TW544896B - Method and apparatus for calibrating marking position in chip scale marker - Google Patents

Method and apparatus for calibrating marking position in chip scale marker Download PDF

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Publication number
TW544896B
TW544896B TW091111645A TW91111645A TW544896B TW 544896 B TW544896 B TW 544896B TW 091111645 A TW091111645 A TW 091111645A TW 91111645 A TW91111645 A TW 91111645A TW 544896 B TW544896 B TW 544896B
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TW
Taiwan
Prior art keywords
wafer
laser beam
screen
patent application
scope
Prior art date
Application number
TW091111645A
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English (en)
Chinese (zh)
Inventor
You-Hie Han
Choong-Shin Lee
Yang-Ghi Min
Byoung-Min Ahn
Hyeyg-Jeon Chang
Original Assignee
Eo Technics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Eo Technics Co Ltd filed Critical Eo Technics Co Ltd
Application granted granted Critical
Publication of TW544896B publication Critical patent/TW544896B/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67282—Marking devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Laser Beam Processing (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Optical Elements Other Than Lenses (AREA)
  • Lasers (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
  • Radar Systems Or Details Thereof (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
TW091111645A 2001-12-01 2002-05-31 Method and apparatus for calibrating marking position in chip scale marker TW544896B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR10-2001-0075668A KR100445974B1 (ko) 2001-12-01 2001-12-01 칩 스케일 마커의 마킹 위치 보정 방법 및 그 장치

Publications (1)

Publication Number Publication Date
TW544896B true TW544896B (en) 2003-08-01

Family

ID=19716533

Family Applications (1)

Application Number Title Priority Date Filing Date
TW091111645A TW544896B (en) 2001-12-01 2002-05-31 Method and apparatus for calibrating marking position in chip scale marker

Country Status (9)

Country Link
US (1) US6808117B2 (ja)
EP (1) EP1316989B1 (ja)
JP (1) JP4168699B2 (ja)
KR (1) KR100445974B1 (ja)
AT (1) ATE504939T1 (ja)
DE (1) DE60239658D1 (ja)
MY (1) MY135275A (ja)
SG (1) SG111945A1 (ja)
TW (1) TW544896B (ja)

Cited By (3)

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TWI446986B (zh) * 2010-04-30 2014-08-01 Qmc Co Ltd 對象目標處理方法及對象目標處理設備
TWI595952B (zh) * 2016-01-14 2017-08-21 蔡宜興 雷射及影像擷取定位裝置及其定位方法
TWI648813B (zh) * 2017-11-09 2019-01-21 台灣積體電路製造股份有限公司 處理腔室、半導體製造設備以及其校正方法

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US7067763B2 (en) * 2002-05-17 2006-06-27 Gsi Group Corporation High speed, laser-based marking method and system for producing machine readable marks on workpieces and semiconductor devices with reduced subsurface damage produced thereby
JP2005177777A (ja) * 2003-12-17 2005-07-07 Barudan Co Ltd パラメータ設定方法及びパラメータ設定装置
JP4428256B2 (ja) * 2005-02-28 2010-03-10 住友電気工業株式会社 レーザ加工装置
JP4684687B2 (ja) * 2005-03-11 2011-05-18 株式会社ディスコ ウエーハのレーザー加工方法および加工装置
WO2007005639A2 (en) * 2005-06-30 2007-01-11 Controlled Semiconductor, Inc. Lead frame isolation using laser technology
KR100870710B1 (ko) * 2007-06-07 2008-11-27 주식회사 이오테크닉스 스캐너 오작동 감지방법
SG152090A1 (en) * 2007-10-23 2009-05-29 Hypertronics Pte Ltd Scan head calibration system and method
KR101122240B1 (ko) * 2009-02-23 2012-03-21 한미반도체 주식회사 반도체 패키지 가공을 위한 레이저 빔 조사 위치 보정방법
CN102639280A (zh) * 2009-12-07 2012-08-15 Jp赛席尔联合股份有限公司 激光加工及切割系统与方法
US20130256286A1 (en) * 2009-12-07 2013-10-03 Ipg Microsystems Llc Laser processing using an astigmatic elongated beam spot and using ultrashort pulses and/or longer wavelengths
WO2011127601A1 (en) * 2010-04-13 2011-10-20 National Research Council Of Canada Laser processing control method
US9718146B2 (en) 2013-06-03 2017-08-01 Mitsubishi Electric Research Laboratories, Inc. System and method for calibrating laser processing machines
KR101511645B1 (ko) * 2013-11-14 2015-04-13 주식회사 엘티에스 레이저빔의 조사위치 보정방법
US10433670B2 (en) 2014-05-13 2019-10-08 Societe Des Produits Nestle S.A. Container and code of system for preparing a beverage or foodstuff
PL3143552T3 (pl) * 2014-05-13 2021-11-08 Société des Produits Nestlé S.A. Pojemnik i kod systemu do przygotowywania napoju lub artykułu spożywczego
WO2015173292A1 (en) * 2014-05-13 2015-11-19 Nestec S.A. Container and code of system for preparing a beverage or foodstuff
US9950389B1 (en) 2014-09-19 2018-04-24 EMC IP Holding Company LLC Laser calibration
KR101708818B1 (ko) * 2015-02-06 2017-03-08 주식회사 이오테크닉스 레이저를 이용한 웨이퍼 마킹 공정에서 웨이퍼의 마킹 위치 변동을 방지하는 장치 및 방법과, 레이저를 이용한 웨이퍼 마킹 장치 및 방법
JP5996687B2 (ja) 2015-02-10 2016-09-21 浜松ホトニクス株式会社 検査装置及び検査方法
KR101812210B1 (ko) 2016-02-15 2017-12-26 주식회사 이오테크닉스 마킹 위치 보정장치 및 방법
KR101857414B1 (ko) * 2016-02-25 2018-05-15 주식회사 이오테크닉스 마킹 위치 보정장치 및 방법
US10766102B2 (en) * 2017-11-20 2020-09-08 Wipro Limited Method and system for performing laser marking
JP7205413B2 (ja) * 2019-08-07 2023-01-17 株式会社Sumco レーザマーク付きシリコンウェーハの製造方法
WO2021166345A1 (ja) 2020-02-18 2021-08-26 浜松ホトニクス株式会社 半導体故障解析装置及び半導体故障解析方法
TWI826848B (zh) * 2020-12-21 2023-12-21 日商斯庫林集團股份有限公司 光照射裝置
CN112864071B (zh) * 2021-01-18 2022-04-01 长鑫存储技术有限公司 校正半导体制造机台中晶圆位置的工具和方法
CN113275758B (zh) * 2021-06-28 2022-12-16 苏州赛腾精密电子股份有限公司 一种芯片规模晶圆级标记系统及激光标记方法

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US5362681A (en) * 1992-07-22 1994-11-08 Anaglog Devices, Inc. Method for separating circuit dies from a wafer
JP2833959B2 (ja) * 1993-05-11 1998-12-09 山口日本電気株式会社 集積回路装置のレーザマーキング装置
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JP3106973B2 (ja) * 1996-09-03 2000-11-06 日本電気株式会社 レーザマーキング装置
US5798947A (en) * 1996-09-25 1998-08-25 The Board Of Trustees Of The Leland Stanford, Jr. University Methods, apparatus and computer program products for self-calibrating two-dimensional metrology stages
US5818018A (en) * 1997-03-27 1998-10-06 Advanced Micro Devices, Inc. Reflective/refractive optical bar code scanning through a transparent/translucent apparatus
FR2790842B1 (fr) * 1999-03-12 2001-04-20 St Microelectronics Sa Procede de fabrication d'un circuit de test sur une plaquette de silicium
JP2000294607A (ja) * 1999-04-08 2000-10-20 Hitachi Ltd 半導体装置の製造方法
KR100600921B1 (ko) * 1999-04-27 2006-07-13 지에스아이 루모닉스 인코퍼레이티드 레이저 보정 장치 및 방법
SE522531C2 (sv) * 1999-11-24 2004-02-17 Micronic Laser Systems Ab Metod och anordning för märkning av halvledare
KR20010073299A (ko) * 2000-01-13 2001-08-01 성규동 웨이퍼 마킹 장치
KR20010073297A (ko) * 2000-01-13 2001-08-01 성규동 웨이퍼 마킹시스템용 교정장치

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI446986B (zh) * 2010-04-30 2014-08-01 Qmc Co Ltd 對象目標處理方法及對象目標處理設備
TWI595952B (zh) * 2016-01-14 2017-08-21 蔡宜興 雷射及影像擷取定位裝置及其定位方法
TWI648813B (zh) * 2017-11-09 2019-01-21 台灣積體電路製造股份有限公司 處理腔室、半導體製造設備以及其校正方法

Also Published As

Publication number Publication date
JP4168699B2 (ja) 2008-10-22
EP1316989A3 (en) 2005-04-20
SG111945A1 (en) 2005-06-29
KR20030045256A (ko) 2003-06-11
EP1316989A2 (en) 2003-06-04
KR100445974B1 (ko) 2004-08-25
MY135275A (en) 2008-03-31
EP1316989B1 (en) 2011-04-06
US6808117B2 (en) 2004-10-26
DE60239658D1 (de) 2011-05-19
JP2003188059A (ja) 2003-07-04
US20030102292A1 (en) 2003-06-05
ATE504939T1 (de) 2011-04-15

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