TWI277478B - Laser marking method - Google Patents

Laser marking method Download PDF

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Publication number
TWI277478B
TWI277478B TW93140106A TW93140106A TWI277478B TW I277478 B TWI277478 B TW I277478B TW 93140106 A TW93140106 A TW 93140106A TW 93140106 A TW93140106 A TW 93140106A TW I277478 B TWI277478 B TW I277478B
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work
work object
compensation factor
laser beam
marking
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TW93140106A
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Chinese (zh)
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Mum-Fatt Buk
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Mum-Fatt Buk
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Abstract

A method for marking a work piece by a laser beam at a pre-defined location, the work piece being supported on a platform and having at least two identification signs, the method comprises determining the compensating factor for errors resulting from difference in the wavelengths of the laser beam used for marking and the visible light used for detection, detecting an image of each of the two identification signs to determine a position of the work piece relative to the platform, generating a set of marking coordinates based on the pre-defined location, the position of the work piece and the compensating factor, and directing a laser beam onto the work piece at the set of marking coordinates to mark the work piece.

Description

1277478 、發明說明(1) 利用雷射處 【發明所屬之技術領域】 本發明係關於一雷射處理方法,特別有關於 理以產生刻印(m a r k )於一工作物上之方法 【先前技術】 雷射刻印係為利用一雷射光束於/工作物之已決定之位置 上產生可察覺之記號之方法。工業上有許多種類之雷射可 以用於刻印之用,包括二氧化碳雷射、雅克(YAG )雷射以 及二極體雷射。除了刻印之外,一雷射也可以用於微加工 (m i c r 〇 - m a c h i n i n g )、表面處理、修飾、知接以及切副 等。 一雷射處理方法中,座標資料或位置之參數係產生於工作 物上之刻印地點,程式化以設計一雷射光束位置控制器當 中,並且有一參考座標。於理想狀況中,工作物置放於一 已決定之理論位置上,即於與上述座標系統對齊。該雷射 光束接著根據上述程式化座標資料應用到上述工作物之 上,因此可以於上述已定義之位置上作刻印。 然而^於一具貫狀況中,一工作物通常並非置放於 座標系統與/或上述參考樣板相對齊。也 、人 差,操作錯誤或置放上述工作物 ° ’、 (機械 地,-工作物通常置放於位錯…此,肩 定義之理論位置上沿著一直線鱼糸統中相對於上劫 綠與/或一旋轉方向移動之1277478, invention description (1) using laser station [Technical field to which the invention belongs] The present invention relates to a laser processing method, and particularly relates to a method for producing a mark on a work object [Prior Art] Ray The stencil printing method is a method of generating a perceptible mark by using a laser beam at a determined position of the /work object. There are many types of lasers in the industry that can be used for marking, including carbon dioxide lasers, YAG lasers, and diode lasers. In addition to marking, a laser can also be used for micromachining (m i c r 〇 - m a c h i n i n g ), surface treatment, modification, splicing, and cutting. In a laser processing method, the parameters of the coordinate data or position are generated at the marking location on the workpiece, programmed to design a laser beam position controller, and have a reference coordinate. In an ideal situation, the work is placed in a determined theoretical position, ie aligned with the coordinate system described above. The laser beam is then applied to the work object based on the stylized coordinate data described above so that it can be imprinted at the defined location. However, in a consistent situation, a work item is usually not placed in alignment with the coordinate system and/or the reference template. Also, people are poor, the operation is wrong or the above work is placed ° ', (mechanically, - the work is usually placed in a dislocation... This, the theoretical position of the shoulder is defined along the line of the fish in the fish. And/or a direction of rotation

1277478 工作私未考置直線以及旋轉方向之移動,列p 述物上所不希望之位置’此為不允許的會產生於 =「卫作物於上述雷射光束下之 據以上所 射刻印品質最關鍵之考量之—。 &amp;準度成為確保雷 影響一雷射光束於— 如’上述雷射系統與 作、上述工作物之定 之前系統已利用量測 以及量測上述工作物 量0 例 操 工作物上定位精準度之因子 導引上㉛雷射光束之光學之誤: 位與固定系統以及運作等。、 一控制器將一測 作系統中,其中會調 之相對位置以補償上 測器係需要的,因此 無效率的。上述感測 外來源。 j[例如量測與位置 之貫際位置以及理論位偵測 I έ士里山L X i '^間之偏移 里、、、口果由上述位置感測器傳送至一 整上述雷射#击LV » 锦 田耵尤來以及上述工作物之n 述偏移量。一分離之量測以及位置2 上述系統之建立以及操作將會笨拙= 态之增加亦可能成為系統誤差之一額 哈特曼(Hartmann)等人取得之美國第6,545,2 5 〇號專利, 提供一雷射處理工作物之方法以及裝置。根據此專利之上 述裝置,使用一光源作為參考導引一光束至上述工作物之 表面上。上述工作物反射回來之光由一光學偵測器所接 收,因此設定值與真實值之比較便可於真正處理之前得 到,並且可以決定於工作物上一輪廓(contour )之實際位1277478 The work has not been tested for the movement of the straight line and the direction of rotation, and the undesired position on the object of the column is 'not allowed to be generated. </ br> = "The crops are under the above-mentioned laser beam. The key consideration is that the &amp;&amp; degree is to ensure that the lightning affects a laser beam - such as 'the above laser system and the work, the above work has been determined by the system and the measurement of the above work volume 0 The factor of positioning accuracy on the object guides the optical error of the 31 laser beam: the position and the fixed system and the operation, etc., a controller will be measured in the system, and the relative position will be adjusted to compensate the upper detector system. Required, and therefore inefficient. The above-mentioned external source of sensing. j [For example, the position of the measurement and the position of the position and the theoretical position detection I έ士里山LX i '^ The position sensor transmits to the above-mentioned laser #击LV » Kam Tin and the above work, and the offset of the above work. A separate measurement and position 2 The establishment and operation of the above system will be awkward = state Increase U.S. Patent No. 6,545,25, the entire disclosure of which is incorporated herein by reference to U.S. Pat. No. No. No. No. No. No. No. No No No No No No No No No No No No No No No No No No No No No No No No No No No No No No No No No No No No No No No No No No No No No No No No No No No No No No. The reference guides a light beam to the surface of the work object, and the light reflected by the work object is received by an optical detector, so that the comparison between the set value and the real value can be obtained before the real processing, and can be determined by the work. The actual position of a contour

第7頁 1277478 五、發明說明(3) 置。 於本系統以及之前之系統,上述一輪廓(c ο n t 〇 u r )或剖面 之偵測位置係視為導引一雷射光束以處理上述工作物之實 際位置。然而,於雷射處理操作中’一彳貞測位置並非永遠 與上述實際位置相同,由於偵測上述位置時可能會將誤差 引入其可能導因於,例如,上述量測感測器之系統誤差或 光學與/或上述雷射光束以及光束之排列不當。上述系統誤 差可能對於某些雷射處理應用影響重大,於那些需要一相 對高定位精確度之應用中,例如雷射刻印,通常需要一位 置誤差約略或小於0. 1毫米。如同偵測位置與上述實際刻印 位置之間之關係為已知的,第6,5 4 5,2 5 0號美國專利所提供 之設定值與真實值之比較於需要高定位精確度之雷射刻印 操作中並不適用。 因此有必要提供一雷射刻印裝置以及系統,以刻印於一工 作物上之精確位置上,即產生高定位精準之刻印於一工作 物上,例如約略為正負(K 0 2毫米之精確度。 【發明内容】 根據本發明之一觀點,提供一種用於刻印一工作物之方 法。上述方法包括產生一波長補償因子,其代表一雷射光 束與一可見光束之間因為波長差異所造成之一偏差量,以Page 7 1277478 V. Description of invention (3). In the present system and prior systems, the above-described contour (c ο n t 〇 u r ) or the detected position of the profile is considered to guide a laser beam to process the actual position of the workpiece. However, in the laser processing operation, the position of a measurement is not always the same as the actual position. Since the detection of the position may introduce an error, it may be caused by, for example, the systematic error of the above-mentioned measurement sensor. Or optical and / or the above-mentioned laser beam and the arrangement of the beam is not appropriate. These system errors may have a significant impact on certain laser processing applications. For applications that require a relatively high positioning accuracy, such as laser marking, a bit error is typically required to be approximately or less than 0.1 mm. The relationship between the set position and the actual value provided by the U.S. Patent No. 6,5,425,250 is compared to the laser that requires high positioning accuracy. Not applicable in marking operations. Therefore, it is necessary to provide a laser marking device and system for imprinting on a precise position on a work object, that is, to produce a high positioning accuracy on a workpiece, for example, approximately positive and negative (K 0 2 mm accuracy). SUMMARY OF THE INVENTION According to one aspect of the present invention, a method for marking a work object is provided. The method includes generating a wavelength compensation factor representative of one of a laser beam and a visible light beam due to a wavelength difference Deviation amount to

