TWI305237B - Pretreatment agent for electroless plating and copper clad laminate for a flexible circuit board - Google Patents
Pretreatment agent for electroless plating and copper clad laminate for a flexible circuit board Download PDFInfo
- Publication number
- TWI305237B TWI305237B TW94129458A TW94129458A TWI305237B TW I305237 B TWI305237 B TW I305237B TW 94129458 A TW94129458 A TW 94129458A TW 94129458 A TW94129458 A TW 94129458A TW I305237 B TWI305237 B TW I305237B
- Authority
- TW
- Taiwan
- Prior art keywords
- copper
- pretreatment agent
- electroless plating
- electroless
- clad laminate
- Prior art date
Links
- 229910052802 copper Inorganic materials 0.000 title claims description 29
- 239000010949 copper Substances 0.000 title claims description 29
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims description 28
- 239000003795 chemical substances by application Substances 0.000 title claims description 28
- 238000007772 electroless plating Methods 0.000 title claims description 15
- 239000000758 substrate Substances 0.000 claims description 26
- 238000007747 plating Methods 0.000 claims description 22
- 229910052751 metal Inorganic materials 0.000 claims description 16
- 239000002184 metal Substances 0.000 claims description 16
- 229920005989 resin Polymers 0.000 claims description 12
- 239000011347 resin Substances 0.000 claims description 12
- DIOQZVSQGTUSAI-UHFFFAOYSA-N decane Chemical compound CCCCCCCCCC DIOQZVSQGTUSAI-UHFFFAOYSA-N 0.000 claims description 9
- 229920001187 thermosetting polymer Polymers 0.000 claims description 9
- 239000007822 coupling agent Substances 0.000 claims description 8
- 239000011248 coating agent Substances 0.000 claims description 6
- 238000000576 coating method Methods 0.000 claims description 6
- 238000009713 electroplating Methods 0.000 claims description 5
- 229920000647 polyepoxide Polymers 0.000 claims description 5
- 239000003822 epoxy resin Substances 0.000 claims description 4
- -1 amine compound Chemical class 0.000 description 15
- 238000000034 method Methods 0.000 description 15
- 150000001875 compounds Chemical class 0.000 description 14
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 12
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 8
- 230000032683 aging Effects 0.000 description 8
- 235000014113 dietary fatty acids Nutrition 0.000 description 8
- 239000000194 fatty acid Substances 0.000 description 8
- 229930195729 fatty acid Natural products 0.000 description 8
- 150000004665 fatty acids Chemical class 0.000 description 8
- 239000003960 organic solvent Substances 0.000 description 8
- 239000003054 catalyst Substances 0.000 description 7
- 230000000694 effects Effects 0.000 description 6
- 229910052500 inorganic mineral Inorganic materials 0.000 description 6
- 239000011707 mineral Substances 0.000 description 6
- 229910000510 noble metal Inorganic materials 0.000 description 6
- 229920001721 polyimide Polymers 0.000 description 6
- 239000000344 soap Substances 0.000 description 6
- 239000000243 solution Substances 0.000 description 6
