JP1638282S - - Google Patents

Info

Publication number
JP1638282S
JP1638282S JPD2018-20434F JP2018020434F JP1638282S JP 1638282 S JP1638282 S JP 1638282S JP 2018020434 F JP2018020434 F JP 2018020434F JP 1638282 S JP1638282 S JP 1638282S
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JPD2018-20434F
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JPD2018-20434F priority Critical patent/JP1638282S/ja
Priority to TW107306772F priority patent/TWD197468S/zh
Priority to US29/672,957 priority patent/USD920935S1/en
Application granted granted Critical
Publication of JP1638282S publication Critical patent/JP1638282S/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JPD2018-20434F 2018-09-20 2018-09-20 Active JP1638282S (enrdf_load_stackoverflow)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JPD2018-20434F JP1638282S (enrdf_load_stackoverflow) 2018-09-20 2018-09-20
TW107306772F TWD197468S (zh) 2018-09-20 2018-11-19 基板處理裝置用晶舟之部分
US29/672,957 USD920935S1 (en) 2018-09-20 2018-12-11 Boat for substrate processing apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JPD2018-20434F JP1638282S (enrdf_load_stackoverflow) 2018-09-20 2018-09-20

Publications (1)

Publication Number Publication Date
JP1638282S true JP1638282S (enrdf_load_stackoverflow) 2019-08-05

Family

ID=67474810

Family Applications (1)

Application Number Title Priority Date Filing Date
JPD2018-20434F Active JP1638282S (enrdf_load_stackoverflow) 2018-09-20 2018-09-20

Country Status (3)

Country Link
US (1) USD920935S1 (enrdf_load_stackoverflow)
JP (1) JP1638282S (enrdf_load_stackoverflow)
TW (1) TWD197468S (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1078667S1 (en) 2022-09-14 2025-06-10 Kokusai Electric Corporation Wafer support of semiconductor manufacturing apparatus

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102677319B1 (ko) * 2017-02-27 2024-06-24 미라이얼 가부시키가이샤 기판 수납 용기
USD937791S1 (en) * 2018-12-26 2021-12-07 Lg Chem, Ltd. Flexible printed circuit board for battery module
USD936025S1 (en) * 2018-12-26 2021-11-16 Lg Chem, Ltd. Flexible printed circuit board for battery module
TWD202895S (zh) * 2019-03-27 2020-02-21 家登精密工業股份有限公司 光罩盒組裝件
USD954666S1 (en) * 2019-05-03 2022-06-14 Lumileds Holding B.V. Flexible circuit board
JP1678278S (ja) * 2020-03-19 2021-02-01 基板処理装置用ボート
JP1731670S (enrdf_load_stackoverflow) * 2022-03-04 2022-12-08
JP1731674S (enrdf_load_stackoverflow) * 2022-05-30 2022-12-08
JP1731675S (enrdf_load_stackoverflow) * 2022-05-30 2022-12-08
JP1731673S (enrdf_load_stackoverflow) * 2022-05-30 2022-12-08
JP1741512S (enrdf_load_stackoverflow) * 2022-09-14 2023-04-11

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD655682S1 (en) * 2010-06-18 2012-03-13 Hitachi Kokusai Electric Inc. Boat of wafer processing apparatus
USD655255S1 (en) * 2010-06-18 2012-03-06 Hitachi Kokusai Electric Inc. Boat of wafer processing apparatus
US9153466B2 (en) * 2012-04-26 2015-10-06 Asm Ip Holding B.V. Wafer boat
USD734730S1 (en) * 2012-12-27 2015-07-21 Hitachi Kokusai Electric Inc. Boat of substrate processing apparatus
TWD163542S (zh) * 2013-03-22 2014-10-11 日立國際電氣股份有限公司 基板處理裝置用晶舟
TWD166332S (zh) * 2013-03-22 2015-03-01 日立國際電氣股份有限公司 基板處理裝置用晶舟之部分
TWD167988S (zh) * 2013-07-29 2015-05-21 日立國際電氣股份有限公司 半導體製造裝置用晶舟
TWD165429S (zh) * 2013-07-29 2015-01-11 日立國際電氣股份有限公司 半導體製造裝置用晶舟
TWD168827S (zh) * 2013-07-29 2015-07-01 日立國際電氣股份有限公司 半導體製造裝置用晶舟
US9343304B2 (en) * 2014-09-26 2016-05-17 Asm Ip Holding B.V. Method for depositing films on semiconductor wafers
JP1537312S (enrdf_load_stackoverflow) * 2014-11-20 2015-11-09
JP1537630S (enrdf_load_stackoverflow) * 2014-11-20 2015-11-09
JP1537629S (enrdf_load_stackoverflow) 2014-11-20 2015-11-09
JP1537313S (enrdf_load_stackoverflow) * 2014-11-20 2015-11-09
JP1563649S (enrdf_load_stackoverflow) * 2016-02-12 2016-11-21
USD873782S1 (en) * 2016-05-17 2020-01-28 Electro Scientific Industries, Inc Component carrier plate
USD836572S1 (en) * 2016-09-30 2018-12-25 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
JP1584784S (enrdf_load_stackoverflow) * 2017-01-31 2017-08-28
JP1584241S (enrdf_load_stackoverflow) * 2017-01-31 2017-08-21
JP1605462S (enrdf_load_stackoverflow) * 2017-08-10 2021-05-31
JP1597807S (enrdf_load_stackoverflow) * 2017-08-21 2018-02-19
USD847105S1 (en) * 2018-05-03 2019-04-30 Kokusai Electric Corporation Boat of substrate processing apparatus
USD846514S1 (en) * 2018-05-03 2019-04-23 Kokusai Electric Corporation Boat of substrate processing apparatus

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1078667S1 (en) 2022-09-14 2025-06-10 Kokusai Electric Corporation Wafer support of semiconductor manufacturing apparatus

Also Published As

Publication number Publication date
TWD197468S (zh) 2019-05-11
USD920935S1 (en) 2021-06-01

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