TWI286563B - Resin composition and protective film - Google Patents
Resin composition and protective film Download PDFInfo
- Publication number
- TWI286563B TWI286563B TW092112983A TW92112983A TWI286563B TW I286563 B TWI286563 B TW I286563B TW 092112983 A TW092112983 A TW 092112983A TW 92112983 A TW92112983 A TW 92112983A TW I286563 B TWI286563 B TW I286563B
- Authority
- TW
- Taiwan
- Prior art keywords
- copolymer
- protective film
- component
- weight
- acid
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
- C08L33/04—Homopolymers or copolymers of esters
- C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
- C08L33/062—Copolymers with monomers not covered by C08L33/06
- C08L33/068—Copolymers with monomers not covered by C08L33/06 containing glycidyl groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
- C08L83/06—Polysiloxanes containing silicon bound to oxygen-containing groups
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
- C09D163/10—Epoxy resins modified by unsaturated compounds
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Optical Filters (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002138240 | 2002-05-14 | ||
JP2002213816A JP3797288B2 (ja) | 2002-07-23 | 2002-07-23 | 樹脂組成物および保護膜 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200401002A TW200401002A (en) | 2004-01-16 |
TWI286563B true TWI286563B (en) | 2007-09-11 |
Family
ID=29552274
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW092112983A TWI286563B (en) | 2002-05-14 | 2003-05-13 | Resin composition and protective film |
Country Status (3)
Country | Link |
---|---|
KR (1) | KR100954044B1 (ko) |
CN (2) | CN1311037C (ko) |
TW (1) | TWI286563B (ko) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100365083C (zh) * | 2002-09-19 | 2008-01-30 | 住友化学工业株式会社 | 硬化性树脂组成物及其保护膜 |
CN101328298B (zh) * | 2004-11-26 | 2012-03-07 | Jsr株式会社 | 共聚物、树脂组合物、保护膜及保护膜的形成方法 |
KR100789590B1 (ko) * | 2005-01-25 | 2007-12-28 | 주식회사 엘지화학 | 보존 안정성이 우수한 열경화성 수지 조성물 |
JP4979963B2 (ja) * | 2006-03-10 | 2012-07-18 | 株式会社Adeka | 光学材料用硬化性組成物及び光導波路 |
JP5354207B2 (ja) * | 2007-03-26 | 2013-11-27 | Jsr株式会社 | 硬化性樹脂組成物、保護膜および保護膜の形成方法 |
CN103443707A (zh) * | 2011-03-30 | 2013-12-11 | 日本瑞翁株式会社 | 树脂组合物和半导体元件基板 |
US20140087136A1 (en) * | 2011-06-01 | 2014-03-27 | Zeon Corporation | Resin composition and semiconductor device board |
JP6921963B2 (ja) * | 2017-03-31 | 2021-08-18 | 東友ファインケム株式会社Dongwoo Fine−Chem Co., Ltd. | 青色感光性樹脂組成物、これを用いて製造されたカラーフィルタおよび画像表示装置 |
CN107974208A (zh) * | 2017-12-12 | 2018-05-01 | 苏州铂邦胶业有限公司 | 一种快速固化的硅酮密封胶及其制备方法 |
KR102414398B1 (ko) * | 2020-03-26 | 2022-06-28 | 주식회사 위드로드 | 인삼 수경 재배용 배드 및 이를 이용한 수경 재배방법 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3074850B2 (ja) * | 1991-09-20 | 2000-08-07 | ジェイエスアール株式会社 | 保護膜材料 |
US5376706A (en) * | 1992-11-17 | 1994-12-27 | E. I. Du Pont De Nemours And Company | Anhydride epoxy coating composition modified with a silane polymer |
US5728779A (en) * | 1992-12-01 | 1998-03-17 | Dsm N.V. | Powder paint of epoxy-reactive polymer and aliphatic chain-containing polyepoxide |
CN1147868A (zh) * | 1995-03-13 | 1997-04-16 | 互応化学工业株式会社 | 感光性树脂组合物及其用于涂膜、抗蚀印色、抗蚀保护膜、焊料抗蚀保护膜和印刷电路基片 |
JP3825506B2 (ja) * | 1996-09-02 | 2006-09-27 | Jsr株式会社 | 液状硬化性樹脂組成物 |
JPH11131013A (ja) * | 1997-10-31 | 1999-05-18 | Hitachi Chem Co Ltd | カラーフィルタ保護膜用樹脂組成物およびこれを用いたカラーフィルタ保護膜並びにカラーフィルタ |
JP4350832B2 (ja) * | 1999-04-19 | 2009-10-21 | Jsr株式会社 | 立体造形用光硬化性樹脂組成物およびこれを硬化してなる造形物 |
JP2000344866A (ja) | 1999-06-07 | 2000-12-12 | Jsr Corp | 平坦化膜用硬化性組成物および平坦化膜 |
TWI250996B (en) | 1999-09-01 | 2006-03-11 | Jsr Corp | Curable composition and color filter protective film |
-
2003
- 2003-05-13 KR KR1020030030092A patent/KR100954044B1/ko active IP Right Grant
- 2003-05-13 TW TW092112983A patent/TWI286563B/zh not_active IP Right Cessation
- 2003-05-14 CN CNB2005100712083A patent/CN1311037C/zh not_active Expired - Fee Related
- 2003-05-14 CN CNB031312861A patent/CN1246402C/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CN1458209A (zh) | 2003-11-26 |
KR100954044B1 (ko) | 2010-04-20 |
KR20030088356A (ko) | 2003-11-19 |
TW200401002A (en) | 2004-01-16 |
CN1246402C (zh) | 2006-03-22 |
CN1311037C (zh) | 2007-04-18 |
CN1683461A (zh) | 2005-10-19 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |