TWI341158B - Noise-suppressing wiring-member and printed wiring board - Google Patents

Noise-suppressing wiring-member and printed wiring board

Info

Publication number
TWI341158B
TWI341158B TW096123389A TW96123389A TWI341158B TW I341158 B TWI341158 B TW I341158B TW 096123389 A TW096123389 A TW 096123389A TW 96123389 A TW96123389 A TW 96123389A TW I341158 B TWI341158 B TW I341158B
Authority
TW
Taiwan
Prior art keywords
noise
suppressing
wiring board
wiring
printed wiring
Prior art date
Application number
TW096123389A
Other languages
English (en)
Other versions
TW200814896A (en
Inventor
Toshiyuki Kawaguchi
Kazutoki Tahara
Tsutomu Saga
Mitsuaki Negishi
Original Assignee
Shinetsu Polymer Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2006181179A external-priority patent/JP5138185B2/ja
Priority claimed from JP2006199286A external-priority patent/JP4916803B2/ja
Application filed by Shinetsu Polymer Co filed Critical Shinetsu Polymer Co
Publication of TW200814896A publication Critical patent/TW200814896A/zh
Application granted granted Critical
Publication of TWI341158B publication Critical patent/TWI341158B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0234—Resistors or by disposing resistive or lossy substances in or near power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0191—Dielectric layers wherein the thickness of the dielectric plays an important role
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0317—Thin film conductor layer; Thin film passive component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H05K2201/0326—Inorganic, non-metallic conductor, e.g. indium-tin oxide [ITO]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/093—Layout of power planes, ground planes or power supply conductors, e.g. having special clearance holes therein
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/09309—Core having two or more power planes; Capacitive laminate of two power planes

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Structure Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Laminated Bodies (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
TW096123389A 2006-06-30 2007-06-28 Noise-suppressing wiring-member and printed wiring board TWI341158B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006181179A JP5138185B2 (ja) 2006-06-30 2006-06-30 プリント配線基板
JP2006199286A JP4916803B2 (ja) 2006-07-21 2006-07-21 多層プリント回路基板

Publications (2)

Publication Number Publication Date
TW200814896A TW200814896A (en) 2008-03-16
TWI341158B true TWI341158B (en) 2011-04-21

Family

ID=38845660

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096123389A TWI341158B (en) 2006-06-30 2007-06-28 Noise-suppressing wiring-member and printed wiring board

Country Status (5)

Country Link
US (1) US8134084B2 (zh)
EP (2) EP2222144B1 (zh)
KR (1) KR101162405B1 (zh)
TW (1) TWI341158B (zh)
WO (1) WO2008001897A1 (zh)

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US8134084B2 (en) * 2006-06-30 2012-03-13 Shin-Etsu Polymer Co., Ltd. Noise-suppressing wiring-member and printed wiring board
US8761895B2 (en) * 2008-03-20 2014-06-24 Greatbatch Ltd. RF activated AIMD telemetry transceiver
CN101275308B (zh) * 2007-03-26 2010-06-02 上海特安纶纤维有限公司 全间位芳香族聚砜酰胺纤维的制造方法
TWI379621B (en) * 2007-08-02 2012-12-11 Shinetsu Polymer Co Conductive noise suppressing structure and wiring circuit substrate
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US10249415B2 (en) 2017-01-06 2019-04-02 Greatbatch Ltd. Process for manufacturing a leadless feedthrough for an active implantable medical device
JP6338750B1 (ja) * 2017-03-03 2018-06-06 株式会社トーキン 装置
JP6872449B2 (ja) * 2017-07-20 2021-05-19 信越ポリマー株式会社 電磁波シールドフィルム及びその製造方法、並びに電磁波シールドフィルム付きプリント配線板及びその製造方法
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Also Published As

Publication number Publication date
US8134084B2 (en) 2012-03-13
EP2048919A1 (en) 2009-04-15
KR101162405B1 (ko) 2012-07-04
EP2222144A2 (en) 2010-08-25
KR20090024821A (ko) 2009-03-09
TW200814896A (en) 2008-03-16
EP2222144A3 (en) 2011-04-20
EP2222144B1 (en) 2014-07-30
US20080049410A1 (en) 2008-02-28
EP2048919A4 (en) 2010-01-06
WO2008001897A1 (fr) 2008-01-03

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