201032936 六、發明說明： 【發明所屬之技術領域】 本發明係關於一雷射加工系統及方法，特別是可進行立體雷射 加工之雷射加工系統及方法。 【先前技術】 伴隨著科技的進步，人們所使用的各式裝置，其功能的整合性 及組成複雜性亦相對的提高，也代表著各式裝置所包含元件的種 類及數量亦趨多樣化。為了在製造過程中對上述之各式裝置所包 -含的立體工件於加工或組裝過程中進行辨識或註記，因此需在立· 體工件之材料表面加以後加工而增加標示.。傳統上，於一立體工 件之材料表面增加標示之方法包含書寫、油墨印製、衝壓成型等。 其中書寫、油墨印製除了需應用於可附著墨水之材料表面外，亦 須擔心墨水脫落材料表面而導致無法順利辨識之問題；而沖壓成 型則必須應用於具有一定程度之剛性材料（通常為一金屬材料） 表面，而且必須在沖壓成型過程中避免該立體工件發生變形。 另一方面，上述後加工標示方法，僅能應用於大尺寸之材料表 面，於現今強調輕薄短小之電子及半導體產品中，由於具有尺寸 上的限制，上述之後加工標示方法並不適用。因此，習知另一後 加工標示方法係利用一雷射加工方式，針對一材料表面以钱刻方 式進行加工。由於雷射可形成一微小之光點，藉此可在一狹小的 空間内對一細微之材料表面進行加工，且產生之標示具有良好的 細敏度。 然而，由於習知目前的雷射加工方式，其用以產生雷射光之加 201032936 工系統於單-製程中僅能於單-表面進行加工，若需標示铁多 資訊或記號，則可能造成標示過於擁擠，甚至標示不清之夕之 生;亦或需增加一製程將該立體工件進行翻轉，而後再進行=發 如此將增加了加工之工時。其次’考慮到標示之精準度方面工若 欲加工複數立體卫件，由於位在該雷射加卫系統上成群排列的: 數立體工件之相對位置難免產生誤差，且其尺寸亦存在一定範圍 的公差’導致其加工標示之精準度受到影響。 是故.，提供-雷射加工系統及方法，以有效率的製程控制於 -立體士件.之複數個表面進行加工，形錢精細且更易於辨識之 標示，同時更可對複數立紅件進行精密控制的雷射加工乃為 此業界所亟需共同努力之目標。 【發明内容】 本發明之一目的在於提供-雷射加工系統可於至少一立體工件 之至少-表面進行加工’並可於加卫前針對至少—立體工件之位 置進行對位及補正，以及加工即時監看功能。 本發明之另-目的在於提供-雷射加工方法，俾可於至少一立 體工件之複數表面進行加卫’並可精準對位複數立體卫件後進行 三維雷射加工。 為達上述目的’本發明揭露—雷射加工系統，其具有一振鏡， 偏斜地設置於雷射加工系統之一工作平台上，用以控制雷射加工 系統所產生之雷射光自；^方向射出，使雷射光線得於立體工件 之至少-表面進行雷射刺。同時，該雷射加4統更具有影像 操取裝置’俾於加工至少-立體工件前，進行對位及補正之功能， 201032936 同時可於加工過程監看至少一立體工件之加工情況。 本發明更揭露一雷射加工方法，用以加工至少一立體工件，該 至少一立體工件置於一工作平台上，包含：（a)定位工作平台上之 至少一立體工件；以及（b)提供一雷射光線，其中雷射光線與工作 平台間具有一可變傾斜角度，俾該雷射光線得於至少一立體工件 之至少二表面上形成數軌跡。 藉此，雷射加工系統可更有效率的進行於至少一立體工件表面 之雕刻，‘而產生的標示.更.易於辨識，.標.示的内.容亦可更加詳·細， 同時加工的精準度也可相對的提高。 為讓本創作之上述目的、技術特徵和檯點能更明顯易槿，下支 係以較佳實施例配合所附圖式進行詳細說明。 【實施方式】 本發明之第一實施例如第1圖所示，一雷射加工系統1，用以加 工至少一立體工件10，雷射加工系統1包含一雷射光源組11、一 工作平台19以及偏斜地設置於工作平台19上之一振鏡12。其中 工作平台19用以置放一個或數個立體工件，而雷射光源組11用 以提供一雷射光線，並透過振鏡12控制雷射光線之行進方向，使 雷射光線得於各立體工件之至少一表面上進行雷射雕刻之加工。 詳細而言，設置於雷射加工系統1之振鏡12其正向係相對於工 作平台19形成一傾斜角度Θ (如第1圖所示之傾斜角度Θ)，而雷 射光源組11係藉由振鏡12將雷射光線投射而出。請合併參閱第2 圖所示，於本實施例中，立體工件係為一晶粒，數個立體工件（例 201032936 如立體工件1〇、10,、10a、10b、10c、1〇<1等）以陣列方式排列而 設置於-晶圓2上’晶圓2係置放於雷射加I系統i之工作平台 19其中振鏡12更包含一平場聚焦鏡121，雷射光線藉由振鏡 12反射，並且通過平場聚焦鏡121加以聚焦。振鏡12在經由一個 掃描器馬達（圖未示出）的帶動下高速的來回沿―㈣旋轉，控 制雷射光線於不同方向上射出，使雷射光線與工作平台間具有一 可變傾斜角度’以於預定的焦距、角度及掃描區之下分別對各 立體工件之三表面上進行雷射關。如第3圖所示分別於立體 •工件10之-上表面及—側表面形成標示班、η (其中標示m、n 之内容僅用於示意）。 • . t· . . . · 須說月的疋帛2圖僅用於示意，各元件之比例與實際並不相 同’而成陣列設置之立體工件之數量亦不限於此。此外，需特別 注意的是，第2圖中由雷射光源組u所產生之雷射光線山及爪 係為振鏡12及其所包含之平場聚焦鏡ΐ2ι於不同條件下分別將 雷射光線Ua及Ub以不同方向投射至其中立體工㈣之二表 面之示意圖並非雷射光源組u同時產生二雷射光線。同時，工 作平台19係為一移動式工作平台，可進行—平面運動，藉此，經 由本發明之上述特徵，雷射光線係可針對陣列設置之立體工件1〇 之二表面逐-進行雷射雕刻之加工，以於立體工件1〇之數 成所需的標示。 〜 於本實施射，振鏡12正向相對於I作平台Η卿彡成之 角度Θ係為45°。傾斜g疮a 〜 " 角度θ之決疋須同時考慮到雷射光源組 所產生的雷射光線在經由平場聚线121人射至—範圍内後是 7 201032936 否可分別於晶圓2上之任意單一立體工件，例如立體工件10之二 表面進行雕刻’而雷射光線不致受到該立體工件10鄰近處之其他 立體工件（例如立體工件10，）之阻擋，而產生死角，影響雷射光 於該立體工件10之表面加工。 另一方面，振鏡的使用必須確保於各旋轉角度反射雷射光線並 經由平場聚焦鏡121入射至掃瞄區域範圍之後，雷射光線不致失 焦，以避免雷射光線能量散逸，而造成不精確之加工標示，甚至 加工失敗。於此’本實施例所锋用之振鏡，以举大旋轉角度反射 雷射光線之下’所推算的投射面積約可在1〇平方厘米之範圍内雨 不致像該雷射光線失焦，同時，立體工件10之最大加工平面係不 大於3平方毫米’因此，本實施例所採用之振鏡適可用於立體工 件10之加工製程。 於本實施例中’設置於晶圓2上之數個立體工件係以陣列設置， 各立體工件間之相對距離存有若干誤差而不一致。有鑑於此，本 發明之雷射加工系統1更包含一影像擷取裝置，用以於加工各立 體工件於前先進行方位的校正。此定位之目的在於使雷射光線可 準確地投射至立體工件10之預定位置，以於正確的位置上產生精 確對焦的標示。於本實施例中’影像摘取裝置主要由電荷叙合元 件（Charge-coupled Device, CCD)所構成，具體而言其包含一定 位影像擷取單元13、一監控影像擷取單元15以及一辅助影像擷取 單元17’其功能分別為用以定位立體工件1〇、監視立體工件1〇 以及補正立體工件10之一角度。於本實施例中，輔助影像擷取單 元Π為傾斜設置’相似於振鏡12之設置方式，必須確認欲擷取 201032936 之單一立體工件影像不至被鄰近其他立體工件所阻擋。 進-步而言’監控影像擷取料15配合—反射鏡14，首先針對 整個晶圓2進行定位，其方式係可挑選位於晶圓2側緣處二相對 設置之立體工件10a、l〇b，透過監控影像掏取單元15之 確認立體工件10a、10b是否於成一直線對齊，若無對齊則透過 移動工作平台19使其對齊。其中，若立體工件1〇&、伽本身方 位誤差過大，造成定位困難，則可再另外挑選其他之立體工件（如 立蟀工件10c、10d)以進行晶圓2整體之定位。 其次，如第4圖所示’以監控影像擷取.