TWD175116S - 晶圓舟之晶圓支撐爪（四） - Google Patents

晶圓舟之晶圓支撐爪（四）

Info

Publication number
TWD175116S
TWD175116S TW104302642F TW104302642F TWD175116S TW D175116 S TWD175116 S TW D175116S TW 104302642 F TW104302642 F TW 104302642F TW 104302642 F TW104302642 F TW 104302642F TW D175116 S TWD175116 S TW D175116S
Authority
TW
Taiwan
Prior art keywords
view
design
parts
wafer
enlarged
Prior art date
Application number
TW104302642F
Other languages
English (en)
Chinese (zh)
Inventor
Yoshinori Kusakabe
Masami Oikawa
Original Assignee
東京威力科創股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 東京威力科創股份有限公司 filed Critical 東京威力科創股份有限公司
Publication of TWD175116S publication Critical patent/TWD175116S/zh

Links

TW104302642F 2014-11-20 2015-05-18 晶圓舟之晶圓支撐爪（四） TWD175116S (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JPD2014-25970F JP1537630S (enrdf_load_stackoverflow) 2014-11-20 2014-11-20

Publications (1)

Publication Number Publication Date
TWD175116S true TWD175116S (zh) 2016-04-21

Family

ID=54399250

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104302642F TWD175116S (zh) 2014-11-20 2015-05-18 晶圓舟之晶圓支撐爪（四）

Country Status (3)

Country Link
US (1) USD769201S1 (enrdf_load_stackoverflow)
JP (1) JP1537630S (enrdf_load_stackoverflow)
TW (1) TWD175116S (enrdf_load_stackoverflow)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP1638282S (enrdf_load_stackoverflow) * 2018-09-20 2019-08-05
KR102552458B1 (ko) * 2019-07-31 2023-07-06 가부시키가이샤 코쿠사이 엘렉트릭 기판 처리 장치, 기판 지지구 및 반도체 장치의 제조 방법
JP1678278S (ja) * 2020-03-19 2021-02-01 基板処理装置用ボート
JP1741513S (enrdf_load_stackoverflow) * 2022-09-14 2023-04-11

Family Cites Families (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD361752S (en) * 1993-09-17 1995-08-29 Tokyo Electron Kasbushiki Kaisha Wafer boat or rack for holding semiconductor wafers
USD366868S (en) * 1993-09-29 1996-02-06 Tokyo Electron Kabushiki Kaisha Wafer boat or rack
USD378823S (en) * 1995-05-30 1997-04-15 Tokyo Electron Limited Wafer boat
USD380454S (en) * 1995-05-30 1997-07-01 Tokyo Electron Limited Wafer boat
USD378675S (en) * 1995-05-30 1997-04-01 Tokyo Electron Limited Wafer boat
JP3218164B2 (ja) * 1995-05-31 2001-10-15 東京エレクトロン株式会社 被処理体の支持ボート、熱処理装置及び熱処理方法
JP3122364B2 (ja) * 1996-02-06 2001-01-09 東京エレクトロン株式会社 ウエハボート
TW325588B (en) * 1996-02-28 1998-01-21 Asahi Glass Co Ltd Vertical wafer boat
US6062853A (en) * 1996-02-29 2000-05-16 Tokyo Electron Limited Heat-treating boat for semiconductor wafers
USD404015S (en) * 1997-01-31 1999-01-12 Tokyo Electron Ltd. Wafer boat for use in a semiconductor wafer heat processing apparatus
USD411176S (en) * 1997-08-20 1999-06-22 Tokyo Electron Limited Wafer boat for use in a semiconductor wafer heat processing apparatus
USD409158S (en) * 1997-08-20 1999-05-04 Tokyo Electron Limited Wafer boat for use in a semiconductor wafer heat processing apparatus
USD404371S (en) * 1997-08-20 1999-01-19 Tokyo Electron Limited Wafer boat for use in a semiconductor wafer heat processing apparatus
KR20000002833A (ko) * 1998-06-23 2000-01-15 윤종용 반도체 웨이퍼 보트
US6099645A (en) * 1999-07-09 2000-08-08 Union Oil Company Of California Vertical semiconductor wafer carrier with slats
US6287112B1 (en) * 2000-03-30 2001-09-11 Asm International, N.V. Wafer boat
US6341935B1 (en) * 2000-06-14 2002-01-29 Taiwan Semiconductor Manufacturing Company, Ltd. Wafer boat having improved wafer holding capability
US20020130061A1 (en) * 2000-11-02 2002-09-19 Hengst Richard R. Apparatus and method of making a slip free wafer boat
KR100410982B1 (ko) * 2001-01-18 2003-12-18 삼성전자주식회사 반도체 제조장치용 보트
JP2002324830A (ja) * 2001-02-20 2002-11-08 Mitsubishi Electric Corp 基板熱処理用保持具、基板熱処理装置、半導体装置の製造方法、基板熱処理用保持具の製造方法及び基板熱処理用保持具の構造決定方法
JP4467028B2 (ja) * 2001-05-11 2010-05-26 信越石英株式会社 縦型ウェーハ支持治具
US6811040B2 (en) * 2001-07-16 2004-11-02 Rohm And Haas Company Wafer holding apparatus
JP4506125B2 (ja) * 2003-07-16 2010-07-21 信越半導体株式会社 熱処理用縦型ボート及びその製造方法
US20050145584A1 (en) * 2004-01-06 2005-07-07 Buckley Richard F. Wafer boat with interference fit wafer supports
TWD119911S1 (zh) * 2006-05-01 2007-11-11 東京威力科創股份有限公司 晶舟
TWD119910S1 (zh) * 2006-05-01 2007-11-11 東京威力科創股份有限公司 晶舟
TWD130137S1 (zh) * 2006-10-25 2009-08-01 東京威力科創股份有限公司 晶舟
USD600221S1 (en) * 2008-03-28 2009-09-15 Tokyo Electron Limited Wafer boat
USD600222S1 (en) * 2008-03-28 2009-09-15 Tokyo Electron Limited Wafer boat
USD616394S1 (en) * 2009-03-06 2010-05-25 Tokyo Electron Limited Support of wafer boat for manufacturing semiconductor wafers
USD616395S1 (en) * 2009-03-11 2010-05-25 Tokyo Electron Limited Support of wafer boat for manufacturing semiconductor wafers
USD655682S1 (en) * 2010-06-18 2012-03-13 Hitachi Kokusai Electric Inc. Boat of wafer processing apparatus
USD655255S1 (en) * 2010-06-18 2012-03-06 Hitachi Kokusai Electric Inc. Boat of wafer processing apparatus
TWD163542S (zh) * 2013-03-22 2014-10-11 日立國際電氣股份有限公司 基板處理裝置用晶舟
TWD166332S (zh) * 2013-03-22 2015-03-01 日立國際電氣股份有限公司 基板處理裝置用晶舟之部分
TWD165429S (zh) * 2013-07-29 2015-01-11 日立國際電氣股份有限公司 半導體製造裝置用晶舟
TWD168827S (zh) * 2013-07-29 2015-07-01 日立國際電氣股份有限公司 半導體製造裝置用晶舟
TWD167988S (zh) * 2013-07-29 2015-05-21 日立國際電氣股份有限公司 半導體製造裝置用晶舟

Also Published As

Publication number Publication date
JP1537630S (enrdf_load_stackoverflow) 2015-11-09
USD769201S1 (en) 2016-10-18

Similar Documents

Publication Publication Date Title
TWD171964S (zh) 晶圓舟之晶圓支撐爪（三）
TWD171963S (zh) 晶圓舟之晶圓支撐爪（一）
TWD175115S (zh) 晶圓舟之晶圓支撐爪（二）
USD808349S1 (en) Elastic membrane for semiconductor wafer polishing apparatus
TWD166332S (zh) 基板處理裝置用晶舟之部分
TWD163542S (zh) 基板處理裝置用晶舟
TWD175116S (zh) 晶圓舟之晶圓支撐爪（四）
TWD179672S (zh) 基板保持環之部分
TWD171916S (zh) 太陽能電池基板之電極之部分
JP2015521701A5 (enrdf_load_stackoverflow)
TWD167109S (zh) 基板保持環
USD766850S1 (en) Wafer holder for manufacturing semiconductor
TWD171962S (zh) 仿真晶圓之部分（三）
TWD171961S (zh) 仿真晶圓之部分（二）
TWD171960S (zh) 仿真晶圓之部分（一）
TWD169007S (zh) 半導體製造用晶圓保持具之部分
TWD169006S (zh) 半導體製造用晶圓保持具之部分
CN302111201S (zh) 晶片悬臂
TWM488100U (zh) 晶片承架
TWD164162S (zh) 半導體晶圓硏磨裝置用彈性膜之部分
TWD164163S (zh) 半導體晶圓硏磨裝置用彈性膜之部分
CN302081588S (zh) 半导体制造机的基座
CN302403323S (zh) 保险杠上脚踏步（d760）
TWD179065S (zh) 電連接端子之部分
CN302445307S (zh) 客车