TWI341551B - Stage apparatus and light exposing apparatus - Google Patents

Stage apparatus and light exposing apparatus

Info

Publication number
TWI341551B
TWI341551B TW093104536A TW93104536A TWI341551B TW I341551 B TWI341551 B TW I341551B TW 093104536 A TW093104536 A TW 093104536A TW 93104536 A TW93104536 A TW 93104536A TW I341551 B TWI341551 B TW I341551B
Authority
TW
Taiwan
Prior art keywords
light exposing
stage
stage apparatus
light
exposing apparatus
Prior art date
Application number
TW093104536A
Other languages
Chinese (zh)
Other versions
TW200421448A (en
Inventor
Yuichi Shibazaki
Original Assignee
Nikon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corp filed Critical Nikon Corp
Publication of TW200421448A publication Critical patent/TW200421448A/en
Application granted granted Critical
Publication of TWI341551B publication Critical patent/TWI341551B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B27/00—Photographic printing apparatus
    • G03B27/32—Projection printing apparatus, e.g. enlarger, copying camera
    • G03B27/52—Details
    • G03B27/58—Baseboards, masking frames, or other holders for the sensitive material
    • G03B27/585—Handling cut photosensitive sheets
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B27/00—Photographic printing apparatus
    • G03B27/32—Projection printing apparatus, e.g. enlarger, copying camera
    • G03B27/52—Details
    • G03B27/62—Holders for the original
    • G03B27/6207—Holders for the original in copying cameras
    • G03B27/625—Apparatus which relate to the handling of originals, e.g. presence detectors, inverters
    • G03B27/6257—Arrangements for moving an original once or repeatedly to or through an exposure station
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7023—Aligning or positioning in direction perpendicular to substrate surface
    • G—PHYSICS
    • G12—INSTRUMENT DETAILS
    • G12B—CONSTRUCTIONAL DETAILS OF INSTRUMENTS, OR COMPARABLE DETAILS OF OTHER APPARATUS, NOT OTHERWISE PROVIDED FOR
    • G12B5/00—Adjusting position or attitude, e.g. level, of instruments or other apparatus, or of parts thereof; Compensating for the effects of tilting or acceleration, e.g. for optical apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/682—Mask-wafer alignment

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Machine Tool Units (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
TW093104536A 2003-04-01 2004-02-24 Stage apparatus and light exposing apparatus TWI341551B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003098464A JP4362862B2 (en) 2003-04-01 2003-04-01 Stage apparatus and exposure apparatus

Publications (2)

Publication Number Publication Date
TW200421448A TW200421448A (en) 2004-10-16
TWI341551B true TWI341551B (en) 2011-05-01

Family

ID=33156672

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093104536A TWI341551B (en) 2003-04-01 2004-02-24 Stage apparatus and light exposing apparatus

Country Status (6)

Country Link
US (1) US7589823B2 (en)
EP (1) EP1610362B1 (en)
JP (1) JP4362862B2 (en)
KR (2) KR101096479B1 (en)
TW (1) TWI341551B (en)
WO (1) WO2004090953A1 (en)