單元15選取於晶圓2中 心（於第4圖中係以-交.叉點c表示.）附近之—立體卫件儀， 經由監控影像擷取單元15之影像視窗，測量立體工件心距離曰 圓25中心C之-水平距離χ及一垂直距離y，並透過原先系統^ 設之各立體工件的已知預定相對位置，而獲得整個晶^ 2上每— 立體工件相對於晶圓2中心c之位置。 接著，於各立體工件進行雷射雕刻前，利用上述所獲得之各 體工件相對於晶圓2中心C之位置，移動當前欲雕刻之立體工^立 (如立體工件10)至該位置，並透過定位影像擷取單元Ο，如 5a圖所示，確認立體工件1〇是否位於定位影像擷取單元η ^ 像視窗13b内之中心（即第5a圖中虛線所示之二定位線交=衫 位於立體工件1〇之中心），並透過移動工作平台19以針否 體工件進行定位補正；再者，如第5b圖所示，透過辅助影^立 單元17,確認立體工件10之一頂邊&與_侧邊^^是否分別蛊擷取 景>像擷取單元17之影像視窗17b中之二定位 /、補助 、1弟5b圖中之 201032936 二虛線）對齊，並透過移動工作平台19以針對單一立體工件之角 度補正。 於上述方位補正過程中，各影像擷取單元13、15、17更分別包 含照明光源13a、15a、17a，照射於至少一立體工件，以於各影像 視窗内獲得較清晰之影像。另一方面，如發現立體工件之方位偏 差過大，而難以補正，則跳過該立體工件，不對其加工，以避免 產生錯誤之雕刻標示。 本實施例中，.雷射加工系統1更包含一控制軟體（圖未示出）及一 . 控制器（圖未示出）。其中控制軟體可設定於一定點雷射光線之雕刻 時間、雕刻次數及雷射延遲參數，雷雕控制器可以控制雷射光線 之移動速度、功率大小與頻率值。而藉此方式，再透過適當的調 • . · - · · 整振鏡12焦距，即可控制雷射光線於立體工件10之雕刻深度及 線宽，而輕易逹成雕刻圖案或字形的精準度。 於本實施例中，雷射光線係為一固態紅外光雷射光線或一固態 紫外光雷射光線，其波長約為193奈米至1064奈米，藉此，係於 至少一立體工件10之表面產生雕刻寬度約30微米之標示。前述 相關之詳細說明可參照本發明申請人所有之我國專利申請第 097121223號。於雷射雕刻的同時，監控影像擷取單元15亦可用 於監看立體工件10之加工結果是否正確。 應用前述之雷射加工系統，本發明亦揭露一雷射加工方法，相 關之流程說明如第6圖所示，說明如下。首先於第一步驟61中， 定位工作平台上之一立體工件，其次於第二步驟62中，提供一雷 射光線，其中雷射光線與工作平台間具有一可變傾斜角度，俾雷 201032936 射光線得於立體工件之至少二表面上形成數軌跡。 進一步說明，於第一步驟61中之定位方法包含提供一影像擷取 裝置，用以將立體工件定位至一預定方位上。於第二步驟62中， 雷射光線係由一雷射光源組所提供，其中雷射光源組適可透過一 振鏡將雷射光線投射出。振鏡的設置相對於工作平台具有一傾斜 角度，同時，振鏡更包含一平場聚焦鏡加以聚焦，除可控制雷射 光線之投射方向外，並同時補償於不同方向上不同反射角度之焦 距。藉此，於第二步驟62中，係可利用振鏡，而偏斜雷射光線至 參.預定方向以於立體工件之數表面上進行.加工。 本實施例中之工作平台係移動式工作平台，因此，雷射加工方 法更可包括一第三步驟63 :移動該工作平台，用以對工作平台上 之另一立體工件重複進行第一步驟61及第二步驟62,直至完成所 有立體工件之加工為止。藉此，本發明之雷射加工方法係可針對 複數立體工件，利用與工作平台成可變傾斜角度之雷射光線，分 別於複數立體工件之數表面進行加工。 ® 綜上所述，本發明提供一雷射加工系統及方法，適可以一偏斜 之雷射光線，以於單一製程中針對一立體工件之數表面進行雷射 雕刻，而有別於習知之雷射加工方式，尚須利用人工方式將立體 工件翻轉並定位後，方可於立體工件之另一表面進行加工。藉此， 可縮短加工工時，俾增進效率。其次，本發明更利用影像擷取裝 置，以於立體工件加工前進行方位之補正，進而獲得精確之雕刻 標示。再者，於本發明中，雷射加工系統更利用控制軟體及控制 器，適當的調整振鏡焦距，藉以控制雷射光線於立體工件之雕刻 11 201032936 深度及線宽。藉由前述的參數控制，可輕易逹成雕刻圖案或字形 的精準度，同時，雷射光線的投射也不易造成過多熱應力集中於 立體工件表面，使立體工作易產生損壞。進一步而言，本發明更 利用移動式工作平台，適可針對複數立體工件進行加工。 上述之實施例僅用來例舉本發明之實施態樣，以及闡釋本發明 之技術特徵，並非用來限制本發明之保護範疇。任何熟悉此技術 者可輕易完成之改變或均等性之安排均屬於本發明所主張之範 .圍本煢明之權利详諫範圍應以申請專利範圍為乎。 【圖式簡單說明】. 第1圖係為本發明之一雷射加工系統示意圖； 第2圖係為利用本發明之雷射加工系統加工至少一立體工件之 • · - · · 不意圖， 第3圖係為於一立體工件之二表面形成標示之示意圖； 第4圖係為本發明用於定義一立體工件之位置之示意圖； 第5a圖係為利用本發明之雷射加工系統定位一立體工件之示意 ΤΐΠ · 圖， 第5b圖係為利用本發明之雷射加工系統定位一立體工件之角度 之示意圖；以及 第6圖係為本發明之一雷射加工方法流程圖。 【主要元件符號說明】 1 .雷射加工系統 10、10’ ：立體工件 201032936 10a、10b、10c、10d、10e :立體工件 11 :雷射光源組 11a、lib :雷射光線 12 :振鏡 121 :平場聚焦鏡 13 :定位影像擷取單元 13a :照明光源 13b :影像視窗 14 :反射鏡 15 :監控影像擷取單元 15a :照明光源 17 :輔助影像擷取單元 17a :照明光源 17b :影像視窗 19 :工作平台 2 .晶圓 61 :第一步驟 62 :第二步驟 • · · . 63 :第三步驟 a :頂邊 * · ： . · · · b :側邊 C :中心 m、η :標示 X:水平距離 y :垂直距離 Θ:傾斜角度 參 13201032936 VI. Description of the Invention: [Technical Field] The present invention relates to a laser processing system and method, and more particularly to a laser processing system and method capable of performing stereo laser processing. [Prior Art] With the advancement of technology, the integration and complexity of functions of various devices used by people have also been relatively improved, and it has also represented that the types and quantities of components included in various devices are also diversified. In order to identify or note the three-dimensional workpiece contained in the various devices described above during the manufacturing process, it is necessary to post-process the material surface of the vertical body workpiece to increase the marking. Conventionally, methods for adding markings to the surface of a three-dimensional