DE60332681D1 - Trägerplattevorrichtung - Google Patents

Trägerplattevorrichtung

Info

Publication number
DE60332681D1
DE60332681D1 DE60332681T DE60332681T DE60332681D1 DE 60332681 D1 DE60332681 D1 DE 60332681D1 DE 60332681 T DE60332681 T DE 60332681T DE 60332681 T DE60332681 T DE 60332681T DE 60332681 D1 DE60332681 D1 DE 60332681D1
Authority
DE
Germany
Prior art keywords
stage apparatus
stage
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60332681T
Other languages
English (en)
Inventor
Hiroyuki Shinozaki
Hirosi Sobukawa
Shoji Yoshikawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2002012338A external-priority patent/JP4310065B2/ja
Priority claimed from JP2002051256A external-priority patent/JP2003247822A/ja
Application filed by Ebara Corp filed Critical Ebara Corp
Application granted granted Critical
Publication of DE60332681D1 publication Critical patent/DE60332681D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/682—Mask-wafer alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
DE60332681T 2002-01-22 2003-01-20 Trägerplattevorrichtung Expired - Lifetime DE60332681D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002012338A JP4310065B2 (ja) 2002-01-22 2002-01-22 ステージ装置
JP2002051256A JP2003247822A (ja) 2002-02-27 2002-02-27 角度検出装置

Publications (1)

Publication Number Publication Date
DE60332681D1 true DE60332681D1 (de) 2010-07-08

Family

ID=26625587

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60332681T Expired - Lifetime DE60332681D1 (de) 2002-01-22 2003-01-20 Trägerplattevorrichtung

Country Status (3)

Country Link
US (1) US7025005B2 (de)
EP (1) EP1333468B1 (de)
DE (1) DE60332681D1 (de)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2850748B1 (fr) * 2003-02-05 2005-12-30 Actaris Sas Dispositif de detection optique pour compteur
JP2005253179A (ja) * 2004-03-03 2005-09-15 Canon Inc 位置決め装置、露光装置およびデバイス製造方法
JP2008028070A (ja) * 2006-07-20 2008-02-07 Sumco Corp 貼り合わせウェーハの製造方法
KR100857416B1 (ko) * 2006-11-22 2008-09-08 주식회사 자코드 휴대용 단말기의 2축 슬라이딩장치
JP4750090B2 (ja) * 2007-09-14 2011-08-17 住友重機械工業株式会社 ステージ装置
EP2573795B1 (de) * 2010-05-20 2017-07-19 Hitachi High-Technologies Corporation Rasterelektronenmikroskop
NL2008345A (en) 2011-03-28 2012-10-01 Asml Holding Nv Lithographic apparatus and device manufacturing method.
JP2014530478A (ja) * 2011-09-09 2014-11-17 マッパー・リソグラフィー・アイピー・ビー．ブイ． 除振モジュール及び基板処理システム
CN102508318B (zh) * 2011-09-30 2013-08-21 浙江大学 用于地震计静态标定的精密倾斜平台装置
EP4033645A1 (de) 2011-10-27 2022-07-27 The University of British Columbia Verschiebungsvorrichtungen und verfahren zur herstellung, ihre verwendung und steuerung
JP5741961B2 (ja) * 2012-10-24 2015-07-01 株式会社デンソー 回転角検出装置、および、これを用いた回転駆動装置
EP3014219B1 (de) * 2013-08-06 2017-10-11 The University Of British Columbia Verschiebungsvorrichtungen und verfahren sowie vorrichtung zur erkennung und schätzung von damit zusammenhängender bewegung
EP3584913B1 (de) 2014-06-07 2023-08-02 The University of British Columbia Systeme zur kontrollierten bewegung von mehrerer beweglicher stufen in einer verdrängervorrichtung
EP3155712A4 (de) 2014-06-14 2018-02-21 The University Of British Columbia Verdrängungsvorrichtungen, beweglichen stufen für verdrängungsvorrichtungen und verfahren zur herstellung, verwendung und steuerung davon
KR101613125B1 (ko) * 2014-12-30 2016-04-18 주식회사 에스에프에이 기준 원점 설정 장치 및 그 방법
CN107852082B (zh) 2015-07-06 2020-05-26 不列颠哥伦比亚大学 用于在位移装置上可控制地移动一个或多个可移动台的方法和系统
CN106814204B (zh) * 2016-12-25 2019-01-15 重庆市永川区益锐机械有限责任公司 回转速度检测装置
CN108897155A (zh) * 2018-08-16 2018-11-27 苏州精濑光电有限公司 一种显示模组对组平台
JP2020068243A (ja) * 2018-10-22 2020-04-30 キヤノン株式会社 基板保持装置、露光装置及び物品の製造方法
CN110906885B (zh) * 2019-12-24 2021-03-30 洛阳恒锐测控科技有限公司 高速高精度角接触轴承接触角测量方法
US20230184540A1 (en) * 2021-12-10 2023-06-15 Applied Materials, Inc. System for wafer dechucking and health monitoring

