TWI341551B - Stage apparatus and light exposing apparatus - Google Patents

Stage apparatus and light exposing apparatus

Info

Publication number
TWI341551B
TWI341551B TW093104536A TW93104536A TWI341551B TW I341551 B TWI341551 B TW I341551B TW 093104536 A TW093104536 A TW 093104536A TW 93104536 A TW93104536 A TW 93104536A TW I341551 B TWI341551 B TW I341551B
Authority
TW
Taiwan
Prior art keywords
light exposing
stage
stage apparatus
light
exposing apparatus
Prior art date
Application number
TW093104536A
Other languages
English (en)
Other versions
TW200421448A (en
Inventor
Yuichi Shibazaki
Original Assignee
Nikon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corp filed Critical Nikon Corp
Publication of TW200421448A publication Critical patent/TW200421448A/zh
Application granted granted Critical
Publication of TWI341551B publication Critical patent/TWI341551B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B27/00—Photographic printing apparatus
    • G03B27/32—Projection printing apparatus, e.g. enlarger, copying camera
    • G03B27/52—Details
    • G03B27/58—Baseboards, masking frames, or other holders for the sensitive material
    • G03B27/585—Handling cut photosensitive sheets
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B27/00—Photographic printing apparatus
    • G03B27/32—Projection printing apparatus, e.g. enlarger, copying camera
    • G03B27/52—Details
    • G03B27/62—Holders for the original
    • G03B27/6207—Holders for the original in copying cameras
    • G03B27/625—Apparatus which relate to the handling of originals, e.g. presence detectors, inverters
    • G03B27/6257—Arrangements for moving an original once or repeatedly to or through an exposure station
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7023—Aligning or positioning in direction perpendicular to substrate surface
    • G—PHYSICS
    • G12—INSTRUMENT DETAILS
    • G12B—CONSTRUCTIONAL DETAILS OF INSTRUMENTS, OR COMPARABLE DETAILS OF OTHER APPARATUS, NOT OTHERWISE PROVIDED FOR
    • G12B5/00—Adjusting position or attitude, e.g. level, of instruments or other apparatus, or of parts thereof; Compensating for the effects of tilting or acceleration, e.g. for optical apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/682—Mask-wafer alignment

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Machine Tool Units (AREA)
TW093104536A 2003-04-01 2004-02-24 Stage apparatus and light exposing apparatus TWI341551B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003098464A JP4362862B2 (ja) 2003-04-01 2003-04-01 ステージ装置及び露光装置

Publications (2)

Publication Number Publication Date
TW200421448A TW200421448A (en) 2004-10-16
TWI341551B true TWI341551B (en) 2011-05-01

Family

ID=33156672

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093104536A TWI341551B (en) 2003-04-01 2004-02-24 Stage apparatus and light exposing apparatus

Country Status (6)

Country Link
US (1) US7589823B2 (zh)
EP (1) EP1610362B1 (zh)
JP (1) JP4362862B2 (zh)
KR (2) KR20110128930A (zh)
TW (1) TWI341551B (zh)
WO (1) WO2004090953A1 (zh)

Families Citing this family (34)