第8頁 1277478 五、發明說明(4) 及一位置補償因子,其代表上述工作物之預期位置與一視 覺系統所偵測之實際位置之間之差異。利用這些補償因子 導出上述刻印座標,其係用於導引上述雷射光束於上述工 作物上以產生高準確度之刻印。 根據本發明之一實施例,產生上述波長補償因子,其係由 產生位於上述平台或一校正樣板上之一第一校 點上。透過一導光構件(guiding 第一狀態導引一雷射光束產生上述 導光構件而得 ,使得上述第 第 於 第一組座標資料透 述導光構件至一第 見光 束由一 導光構件而 一差值,透 因此補償上 導致之誤差 視覺偵 得到。 過上述 述雷射 過上述 二狀態 測器接 得到上 差值決 光束與 收。一第二組 述第一組以及 定波長補償因 上述可見光之 正記號於一 optic assembly) 第一校正記號。一 到。接著,調整上 一校正記號之一可 座標資 第二組 子。上 間由於 料透過上述 座標資料之 述補償因子 波長差異所 根據本發明之一另一實施例,產生兩校正記號。透過内插 (i n t e r ρ ο 1 a t i ο η)計算,根據上述兩校正記號之補償因子 決定沿著上述兩校正記號定義之一直線之一點之一補償因 子。選擇上述兩校正記號使得上述已定義刻印位置落於由 上述兩校正記號所定義之線上。產生三、四或更多之校正 記號,分別定義一三邊形、四邊形或多邊形區域,使得上 述區域包圍上述已定義刻印位置。使用上述三、四或更多Page 8 1277478 V. Description of the invention (4) and a position compensation factor representing the difference between the expected position of the work object and the actual position detected by a visual system. These compensation factors are used to derive the above-described imprinted coordinates for guiding the above-mentioned laser beam onto the above-mentioned crop to produce a high-accuracy imprint. According to an embodiment of the invention, the wavelength compensation factor is generated by generating a first calibration point on the platform or a calibration template. Generating the light guiding member by guiding a laser beam in a first state, so that the first group of coordinate data is transparent to the light guiding member to a first light beam by a light guiding member A difference, through which the error caused by the compensation is visually detected. The above-mentioned two-state detector is connected to obtain the upper difference beam and the received light. A second group of the first group and the fixed wavelength compensation are as described above. The positive sign of visible light is in an optic assembly) the first correction mark. One arrives. Next, adjust one of the last calibration tokens to the second group. According to another embodiment of the present invention, the two correction marks are generated due to the difference in the compensation factor wavelength of the material passing through the coordinate data. By the interpolation (i n t e r ρ ο 1 a t i ο η) calculation, the compensation factor of one of the straight lines along one of the two correction marks is determined according to the compensation factors of the two correction marks. The above two correction marks are selected such that the above defined mark position falls on the line defined by the above two correction marks. Three, four or more correction marks are generated to define a trigonometric, quadrilateral or polygonal region, respectively, such that the above region encompasses the above defined imprinting position. Use the above three, four or more

第9頁 1277478 五、發明說明(5) 校正記號之補償因子以計算一點或與上述已定義刻印位置 或透過内插位置重疊之點之補償因子。 至於導出上述位置補償因子,上述刻印之工作物有兩個或 更多辨識記號預先製作於其上。產生刻印之上述工作物上 之位置係已定義與上述二或更多辨識記號有關。由透過一 線性聚焦鏡(f-theta lens)接收一可見光束偵測上述工 作物之每一辨識記號之一圖像,以決定上述工作物相對於 支持上述工作物之一平台之一位置。產生一組刻印座標根 據上述工作物之位置以及已定義之位置。此組刻印座標補 償由於上述工作物誤對準(mi sal igned)其預設位置造成 之誤差,其通常產生於操作處理之中。 透過内插上述波長以及位置補償因子進入上述原先設計之 刻印參數,得到修正之刻印座標以導引上述雷射光束於根 據上述工作物上偵測以及/或計算之位置。 根據本發明之另一觀點,提供一種刻印支持於平台上之一 工作物之方法。上述方法包括產生一補償因子以代表一偏 移量,其係由於形成一校正記號之一雷射光束與偵測上述 校正記號之一可見光束之間之一波長差所造成。定義上述 刻印之工作物上之一位置,其係利用一第一組位置識別 符。決定相對上述平台之上述工作物之一位置,以及根據 上述第一組位置識別符、上述工作物之上述位置與上述補Page 9 1277478 V. INSTRUCTIONS (5) The compensation factor of the correction mark is used to calculate the compensation factor of a point or a point overlapping with the above defined mark position or through the interpolation position. As for the above-mentioned position compensation factor, the above-described engraved work has two or more identification marks previously prepared thereon. The position on the above-mentioned work piece that produces the engraving has been defined to be related to the above two or more identification marks. An image of each of the identification marks of the crop is detected by receiving a visible light beam through an f-theta lens to determine a position of the work object relative to one of the platforms supporting the work. A set of inscribed coordinates is generated based on the location of the work and the defined location. This set of imprinted coordinates compensates for the error caused by the misalignment of the above-mentioned workpieces (mi sal igned), which is usually generated in the operation process. By interpolating the above wavelengths and position compensation factors into the previously designed imprinting parameters, a corrected inscribed coordinate is obtained to direct the laser beam to a position detected and/or calculated based on the workpiece. According to another aspect of the present invention, a method of marking a work object supported on a platform is provided. The above method includes generating a compensation factor to represent an amount of offset due to a wavelength difference between a laser beam forming one of the correction marks and a visible light beam detecting one of the correction marks. Defining a location on the above-described imprinted work utilizes a first set of position identifiers. Determining a position of the work object relative to the platform, and according to the first set of position identifiers, the position of the work object, and the supplement