- 150000001412 amines Chemical class 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- 229910052763 palladium Inorganic materials 0.000 description 5
- 210000003296 saliva Anatomy 0.000 description 5
- 239000002904 solvent Substances 0.000 description 5
- 239000002253 acid Substances 0.000 description 4
- 125000000217 alkyl group Chemical group 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- 125000004432 carbon atom Chemical group C* 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 238000002203 pretreatment Methods 0.000 description 4
- YIWUKEYIRIRTPP-UHFFFAOYSA-N 2-ethylhexan-1-ol Chemical compound CCCCC(CC)CO YIWUKEYIRIRTPP-UHFFFAOYSA-N 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical group [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 3
- 229910052799 carbon Chemical group 0.000 description 3
- 229910052739 hydrogen Inorganic materials 0.000 description 3
- 239000001257 hydrogen Substances 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 150000002736 metal compounds Chemical class 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- 150000002923 oximes Chemical class 0.000 description 3
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 3
- 239000011342 resin composition Substances 0.000 description 3
- 229910052707 ruthenium Inorganic materials 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- WRIDQFICGBMAFQ-UHFFFAOYSA-N (E)-8-Octadecenoic acid Natural products CCCCCCCCCC=CCCCCCCC(O)=O WRIDQFICGBMAFQ-UHFFFAOYSA-N 0.000 description 2
- KBPLFHHGFOOTCA-UHFFFAOYSA-N 1-Octanol Chemical compound CCCCCCCCO KBPLFHHGFOOTCA-UHFFFAOYSA-N 0.000 description 2
- KAESVJOAVNADME-UHFFFAOYSA-N 1H-pyrrole Natural products C=1C=CNC=1 KAESVJOAVNADME-UHFFFAOYSA-N 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 2
- LQJBNNIYVWPHFW-UHFFFAOYSA-N 20:1omega9c fatty acid Natural products CCCCCCCCCCC=CCCCCCCCC(O)=O LQJBNNIYVWPHFW-UHFFFAOYSA-N 0.000 description 2
- YPIFGDQKSSMYHQ-UHFFFAOYSA-N 7,7-dimethyloctanoic acid Chemical compound CC(C)(C)CCCCCC(O)=O YPIFGDQKSSMYHQ-UHFFFAOYSA-N 0.000 description 2
- QSBYPNXLFMSGKH-UHFFFAOYSA-N 9-Heptadecensaeure Natural products CCCCCCCC=CCCCCCCCC(O)=O QSBYPNXLFMSGKH-UHFFFAOYSA-N 0.000 description 2
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 2
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 2
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000005642 Oleic acid Substances 0.000 description 2
- ZQPPMHVWECSIRJ-UHFFFAOYSA-N Oleic acid Natural products CCCCCCCCC=CCCCCCCCC(O)=O ZQPPMHVWECSIRJ-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 206010036790 Productive cough Diseases 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 150000001335 aliphatic alkanes Chemical class 0.000 description 2
- 239000012298 atmosphere Substances 0.000 description 2
- 239000007795 chemical reaction product Substances 0.000 description 2
- 229910000365 copper sulfate Inorganic materials 0.000 description 2
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- NIHNNTQXNPWCJQ-UHFFFAOYSA-N fluorene Chemical compound C1=CC=C2CC3=CC=CC=C3C2=C1 NIHNNTQXNPWCJQ-UHFFFAOYSA-N 0.000 description 2