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US7072024B2 (en) * 2004-01-20 2006-07-04 Nikon Corporation Lithographic projection method and apparatus
TWI536429B (en) 2004-11-18 2016-06-01 尼康股份有限公司 A position measuring method, a position control method, a measuring method, a loading method, an exposure method and an exposure apparatus, and a device manufacturing method
US7456935B2 (en) * 2005-04-05 2008-11-25 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method utilizing a positioning device for positioning an object table
US7161659B2 (en) * 2005-04-08 2007-01-09 Asml Netherlands B.V. Dual stage lithographic apparatus and device manufacturing method
USRE43576E1 (en) * 2005-04-08 2012-08-14 Asml Netherlands B.V. Dual stage lithographic apparatus and device manufacturing method
US7515281B2 (en) * 2005-04-08 2009-04-07 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
KR100698751B1 (en) * 2005-12-27 2007-03-23 동부일렉트로닉스 주식회사 Wafer transferring device of exposer and method of driving the same
TWI508133B (en) * 2006-01-19 2015-11-11 尼康股份有限公司 Exposure method and exposure apparatus, and component manufacturing method
US7483120B2 (en) * 2006-05-09 2009-01-27 Asml Netherlands B.V. Displacement measurement system, lithographic apparatus, displacement measurement method and device manufacturing method
KR100671241B1 (en) * 2006-05-12 2007-01-19 충주대학교 산학협력단 Method and apparatus for detecting in-plane position in a planar stage by measuring air gap displacement
SG10201507251TA (en) * 2006-08-31 2015-10-29 Nikon Corp Movable Body Drive Method And Movable Body Drive System, Pattern Formation Method And Apparatus, Exposure Method And Apparatus, And Device Manufacturing Method
JP4863948B2 (en) 2007-07-30 2012-01-25 株式会社日立ハイテクノロジーズ Exposure apparatus, exposure method, and manufacturing method of display panel substrate
JP4377424B2 (en) * 2007-07-31 2009-12-02 住友重機械工業株式会社 Reaction force processing device
US20090201484A1 (en) * 2007-10-29 2009-08-13 Nikon Corporation Utilities supply member connection apparatus, stage apparatus, projection optical system support apparatus and exposure apparatus
JP2009147078A (en) * 2007-12-13 2009-07-02 Taiheiyo Cement Corp Vacuum suction device, and manufacturing method thereof
JP5219534B2 (en) * 2008-01-31 2013-06-26 キヤノン株式会社 Exposure apparatus and device manufacturing method
TW200947149A (en) * 2008-04-11 2009-11-16 Nikon Corp Stage device, exposure device and device production method
EP2128703A1 (en) 2008-05-28 2009-12-02 ASML Netherlands BV Lithographic Apparatus and a Method of Operating the Apparatus
JP2010091628A (en) 2008-10-03 2010-04-22 Hitachi High-Technologies Corp Exposure apparatus and exposure method for display panel, and method of assembling or adjusting the exposure apparatus for display panel
US8063383B2 (en) * 2008-11-04 2011-11-22 Sergiy Pryadkin Inertial positioner and an optical instrument for precise positioning
TW201102757A (en) * 2009-07-01 2011-01-16 Els System Technology Co Ltd Position adjustment apparatus and exposure machine containing same
JP5578485B2 (en) * 2009-10-14 2014-08-27 株式会社ニコン MOBILE DEVICE, EXPOSURE APPARATUS, AND DEVICE MANUFACTURING METHOD
NL2008696A (en) * 2011-05-25 2012-11-27 Asml Netherlands Bv A multi-stage system, a control method therefor, and a lithographic apparatus.
NL2009827A (en) * 2011-12-22 2013-06-26 Asml Netherlands Bv A stage system and a lithographic apparatus.
JP5910992B2 (en) * 2012-04-04 2016-04-27 株式会社ニコン Mobile device, exposure apparatus, flat panel display manufacturing method, and device manufacturing method
JP6121727B2 (en) * 2013-01-23 2017-04-26 株式会社日立ハイテクノロジーズ Scanning electron microscope
AU2016284813B2 (en) * 2015-06-25 2020-12-24 Profusa, Inc. Transcutaneous reader for use with implantable analyte sensors
JP6197909B2 (en) * 2016-04-06 2017-09-20 株式会社ニコン Mobile device
JP6735693B2 (en) 2017-02-27 2020-08-05 株式会社日立ハイテク Stage device and charged particle beam device
US10254659B1 (en) * 2017-09-27 2019-04-09 Wuhan China Star Optoelectronics Technology Co., Ltd Exposure apparatus and method for exposure of transparent substrate
TWI645192B (en) * 2017-10-23 2018-12-21 由田新技股份有限公司 A semiconductor wafer leveling device and method thereof
CN110010189B (en) * 2019-04-23 2022-02-15 山东理工大学 Large-stroke two-dimensional precise micro-motion platform capable of realizing motion decoupling
CN113108715B (en) * 2021-04-13 2024-01-23 南京中安半导体设备有限责任公司 Suspension measuring device and air floating chuck
CN115127388B (en) * 2022-05-10 2023-12-12 北京机械设备研究所 Automatic filling and throwing device and method based on linear motor

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Also Published As

Publication number Publication date
EP1610362A1 (en) 2005-12-28
JP4362862B2 (en) 2009-11-11
KR101096479B1 (en) 2011-12-20
KR20110128930A (en) 2011-11-30
US20050237510A1 (en) 2005-10-27
US7589823B2 (en) 2009-09-15
EP1610362A4 (en) 2009-05-13
JP2004311459A (en) 2004-11-04
WO2004090953A1 (en) 2004-10-21
KR20050111572A (en) 2005-11-25
TW200421448A (en) 2004-10-16
EP1610362B1 (en) 2016-09-14

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees