassing | |
US20120309205A1 (en) | Capping layer for reduced outgassing | |
KR20130014543A (ko) | 라디칼 성분 cvd에 의한 컨포멀 층들 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20100518 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20101012 |
|
RD03 | Notification of appointment of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7423 Effective date: 20101130 |
|
RD04 | Notification of resignation of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7424 Effective date: 20101210 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20120703 |
|
RD04 | Notification of resignation of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7424 Effective date: 20120925 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20121001 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20130409 |