- 125000000524 functional group Chemical group 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 description 2
- QXJSBBXBKPUZAA-UHFFFAOYSA-N isooleic acid Natural products CCCCCCCC=CCCCCCCCCC(O)=O QXJSBBXBKPUZAA-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- WWZKQHOCKIZLMA-UHFFFAOYSA-N octanoic acid Chemical compound CCCCCCCC(O)=O WWZKQHOCKIZLMA-UHFFFAOYSA-N 0.000 description 2
- ZQPPMHVWECSIRJ-KTKRTIGZSA-N oleic acid Chemical compound CCCCCCCC\C=C/CCCCCCCC(O)=O ZQPPMHVWECSIRJ-KTKRTIGZSA-N 0.000 description 2
- 229920001568 phenolic resin Polymers 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- WGYKZJWCGVVSQN-UHFFFAOYSA-N propylamine Chemical compound CCCN WGYKZJWCGVVSQN-UHFFFAOYSA-N 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 210000003802 sputum Anatomy 0.000 description 2
- 208000024794 sputum Diseases 0.000 description 2
- CWZQYRJRRHYJOI-UHFFFAOYSA-N 1,1,1-trimethoxydecane Chemical compound CCCCCCCCCC(OC)(OC)OC CWZQYRJRRHYJOI-UHFFFAOYSA-N 0.000 description 1
- OWQPOVKKUWUEKE-UHFFFAOYSA-N 1,2,3-benzotriazine Chemical compound N1=NN=CC2=CC=CC=C21 OWQPOVKKUWUEKE-UHFFFAOYSA-N 0.000 description 1
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 1
- RSWGJHLUYNHPMX-UHFFFAOYSA-N 1,4a-dimethyl-7-propan-2-yl-2,3,4,4b,5,6,10,10a-octahydrophenanthrene-1-carboxylic acid Chemical compound C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- YRBRVMGXTWJLBZ-UHFFFAOYSA-N 1h-imidazole;1h-pyrrole Chemical compound C=1C=CNC=1.C1=CNC=N1 YRBRVMGXTWJLBZ-UHFFFAOYSA-N 0.000 description 1
- MFAWEYJGIGIYFH-UHFFFAOYSA-N 2-[4-(trimethoxymethyl)dodecoxymethyl]oxirane Chemical compound C(C1CO1)OCCCC(C(OC)(OC)OC)CCCCCCCC MFAWEYJGIGIYFH-UHFFFAOYSA-N 0.000 description 1
- HNNQYHFROJDYHQ-UHFFFAOYSA-N 3-(4-ethylcyclohexyl)propanoic acid 3-(3-ethylcyclopentyl)propanoic acid Chemical compound CCC1CCC(CCC(O)=O)C1.CCC1CCC(CCC(O)=O)CC1 HNNQYHFROJDYHQ-UHFFFAOYSA-N 0.000 description 1
- KHHHJNKHVZHHPJ-UHFFFAOYSA-N 3-(triazin-4-yl)propan-1-amine Chemical compound NCCCC1=NN=NC=C1 KHHHJNKHVZHHPJ-UHFFFAOYSA-N 0.000 description 1
- JBMKAUGHUNFTOL-UHFFFAOYSA-N Aldoclor Chemical class C1=C(Cl)C(S(=O)(=O)N)=CC2=C1NC=NS2(=O)=O JBMKAUGHUNFTOL-UHFFFAOYSA-N 0.000 description 1
- FMMWHPNWAFZXNH-UHFFFAOYSA-N Benz[a]pyrene Chemical compound C1=C2C3=CC=CC=C3C=C(C=C3)C2=C2C3=CC=CC2=C1 FMMWHPNWAFZXNH-UHFFFAOYSA-N 0.000 description 1
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 description 1
- JNXPZTZMHOPJEN-UHFFFAOYSA-N C(C)NCCCC(C(OCC)(OCC)OCC)CCCCCCCC Chemical compound C(C)NCCCC(C(OCC)(OCC)OCC)CCCCCCCC JNXPZTZMHOPJEN-UHFFFAOYSA-N 0.000 description 1
- XRNDMACZMJPCRX-UHFFFAOYSA-N C(CC)C(C(OCC)(OCC)OCC)CCCCCCCC Chemical compound C(CC)C(C(OCC)(OCC)OCC)CCCCCCCC XRNDMACZMJPCRX-UHFFFAOYSA-N 0.000 description 1
- CDGLXCKEWXINMF-UHFFFAOYSA-N C(CC)C(CCCCCCCCC)OCCCCCCCCCCCCC Chemical compound C(CC)C(CCCCCCCCC)OCCCCCCCCCCCCC CDGLXCKEWXINMF-UHFFFAOYSA-N 0.000 description 1
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 235000005135 Micromeria juliana Nutrition 0.000 description 1
- 241000237503 Pectinidae Species 0.000 description 1
- 206010039424 Salivary hypersecretion Diseases 0.000 description 1
- 241000246354 Satureja Species 0.000 description 1
- 235000007315 Satureja hortensis Nutrition 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 235000021355 Stearic acid Nutrition 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 229920001646 UPILEX Polymers 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 150000001338 aliphatic hydrocarbons Chemical class 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- OBETXYAYXDNJHR-UHFFFAOYSA-N alpha-ethylcaproic acid Natural products CCCCC(CC)C(O)=O OBETXYAYXDNJHR-UHFFFAOYSA-N 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 150000004982 aromatic amines Chemical class 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- UHOVQNZJYSORNB-UHFFFAOYSA-N benzene Substances C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 1
- 150000004649 carbonic acid derivatives Chemical class 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 150000002009 diols Chemical class 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 125000000816 ethylene group Chemical group [H]C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 150000004679 hydroxides Chemical class 0.000 description 1
- YAQXGBBDJYBXKL-UHFFFAOYSA-N iron(2+);1,10-phenanthroline;dicyanide Chemical compound [Fe+2].N#[C-].N#[C-].C1=CN=C2C3=NC=CC=C3C=CC2=C1.C1=CN=C2C3=NC=CC=C3C=CC2=C1 YAQXGBBDJYBXKL-UHFFFAOYSA-N 0.000 description 1
- 150000002601 lanthanoid compounds Chemical class 0.000 description 1
- 238000005649 metathesis reaction Methods 0.000 description 1
- WQEPLUUGTLDZJY-UHFFFAOYSA-N n-Pentadecanoic acid Natural products CCCCCCCCCCCCCCC(O)=O WQEPLUUGTLDZJY-UHFFFAOYSA-N 0.000 description 1
- 125000005608 naphthenic acid group Chemical group 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- 125000001820 oxy group Chemical group [*:1]O[*:2] 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 125000000864 peroxy group Chemical group O(O*)* 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
- 239000001397 quillaja saponaria molina bark Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 208000026451 salivation Diseases 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 229930182490 saponin Natural products 0.000 description 1
- 150000007949 saponins Chemical class 0.000 description 1
- 235000003441 saturated fatty acids Nutrition 0.000 description 1
- 150000004671 saturated fatty acids Chemical class 0.000 description 1
- 229930195734 saturated hydrocarbon Natural products 0.000 description 1
- 235000020637 scallop Nutrition 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 239000011343 solid material Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 210000002784 stomach Anatomy 0.000 description 1
- 229940124530 sulfonamide Drugs 0.000 description 1
- 150000003456 sulfonamides Chemical class 0.000 description 1
- 150000003467 sulfuric acid derivatives Chemical class 0.000 description 1
- 150000003535 tetraterpenes Chemical class 0.000 description 1
- 235000009657 tetraterpenes Nutrition 0.000 description 1
- 239000003451 thiazide diuretic agent Substances 0.000 description 1
- 150000003648 triterpenes Chemical class 0.000 description 1
- 229930195735 unsaturated hydrocarbon Natural products 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 229910052727 yttrium Inorganic materials 0.000 description 1
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
- C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1635—Composition of the substrate
- C23C18/1639—Substrates other than metallic, e.g. inorganic or organic or non-conductive
- C23C18/1641—Organic substrates, e.g. resin, plastic
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2073—Multistep pretreatment
- C23C18/208—Multistep pretreatment with use of metal first
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2073—Multistep pretreatment
- C23C18/2086—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
- H05K3/387—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive for electroless plating
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- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/389—Improvement of the adhesion between the insulating substrate and the metal by the use of a coupling agent, e.g. silane
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
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Description
1305237 九、發明說明： 【發明所屬之技術領域】 本發明係有關用於作為印刷配線用可撓性基板的原料 等之覆銅積層體之基材的無電解鑛覆（electroless -Plating)前處理劑’及使用該前處理劑所製造的可撓性基 板用覆銅積層體（copper clad laminate)。 【先前技術】 φ 聚醯亞胺基板多用來作為電子零件用的絕緣基板材 料。近來隨著電子機器的薄型化、小型化，於聚醯亞胺薄 膜上升y成直接金屬層之有更高自由度的2層銅聚醯亞胺基 板已文到注目，此基板之聚醯亞胺薄膜與金屬層在常態下 ^刀期黏著力雖然已達到實用程度，但是耐熱、高溫高濕 環境下的黏著力等特性仍然不穩定。 再者’關於聚醯亞胺薄膜之可撓性覆銅積層板，例如 =於專利文獻！的是藉由濺鑛法製造金屬層的方法。但 的黏^的成本^ ’而且無法滿足耐熱、高溫高濕環境下 用以提高聚醯亞胺薄膜盥冬厘 有電漿法、UV法等黏著性的方法雖然 等乾式衣程’驗法等渴式制 體的穩定性、作業性或過度處寺^衣考王，但所用液 凸不平，可At射 ' 在金屬層表面會有凹 再者，二=密配線的形成會造成不良影響。 ^ 專利文獻2中，p 9畨 形成樹脂組成匕6己戟於進行聚醯亞胺薄膜上 驟、觸媒活彳卜牛挪 „ 復勝居化步驟、觸媒賦與步 力驟、無電解金屬錢覆步驟之5步驟所成的 317361 5 1305237 無電解鍍銅之後，進行電鍍銅的方法。此方法係以生成作 為黏著賦與層之樹脂組成物層為主題，其結果樹脂組成物 層的膜厚有1至2 0 μιη，但製程煩雜。 專利文獻1 :特開平9一136378號公報 專利文獻2 :特開2〇〇1_168496號公報 【發明内容】 [發明要解決的課題] φ 本發明之目的係提供基材與鍍銅層之常態下的初期黏 2力，及耐熱蝕刻試驗（大氣中，15(rc，168小時）下的黏 著力為0. 4kgf/cm以上之用於可撓性基板用覆銅積層體的 無電解鍍覆前處理液，及使用該無電解鑛覆前處理液所製 造的可撓性基板用之覆銅積層體。 本案發明針對上述課題致力探討的結果，發現藉由使 用含有具備金屬捕捉能力之石夕烧偶合劑（si lane coupnng agent)與熱固性樹脂的無電解鑛覆前處理劑作為可挽性基 籲㈣覆銅積層體的無電解鑛覆前處理劑，能解決上述課 題。亦即，本發明如下。 )用於可撓性基板用之覆銅積層體的無電解鍍覆前 理劑’其特徵為含有具備金屬捕捉能力之矽烷偶合劑盥 熱固性樹脂。
⑺如前述⑴記載的無電解鑛覆前處理 性樹脂為環氧樹脂。 /、T ”、、U ⑴二)「種可撓性基板用之覆銅積層體’其特徵為用前述 )或⑵記載的無電賴覆前處_處理基材之後，藉由 317361 6 l3〇5237 無電解鍍覆形成鍍銅鍍覆層，於該銅鍍覆 成鋼電鍍層。 θ上错由電鍍形 使用本發明之無電解鑛覆前處理劑處理爲 層無電解鍍銅層及電解鍍銅層而成的可撓性：用 積層體，係基材與鍍銅層之常態下的初期黏 覆銅 蝕刻試驗（大氣中，15(rc，168小時）下的黏著力為及耐熱 ==上，且為黏附性優異的2層覆鋼可撓性基板 之覆銅積層體。能賦予基材表面完全 處理的黏著力。 &進仃乾式、濕式前 【實施方式】 力之覆前處理劑是含有具備金屬捕捉能 刀之石夕烷偶合劑與熱固性樹脂。 透過添加具有金屬捕捉能力之矽烷偶合劑， 烷偶合劑使貴全屬觸搵# M ^ 此猎由石夕 义，貝金屬觸媒更均勻、更確實地固定於被鑛面。 前述石夕燒偶合劑，較佳者為藉由嗤系化合物（扣^ • compounds)或胺化合物與環氧系化合物之反應而得到者。 唑系化合物列舉有咪唾、曙唾、嚷唾、碼唾 、 異，坐、異噻唾、三嗤、曙二唾、噻二唾、四咕、嗜三唾、
