WO2016117224A1 - Marking device and method, pattern generation device, and workpiece - Google Patents

Marking device and method, pattern generation device, and workpiece

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Publication number
WO2016117224A1
WO2016117224A1 PCT/JP2015/083087 JP2015083087W WO2016117224A1 WO 2016117224 A1 WO2016117224 A1 WO 2016117224A1 JP 2015083087 W JP2015083087 W JP 2015083087W WO 2016117224 A1 WO2016117224 A1 WO 2016117224A1
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WO
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Patent type
Prior art keywords
pattern
drawing
unit
marking
laser
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PCT/JP2015/083087
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French (fr)
Japanese (ja)
Inventor
正則 田尾
岡部 均
Original Assignee
東レエンジニアリング株式会社
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring

Abstract

This marking device (1) has: a first laser machining unit (3a, 3b) for marking a workpiece at a first dot diameter; a second laser machining unit (5a, 5b) as a second marking unit for marking the workpiece at a second dot diameter that is less than the first dot diameter; and a device (PC7) for recording a drawing pattern split into a first drawing pattern drawn by the first laser machining unit (3a, 3b) and a second drawing pattern drawn by the second laser machining unit (5a, 5b). The first drawing pattern and the second drawing pattern, by being drawn in a mutually superimposed fashion, form a prescribed drawing pattern on the workpiece, and the second drawing pattern includes a contour pattern that fills in the edge portion of the first drawing pattern, whereby improved machining accuracy and shorter working time are achieved at the same time.

Description

Marking device and method, pattern generator, and the workpiece

The present invention is a marking apparatus and method, pattern generator, and to the workpiece.

Marking device is a device that characters, symbols, graphics, printing a predetermined shape such as a wiring pattern (marking) and drawing (patterning) the semiconductor devices and substrates for liquid crystal display, a workpiece such as an electronic component.

Specific marking device, a laser marking apparatus which converges the laser beam at a predetermined dot size is scanned in a two-dimensional direction while irradiating the surface of the workpiece, to mark letters or figures on the surface of the workpiece There has been proposed (e.g., Patent Document 1).

As the configuration of the laser marking device, one of the pulsed laser beam emitted from the laser unit of one, it is also known configuration for performing the processing by distributing to the plurality of optical paths (for example, Patent Document 2).

Further, as a structure of a laser marking device, change smaller dot diameter when the laser printing, configuration capable small micro printing line width of thin size have also been proposed (e.g., Patent Document 3).

JP 2005-66611 JP JP 2005-74479 JP JP 2009-285693 JP

Here, as requirements for marking device is mentioned to have a high processing precision, it is also required reduction of the working time to consider productivity.

However, there is a problem that the technique shown in Patent Documents 1 to 3 is difficult to achieve both of reduction of the processing accuracy and operation time.

Specifically, in the technique shown in Patent Document 1, the greater the laser dot diameter used for the marking, although the operation time is shortened, it becomes impossible fine pattern writing, a problem that the machining accuracy is deteriorated was there. On the other hand, as the dot diameter to be used for marking is reduced, since it is a fine pattern writing, although machining accuracy is improved, since the processing time is prolonged, there is a problem that it is difficult to shorten the working time.

That is, in the technique disclosed in Patent Document 1, reduction of machining accuracy and operation time there is a problem of a trade-off.

Further, as shown in Patent Document 2, a technique for marking allocation from one laser light source a plurality of laser light into a plurality of optical paths, to shorten the operation time as compared with the case of marking by using only one optical path but it is, processing precision is a problem that can not be improved, also shorter machining accuracy and working time there has been a problem that no change in that a tradeoff relationship.

Furthermore, as shown in Patent Document 3, in the structure marking while changing the dot diameter emitted from one laser light source, although attained the compatibility between reduction of the degree of machining accuracy and working time, due to changes in the dot diameter fine setting change of the optical system and the laser output of the laser is required to.

Therefore, it is difficult to sequentially follow these configuration changes to a change in dot diameter, there is a problem that the machining accuracy can not be sufficiently improved.

Thus, we have problems Any been marking device described in Patent Documents 1 to 3, not the feasible shortening improve the working time of the machining accuracy at the same time technology has at present.

The present invention has been made in view of the above problems, its object is to provide a simultaneous feasible marking device shortening improve the working time of the machining accuracy.

To solve the aforementioned problems, a first aspect of the present invention, the marking device to draw the predetermined drawing pattern marking area set to the workpiece, the marking on the workpiece at a first dot diameter a first marking portion which performs a second marking unit to mark the said workpiece with a small second dot diameter of a dot diameter than the first dot size, the drawing pattern, with the first marking portion registering the first drawing pattern and divided and the second drawing pattern to be drawn in the second marking unit draws division drawing pattern comprises a registration unit, a said second drawing pattern and the first drawing pattern , which is given the drawing pattern relative to the workpiece by being drawn by superimposing each other are formed, wherein the second drawing pattern, the first drawing It contains contour patterns to fill the edges of the pattern, a marking device.

A second aspect of the present invention, the entire drawing pattern registration unit, the first drawing pattern from the entire drawing pattern to be registered as a whole writing pattern across the drawing pattern marking marking apparatus according to the first aspect and the second drawing pattern with a split drawing pattern generation unit that divides generating a pattern generator.

A third aspect of the present invention,
In marking method of drawing a predetermined drawing pattern marking area set to the workpiece,
The drawing pattern is registered divided into a second drawing pattern set a small second dot diameter of a dot diameter than the first drawing pattern and the first dot diameter set by the first dot diameter, a division drawing pattern registration step,
A first marking step of marking the workpiece on the basis of the first drawing pattern,
A second marking step of marking the workpiece based on the second drawing pattern,
Have,
The first drawing pattern and the second drawing pattern, which predetermined drawing pattern is formed to the workpiece by being drawn by superimposing each other,
The second drawing pattern, contour pattern to fill the edge of the first drawing pattern contains a marking method.

A fourth aspect of the present invention is the workpiece which has been marked with the marking method according to the third aspect.