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US7072024B2 (en) * 2004-01-20 2006-07-04 Nikon Corporation Lithographic projection method and apparatus
TWI538013B (zh) 2004-11-18 2016-06-11 尼康股份有限公司 A position measuring method, a position control method, a measuring method, a loading method, an exposure method and an exposure apparatus, and a device manufacturing method
US7456935B2 (en) * 2005-04-05 2008-11-25 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method utilizing a positioning device for positioning an object table
US7161659B2 (en) * 2005-04-08 2007-01-09 Asml Netherlands B.V. Dual stage lithographic apparatus and device manufacturing method
US7515281B2 (en) * 2005-04-08 2009-04-07 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
USRE43576E1 (en) * 2005-04-08 2012-08-14 Asml Netherlands B.V. Dual stage lithographic apparatus and device manufacturing method
KR100698751B1 (ko) * 2005-12-27 2007-03-23 동부일렉트로닉스 주식회사 노광 장치의 웨이퍼 반송 장치 및 그 구동 방법
TWI550688B (zh) * 2006-01-19 2016-09-21 尼康股份有限公司 液浸曝光裝置及液浸曝光方法、以及元件製造方法
US7483120B2 (en) * 2006-05-09 2009-01-27 Asml Netherlands B.V. Displacement measurement system, lithographic apparatus, displacement measurement method and device manufacturing method
KR100671241B1 (ko) * 2006-05-12 2007-01-19 충주대학교 산학협력단 공극 변위 측정을 이용한 평면 스테이지 면내 위치 검출방법 및 장치
KR101634893B1 (ko) * 2006-08-31 2016-06-29 가부시키가이샤 니콘 이동체 구동 방법 및 이동체 구동 시스템, 패턴 형성 방법 및 장치, 노광 방법 및 장치, 그리고 디바이스 제조 방법
JP4863948B2 (ja) 2007-07-30 2012-01-25 株式会社日立ハイテクノロジーズ 露光装置、露光方法、及び表示用パネル基板の製造方法
JP4377424B2 (ja) * 2007-07-31 2009-12-02 住友重機械工業株式会社 反力処理装置
US20090201484A1 (en) * 2007-10-29 2009-08-13 Nikon Corporation Utilities supply member connection apparatus, stage apparatus, projection optical system support apparatus and exposure apparatus
JP2009147078A (ja) * 2007-12-13 2009-07-02 Taiheiyo Cement Corp 真空吸着装置およびその製造方法
JP5219534B2 (ja) * 2008-01-31 2013-06-26 キヤノン株式会社 露光装置及びデバイスの製造方法
JPWO2009125867A1 (ja) * 2008-04-11 2011-08-04 株式会社ニコン ステージ装置、露光装置、及びデバイス製造方法
US9176393B2 (en) 2008-05-28 2015-11-03 Asml Netherlands B.V. Lithographic apparatus and a method of operating the apparatus
JP2010091628A (ja) 2008-10-03 2010-04-22 Hitachi High-Technologies Corp 表示用パネル露光装置および露光方法並びに表示用パネル露光装置の組立てまたは調整方法
US8063383B2 (en) 2008-11-04 2011-11-22 Sergiy Pryadkin Inertial positioner and an optical instrument for precise positioning
TW201102757A (en) * 2009-07-01 2011-01-16 Els System Technology Co Ltd Position adjustment apparatus and exposure machine containing same
JP5578485B2 (ja) * 2009-10-14 2014-08-27 株式会社ニコン 移動体装置、露光装置、及びデバイス製造方法
NL2008696A (en) * 2011-05-25 2012-11-27 Asml Netherlands Bv A multi-stage system, a control method therefor, and a lithographic apparatus.
NL2009827A (en) * 2011-12-22 2013-06-26 Asml Netherlands Bv A stage system and a lithographic apparatus.
JP5910992B2 (ja) * 2012-04-04 2016-04-27 株式会社ニコン 移動体装置、露光装置、フラットパネルディスプレイの製造方法、及びデバイス製造方法
JP6121727B2 (ja) * 2013-01-23 2017-04-26 株式会社日立ハイテクノロジーズ 走査電子顕微鏡
US20160374556A1 (en) * 2015-06-25 2016-12-29 Profusa, Inc. Transcutaneous reader for use with implantable analyte sensors
JP6197909B2 (ja) * 2016-04-06 2017-09-20 株式会社ニコン 移動体装置
JP6735693B2 (ja) 2017-02-27 2020-08-05 株式会社日立ハイテク ステージ装置、及び荷電粒子線装置
US10254659B1 (en) * 2017-09-27 2019-04-09 Wuhan China Star Optoelectronics Technology Co., Ltd Exposure apparatus and method for exposure of transparent substrate
TWI645192B (zh) * 2017-10-23 2018-12-21 由田新技股份有限公司 半導體料片之整平裝置及其方法
CN110010189B (zh) * 2019-04-23 2022-02-15 山东理工大学 一种可实现运动解耦的大行程二维精密微动平台
CN113108715B (zh) * 2021-04-13 2024-01-23 南京中安半导体设备有限责任公司 悬浮物的测量装置和气浮卡盘
CN115127388B (zh) * 2022-05-10 2023-12-12 北京机械设备研究所 一种基于直线电机的自动装填抛投装置及方法

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Also Published As

Publication number Publication date
JP2004311459A (ja) 2004-11-04
US20050237510A1 (en) 2005-10-27
KR101096479B1 (ko) 2011-12-20
EP1610362A1 (en) 2005-12-28
EP1610362B1 (en) 2016-09-14
WO2004090953A1 (ja) 2004-10-21
TW200421448A (en) 2004-10-16
JP4362862B2 (ja) 2009-11-11
US7589823B2 (en) 2009-09-15
KR20110128930A (ko) 2011-11-30
EP1610362A4 (en) 2009-05-13
KR20050111572A (ko) 2005-11-25

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees