TWD191626S - 物理氣相沉積室靶 - Google Patents

物理氣相沉積室靶

Info

Publication number
TWD191626S
TWD191626S TW106301373D01F TW106301373D01F TWD191626S TW D191626 S TWD191626 S TW D191626S TW 106301373D01 F TW106301373D01 F TW 106301373D01F TW 106301373D01 F TW106301373D01 F TW 106301373D01F TW D191626 S TWD191626 S TW D191626S
Authority
TW
Taiwan
Prior art keywords
target
vapor deposition
physical vapor
deposition chamber
case
Prior art date
Application number
TW106301373D01F
Other languages
English (en)
Chinese (zh)
Inventor
萊克馬丁李
張富宏
王曉東
Original Assignee
應用材料股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 應用材料股份有限公司 filed Critical 應用材料股份有限公司
Publication of TWD191626S publication Critical patent/TWD191626S/zh

Links

TW106301373D01F 2016-09-30 2017-03-17 物理氣相沉積室靶 TWD191626S (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US29/579,470 2016-09-30
US29/579,470 USD836572S1 (en) 2016-09-30 2016-09-30 Target profile for a physical vapor deposition chamber target

Publications (1)

Publication Number Publication Date
TWD191626S true TWD191626S (zh) 2018-07-11

Family

ID=61066246

Family Applications (2)

Application Number Title Priority Date Filing Date
TW106301373D01F TWD191626S (zh) 2016-09-30 2017-03-17 物理氣相沉積室靶
TW106301373F TWD188898S (zh) 2016-09-30 2017-03-17 物理氣相沉積室靶

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW106301373F TWD188898S (zh) 2016-09-30 2017-03-17 物理氣相沉積室靶

Country Status (3)

Country Link
US (2) USD836572S1 (enrdf_load_stackoverflow)
JP (2) JP1596742S (enrdf_load_stackoverflow)
TW (2) TWD191626S (enrdf_load_stackoverflow)

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TWD202101S (zh) 2018-03-09 2020-01-11 美商應用材料股份有限公司 用於物理氣相沉積腔室靶材的靶材輪廓
USD888903S1 (en) 2018-12-17 2020-06-30 Applied Materials, Inc. Deposition ring for physical vapor deposition chamber
TWD212866S (zh) 2020-05-20 2021-07-21 美商應用材料股份有限公司 可替換基板載具接面膜
TWD214766S (zh) 2019-08-26 2021-10-21 美商應用材料股份有限公司 用於物理氣相沉積腔室的濺射靶
US11961723B2 (en) 2018-12-17 2024-04-16 Applied Materials, Inc. Process kit having tall deposition ring for PVD chamber
USD1027120S1 (en) 2020-12-17 2024-05-14 Applied Materials, Inc. Seal for an assembly in a vapor deposition chamber

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Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD202101S (zh) 2018-03-09 2020-01-11 美商應用材料股份有限公司 用於物理氣相沉積腔室靶材的靶材輪廓
TWD203691S (zh) 2018-03-09 2020-04-01 美商應用材料股份有限公司 用於物理氣相沉積腔室靶材的靶材輪廓
USD888903S1 (en) 2018-12-17 2020-06-30 Applied Materials, Inc. Deposition ring for physical vapor deposition chamber
TWD207532S (zh) 2018-12-17 2020-10-01 美商應用材料股份有限公司 Pvd腔的沉積環
TWD209650S (zh) 2018-12-17 2021-02-01 美商應用材料股份有限公司 Pvd腔的沉積環
US11961723B2 (en) 2018-12-17 2024-04-16 Applied Materials, Inc. Process kit having tall deposition ring for PVD chamber
USD1040304S1 (en) 2018-12-17 2024-08-27 Applied Materials, Inc. Deposition ring for physical vapor deposition chamber
TWD214766S (zh) 2019-08-26 2021-10-21 美商應用材料股份有限公司 用於物理氣相沉積腔室的濺射靶
TWD212866S (zh) 2020-05-20 2021-07-21 美商應用材料股份有限公司 可替換基板載具接面膜
USD1027120S1 (en) 2020-12-17 2024-05-14 Applied Materials, Inc. Seal for an assembly in a vapor deposition chamber

Also Published As

Publication number Publication date
JP1599074S (enrdf_load_stackoverflow) 2018-03-05
USD836572S1 (en) 2018-12-25
TWD188898S (zh) 2018-03-01
JP1596742S (enrdf_load_stackoverflow) 2018-02-05
USD869409S1 (en) 2019-12-10

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