第10頁 1277478 五、發明說明(6) 償因子產生一第二組位置辨識符。導引一雷射光束至上述 工作物上並至上述第二組位置識別符以刻印上述工作物。 根據本發明之又一觀點,提供一種利用雷射刻印一工作物 之方法,上述方法包括載入一第一工作物至一平台之上; 定義上述第一工作物上之一位置以利用一第一組座標刻 印;偵測上述第一工作物之一圖像以決定上述第一工作物 相對於上述平台之一位置;產生一補償因子,以減少於一 第一工作物上由一雷射光束所指向之第一點以及由一可見 光束所偵測之第二點之間之一位置差;根據上述第一組座 標、上述第一工作物之位置與補償因子產生一第二組座 標;以及,導引一雷射光束至上述第一批工作物上之第二 組座標以刻印上述第一工作物。 【實施方式】 圖一 A顯示根據本發明之一實施例之一雷射刻印裝置1 0 0刻 印一工作物。圖一 B顯示上述圖一 A之裝置以及一工作物放 置於上述裝置之上以刻印。根據圖一 A以及圖一 B,上述裝 置1 00包括一雷射源1 1 0,例如一雅克(YAG)雷射或一二氧 化碳雷射,提供一雷射光束1 1 2具有一足夠能量以產生一刻 印於一工作物之上。一第一反射鏡1 2 0將上述雷射光束1 1 2 偏斜至一第二反射鏡130。上述第二反射鏡130又將上述雷 射光束11 2偏斜至一導光構件(guiding optics assemblyPage 10 1277478 V. INSTRUCTIONS (6) The compensation factor produces a second set of position identifiers. A laser beam is directed onto the workpiece and to the second set of position identifiers to mark the workpiece. According to still another aspect of the present invention, a method for marking a work object by laser is provided, the method comprising: loading a first work object onto a platform; defining a position on the first work object to utilize a first Marking a set of coordinates; detecting an image of the first work object to determine a position of the first work object relative to the platform; generating a compensation factor to reduce a laser beam by a first work object a position difference between the first point pointed and the second point detected by a visible light beam; generating a second set of coordinates according to the first set of coordinates, the position of the first work object and the compensation factor; And directing a laser beam to the second set of coordinates on the first batch of work objects to mark the first work object. [Embodiment] FIG. 1A shows a laser marking apparatus 100 imprinting a work object according to an embodiment of the present invention. Figure 1B shows the apparatus of Figure A above and a work placed on top of the apparatus for marking. According to FIG. 1A and FIG. 1B, the apparatus 100 includes a laser source 110, such as a YAG laser or a carbon dioxide laser, providing a laser beam 1 1 2 with sufficient energy to generate It is printed on a work at a time. A first mirror 120 excurs the laser beam 1 1 2 to a second mirror 130. The second mirror 130 further deflects the laser beam 11 2 to a light guiding member (guiding optics assembly)