According to the present invention, at the same time feasible marking device and method to shorten the improvement and working time of the machining accuracy, it is possible to provide a pattern generator and the workpiece.

Is a perspective view showing a schematic configuration of a marking device 1 according to an embodiment of the present invention. A block diagram of the marking apparatus 1 according to an embodiment of the present invention, the connection by the thick lines dedicated line, the connection by the communication line waveform, the fine line connection by an I / O (input and output) port, the dotted line is refers to the connection by the analog line. It is a cross-sectional view of a film 100 according to an embodiment of the present invention. Is a plan view showing a marking area 203 on the film 100 according to an embodiment of the present invention. It is a perspective view showing a schematic configuration of a first laser processing unit 3a. Is a plan view showing an example of the entire drawing pattern 113 formed on the film 100. A plan view showing an example of the entire drawing pattern 113 formed on the film 100, which is an enlarged view of the vicinity of the wiring pattern 70 of FIG. A plan view showing an example of a first drawing pattern 115 is a view corresponding to FIG. A plan view showing an example of a second drawing pattern 117 is a view corresponding to FIG. A plan view showing an example of the entire drawing pattern 113, is depicted portion with diagonal lines of the first drawing pattern 115, the stippled portion second drawing pattern 117, drawing entirely drawn portion is shaded a pattern 113 shows a superimposed area 118 of the first drawing pattern 115. An enlarged view of region A of FIG. 10, the first dot diameter 303 and the second dot diameter 304 is also indicated. It is a diagram showing a drawing pattern which assumes the case of drawing the entire area 310 first laser processing unit 3a as a first drawing pattern 115, using 3b only. Is a diagram illustrating an example of forming a second drawing pattern 117 in a pattern including a plurality of rows. Is a flow diagram showing the marking procedure using the marking device 1. It is a detailed flow diagram of S2 in FIG. A side view of a periphery of the processing table 21 of the marking apparatus 1 according to an embodiment of the present invention, is a view corresponding to the flow of FIG. 15. A side view of a periphery of the processing table 21 of the marking apparatus 1 according to an embodiment of the present invention, is a view corresponding to the flow of FIG. 15. Is a plan view showing an example of a first position check the reference mark 73 and the second position check reference mark 75.

Hereinafter, description of the preferred embodiment in detail the present invention with reference to the drawings.

First, description will be given of a configuration of a marking device 1 according to this embodiment with reference to FIGS.

Here, as the marking device 1, a laser marking device to mark using a laser on the surface of the film 100 is illustrated. As clear from the figure, the marking device 1 according to the present invention comprises a plurality of marking unit. In this example, first and second marking portion.

Specifically, the marking device 1 which is illustrated, two first laser processing unit 3a as a first marking unit to mark the workpiece with a laser of the first dot diameter 303, and 3b, the first dot two second laser processing unit 5a to the workpiece in the laser of the second dot diameter 304 dot diameter is smaller than the diameter 303 as a second marking unit to mark, and a 5b. Furthermore, device PC7 shown in Figure 2 along with the PLC (Programmable Logic Controller) 37, which operates as a control device for controlling the marking will be described later. It will be described later size of the first dot diameter 303 and the second dot diameter 304.

Of these, it has a device PC7 the control unit 6 and the storage unit 7a, a storage unit 7a storage area 12 for storing the entire drawing pattern 113 is information of the whole pattern to be marked (described later), the first laser the store processing unit 3a, a first drawing pattern 115 the first partial storage area 14 and a second laser processing unit 5a for storing (described later), a second drawing pattern 117 is drawn with 5b to draw with 3b (described below) and a second partial storage area 16. Thus, the storage unit 7a, are registered by dividing the entire drawing pattern 113 in the first partial storage area 14 and a second partial storage area 16. Therefore, device PC7 operates as a split drawing pattern registering unit for registering by dividing the entire drawing pattern 113.

Further, details are device PC7 described below, operates as a contour sequence number setting section that sets the number of columns of the contour pattern 120 in the second drawing pattern 117.

The device PC7 is superposition of the first drawing pattern 115 and the second drawing pattern 117 Vx, (details below) Vy also operate as a superposition amount setting unit that sets the edges of the entire drawing pattern 113 offset of the edge of the first drawing pattern 115 for 313 Gx, (details below) Gy also operates as an offset amount setting unit for setting.

Since the registration of the whole drawing pattern 113 in the present embodiment, and the entire drawing pattern 113 first drawing pattern 115 and the second drawing pattern 117 processing unit PC7 for generating by dividing the performed entirely device PC7 It has a function as a drawing pattern registration unit and the divided drawing pattern generation unit.

Referring to FIGS. 1-5, the structure of the marking apparatus 1 will be described in further detail.

As shown in FIGS. 1 and 2, the marking device 1 is closed and the unwinding device 11 for unwinding the film 100 as a workpiece, a winder 13 for winding the unwound film 100 from the unwinding device 11 doing.

Film 100 here, as shown in FIG. 3, it is obtained by forming a metal layer 103 on a substrate 101 such as a polymer film, a first laser processing unit 3a on the metal layer 103, 3b and second laser machining parts 5a, by selectively irradiating the laser from 5b, irradiating the receiving portion is removed (described later in detail) a predetermined wiring pattern 70 is formed.

On the other hand, in the marking device 1, winding between the output 11 and the winding device 13, and below the film 100, the processing table of the marking area 203 of the film 100 (described later in detail) as a relative movement unit for holding suction 21 is provided. The work table 21 is driven portion 23, which is oriented parallel to the conveying direction of the film 100, in FIG. 1 + x, -x direction, and the normal direction of the surface of the film 100 is oriented parallel + z, -z it is movable in the direction.

On the other hand, the processing table 21 + x, the movable distance of the -x direction is restricted to a distance H of FIG. 1, the ends of the travel limits, the holding table 25 for temporarily adsorbing and holding the film 100 It is provided. Holding table 25 is movable by an actuator, not shown in FIG. 1 + z, in the direction of -z.

Although details will be described later, the processing table 21 together by adsorbing the film 100 at the time of marking, during the transport of the film 100 to prevent positional deviation of the film 100 by moving to follow the film 100.

Further, when the machining table 21 has reached the movement limit by the conveyance of the film 100, the film 100 was adsorbed temporarily holding table 25, upstream disconnect the work table 21 from the film 100 (unwinding unit 11 side) return the processing table 21 in.

Further, the first laser processing part 3a above the work table 21, 3b and the second laser processing unit 5a, and 5b are provided, further, the alignment unit 27 for later alignment correction are provided. As shown in FIG. 2, the alignment unit 27, CCD as a reference mark imaging unit (Charge Coupled Device) image pickup unit 28 such as a camera is provided.

Further, the marking device 1 first laser processing unit 3a, but 3b is fixed, the second laser processing unit 5a, the driving stage 29 such XYθ stage or UVW stage as a marking position correction unit is provided to 5b and which film 100 and the first laser processing unit 3a, a second laser processing unit 5a relative 3b, 5b are horizontal (XY) rotation direction and z-direction as a rotation axis (theta) direction movable relative going on.

Furthermore, the marking device 1 has a laser power meter 33 and the transducer 35 measures the output of the laser.

Device PC7 is a computer for driving and controlling the components of the marking device 1, the device PC7, the monitor 8 for operating the device PC7, keyboard 10 is provided as input and output devices. These input and output device may be a tablet type of input and output devices.

The device PC7 machining table 21 (and the unwinding device 11, the winding 13) the first laser machining unit 3a controls to the to the film 100, 3b and the second laser machining unit 5a, and 5b relatively while moving to function as a migration marking control unit for marking also has.

Further, as described above, in the present embodiment operates as a control device for controlling the marking apparatus PC7 and PLC37 will be described later. More specifically, device PC7 first laser processing unit 3a, 3b and the second laser processing unit 5a, 5b laser processing conditions (laser current value of the laser oscillation frequency, the galvanometer scanning speed, the conveying speed of the machining table 21, transport distance of the machining table 21, the condition of the alignment unit 27, the condition of the laser power meter 33, the laser processing of the layout, and setting the laser accuracy correction data processing), a first laser processing unit 3a, 3b and the second laser machining unit 5a, except that mainly performs processing instruction control, etc. related to 5b, also responsible for transmitting the information indicating that the processing has been completed (end of machining trigger) to PLC37.

Further, PLC37 the control of the operation of the processing table 21, control of the operation of the holding table 25, control of the release of the vacuum adsorption and adsorption of the processing table 21 and the holding table 25, a dust collector (not shown), laser chiller, operations such as table nip control, such as control of the opening and closing operation of the laser of the mechanical shutter, a first laser processing unit 3a, 3b and the second laser processing unit 5a, the other for controlling the operation of the non-5b construction, that the control of the operation has been completed also responsible for transmitting the information (trigger) a device PC7 shown.

Device PC7 a first laser processing unit 3a, 3b, the second laser processing unit 5a, 5b, the unwinding device 11, the winding device 13, the processing table 21, the holding table 25, alignment unit 27, the driving stage 29, a laser power meter 33 (converter 35) is connected via a PLC (Programmable Logic Controller) 37.

The first laser processing unit 3a which is illustrated, 3b, the second laser processing unit 5a, 5b first laser processing unit 3a, 3b to each other, and the second laser processing unit 5a, 5b each other in the conveying direction of the film 100 They are arranged in parallel (the conveying direction and perpendicular direction) against.

Therefore, area to be marked at a time in the film 100 (marked area 203), as shown in FIG. 4, the roughing region 103a where the first laser processing unit 3a, 3b is processed, 103b, and the second laser processing unit 5a , microfabrication region 105a where 5b is processed, is divided into four 105b.

Thus, when performing marking, the second drawing pattern for drawing a marking area 203 first drawing pattern 115 (second region) and a second laser processing unit 5a of the first laser processing unit 3a, 3b is drawn, at 5b 117 it is necessary to previously register information of the divided pattern device PC7 (the second region).

Here, the first laser processing portion 3a with reference to FIG. 5, 3b and the second laser processing unit 5a, construction of 5b, as well as the outline of these operations will be described.

Since the first laser processing unit 3b and the second laser processing unit 5a, 5b of the configuration is the same as that of the first laser processing unit 3a, the description thereof is omitted.

As shown in FIG. 5, the first laser processing unit 3a includes a light source 51 for irradiating a laser such as a YAG (Yttrium Aluminum Garnet) laser, provided on the optical path of the laser emitted from the light source 51, the dot diameter of the laser beam expander 53 is a lens for adjusting, corner mirrors 55 and 57 for changing the direction of the laser transmitted through the beam expander 53, the laser of the Z-axis that is incident from the corner mirror 57 (see FIG. 5) direction of the focal point Z scanner 59 and the objective lens 61 to adjust, XY galvanometer scanner 63 for adjusting the X-axis and Y-axis direction coordinate of the light transmitted through the objective lens 61, and a laser processing unit PC39 controlling the operations of the component Yes doing.

That is, in the first laser processing unit 3a, a laser irradiated at a predetermined output from the light source 51 is adjusted to a predetermined dot diameter by the beam expander 53, is irradiated with Z scanner 59, an objective lens 61, XY galvanometer scanner 63 location coordinates and is adjusting the focus at that position is irradiated with the first dot diameter 303 to a desired position of the film 100. In general, Z scanner 59, by adjusting the objective lens 61 or the like, it is possible to vary the dot diameter. However, when adjusted dot diameter by adjusting a time division manner the optical system, the beam energy of the film 100 becomes uneven, the fact that the quality of the marking deteriorates was found. Therefore, the present invention is a laser of different dot diameters to be substantially equal energy on the film 100, it is adjusted a plurality of laser processing unit. The first laser processing portion 3a in this embodiment, the output of 3b is 11 watts, the repetition frequency is 40 kHz.

On the other hand, the second laser processing unit 5a, 5b and the second only in irradiating the laser dot diameter 304 first laser processing unit 3a, and 3b differs. The second dot diameter 304 is not particularly limited if the size it is smaller dot diameter than the first dot size 303, for example, the first and the diameter of the dot diameter 303 second dot diameter 304 the ratio of the diameter of 4: is about 1. In this example, the second laser processing unit 5a, the output of 5b is 2 watts, the repetition frequency is 40 kHz.

The above is the outline of the structure and operation of the first laser processing unit 3a.

Next, the marking procedure using the marking device 1 will be described with reference to FIGS. 6 to 18.

First, an example of the entire drawing pattern 113 formed on the film 100 in the following description, with reference to FIGS. 6 to 14.

As shown in FIG. 6, the entire drawing pattern 113 within a rectangular marking area 203 is a wiring pattern 70 is provided 16, further position check reference mark 71 for alignment is provided on the four corners of the marking area 203 It is.

Further, the entire drawing pattern 113 as described above, is divided into a first drawing pattern 115 and the second drawing pattern 117. This first drawing pattern 115 and the second drawing pattern 117 will be described in detail with reference to FIGS. 7-14.

First, there is the whole drawing pattern 113 shown in FIG. 7, the diameter of the first dot diameter 303 consider the case where D. In this case, (narrower) smaller than D for regions 305,306,307,309 the first laser processing unit 3a, can not be drawn in 3b, the second laser processing unit 5a having the second dot size 304, 5b in is set as a second drawing pattern 117 to be drawn.

Next, the first laser processing unit 3a for drawing the first drawing pattern 115, 3b is a second laser processing unit 5a to draw the second drawing pattern 117, than 5b, larger laser dot diameter during drawing , since it is possible to draw a large area at high speed, drawable region in the first dot diameter 303 (region 310) is the original being set as a first drawing pattern 115 desired.

On the other hand, in the present embodiment as a pattern having a contour pattern 120, such as to fill the edge 116 of the first drawing pattern 115, the second drawing pattern 117 is set. Conversely, the offset shape inside to the edge 313 of the edge 116 entire drawing pattern 113 of the first drawing pattern 115. On the other hand (including the outline pattern 120) outer edge portion 114 of the second drawing pattern 117 coincides with the edge 313 of the entire drawing pattern 113.

According to the above criteria, splitting the entire drawing pattern 113 of FIG. 7, the first drawing pattern 115 becomes a pattern shown in FIG. 8, the second drawing pattern 117 is a pattern shown in FIG.

Further, when the overlap between the first drawing pattern 115 a second drawing pattern 117, resulting in region 118 overlaid as shown in FIG. 10 and FIG. 11.

Incidentally, as shown in FIG. 11, overlapping amount of the X direction and the first drawing pattern 115 in the second drawing pattern 117 is referred to as a Vx, it referred to the amount of superposition of Y direction Vy. Also refers to the offset amount of the X-direction from the edge of the first drawing pattern 115 against the edge 313 of the entire drawing pattern 113 and Gx, referred offset amount in the Y direction and Gy.

Here, to set the edge of the first drawing pattern 115 as a contour pattern 120 of the second drawing pattern 117 is due to the following two reasons.

First, as described later, the first laser processing unit 3a, 3b and the second laser processing unit 5a, 5b is to mark on the basis of the first drawing pattern 115 and the second drawing pattern 117, the laser dot shape planar shape There is a circle. Therefore, as shown in FIG. 12, when marking by using tentatively first laser processing unit 3a as a first drawing pattern 115, 3b only the entire large area 310 than D, actually the edge of the first drawing pattern 115 predetermined gap 315 is generated between the patterns to be drawn.

Such gap 315 and the second laser processing unit 5a, but occurs even in the case of performing drawing on a region 310 using 5b, since towards the first dot diameter 303 is greater than the second dot diameter 304, first 1 the laser processing unit 3a, better when drawn using 3b, gap 315 becomes larger.

Therefore, by setting the second drawing pattern 117 as a pattern including a contour pattern 120, such as to fill the edge of the first drawing pattern 115, the gap 315 as compared with the case where the entire region 310 and the first drawing pattern 115 more can be reduced, thereby improving the accuracy of the entire drawing pattern 113. This is the first reason.

Next, in the marking device 1, the first laser processing unit 3a, 3b and the second laser processing unit 5a, the positioning accuracy of 5b, due to aging or the like during marking of a pattern to be actually drawn position first sometimes the writing pattern 115 and the second drawing pattern 117 deviate.

In this case, toward the first drawing pattern 115 shift amount is greater than the second drawing pattern 117. This is because the first laser processing unit 3a, found the following 3b second laser processing unit 5a, is larger dot diameter than 5b. Therefore, misalignment of the first drawing pattern 115 is a particular problem.

Therefore, by setting the edge of the first drawing pattern 115 as a second drawing pattern 117, the area to be drawn in the first drawing pattern 115, as in fact resulted in a shift, minutes produced a shift is It is drawn in the region of the second drawing pattern 117.

More precisely, the offset amount Gx from the outer periphery of the first drawing pattern 115 against the edge 313 of the entire drawing pattern 113 as shown in FIG. 11, Gy is superposition amount Vx, the following cases Vy, first drawing pattern shift amount of 115 Gx, if Gy or less, minutes produced a shift is drawn in the area of ​​the region or overlapping region 118 of the second drawing pattern 117.

On the other hand, the offset amount Gx, Gy is superposition amount Vx, greater than Vy, the shift amount of the first drawing pattern 115 is Vx, if Vy less, minutes produced a shift of the second drawing pattern 117 It is drawn in the region of the region or overlapping region 118.

Therefore, the offset amount Gx minute resulting deviation, Gy or superposition amount Vx, can be absorbed by the range of Vy, pattern itself that is actually drawn with or without displacement, the same as the entire drawing pattern 113 It can be in shape. This is the second reason.

This is the method of dividing the entire drawing pattern 113 on the first drawing pattern 115 and the second drawing pattern 117.

Thus, having individually light source 51, a plurality of laser processing unit having a different dot diameter, high speed drawing portions that need to be processed a large area with the larger laser processing portion of the dot diameter, fine by precisely draw a portion requiring machining with a small laser processing unit of dot diameter, the marking device 1 can realize shortening of improving the working time of the machining accuracy at the same time.

Further, by setting the marking device 1 the edge of the first drawing pattern 115 as a contour pattern 120 of the second drawing pattern 117, as the area to be drawn in the first drawing pattern 115 may actually have deviated also, minutes produced a shift is drawn into the region of the second drawing pattern 117.

Therefore, the marking device 1 can realize shortening of improving the working time of further processing accuracy at the same time.

Among the second drawing pattern 117 in FIG. 11, (referred to the width of the 11 X-direction Sx, the width in the Y direction and Sy) width of the pattern to fill the edge of the first drawing pattern 115 of the second is the same as the diameter of the dot diameter 304. That second drawing pattern 117 is formed by dots a row.

On the other hand, the second drawing pattern 117 is not necessarily required to be formed in dots a line may be formed in a plurality of rows as shown in FIG. 13.

By the plurality of rows in this manner, the amount of superimposed as compared with the case of a row Vx, can be increased Vy and offset amount Gx, the Gy.

Therefore, the acceptable deviation amount of the first drawing pattern 115 (and the second drawing pattern 117) can be increased.

However, as the number of columns and overlay amount Vx, Vy is large, the area of ​​the second drawing pattern 117 is increased, the time required for drawing is prolonged.

Therefore, overlap amount Vx, Vy number column is a suitable range by comparing the working time and the shift amount is expected desirably be selected.

For example, the position of the first laser processing unit 3a, 3b and the second laser processing unit 5a, 5b of the positioning accuracy, the first drawing pattern 115 and the second drawing pattern 117 that is assumed marking locations due to aging or the like during the marking deviation respectively alpha, when the beta, overlap amount Vx, Vy is required even alpha + beta a minimum. Further, when the first drawing pattern 115 and the second drawing pattern 117 is maximum deviation amount in opposite directions to each other, there is a possibility that a gap that is derived from the fact the dot diameter of the circle (see the gap 315 in FIG. 12) occurs Therefore, if the amount to be filled the gap and gamma, actual superposition amount Vx, Vy becomes α + β + γ.

The column number of the second drawing pattern 117 as described above, overlap amount Vx, Vy size and offset Gx, increased or decreased by the magnitude of Gy. That superposition amount Vx, Vy and offset Gx, it is desirable to increase the number of columns as the Gy increases, overlap amount Vx, Vy and offset Gx, that reduce the extent columns Gy is less desirable.

The above is the description of an example of the entire drawing pattern 113 formed on the film 100.

It will now be described with reference to FIG. 14 for the marking procedure.

First, device PC 7 (the control unit 6) of the marking apparatus 1, whether or not the first drawing pattern 115 corresponding to the entire drawing pattern 113 and the entire drawing pattern 113, the second drawing pattern 117 is registered in the storage unit 7a determine (S1 in FIG. 14), to mark (pattern drawing) according to the pattern that has been registered If registered (S2 of FIG. 14).

When the first drawing pattern 115 and the second drawing pattern 117 is not registered, it generates the first drawing pattern 115 and the second drawing pattern 117 control unit 6 of the apparatus PC7 are according to the following procedure (split drawing pattern) register. Note that we are using the device PC7 as divided drawing pattern generation unit that generates a divided drawing pattern (or split drawing pattern generation apparatus), but manufactured device rather PC7 division drawing pattern, other computers (pattern generation device) may be performed using.

First, the control unit 6 of the apparatus PC7 reads data pattern, such as CAD data corresponding to the entire drawing pattern 113 (S3 in FIG. 14).

Next, the control unit 6 of the apparatus PC7 superposition amount Vx of the first drawing pattern 115 and the second drawing pattern 117, Vy, offset Gx of the first drawing pattern 115 against the edge 313 of the entire drawing pattern 113, Gy, and setting the number of columns of the second drawing pattern 117 (S4 in Fig. 14). Amount allowed Specifically, superimposed operator Vx, Vy, offset Gx, or to input the number of columns Gy and the second drawing pattern 117, or reads these data from other PC or storage medium.

Next, the control unit 6 of the apparatus PC7 converts the CAD data read in the Gerber data (S5 in FIG. 14).

Next, the control unit 6 of the apparatus PC7 divided into a plurality of regions corresponding to Gerber data on the number of the laser processing unit (S6 in FIG. 14). Shape manner and area of ​​the division is the same as FIG. That is, since the marking device 1 to have a first laser processing unit 3a, 3b and the second laser processing unit 5a, four of the laser processing unit 5b, divides the Gerber data into four regions.

Next, the control unit 6 of the apparatus PC7 from divided regions, the first drawing pattern 115 and the second drawing pattern 117 is divided product, and registers (S7 in FIG. 14). How specific division product is is as described with reference to FIGS. 6 to 14 are briefly described below.

That is, the divided drawing pattern generation unit, first to the overall shape of the drawing pattern 113, the superposition amount of the first drawing pattern 115 and the second drawing pattern 117 set in S4 Vx, Vy, edge 313 of the entire drawing pattern 113 1 drawing pattern 115 of the offset amount Gx, the second drawing pattern 117 divide generated based on the number of columns of the Gy and the second drawing pattern 117.

Next, a method of rendering the entire drawing pattern 113 (S2 in FIG. 14), with reference to FIGS. 15 to 18, will be described in more detail.

First, the marking device 1 (PLC37 of device PC7) is driven by a motor (not shown) or the like unwinding device 11 and the winding device 13, the first laser processing unit 3a, 3b marking area of ​​the film 100 to drawable position 203 transports the film 100 to be placed (S11 in FIG. 15). In this case, the processing table 21 under the control of PLC37, while sucking and holding the lower surface of the marking area 203, to move. When the movement of the work table 21 is completed, PLC37 sends the position information of the information indicating that the move is complete (movement completion trigger) and the processing table 21 in the apparatus PC 7.