workpiece include writing, ink printing, stamping, and the like. Among them, writing and ink printing need to be applied to the surface of the material to which the ink can be attached, and there is also a concern that the ink may fall off the surface of the material and the problem cannot be smoothly recognized; and the stamping must be applied to a certain degree of rigid material (usually one) Metal material) Surface, and the three-dimensional workpiece must be prevented from being deformed during the stamping process. On the other hand, the above-mentioned post-processing marking method can only be applied to a large-sized material surface. In today's electronic and semiconductor products that emphasize lightness and shortness, the above-described post-processing marking method is not applicable due to size limitations. Therefore, another conventional processing method is to use a laser processing method to process a surface of a material in a money-engraved manner. Since the laser can form a tiny spot of light, the surface of a fine material can be processed in a small space and the resulting mark has good sensitivity. However, due to the current laser processing method, the 201032936 system for generating laser light can only process single-surface in a single-process. If it is necessary to mark the iron information or mark, it may cause marking. It is too crowded and even unclear. It is also necessary to add a process to flip the three-dimensional workpiece, and then to do so will increase the processing time. Secondly, considering the accuracy of the marking, if the worker wants to process a plurality of three-dimensional guards, they are arranged in groups on the laser-assisted system: the relative positions of the three-dimensional workpieces are inevitably inaccurate, and the size also has a certain range. The tolerance 'causes the accuracy of the processing mark to be affected. Therefore, the laser processing system and method are provided to process the complex surface of the three-dimensional member with efficient process control, and the shape is fine and easier to identify, and at the same time, the complex red piece can be used. Laser processing with precise control is a goal that the industry needs to work together. SUMMARY OF THE INVENTION It is an object of the present invention to provide a laser processing system that can process at least a surface of at least one solid workpiece and that can be aligned and corrected for at least the position of the three-dimensional workpiece prior to curing, and processed. Instant monitoring function. Another object of the present invention is to provide a laser processing method in which a plurality of surfaces of at least one of the vertical workpieces can be reinforced and a three-dimensional laser processing can be performed after accurately aligning the plurality of three-dimensional solid parts. In order to achieve the above object, the present invention discloses a laser processing system having a galvanometer mirror disposed obliquely on one of the working platforms of the laser processing system for controlling the laser light generated by the laser processing system; The direction is emitted so that the laser light is subjected to a laser spur on at least the surface of the three-dimensional workpiece. At the same time, the laser plus 4 system has an image manipulation device's function of alignment and correction before processing at least the three-dimensional workpiece. 