第11頁 1277478 五、發明說明(7) ),如掃秸碩(scan head) 140。兩個電流控制 (=vOCOntrolled)之反射鏡 142與 144係 140中以接收以及導引雷射光束112於一平台15〇之,二 150係支持一工作物2〇〇以雷射刻印。電流控制反射 σ (galvo rairror) 142與144之軸相互對齊於一垂直 上。每一電流控制反射鏡為獨立地固定於—相對應之一 要軸上。掃描頭140有兩個電流控制反射鏡142以^ 14^以 方排Λ,/有偏斜、導引以及操縱上述雷射光束112 者:X方向以及一γ方向,相對地,上述雷射光束112可以 到達平台1 5 0上二維環境之任何一位置。 上述裝置100有一視覺福測器160,例如一電荷耦合元件攝 影機(CCD camera),以接收以及偵測自上述平台15〇與/ 或上述工作物2 0 0之可見光束212。上述視覺偵測器16〇置放 於上述第一反射鏡130。上述第二反射鏡為一分色鏡 (dichroic mirror),其可反射上述雷射光束並且允許上 述可見光通過。Page 11 1277478 V. Description of the invention (7)), such as the scan head 140. Two current controlled (= vOCOntrolled) mirrors 142 and 144 are coupled to receive and direct the laser beam 112 to a platform 15 which supports a workpiece 2 for laser marking. The current controlled reflection σ (galvo rairror) 142 and 144 axes are aligned with each other on a vertical plane. Each current control mirror is independently fixed to one of the corresponding axes. The scanning head 140 has two current control mirrors 142 arranged in a square row, / deflected, guided and manipulated the above-mentioned laser beam 112: X direction and a gamma direction, relatively, the above laser beam 112 can reach any position of the two-dimensional environment on the platform 150. The device 100 has a visual detector 160, such as a CCD camera, for receiving and detecting the visible light beam 212 from the platform 15 and/or the workpiece 200. The visual detector 16 is placed on the first mirror 130. The second mirror is a dichroic mirror that reflects the laser beam and allows the visible light to pass therethrough.

一聚光鏡(convergent lens) 170位於上述掃描頭140以及 上述平台150之間。上述聚光鏡17〇為一線性聚焦鏡 (f-theta lens)。上述線性聚焦鏡(f_theta lens) 170 將上述雷設光束11 2聚焦於上述工作物2 〇 〇之上。上述可見 光束2 1 2亦通過上述線性聚焦鏡(f-fheta lens) 170,並 且可以導引其向後透過上述電流控制反射鏡1 4 2,1 4 4以及A convergent lens 170 is located between the scanning head 140 and the platform 150. The condensing mirror 17 is a f-theta lens. The above-mentioned linear focusing mirror (f_theta lens) 170 focuses the above-described lightning beam 11 2 on the above-mentioned workpiece 2 〇 。. The visible light beam 2 1 2 also passes through the above-mentioned f-fheta lens 170 and can be guided to pass back through the current control mirrors 1 4 2, 1 4 4 and

1277478 五、發明說明(8) 上述第一反射鏡1 3 〇,進入上述視覺偵測器丨6 〇。一”線性聚 焦鏡$ f-theta lens) ”為—聚光鏡,其維持一雷射與/或 可見光束之焦點於一平面之上,當上述雷射與/或可見光束 之入射角改’艾日守。上述雷射與/或可見光束之入射角以及移 動距離之間有一線性關係◦於一實施例中,上述線性聚焦 鏡(f theta lens)為一顏色校正(c〇i〇r correct)掃描 鏡片(scan lens),可允許兩個或更多雷射與/或不同波 長之光束於通過時維持其焦點於相同平面上。1277478 V. INSTRUCTION DESCRIPTION (8) The first mirror 1 3 上述 enters the visual detector 丨6 〇. A "linear focusing mirror $ f-theta lens" is a concentrating mirror that maintains the focus of a laser and/or visible beam above a plane when the angle of incidence of the above-mentioned laser and/or visible beam is changed to 'Ai Shou. There is a linear relationship between the incident angle and the moving distance of the above-mentioned laser and/or visible light beam. In one embodiment, the linear lens (f theta lens) is a color correction (c〇i〇r correct) scanning lens ( Scan lens) allows two or more lasers and/or beams of different wavelengths to maintain their focus on the same plane as they pass.

上述視免谓測為1 6 〇其光學轴(〇 p t丨c a 1 ^ X i s) 1 6 2與上述 雷射光束1 1 2於上述電流控制反射鏡i 4 2與上述第二反射鏡 1 3 0之間之路徑相對齊。根據如上所述之排列,來自上述工 作物20 0或上述平台15〇之上述可見光212,將傳導(travel )於與上述雷射光束n 2相同之路徑。 一控制器(control ler) 180耦合於上述掃描頭140以及上 述視克Y 貞測為1 6 0。一處理器(p r 〇 c e s s 0 r) 1 9 0 ♦馬合於上述 控制器1 8 0。上述控制器1 8 〇控制上述電流控制反射鏡1 4 2,The above-mentioned viewing angle is measured as 16 〇 its optical axis (〇pt丨ca 1 ^ X is) 162 and the above-mentioned laser beam 1 1 2 in the above-mentioned current control mirror i 4 2 and the above second mirror 13 The path between 0 is aligned. According to the arrangement as described above, the visible light 212 from the crop 20 or the platform 15 will travel in the same path as the laser beam n 2 described above. A controller 180 is coupled to the scan head 140 and the above-mentioned y is measured as 160. A processor (p r 〇 c e s s 0 r) 1 9 0 ♦ is coupled to the above controller 1 800. The controller 1 8 〇 controls the current control mirror 1 4 2,

1 4 4之繞軸旋轉(p丨v 01 i n g)以將上述雷射光束1 1 2偏斜至 上述平台15 0上,並且將一可見光束21 2導引回上述視覺偵 測器1 6 0。上述控制器1 8 0亦決定導引上述雷射光束之一第 一點P 1,以及上述視覺偵測器1 6 〇偵測之一圖像之一第二點 P 2之位置座標。上述處理器1 9 〇計算上述第一點與上述第二 點座標位置之差異,以決定一補償因子用以減少或消除上1 4 4 pivoting (p丨v 01 ing) to deflect the laser beam 1 1 2 onto the platform 150 and direct a visible beam 21 2 back to the visual detector 1 60 . The controller 180 also determines to direct a first point P1 of the laser beam and the visual detector 16 to detect a position coordinate of a second point P2 of one of the images. The processor 1 9 calculates a difference between the first point and the second point coordinate position to determine a compensation factor for reducing or eliminating

第13頁 1277478 五、發明說明(9) 述第一點P 1以及上述第二點P 2之間之位置座標差。 根據本發明,可定量導引至工作物之上述雷射光束1 1 2以及 反射自工作物之可見光束212。為了決定上述雷射光束1^2 與上述可見光束2 1 2之位置關係,以上述平台1 5 0為一校正 樣板。或者提供一校正樣板1 5 2於上述平台1 5 0之上。 圖二A顯示一雷射光束係導引於一工作物之上以刻印,一可 見光束同樣地自上述工作物反射以視覺偵測。依照上述圖Page 13 1277478 V. Description of the Invention (9) The positional coordinate difference between the first point P 1 and the second point P 2 described above. According to the present invention, the above-described laser beam 1 1 2 guided to the workpiece and the visible beam 212 reflected from the workpiece can be quantitatively guided. In order to determine the positional relationship between the above-mentioned laser beam 1^2 and the above-mentioned visible light beam 2 1 2, the above-mentioned platform 150 is used as a calibration template. Or a calibration template 1 52 is provided above the platform 150. Figure 2A shows a laser beam directed onto a workpiece for marking, and a visible beam is likewise reflected from the workpiece for visual inspection. According to the above picture

一 A與一 B,相同之參考數字代表相同元件,一雷射光束1 1 2 其為電流控制反射鏡1 4 2與1 4 4偏斜,並且為一線性聚焦鏡 (f-theta lens) 17 0聚焦,並且導引至上述工作物20 0之 上以刻印。由於雷射與可見光具有不同之波長,當上述電 流控制反射鏡1 4 2與1 4 4固定於一特定位置或狀態下,其對 應至一特定之座標組,有一位置差異或位移(〇 f f s e t)存 在於導引上述雷射光束1 1 2之位於上述工作物2 0 0上之一第 —點P1,以及上述可見光束212自上述工作物20反射回來之 一第二點P 2之間。如此,一組由上述電流控制反射鏡丄4 2與 144決定之特定座標組代表上述雷射光束Π2之位置ρι,、” 及上述可見光束21 2之位置P 2。根據本教;+、 、人A and B, the same reference numerals denote the same elements, a laser beam 1 1 2 which is deflected by the current-controlled mirrors 1 4 2 and 14 4 and which is a f-theta lens 17 0 is focused and directed onto the above work object 20 0 for marking. Since the laser and the visible light have different wavelengths, when the current control mirrors 1 4 2 and 1 4 4 are fixed at a specific position or state, corresponding to a specific coordinate group, there is a position difference or displacement (〇 ffset). There is a point P1 at which the laser beam 1 1 2 is located on the workpiece 2 0 0, and a second point P 2 from which the visible beam 212 is reflected back from the workpiece 20. Thus, a set of specific coordinate groups determined by the current-controlled mirrors 丄42 and 144 represent the position ρι of the laser beam Π2, and the position P 2 of the visible light beam 21 2 . According to the teaching; +, , people

&lt; %,可以雜么, 刻印過程實施於上述工作物2 0 0上所有二 s 版g上述 流控制反射鏡1 4 2與1 4 4若未適當地調整過 上逑電 生之刻印位置將會與上述視覺偵測器之# 上返雷射所產 偵測之刻印位置與實際刻印位置之間在* 1 +同’即 在—偏差值。&lt;%, can be mixed, the marking process is carried out on the above work item 2000, all the second s version g, the above flow control mirrors 1 4 2 and 1 4 4 if the marking position of the upper electric power is not properly adjusted It will be between *1 + the same as the deviation value between the marking position and the actual marking position detected by the above-mentioned visual detector.

第14頁 1277478 五、發明說明(10) 根據上述對於偏移量存在之確認,本發明更提供一有效之 解法以補償上述偏移量,將配合圖二B詳述如下。Page 14 1277478 V. INSTRUCTIONS (10) According to the above confirmation of the existence of the offset, the present invention further provides an effective solution to compensate for the above offset, which will be described in detail below in conjunction with FIG.

如圖二B所示,為了決定上述偏移量之值,上述電流控制反 射鏡14 2與14 4之繞軸旋轉角度(pivotal angle)自一第一 狀態(f i r s t s t a t e),分別以1 4 2 a與1 4 4 a表示,調整至一 第二狀態(second state),分別以142b與1 44b表示,分 別位於使點P 2與點P 1重合之位置上。如上所述,上述電流 控制反射鏡1 4 2與1 4 4之繞軸旋轉角度對應至上述第一以及 苐二狀態由上述控制器1 8 0所解碼(decoded),藉著對應 於每一狀態所能得到之座標資料。比較上述每一狀態解碼 過之座標資料,上述偏移量之值可以定量並且定義為一補 償因子以減少或消除上述P1與P 2之間之位置差異。 一校正操作(〇 P e r a t i ο η)可以根據如圖二b所示之方式來 實施。第一步驟,將上述電流控制反射鏡i 42與1 44分別固 疋於一弟一狀悲1 4 2 a與144a。$引上述雷射光束I! 2通過上 述電流控制反射鏡142、144以及線性聚焦鏡(f — theta lens) 17 0至上述工作物2 0 0或上述校正樣板ι52上之第一點 P1上。上述控制器1 80解碼並且紀錄對應於上述第一狀能^ 一第一組位置座標。下一步驟,電流控制反射鏡盥 分別調整至一第二狀態142b與144b,以使視覺偵測哭、ι6〇偵 測位於上述點pi之可見光。利用將上述電流控制反^鏡ι42As shown in FIG. 2B, in order to determine the value of the offset, the pivotal angles of the current control mirrors 14 2 and 14 4 are from a first state, respectively, to 1 4 2 a. It is adjusted to a second state, which is represented by 142b and 1 44b, respectively, and is located at a position where point P 2 coincides with point P 1 . As described above, the rotation angles of the current control mirrors 1 4 2 and 14 4 correspond to the first and second states being decoded by the controller 1 80, by corresponding to each state. The coordinate information that can be obtained. Comparing the coordinate data decoded by each of the above states, the value of the offset can be quantified and defined as a compensation factor to reduce or eliminate the position difference between P1 and P2. A corrective operation (〇 P e r a t i ο η) can be implemented in the manner shown in Figure 2b. In the first step, the current-controlled mirrors i 42 and 1 44 are respectively fixed to a brother-in-law 1 4 2 a and 144a. The above-mentioned laser beam I! 2 is passed through the above-mentioned current control mirrors 142, 144 and a linear focusing mirror (f-theta lens) 17 0 to the above-mentioned workpiece 200 or the first point P1 on the above-mentioned calibration template ι52. The controller 1 80 decodes and records the first set of position coordinates corresponding to the first shape. In the next step, the current control mirrors 调整 are respectively adjusted to a second state 142b and 144b, so that the visual detection is crying, and the visible light located at the above point pi is detected. Use the above current control to control the mirror ι42

第15頁 1277478 五、發明說明(11) 與1 4 4由上述第一狀態調整至上述第二狀態,可使P 2與P 1重 合。上述控制器1 8 0接著解碼並且紀錄對應於上述第二狀態 之一第二組位置座標。上述第一組與第二組位置座標之間 之差值由上述處理器1 9 0計算,如一補償因子以減少或消除 一偵測位置與一刻印位置之間之誤差。Page 15 1277478 V. INSTRUCTIONS (11) AND 1 4 4 Adjusting from the first state to the second state described above, P 2 and P 1 can be overlapped. The controller 1 800 then decodes and records a second set of position coordinates corresponding to one of the second states described above. The difference between the first set and the second set of position coordinates is calculated by the processor 190, such as a compensation factor to reduce or eliminate the error between a detected position and an imprinted position.