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4118042A (en) 1977-09-27 1978-10-03 The United States Of America As Represented By The United States Department Of Energy Air bearing vacuum seal assembly
US4191385A (en) * 1979-05-15 1980-03-04 Fox Wayne L Vacuum-sealed gas-bearing assembly
US4462580A (en) * 1981-10-02 1984-07-31 At&T Bell Laboratories Hydraulically driven X-Y stage
US4425508A (en) 1982-05-07 1984-01-10 Gca Corporation Electron beam lithographic apparatus
JPH0648170B2 (ja) * 1987-05-11 1994-06-22 キヤノン株式会社 変位測定装置
JP2714502B2 (ja) * 1991-09-18 1998-02-16 キヤノン株式会社 移動ステージ装置
JPH0697033A (ja) * 1992-09-14 1994-04-08 Nikon Corp 基板の位置合わせ方法
JPH06160075A (ja) * 1992-11-17 1994-06-07 Matsushita Electric Ind Co Ltd スクロール羽根の形状測定装置
JP3363662B2 (ja) * 1994-05-19 2003-01-08 キヤノン株式会社 走査ステージ装置およびこれを用いた露光装置
JPH08233521A (ja) * 1995-02-28 1996-09-13 Toho Technol Kk 距離測定方法、回転角度測定方法、移動距離測定装置、位置測定装置、寸法測定装置、回転角度測定装置及び回転位置測定装置
JP3075981B2 (ja) * 1996-04-05 2000-08-14 松下電器産業株式会社 形状測定装置
US5784925A (en) 1996-12-13 1998-07-28 Etec Systems, Inc. Vacuum compatible linear motion device
JPH10209034A (ja) * 1997-01-23 1998-08-07 Canon Inc ステージ装置および露光装置
US6074888A (en) 1998-08-18 2000-06-13 Trw Inc. Method for fabricating semiconductor micro epi-optical components
US6499880B2 (en) * 1999-02-19 2002-12-31 Nikon Corporation Static pressure air bearing
TWI233535B (en) * 1999-04-19 2005-06-01 Asml Netherlands Bv Motion feed-through into a vacuum chamber and its application in lithographic projection apparatuses
TW552480B (en) * 1999-04-19 2003-09-11 Asml Netherlands Bv Moveable support in a vacuum chamber and its application in lithographic projection apparatus
US6255645B1 (en) * 1999-06-04 2001-07-03 Hewlett-Packard Company Method and apparatus for optically measuring drive train backlash
US6515288B1 (en) * 2000-03-16 2003-02-04 Applied Materials, Inc. Vacuum bearing structure and a method of supporting a movable member
JP2002106563A (ja) 2000-09-27 2002-04-10 Toshiba Corp 駆動装置
JP4612777B2 (ja) * 2001-03-09 2011-01-12 キヤノン株式会社 移動案内装置、それを用いた露光装置及び半導体デバイス製造方法

Also Published As

Publication number Publication date
EP1333468A3 (de) 2008-01-16
US7025005B2 (en) 2006-04-11
EP1333468B1 (de) 2010-05-26
EP1333468A2 (de) 2003-08-06
US20030136309A1 (en) 2003-07-24

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Legal Events

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