Next, device PC7 which receives the location information of the movement completion trigger and a processing table 21, based on the position information of the machining table 21, which coincides with the position information from the processing layout storage section 7a has (first drawing pattern 115) is selected, and instructs the machining first laser processing unit 3a on the basis of the selected machining layout, the 3b (laser processing unit PC39 of). The first laser processing unit 3a that has received the instruction, 3b, based on the first drawing pattern 115, the roughing region 103a, the laser is irradiated to 103b, and patterned (S12 in FIG. 15). At this time, the position confirmation reference mark 71, the first laser processing unit 3a, the roughing region 103a by 3b, is depicted in 103b. Here, the first laser processing unit 3a, a position check reference mark 71 3b is depicted referred to as a first position check reference mark 73. When processing is complete, device PC7 transmits information indicating that the processing has been completed (completion of processing triggers) to PLC37.

Next, the processing completion trigger has received the PLC37 is driven by a motor (not shown) or the like unwinding device 11 and the winding device 13, the previous roughing region 103a, the region corresponding to 103b is next microfabrication region 105a, 105b the film 100 is transported in the direction of position to + x overlapping (S13 in FIG. 15). In this case, the processing table 21 so as to follow the conveyor while sucking and holding the lower surface of the marking area 203, to move.

Then, PLC37 uses the alignment unit 27, micro processing area 105a by the imaging unit 28, by imaging the first position check reference mark 73 moves to 105b, to calculate the positional deviation in the alignment unit 27, the positional deviation There it is determined whether the allowable range, if deviation is not within an allowable range the alignment correction (S14 of FIG. 15, FIG. 16 (a)). Alignment correction is performed, for example by PLC37 corrects the position of the second laser processing unit 5a, 5b controls the drive stage 29. Or alignment correction is completed, the (position deviation in the case of the allowable range) is calculated positional deviation ends, PLC37 is information indicating that the alignment has been completed (completion of alignment trigger) and the position information of the processing table 21 and transmits it to the apparatus PC7.

Next, device PC7 which receives the location information of the completion of alignment trigger and the processing table 21, based on the position information of the machining table 21, a first drawing pattern 115 coincides with the position information from the processing layout storage section 7a has and selects a second drawing pattern 117, and instructs the first laser processing unit 3a on the basis of the selected drawing pattern, 3b and the second laser processing unit 5a, the processed 5b (laser processing unit PC39 of). The first laser processing unit 3a receives the instruction, 3b and the second laser processing unit 5a, 5b, on the basis of the first drawing pattern 115 and the second drawing pattern 117, the roughing region 103a, 103b, and microfabrication region 105a, the laser irradiated to 105b, and patterned (S15 of FIG. 15, FIG. 16 (b)). Accordingly, microfabrication region 105a, 105b and the second drawing pattern 117 so as to overlap the region where the first drawing pattern 115 is formed in S12 is formed, the whole of the entire drawing pattern 113 is drawn.

At this time, depicts the first laser processing unit 3a, 3b is a first position check reference mark 73 in the same manner the S12 roughing region 103a, in 103b.

Further, the second laser processing unit 5a, 5b also draw fine processing region 105a, the position confirmation reference mark 71 to 105b. Wherein the second laser processing unit 5a, a position check reference mark 71 5b is depicted referred to as a second position check reference mark 75.

Thus, microfabrication region 105a, in 105b, the location to be portrayed position check reference mark 71 is depicted as the first position check the reference mark 73 and the second position check the reference mark 75 is overlapped .

When processing is complete, device PC7 transmits the processed completion trigger PLC37.

Next, PLC37, which has received the processing completion trigger using the alignment unit 27, images the first position check the reference mark 73 and the second position check reference mark 75 is overlapped portion by the imaging unit 28, shown in FIG. 18 a first position check reference mark 73, such as to measure a relative displacement P of the second position check the reference mark 75 on the alignment unit 27. If the positional deviation P is not within an allowable range the alignment correction (S16 of FIG. 15, FIG. 16 (c)). Although a specific method of alignment correction are mentioned S14 other, it includes methods for correcting the irradiation conditions of the laser with the laser processing unit PC39.

Next, the movement limit of (S17 in FIG. 15) downstream marking PLC37 apparatus 1 determines whether the position of the processing table 21 is in the movement limit of the downstream side (the winding 13 side) in this state If there is no return to S13, when in the movement limit, the process proceeds to S18.

If the position of the work table 21 is in the movement limit of the downstream, the marking device 1 it is necessary to return the work table 21 on the upstream side (unwinding unit 11 side), to move the work table 21 according to the following procedure.

First, PLC37 marking apparatus 1 moves the holding table 25 by using an actuator or the like (not shown) in the direction of + z, the film 100 is held by suction (S18 of FIG. 15, FIG. 16 (d)).

Next, PLC37 marking device 1 releases the suction of the film 100 by the processing table 21, a work table 21 using the driving portion 23 is moved in the direction of -z and away from the film 100 (S19 in FIG. 15, FIG. 17 (a)).

Next, PLC37 marking apparatus 1 moves the machining table 21 in the direction of -x using the drive unit 23 is moved to the upstream side (S20 of FIG. 15, FIG. 17 (b)).

Next, PLC37 marking device 1 is brought into contact with the film 100 again moves the machining table 21 + z in the direction by using the driving unit 23, to adsorb the film 100 (S21 in FIG. 15, FIG. 17 (c)) .

Next, PLC37 marking device 1 releases the suction of the film 100 of the holding table 25 moves the holding table 25 in the direction of -z, away from the film 100 (S22 in FIG. 15, FIG. 17 (d)) .

Thereafter, repeated S13 ~ S21 until processing all the marking area 203.

Thus, by suction holding the workpiece table 21 is always marked area 203 from below, it is possible to minimize the positional deviation of the film 100 at the time of marking.

The above is the marking procedure using the marking device 1.

Thus, according to this embodiment, the marking device 1, the first laser processing portion 3a of the first marking unit to mark the workpiece at a first dot diameter 303, and 3b, the first dot the second laser processing unit 5a of the workpiece in the second dot diameter 304 smaller dot diameter than the diameter 303 as a second marking unit to mark, and 5b, the entire drawing pattern 113, drawn in the first marking portion first divided and registered in the second drawing pattern 117 to be drawn by the drawing pattern 115 and the second marking unit, first laser processing part 3a, a first drawing pattern 115 and the second laser processing unit 5a to draw in 3b which, register divided into a second drawing pattern 117 to be drawn in 5b, the device PC7 as split drawing pattern registration unit, has a first drawing pattern 115 second A drawing pattern 117 is intended to be formed is predetermined overall drawing pattern 113 to the drawing object by being drawn by superimposing each other, the second drawing pattern 117, the edge of the first drawing pattern 115 contour patterns are included, such as to fill the part 313.

Therefore, the marking device 1 can be realized to shorten the improvement and working time of the machining accuracy at the same time.

Further, by setting the marking device 1 the edge of the first drawing pattern 115 as a second drawing pattern 117, the area to be drawn in the first drawing pattern 115, as in fact resulted in a shift, the shift the resulting amount is drawn into the region of the second drawing pattern 117.

Therefore, the marking device 1 can realize shortening of improving the working time of further processing accuracy at the same time.

Further, in other words the aforementioned embodiments, the marking method according to the present invention, dots across drawing pattern 113 than the first drawing pattern 115 and the first dot diameter 303 that is set by the first dot diameter 303 register divided into a second drawing pattern 117 that is set by the second dot diameter 304 smaller diameters, and dividing drawing pattern registration step (registered in device PC7 of the above marking device 1),
The first marking step to mark the workpiece (first laser processing portion 3a of the above-mentioned marking apparatus 1, for marking at 3b) on the basis of the first drawing pattern 115,
A second marking step to mark the workpiece (second laser processing unit 5a of the above-mentioned marking apparatus 1, for marking at 5b) based on the second drawing pattern 117,
It has a first drawing pattern 115 and the second drawing pattern 117, which predetermined overall drawing pattern 113 to the workpiece is formed by being drawn by superimposing one another, the second drawing the pattern 117 includes a contoured pattern that fills the edges 313 of the first drawing pattern 115.

Furthermore, the workpiece is marked by the marking device and method according to the present invention, the predetermined entire drawing pattern 113 where the first drawing pattern 115 and the second drawing pattern 117 is drawn by superimposing each other are formed .

Has been described above based on the embodiment of the present invention, the present invention is not limited to the embodiment described above.

For example, in the embodiment described above, as the marking device 1 is exemplified a device for performing the marking using a laser, the present invention is not in any way limited thereto, as long as markable device to the workpiece , it may be an apparatus for marking, for example, using a coating apparatus such as an ink jet or a dispenser.

Further, in the above embodiment, every time of moving the film 100, is performed to the alignment correction, condition for alignment correction is not limited to this, each movement of the film 100 several times, constant after time, or the like after the new drawing pattern is registered may be aligned correction under various conditions.

Furthermore, in the above embodiment, the first laser processing unit 3a, and 3b, the second laser processing unit 5a, but two by two 5b are arranged in parallel is performed marking, one each, or three or more or side by side laser processing unit.

Moreover, the entire drawing pattern 113 in the present embodiment, first, the first laser processing unit 3a, after the drawing of the first drawing pattern 115 at 3b, moves the film 100, the second laser processing unit 5a, in 5b the While performing drawing 2 drawing pattern 117, the drawing of the first drawing pattern 115 and the second drawing pattern 117 may be simultaneously. That may be performed drawing without dividing a machining area into roughing region 103a and microfabrication region 105a.

As the marking object to which the present invention can be applied (workpiece), a circular substrate such as a rectangular substrate or a semiconductor wafer or a glass wafer is not limited to a long sheet such as the film 100, such as a glass plate or a printed circuit board etc. can be exemplified.

Further, the marking according to the present invention, the character of the small area in the workpiece having a wide area, symbols, not only the narrow sense of the marking to be printed a predetermined shape, such as a figure, the majority of the workpiece having a wide area figure also includes broad markings to be drawn (patterned) to a predetermined shape such as a wiring pattern.

1: Marking device 3a: first laser processing unit 3b: first laser processing unit 5a: second laser processing unit 5b: second laser processing unit 6: control unit 7: device PC
7a: a storage unit 8: monitor 10: Keyboard 11: unwinder 12: storage area 13: winder 14: first partial storage area 16: second partial storage area 21: a processing table 23: drive unit 25: holding table 27: alignment unit 28: imaging unit 29: drive stage 33: laser power meter 35: converter 37: PLC
39: laser processing unit PC
51: light source 53: the beam expander 55: corner mirror 57: corner mirror 59: Z scanner 61: objective lens 63: XY galvanometer scanners 70: wiring pattern 71: position check reference mark 73: first position check reference mark 75 : second position check reference mark 100: film 101: substrate 103: metal layer 103a: roughing region 103b: roughing region 105a: microfabrication region 105b: microfabrication region 113: entire drawing pattern 114: edge 115: the first drawing pattern 116: edge 117: second drawing pattern 118: overlay area 120: contour pattern 203: marking area 303: the first dot diameter 304: second dot diameter 305: region 306: region 307: region 309: area 3 0: area 313: edge 315: gap

Claims (13)

  1. In the marking device to draw the predetermined drawing pattern marking area set to the workpiece,
    A first marking portion to mark the workpiece at a first dot diameter,
    A second marking unit to mark the said workpiece with a small second dot diameter of a dot diameter than the first dot size,
    Said drawing pattern is registered divided into a second drawing pattern to be drawn in the first drawing pattern and the second marking unit draws in the first marking unit, a division drawing pattern registration unit,
    Have,
    Wherein the first drawing pattern and the second drawing pattern, which predetermined said drawing pattern is formed for the workpiece by being drawn by superimposing each other,
    Wherein the second drawing pattern, the contour pattern to fill the edge of the first drawing pattern is included, the marking device.
  2. The contour pattern of the second drawing pattern is composed of a plurality of rows, marking device according to claim 1.
  3. Includes a contour column number setting unit for setting the number of columns of the contour patterns in the second drawing pattern,
    The divided drawing pattern registration unit, the drawing pattern based on the column number set by the contour sequence number setting unit, and registers are divided into the first drawing pattern and the second drawing pattern, to claim 2 marking device as claimed.
  4. And overlapping amount setting unit for setting a superposition of said second drawing pattern and the first drawing pattern,
    Wherein with the offset amount setting unit that sets the offset amount of the edge of the first drawing pattern for the edge of the drawing pattern, marking device according to any one of claims 1 to 3.
  5. A relative movement unit for relatively moving the workpiece and the first marking unit and the second marking unit,
    With a migration marking control unit for marking while controlling the relative movement unit by relatively moving the first marking unit and said second marking unit relative to the workpiece,
    Marking device according to any one of claims 1 to 4.
  6. The overall drawing pattern registration unit for registering the drawing pattern of the entire marking on the workpiece as a whole writing pattern,
    With a split drawing pattern generation unit that divides generate the first drawing pattern and the second drawing pattern from the entire drawing pattern, marking device according to any one of claims 1 to 5.
  7. The overall drawing pattern registration unit for registering the whole of the drawing pattern marking marking device according to any one of claims 1 to 6 as a whole writing pattern,
    With a split drawing pattern generation unit that divides generate the first drawing pattern and the second drawing pattern from the entire drawing pattern, the pattern generator.


  8. In marking method of drawing a predetermined drawing pattern marking area set to the workpiece,
    Said drawing pattern is registered divided into a second drawing pattern set a small second dot diameter of a dot diameter than the first drawing pattern and the first dot diameter set by the first dot diameter , a division drawing pattern registration step,
    A first marking step of marking the workpiece on the basis of the first drawing pattern,
    A second marking step of marking the workpiece on the basis of the second drawing pattern,
    Have,
    Wherein the first drawing pattern and the second drawing pattern, which predetermined said drawing pattern is formed for the workpiece by being drawn by superimposing each other,
    Wherein the second drawing pattern, the first contains the contour pattern to fill the edge of the drawing pattern, marking method.
  9. Wherein the contour pattern of the second drawing pattern is composed of a plurality of rows, marking method of claim 8.
  10. Includes a contour column number setting step of setting the number of columns of the contour patterns in the second drawing pattern,
    The divided drawing pattern registration step, the drawing pattern based on the column number set by the contour sequence number setting unit, and registers are divided into the first drawing pattern and the second drawing pattern, to claim 9 marking method as claimed.
  11. A superposition amount setting step of setting a superposition of said second drawing pattern and the first drawing pattern,
    Wherein with the offset amount setting step of setting the offset amount of the edge of the first drawing pattern for the edge of the drawing pattern, marking method according to any one of claims 8-10.
  12. The overall drawing pattern registration step of registering the drawing pattern of the entire marking on the workpiece as a whole writing pattern,
    Divided drawing pattern with a generating step marking method according to any one of claims 8-11 for dividing generate the first drawing pattern and the second drawing pattern from the entire drawing pattern.
  13. It said workpiece is marked by the marking method according to any one of claims 8-11.
PCT/JP2015/083087 2015-01-20 2015-11-25 Marking device and method, pattern generation device, and workpiece WO2016117224A1 (en)

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Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10229268A (en) * 1998-03-26 1998-08-25 Matsushita Electric Works Ltd Manufacture of circuit board
JPH10315425A (en) * 1997-05-20 1998-12-02 Dainippon Screen Mfg Co Ltd Laser platemaking apparatus
JPH11156564A (en) * 1997-11-28 1999-06-15 Toshiba Ceramics Co Ltd Heat resistant transparent member and manufacture
JP2002261315A (en) * 2001-03-05 2002-09-13 Kanegafuchi Chem Ind Co Ltd Method of manufacturing thin-film photoelectric conversion module
JP2011040446A (en) * 2009-08-07 2011-02-24 Bridgestone Corp Method of manufacturing optical filter for display, laser working device used therefor, and the optical filter for display
JP2011121106A (en) * 2009-12-14 2011-06-23 Hitachi High-Technologies Corp Laser patterning method and apparatus therefor
US20140175067A1 (en) * 2012-12-20 2014-06-26 Electro Scientific Industries, Inc. Methods of forming images by laser micromachining
US8927069B1 (en) * 2013-10-02 2015-01-06 Eritek, Inc. Method and apparatus for improving radio frequency signal transmission through low-emissivity coated glass

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10315425A (en) * 1997-05-20 1998-12-02 Dainippon Screen Mfg Co Ltd Laser platemaking apparatus
JPH11156564A (en) * 1997-11-28 1999-06-15 Toshiba Ceramics Co Ltd Heat resistant transparent member and manufacture
JPH10229268A (en) * 1998-03-26 1998-08-25 Matsushita Electric Works Ltd Manufacture of circuit board
JP2002261315A (en) * 2001-03-05 2002-09-13 Kanegafuchi Chem Ind Co Ltd Method of manufacturing thin-film photoelectric conversion module
JP2011040446A (en) * 2009-08-07 2011-02-24 Bridgestone Corp Method of manufacturing optical filter for display, laser working device used therefor, and the optical filter for display
JP2011121106A (en) * 2009-12-14 2011-06-23 Hitachi High-Technologies Corp Laser patterning method and apparatus therefor
US20140175067A1 (en) * 2012-12-20 2014-06-26 Electro Scientific Industries, Inc. Methods of forming images by laser micromachining
US8927069B1 (en) * 2013-10-02 2015-01-06 Eritek, Inc. Method and apparatus for improving radio frequency signal transmission through low-emissivity coated glass

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