201032936 can also monitor the processing of at least one solid workpiece during the machining process. The present invention further discloses a laser processing method for processing at least one solid workpiece, the at least one solid workpiece being placed on a work platform, comprising: (a) positioning at least one solid workpiece on the work platform; and (b) providing a laser beam, wherein the laser beam has a variable tilt angle with the working platform, and the laser light is formed on the at least two surfaces of the at least one solid workpiece to form a plurality of tracks. Thereby, the laser processing system can more efficiently perform engraving on at least one surface of the three-dimensional workpiece, and the resulting mark is more easily identifiable, and the inner volume of the label can be more detailed and fine, and processed at the same time. The accuracy can also be relatively increased. In order to make the above objects, technical features and workstations of the present invention more obvious, the following embodiments are described in detail with reference to the preferred embodiments. [Embodiment] A first embodiment of the present invention, as shown in FIG. 1, a laser processing system 1 for processing at least one solid workpiece 10, the laser processing system 1 comprising a laser light source group 11 and a working platform 19 And a galvanometer 12 disposed obliquely on the working platform 19. The working platform 19 is used for placing one or several three-dimensional workpieces, and the laser light source group 11 is used to provide a laser beam, and the ray mirror 12 is used to control the traveling direction of the laser light, so that the laser light is obtained for each three-dimensional image. Laser engraving is performed on at least one surface of the workpiece. In detail, the galvanometer 12 disposed in the laser processing system 1 forms a tilt angle Θ with respect to the work platform 19 (such as the tilt angle 第 shown in FIG. 1), and the laser source group 11 borrows The laser beam is projected by the galvanometer 12. Please refer to FIG. 2 for combination. In this embodiment, the three-dimensional workpiece is a single crystal grain and several three-dimensional workpieces (for example, 201032936 such as three-dimensional workpieces 1〇, 10, 10a, 10b, 10c, 1〇<1 And the array is arranged on the wafer 2, and the wafer 2 is placed on the working platform 19 of the laser plus I system i. The galvanometer 12 further includes a flat field focusing mirror 121, and the laser beam is excited by the laser beam. The mirror 12 reflects and is focused by a flat field focusing mirror 121. The galvanometer 12 rotates at a high speed back and forth via a scanner motor (not shown) to control the laser beam to be emitted in different directions, so that the laser beam has a variable tilt angle with the working platform. 'Laser off the three surfaces of each solid workpiece under the predetermined focal length, angle and scanning area respectively. As shown in Fig. 3, the markings, η (where the contents of m and n are indicated for illustration only) are formed on the upper surface and the side surface of the three-dimensional workpiece 10. • t· . . . • The 疋帛 2 diagram of the month is for illustration only, and the proportion of each component is not the same as the actual one. The number of three-dimensional workpieces arranged in an array is not limited to this. In addition, it should be noted that the laser beam and the claws generated by the laser source group u in Fig. 2 are the galvanometer 12 and the flat field focusing mirror ΐ2ι included therein, respectively, under different conditions. The diagram in which Ua and Ub are projected in different directions to the surface of the three-dimensional work (4) is not the laser light source group u simultaneously generates two laser rays. At the same time, the working platform 19 is a mobile working platform, which can perform a plane motion, whereby, according to the above features of the present invention, the laser beam can be laser-perspectively directed to the surface of the three-dimensional workpiece disposed on the array. The engraving process is used to make the required number of three-dimensional workpieces into one. ~ In this implementation, the galvanometer 12 is oriented at an angle of 45° with respect to I. Tilting g sore a ~ " Angle θ does not have to take into account that the laser light generated by the laser source group is in the range of 121 people through the flat field polyline is 7 201032936 No can be on the wafer 2 Any single solid workpiece, such as two surfaces of the three-dimensional workpiece 10, is engraved, and the laser light is not blocked by other three-dimensional workpieces (such as the three-dimensional workpiece 10) in the vicinity of the three-dimensional workpiece 10, thereby generating a dead angle, which affects the laser light. The surface of the three-dimensional workpiece 10 is processed. On the other hand, the use of the galvanometer must ensure that the laser beam is reflected at each rotation angle and is incident on the scanning area via the flat field focusing mirror 121, and the laser light is not out of focus to avoid the dissipation of the laser light energy, thereby causing no Accurate processing marks and even processing failures. In this embodiment, the galvanometer used in the embodiment has a projection area estimated by reflecting the laser beam at a large rotation angle, and the projection area can be about 1 〇 square centimeter, and the rain does not defocus like the laser light. At the same time, the maximum machining plane of the three-dimensional workpiece 10 is no more than 3 square millimeters. Therefore, the galvanometer used in the embodiment can be used for the processing of the three-dimensional workpiece 10. In the present embodiment, a plurality of three-dimensional workpieces disposed on the wafer 2 are arranged in an array, and the relative distance between the three-dimensional workpieces is inconsistent with a number of errors. In view of this, the laser processing system 1 of the present invention further includes an image capturing device for correcting the orientation of each of the vertical workpieces. The purpose of this positioning is to enable the laser light to be accurately projected to a predetermined position of the solid workpiece 10 to produce a precise focus indication at the correct location. In the present embodiment, the image capturing device is mainly composed of a charge-coupled device (CCD), and specifically includes a positioning image capturing unit 13, a monitoring image capturing unit 15, and an auxiliary device. The image capturing unit 17' functions to position the three-dimensional workpiece 1〇, monitor the solid workpiece 1〇, and correct the angle of the solid workpiece 10, respectively. In this embodiment, the auxiliary image capturing unit is tilted to be set to be similar to the setting of the galvanometer 12. It must be confirmed that the single solid workpiece image to be captured 201032936 is not blocked by the adjacent three-dimensional workpiece. In the case of the step-by-step, the monitor image capture material 15 is matched with the mirror 14, and the entire wafer 2 is first positioned in such a manner that the three-dimensional workpieces 10a, 10b located at opposite sides of the wafer 2 can be selected. It is confirmed by the monitoring image capturing unit 15 whether the three-dimensional workpieces 10a, 10b are aligned in a straight line, and if there is no alignment, they are aligned by moving the working platform 19. If the position error of the three-dimensional workpiece 1〇& and the gamma itself is too large, the positioning is difficult, and other three-dimensional workpieces (such as the workpieces 10c and 10d) may be additionally selected to position the wafer 2 as a whole. Secondly, as shown in Fig. 4, 'monitoring the image. The unit 15 is selected from the center of the wafer 2 (indicated by the intersection of the intersection of the intersection and the intersection of the c). The image window of the image capturing unit 15 measures the center-to-center distance of the solid workpiece 25 from the center C-horizontal distance χ and a vertical distance y, and obtains the entire predetermined relative position of each of the three-dimensional workpieces of the original system. The position of each of the three-dimensional workpieces on the wafer 2 with respect to the center c of the wafer 2. Then, before performing laser engraving on each of the three-dimensional workpieces, the position of each of the obtained workpieces relative to the center C of the wafer 2 is moved to the position of the three-dimensional workpiece (such as the three-dimensional workpiece 10) to be engraved to the position, and By positioning the image capturing unit Ο, as shown in FIG. 5a, it is confirmed whether the solid workpiece 1 is located at the center of the positioning image capturing unit η ^ image window 13b (ie, the two positioning lines indicated by the broken line in FIG. 5a = shirt) Located at the center of the solid workpiece 1〇, and through the moving work platform 19, the positioning correction is performed by the needle body; further, as shown in FIG. 5b, the top edge of the solid workpiece 10 is confirmed through the auxiliary image forming unit 17. & _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ Corrected for the angle of a single solid workpiece. During the orientation correction process, each of the image capturing units 13, 15, 17 further includes illumination sources 13a, 15a, 17a for illuminating at least one of the three-dimensional workpieces to obtain a clear image in each image window. On the other hand, if it is found that the azimuth deviation of the three-dimensional workpiece is too large and it is difficult to correct, the three-dimensional workpiece is skipped and not processed to avoid erroneous engraving marks. In this embodiment, the laser processing system 1 further includes a control software (not shown) and a controller (not shown). The control software can set the engraving time, engraving times and laser delay parameters of the laser light at a certain point, and the laser controller can control the moving speed, power level and frequency value of the laser light. In this way, through proper adjustment, the focal length of the oscillating mirror 12 can control the engraving depth and line width of the laser beam on the three-dimensional workpiece 10, and easily achieve the precision of engraving patterns or glyphs. . In this embodiment, the laser light is a solid infrared light or a solid ultraviolet light having a wavelength of about 193 nm to 1064 nm, thereby being attached to at least one solid workpiece 10 The surface is marked with an engraving width of approximately 30 microns. The above-mentioned related detailed description can be referred to the applicant's patent application No. 097121223. At the same time as the laser engraving, the monitoring image capturing unit 15 can also be used to monitor whether the processing result of the solid workpiece 10 is correct. Applying the laser processing system described above, the present invention also discloses a laser processing method, and the related flow description is as shown in Fig. 6, and is explained as follows. Firstly, in a first step 61, a solid workpiece on the working platform is positioned, and secondly in a second step 62, a laser beam is provided, wherein the laser beam has a variable tilt angle with the working platform, and the mine is exposed to 201032936. The light is formed on the at least two surfaces of the three-dimensional workpiece to form a number of tracks. Further, the positioning method in the first step 61 includes providing an image capturing device for positioning the solid workpiece to a predetermined orientation. In a second step 62, the laser beam is provided by a laser source group, wherein the laser source group is adapted to project the laser beam through a galvanometer. The setting of the galvanometer has an oblique angle with respect to the working platform. At the same time, the galvanometer further includes a flat field focusing mirror for focusing, in addition to controlling the projection direction of the laser light, and simultaneously compensating for the focal lengths of different reflection angles in different directions. Thereby, in the second step 62, the galvanometer can be used to deflect the laser light to a predetermined direction for processing on the surface of the three-dimensional workpiece. The working platform in this embodiment is a mobile working platform. Therefore, the laser processing method may further include a third step 63: moving the working platform to repeat the first step 61 on another solid workpiece on the working platform. And the second step 62 until the processing of all the three-dimensional workpieces is completed. Accordingly, the laser processing method of the present invention can perform processing for a plurality of three-dimensional workpieces by using laser light having a variable tilt angle with the working platform, respectively, on the surface of the plurality of solid workpieces. In summary, the present invention provides a laser processing system and method suitable for deflecting laser light for laser engraving on a number of surfaces of a solid workpiece in a single process, which is different from conventional In the laser processing mode, the three-dimensional workpiece must be manually turned over and positioned before being processed on the other surface of the three-dimensional workpiece. Thereby, the processing time can be shortened and the efficiency can be improved. Secondly, the present invention further utilizes an image capture device for correcting the orientation of the solid workpiece prior to processing, thereby obtaining an accurate engraving mark. Furthermore, in the present invention, the laser processing system further utilizes the control software and the controller to appropriately adjust the focal length of the galvanometer to control the depth of the laser and the line width of the laser beam. By the above-mentioned parameter control, the accuracy of the engraving pattern or the glyph can be easily formed, and at the same time, the projection of the laser light is not easy to cause excessive thermal stress to concentrate on the surface of the three-dimensional workpiece, so that the three-dimensional work is liable to be damaged. Further, the present invention further utilizes a mobile work platform, which is suitable for processing a plurality of solid workpieces. The embodiments described above are only intended to illustrate the embodiments of the present invention, and to explain the technical features of the present invention, and are not intended to limit the scope of the present invention. Any arrangement that changes or equals can be easily accomplished by those skilled in the art is intended to be within the scope of the invention. The scope of the rights of the application is intended to be in the scope of the patent application. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic view of a laser processing system of the present invention; Fig. 2 is a view of processing at least one solid workpiece by the laser processing system of the present invention. 3 is a schematic diagram showing the two surfaces of a three-dimensional workpiece; FIG. 4 is a schematic diagram for defining the position of a three-dimensional workpiece according to the present invention; FIG. 5a is a positioning of a three-dimensional image by using the laser processing system of the present invention; Schematic diagram of the workpiece 图 · Figure 5b is a schematic diagram of the angle of a solid workpiece using the laser processing system of the present invention; and Figure 6 is a flow chart of a laser processing method of the present invention. [Main component symbol description] 1. Laser processing system 10, 10': three-dimensional workpiece 201032936 10a, 10b, 10c, 10d, 10e: three-dimensional workpiece 11: laser light source group 11a, lib: laser light 12: galvanometer 121 : flat field focusing mirror 13 : positioning image capturing unit 13 a : illumination light source 13 b : image window 14 : mirror 15 : monitoring image capturing unit 15 a : illumination source 17 : auxiliary image capturing unit 17 a : illumination source 17 b : image window 19 : Work Platform 2. Wafer 61: First Step 62: Second Step • · · . 63 : Third Step a: Top Edge* · : . · · · b : Side C: Center m, η: Mark X : Horizontal distance y: Vertical distance Θ: Tilt angle Ref.