TWI329918B - Semiconductor multi-package module having wire bond interconnection between stacked packages - Google Patents
Semiconductor multi-package module having wire bond interconnection between stacked packages Download PDFInfo
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- TWI329918B TWI329918B TW092125625A TW92125625A TWI329918B TW I329918 B TWI329918 B TW I329918B TW 092125625 A TW092125625 A TW 092125625A TW 92125625 A TW92125625 A TW 92125625A TW I329918 B TWI329918 B TW I329918B
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- package
- die
- substrate
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Classifications
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
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- Condensed Matter Physics & Semiconductors (AREA)
- Health & Medical Sciences (AREA)
- Electromagnetism (AREA)
- Toxicology (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Wire Bonding (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Applications Claiming Priority (7)
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US10/632,553 US7053476B2 (en) | 2002-09-17 | 2003-08-02 | Semiconductor multi-package module having package stacked over die-down flip chip ball grid array package and having wire bond interconnect between stacked packages |
US10/632,550 US6972481B2 (en) | 2002-09-17 | 2003-08-02 | Semiconductor multi-package module including stacked-die package and having wire bond interconnect between stacked packages |
US10/632,552 US20040061213A1 (en) | 2002-09-17 | 2003-08-02 | Semiconductor multi-package module having package stacked over die-up flip chip ball grid array package and having wire bond interconnect between stacked packages |
US10/632,551 US6838761B2 (en) | 2002-09-17 | 2003-08-02 | Semiconductor multi-package module having wire bond interconnect between stacked packages and having electrical shield |
US10/632,568 US7205647B2 (en) | 2002-09-17 | 2003-08-02 | Semiconductor multi-package module having package stacked over ball grid array package and having wire bond interconnect between stacked packages |
US10/632,549 US7064426B2 (en) | 2002-09-17 | 2003-08-02 | Semiconductor multi-package module having wire bond interconnect between stacked packages |
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TW100113640A TWI469301B (zh) | 2002-09-17 | 2003-09-17 | 堆疊封裝間具有線接點互連之半導體多重封裝模組 |
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TWI406377B (zh) * | 2010-12-27 | 2013-08-21 | Powertech Technology Inc | 方向指示標記立體化之球格陣列封裝構造及其製造方法 |
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JP5522561B2 (ja) * | 2005-08-31 | 2014-06-18 | マイクロン テクノロジー, インク. | マイクロ電子デバイスパッケージ、積重ね型マイクロ電子デバイスパッケージ、およびマイクロ電子デバイスを製造する方法 |
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JP2001358280A (ja) * | 2000-04-12 | 2001-12-26 | Sony Corp | リードフレームと、その製造方法と、半導体集積回路装置と、その製造方法 |
JP3916854B2 (ja) * | 2000-06-28 | 2007-05-23 | シャープ株式会社 | 配線基板、半導体装置およびパッケージスタック半導体装置 |
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JP3798620B2 (ja) * | 2000-12-04 | 2006-07-19 | 富士通株式会社 | 半導体装置の製造方法 |
US6340846B1 (en) * | 2000-12-06 | 2002-01-22 | Amkor Technology, Inc. | Making semiconductor packages with stacked dies and reinforced wire bonds |
JP2002184936A (ja) * | 2000-12-11 | 2002-06-28 | Matsushita Electric Ind Co Ltd | 半導体装置およびその製造方法 |
JP2002217354A (ja) * | 2001-01-15 | 2002-08-02 | Shinko Electric Ind Co Ltd | 半導体装置 |
-
2003
- 2003-09-15 WO PCT/US2003/028919 patent/WO2004027823A2/en active Application Filing
- 2003-09-15 EP EP03754585A patent/EP1547141A4/en not_active Ceased
- 2003-09-15 JP JP2004568930A patent/JP4800625B2/ja not_active Expired - Fee Related
- 2003-09-15 KR KR1020057004551A patent/KR101166575B1/ko active IP Right Grant
- 2003-09-15 AU AU2003272405A patent/AU2003272405A1/en not_active Abandoned
- 2003-09-17 TW TW098139252A patent/TWI378548B/zh not_active IP Right Cessation
- 2003-09-17 TW TW092125625A patent/TWI329918B/zh not_active IP Right Cessation
- 2003-09-17 TW TW100113640A patent/TWI469301B/zh not_active IP Right Cessation
-
2011
- 2011-06-21 JP JP2011137096A patent/JP5602685B2/ja not_active Expired - Fee Related
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2013
- 2013-06-12 JP JP2013123601A patent/JP5856103B2/ja not_active Expired - Lifetime
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI406377B (zh) * | 2010-12-27 | 2013-08-21 | Powertech Technology Inc | 方向指示標記立體化之球格陣列封裝構造及其製造方法 |
Also Published As
Publication number | Publication date |
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WO2004027823A2 (en) | 2004-04-01 |
WO2004027823A3 (en) | 2004-05-21 |
EP1547141A4 (en) | 2010-02-24 |
JP4800625B2 (ja) | 2011-10-26 |
JP2013211589A (ja) | 2013-10-10 |
AU2003272405A8 (en) | 2004-04-08 |
JP2005539403A (ja) | 2005-12-22 |
AU2003272405A1 (en) | 2004-04-08 |
TW201131731A (en) | 2011-09-16 |
JP5856103B2 (ja) | 2016-02-09 |
EP1547141A2 (en) | 2005-06-29 |
KR20050044925A (ko) | 2005-05-13 |
TW200419765A (en) | 2004-10-01 |
JP5602685B2 (ja) | 2014-10-08 |
TWI469301B (zh) | 2015-01-11 |
KR101166575B1 (ko) | 2012-07-18 |
TW201017853A (en) | 2010-05-01 |
JP2011181971A (ja) | 2011-09-15 |
TWI378548B (en) | 2012-12-01 |
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