St策五：+坐、苯并咪唾、苯并三唾等。並非限制 有此等化合物，但以咪唑為特佳。 .再者胺化合物可列舉如丙胺等飽和烴胺，乙稀胺 (vinyl amine)等不飽和烴胺，苯胺等芳胺等。 再者’前述石夕烧偶合劑，除了來自前述唾系化合物或 胺化合物的貴金屬捕捉基以外，還有具有一 MW基的 317361 7 1305237 化合物，Xl、X2、Xa意指烷基、鹵素或烷氧基等，只要是 可固定被鍍物的官能基就好。Χι、X2、X3可為相同或相異 者。 前述矽烷偶合劑，可藉由使前述唑系化合物或胺化合 -物與環氡矽烷化合物反應而得。 - 這類環氧矽烷化合物係以 [化1] • C\^>CH'CH2° (°Η2)3 Si (OR^a R2(3~n) (式中，R]、R2為氫或碳數1至3的烷基，n為〇至3)所示 之％氧偶合劑較佳。 前述唾系化合物與前述含有環氧基之石夕燒化合物的反 應’例如可在特開平6一256358號公報所記載的條件下進 干〇 合物;:::.=:8二至20rc下，對於1莫耳的嗤系化 反應5分鐘之含有環氧基的錢化合物，使其 可使用氣仿、二庐J而# ’尤其不需要溶劑’但也 特佳之實；二醇、乙醇等有機溶劑。 物之反應。 下相示㈣化合物與環氧我系化合 [化2] 317361 8 1305237
CH2CHCH20(CH2)3S i (OR^R'、
CH2CHCH20(CH2)3S i (OR^nR2^. OH (式中，Rl、R2表示氫或碳數1至3的烷基，R3表示氫 或碳數1至20的燒基，R4表示乙稀基或碳數1至5的烷基， η表示〇至3。） 本發明中所使用之含有具備金屬捕捉能力官能基之矽 ^偶°劑的其他實例’列舉有γ-胺基丙基三曱氧基石夕烧、γ- 胺土丙基一乙氧基矽烷、胺乙基）γ一胺基丙基三曱氧基 f二Ν β(胺乙基胺基丙基三乙氧基矽烷、毓醇基丙 基三曱氧基矽烷等。 與士 =於本^明之無電解鑛覆前處理劑的熱固性樹脂，列 舉有環氧樹脂、爲1 素祕知、酚醛樹脂、三聚氰胺樹脂、聚 由？力:熱固性樹脂以提高黏著力。使用環 因此較佳I、、固^料’黏著力提高的效果特別顯著， 本發明中，於無電解轳瓔命 金屬化合物。於本鑛覆==理劑内不-定要含有責 水溶液能得到…Γ 劑浸潰後’浸潰於氣化鈀 令饮月匕侍到鍍覆活性。 化合物等觸媒者更佳。心復河處理劑以含有貴金屬 、 觸媒可列舉鈀、銀、鉑、金等貴金 317361 9 1305237 等貴金屬之齒化物、氫氧化物、硫酸鹽 往的氣化錫等觸媒也可化合物較佳。再者’以 主 于卿跺也了包含在本發明之目的範圍内。 仆入11屬皂可藉由脂肪酸、樹脂酸或環㈣，與貴金屬 化合物的反應而得，能較佳地用於本發明中。金屬 脂肪酸係以碳原子數5至25者為較佳，更佳者 至、Γ。脂肪酸的碳數為4以下時，在有機溶劑中會變得難 ^ 而變得不穩定。再者，碳原子數在26以上時，會 限疋對於有機溶劑的可玄八 τ會 變多而不實用。合刀貝金屬含量降低會使添加量 前^旨肪酸可列舉如辛酸、新癸酸、十二㈣、十五 …十八烷酸等飽和脂肪酸，油酸 肪酸’經基十四炫酸、敌基癸酸等含氧胞肪酸=;°: 肪酸的混合物。 寺月曰 再者，前述脂肪酸、樹脂酸、環烷 者’可列“環烷酸、辛酸、新癸酸、十五烷酸等 物=者别述貝金屬化合物可為自無電解鍍覆液於被鑛 =上析出銅或鎳等之際表現出觸媒效果的！巴、銀、始、 、’：'之齒化物、氫氧化物、硫酸鹽、碳酸鹽等化合物，盥 =肪酸等形成肥皂所得到的化合物，特別是以在巴化合物較 佳。 主入Ϊ發明中使用的貴金屬息可藉由前述脂肪酸等與前述 =屬化合物之複分解法、直接法等金屬皂製造法 方法而得。 317361 10 1305237 示之環烷酸 本發明中使用的貴金屬皂較佳為下述所 把。 [化3] (CH2)nC〇〇
Pd η = 9至13的混合物 環烷酸鈀的構造式 :發明中使用的前述貴金屬矣在有機溶劑中有可容 ^己穩定者。這類有機溶劑可列舉如丁醇、2 乙基己醇、辛醇等醇，二f苯等芳族烴， 氯仿、二噚烷等。 荨知無烴’ 本發明之無電解鍍㈣處_，係 ，屬捕捉能力的錢偶合劑、熱固性樹脂、=有= 解於例如丁醇、2_乙基已醇、辛醇轉類，二屬 埋’己燒等脂族烴，氣仿、二曙炫等有機溶劑者Γ方1 無電解鍍覆前處理劑中且有全屬捕 劑的濃ί屬捕I力切燒偶合 佳韻至請1至1G重量％為 著於A材夺“ 不足〇.°01重量%時，容易使黏 者於基材表面的化合物量降低，而難以得到效果。再去 超過10重！%時，黏著量過多變得難以乾 末凝集。 谷易發生粉 317361 11 1305237 無屯解鑛覆月il處理劑中之熱固性樹脂濃度係以〇. 〇〇1 至30重量/β為佳，〇. 05至10重量％更佳。比0. 001重量％ ^少時沒有效果’超過30重量％時，由於液體黏度變得太 尚，因此鑛覆會出現不勻稱。 再者，貝金屬皂於無電解鍍覆前處理劑的溶液中，可 使用1至30000mg/L ’較佳為5〇至1〇〇〇〇mg/L的濃度（貴 金屬換算）。 本發明之可撓性基板用覆銅積層體的基材，較佳為使 用各種聚酸亞胺薄膜、PET等。聚醯亞胺薄膜例如Kapton 箄，PpHi〇H C〇· Ud.製造）、UpileX(宇部興產製造） 、 ，牛有 Lumilar (Toray Co·，Ltd.製造）。 〜主用無，解鍍覆前處理劑處理基材的方法，一般而言有 而4方法，在此並沒有限定，然 而八要疋使别處理劑黏著於表面上的方法就好。 ” 後使所用的溶劑揮發時’加熱至此溶劑揮發 Γ至度=/:燥就很好，進-步㈣至_下加熱 至2〇^=發明之無電解鍍覆前處理劑層的膜厚係以1 本發明之可撓性基板之覆 前為止所述之前處理，藉由常體係於基材上施加目 ，層：進-步藉由常用方法之電鍍形成物：法= 來，糟由本發明能得到均勾、 田者。如此 用之覆銅積層體。 優異的可撓性基板 317361 12 1305237 實施例 以下藉由實施例進一步詳細說明本發明。 實施例1 於市售聚醯亞胺薄膜Kapton (200H，Du P〇nt-Toray —Co.，Ltd.製造）表面上塗布含有ig/L之咪唑矽烷（咪唑與 -3_環氧丙氧丙基三甲氧基矽烷的等莫耳反應產物）與 〇.5g/L(Pd 換算 l〇〇mg/L)之 Pd 皂（環烷酸鈀，Nikk〇 籲 Materials Co. Ltd·製造）與 lg/L 之環氧樹脂（Epic〇at EP828，Japan epoxy resin Co.，Ltd·製造）的有機溶劑（丁 醇）系無電解鍍覆前處理劑。於15(TC下除去溶劑，形成膜 厚70nra的前處理劑層之後，藉由無電解鍍銅（錢覆液： NKM554 ’ Nikko Metal Plating Co· Ltd.製造）形成膜厚 0·5μιη的鍍銅層，接著於電流密度2A/dm2下進行電鍵銅（鍍 覆液.硫酸銅系，Nikko Metal Plating Co. Ltd 製造）， 形成膜厚35μιη的鍍銅層。分別測定該鍍銅層在常態下的 #剝離強度’其後在空氣中於150°C老化168小時後的剝離 強度。剝離強度係根據JIS C-6481為基準的90度剝離試 驗。在以下的實施例、比較例中也相同。結果如表1，老 化後的強度也顯示出有〇. 7kgf/cm的高數值。 實施例2 於市售聚醯亞胺薄膜Kapton (200H，Du Pont-Toray Co.，Ltd.製造）表面上塗布含有lg/L之咪唑矽烷米唑與 3-環氧丙氧丙基三甲氧基矽烷的等莫耳反應產物）與 0· 5g/L(Pd 換算 100mg/L)之 Pd 皂（環烷酸鈀，Nikko 317361 ⑧ 1305237
Materials Co. Ltd.製造）與2g/L之酚醛樹脂（χιχ_礼’ 三井化學公司製造）的有機溶劑（丁醇）系無電解鍍覆前處 理劑。於15(TC下除去溶劑，形成膜厚7〇nm的前處理劑層 之後，藉由無電解鍍銅（鍍覆液：NKM554，Nikk〇 _ Plating Co. Ltd.製造）形成臈厚〇 5μιη的鍍銅層，接著 進行電鍍銅（鍍覆液：硫酸銅系，Nikk〇Metal piatingCQ.
Ltd.製造）’形成膜厚35μιη的鍍銅層。分別測定該鍍銅層 在常態下的剝離強度，其後在空氣中於15〇。〇老化ΐ6δ小 胃時後的剝離強度。 實施例3 除了使用代替實施例i之味唾石夕烧的胺基石夕燒胺 基丙基三乙氧基矽烷’信越化學公司製造)以外，其餘 施例1同樣地進行處理、試驗。結果如表i，老化後的強 度也顯不出有〇· 4kgf/cm的高數值。 比較例1 鲁❺了不含每氧樹脂以外，其餘與實施例1同樣地進行 處理武驗。結果如表卜雖然初期剝離強度高達 0· 9kgf /Cm，但老化後的剝離強度下降到0· 1 kgf /cm這麼 比較例 藉由歲鑛法形成〇. &μιη之銅晶種層後，與實施例 樣電鑛銅形成3_的锻銅層，與實施例1同樣地進 :丁二^果如表1 ’雖然初期剝離強度高達〇. 9kgf/cm 但老化之後卻變低。 g /cm ’ 317361 Γδ> 14 1305237 [表1] 初期剝離強度 (kgf/cm) 而寸熱老化試驗 剝離強度（kgf/cm) 實施例1 0. 9 0. 7 實施例2 0.8 0. 6 實施例3 0.6 0. 4 比較例1 0. 9 0.1 比較例2 0. 9 0. 1 【圖式簡單說明】 無
15 317361 ⑧
Claims (1)
- 1305237 、申凊專利範圍： h :種無電解鍍覆前處理劑，其係用於可撓性基板用之 :銅積層體基材’其特徵為含有具備金屬捕捉能力之 矽烷偶合劑與熱固性樹脂。 4 2.:申請專利範圍第！項之無電解鍍覆前處理劑，1中 .熱固性樹脂為環氧樹脂。 ’、 3. 撓性基板用之覆銅積層體，其特徵為用申請專 =㈣第W2項之無電解鍍覆前處理劑處理基材之 ^由：由無電解鐘覆形成銅鍍覆層’於該鋼錢覆層上 耩由電鍍形成銅電鍍層。317361 16
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| JP (2) | JP4859232B2 (zh) |
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| WO2005044931A1 (ja) * | 2003-11-05 | 2005-05-19 | Nikko Materials Co., Ltd. | インクジェット用インク組成物 |
| US7713340B2 (en) * | 2004-01-29 | 2010-05-11 | Nippon Mining & Metals Co., Ltd. | Pretreating agent for electroless plating, method of electroless plating using the same and product of electroless plating |
| JP2008007849A (ja) * | 2006-06-01 | 2008-01-17 | Nippon Paint Co Ltd | 無電解めっき用プライマー組成物及び無電解めっき方法 |
| JP5092391B2 (ja) * | 2006-12-22 | 2012-12-05 | 富士通株式会社 | 樹脂筐体及びその製造方法 |
| JP2008210892A (ja) * | 2007-02-23 | 2008-09-11 | Sekisui Chem Co Ltd | 電磁波遮蔽材料の製造方法、及び、電磁波遮蔽材料 |
| CN101688308B (zh) * | 2007-07-02 | 2012-10-10 | 荏原优莱特科技股份有限公司 | 金属层叠聚酰亚胺底座及其制造方法 |
| DE102007051930A1 (de) | 2007-10-29 | 2009-04-30 | Leonhard Kurz Gmbh & Co. Kg | Verfahren zur Herstellung einer Leiterbahnstruktur |
| KR20090067744A (ko) | 2007-12-21 | 2009-06-25 | 엘지전자 주식회사 | 연성 필름 |
| KR100947608B1 (ko) | 2007-12-28 | 2010-03-15 | 엘지전자 주식회사 | 연성 필름 |
| KR100965327B1 (ko) * | 2008-02-28 | 2010-06-22 | 엘에스엠트론 주식회사 | 진동특성이 개선된 연성 동장적층판 |
| JP5404452B2 (ja) * | 2010-01-28 | 2014-01-29 | 京セラ株式会社 | 配線基板の製造方法及び配線基板 |
| WO2011118439A1 (ja) * | 2010-03-23 | 2011-09-29 | Jx日鉱日石金属株式会社 | 無電解めっき前処理剤、それを用いる無電解めっき方法及び無電解めっき物 |
| JP6020833B2 (ja) * | 2011-04-12 | 2016-11-02 | 日産化学工業株式会社 | ハイパーブランチポリマー及び金属微粒子を含む無電解めっき下地剤 |
| US9499912B2 (en) | 2014-05-26 | 2016-11-22 | Rohm And Haas Electronic Materials Llc | Copolymers of diglycidyl ether terminated polysiloxane compounds and non-aromatic polyamines |
| JP6352059B2 (ja) * | 2014-06-05 | 2018-07-04 | 奥野製薬工業株式会社 | 無電解めっき下地層形成用組成物 |
| JP6578204B2 (ja) * | 2014-12-29 | 2019-09-18 | 四国化成工業株式会社 | 表面処理剤、樹脂組成物及びそれらの利用 |
| CN104789949B (zh) * | 2015-04-27 | 2017-03-01 | 电子科技大学 | 自催化化学镀铜环氧树脂溶液的配置方法及化学镀铜方法 |
| ES2646237B2 (es) | 2017-09-28 | 2018-07-27 | Avanzare Innovacion Tecnologica S.L. | Formulación para el mordentado de materiales poliméricos previo al recubrimiento de los mismos |
| CN110527990B (zh) * | 2019-09-04 | 2022-05-24 | 中国科学院深圳先进技术研究院 | 一种改性剂、带有金属层的玻璃基底及其制备方法和应用 |
| KR102538130B1 (ko) * | 2021-01-26 | 2023-05-30 | 도레이첨단소재 주식회사 | 동박적층필름, 이를 포함하는 전자소자, 및 상기 동박적층필름의 제조방법 |
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| JPS62250086A (ja) * | 1986-04-22 | 1987-10-30 | Nippon Soda Co Ltd | 無電解メツキ用下地接着剤 |
| JPS6429479A (en) * | 1987-07-23 | 1989-01-31 | Ibiden Co Ltd | Adhesive composition for electroless plating |
| DE4036591A1 (de) * | 1990-11-16 | 1992-05-21 | Bayer Ag | Primer zum metallisieren von substratoberflaechen |
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| JPH06334334A (ja) * | 1993-05-20 | 1994-12-02 | Sumitomo Bakelite Co Ltd | プリント配線板の製造方法 |
| JP2751881B2 (ja) * | 1995-08-02 | 1998-05-18 | 有限会社さくらホビークラフト | 装飾体の製作方法 |
| CN1195099C (zh) * | 1998-07-07 | 2005-03-30 | 株式会社日矿材料 | 金属镀覆的前处理剂和使用该前处理剂的金属镀覆方法 |
| US6440576B1 (en) * | 1999-02-03 | 2002-08-27 | Ube Industries, Ltd. | Metal plated aromatic polyimide film |
| JP2001303254A (ja) * | 2000-04-24 | 2001-10-31 | Mitsuboshi Belting Ltd | ガラス基板表面のパターンメッキ方法及びパターンメッキしたガラス基板 |
| KR100495164B1 (ko) * | 2000-04-25 | 2005-06-14 | 가부시키 가이샤 닛코 마테리알즈 | 도금 전처리제 및 그것을 사용한 금속도금 방법 |
| JPWO2003091476A1 (ja) * | 2002-04-23 | 2005-09-02 | 株式会社日鉱マテリアルズ | 無電解めっき方法及び金属めっき層が形成された半導体ウエハー |
| WO2005044931A1 (ja) * | 2003-11-05 | 2005-05-19 | Nikko Materials Co., Ltd. | インクジェット用インク組成物 |
| US7713340B2 (en) * | 2004-01-29 | 2010-05-11 | Nippon Mining & Metals Co., Ltd. | Pretreating agent for electroless plating, method of electroless plating using the same and product of electroless plating |
-
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- 2005-08-22 WO PCT/JP2005/015228 patent/WO2006027947A1/ja active Application Filing
- 2005-08-22 JP JP2006535103A patent/JP4859232B2/ja active Active
- 2005-08-22 US US11/662,046 patent/US20070269680A1/en not_active Abandoned
- 2005-08-22 KR KR20077008060A patent/KR20070088611A/ko not_active Application Discontinuation
- 2005-08-29 TW TW94129458A patent/TWI305237B/zh active
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| KR20070088611A (ko) | 2007-08-29 |
| US20070269680A1 (en) | 2007-11-22 |
| TW200619418A (en) | 2006-06-16 |
| WO2006027947A1 (ja) | 2006-03-16 |
| JP2012007244A (ja) | 2012-01-12 |
| JPWO2006027947A1 (ja) | 2008-07-31 |
| JP4859232B2 (ja) | 2012-01-25 |
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