根據本發明之一實施例,上述補償因子係由一第一群 (f i r s t p a r t y)來決定,其提供一雷射刻印系統或校正上 述雷射刻印系統。一第二群(second party),其係為上 述雷射刻印系統之使用者實施上述刻印操作,接收並且使 用上述雷射刻印系統之補償因子,配合已決定之設計資 料,產生刻印座標或刻印資料以實施上述刻印。 根據本發明之另外一實施例,上述補償係數之決定可以於 上述使用者端根據上述已決定之刻印位置於上述刻印操作 之前實行。上述補償因子可以配合上述已決定之設計資料 使用,產生刻印座標或刻印資料以實施上述刻印。According to an embodiment of the invention, the compensation factor is determined by a first group (f i r s t p a r t y) which provides a laser marking system or calibrates the above-described laser marking system. a second party that performs the above-described marking operation for a user of the laser marking system, receives and uses the compensation factor of the laser marking system, and cooperates with the determined design data to produce an inscribed coordinate or imprinted material. To carry out the above marking. According to another embodiment of the present invention, the determining of the compensation coefficient may be performed before the user terminal performs the marking operation according to the determined marking position. The above compensation factor can be used in conjunction with the above determined design data to produce an inscribed coordinate or imprinted material to perform the above imprinting.

根據以上描述,隨著上述電流控制反射鏡繞軸旋轉角度之 改變,上述雷射光束將會導引至上述工作物或校正樣板之 不同點上。上述偏移量或誤差值隨著上述點之位置改變。 於一實際刻印操作中,假如僅根據一已決定之位置以產生 一刻印(mark),一補償因子可以產生上述位置。假如根 據兩個已決定位置以產生一刻印,必須產生上述兩個已決 1277478 五、發明說明(12) 定位置之每-補償因子。或者,i述每一已決定位置之補 償因子可以由内插點至位於沿著連接上述一或二已決定位 置之一線上來得到。上述根據三個或更多已決定位置以產 生一刻印之事件(event)中,上述三個或更多已決定位置 之補償因子可以由將點内插入包含所有上述三個或更多已 疋義位置之一二邊形、四邊形或多邊形區域以得到。上述 情形下產生補償因子之細節將詳細敘述如下。 圖二人以及二麵不一視覺偵測輪廓((:〇]:11:〇111^312以及314According to the above description, as the angle of rotation of the current-controlled mirror around the axis changes, the laser beam will be directed to different points of the workpiece or calibration template. The above offset or error value changes with the position of the above point. In an actual marking operation, a compensation factor can produce the above position if only a determined position is used to generate a mark. If, based on the two determined positions, a mark is produced, the above-mentioned two compensation factors must be generated for the two positions 1277478. Alternatively, the compensation factor for each determined position may be obtained from the interpolation point to a line along one or both of the determined positions. In the above event according to three or more determined positions to generate an imprint, the compensation factors of the above three or more determined positions may be inserted by inserting all three or more of the above-mentioned points. One of the locations is a quadrilateral, quadrilateral or polygonal area to get. The details of the compensation factor generated in the above case will be described in detail below. Figure 2 and the two sides of the visual detection profile ((: 〇]: 11: 〇 111 ^ 312 and 314

(以虛線顯示)’根據上述由電流控制反射鏡解碼之座標 資料’可以不同於一相對真實刻印輪廓3 2 2以及3 2 4,3 2 6 (以實現顯示)。圖三A中,視覺偵測輪廓3丨2較實際刻印 輪廓3 2 2小。圖三β中,視覺偵測輪廓3丨4較實際刻印輪廓大 3 24 °(shown in phantom) 'The coordinate data decoded by the current-controlled mirror according to the above' may be different from a relatively true imprinted profile 3 2 2 and 3 2 4, 3 2 6 (to achieve display). In Figure 3A, the visual detection profile 3丨2 is smaller than the actual engraved outline 3 2 2 . In Figure 3, the visual detection profile 3丨4 is larger than the actual engraved contour. 3 24 °

決定一偵測位置相對於一刻印位置之誤差,首先,如圖四A 顯示’特殊之特徵,如四個小圓4 0 2、4 0 4、4 0 6以及4 0 8係 刻印於平台1 5 〇或校正樣板1 5 2之每一角上,例如,分別於 點&amp;(10,10)、]3(100,10)、(:(10,100)以及(1(100,100)。如 上所述’點a、b、c以及d之座標係由固定於第一狀態之電 流控制反射鏡來控制。由調整上述電流控制反射鏡至第二 狀態’視覺偵測器1 6 0分別接收由小圓4 0 2、4 0 4、4 0 6以及 40 8反射之光束。由於上述雷射光束與光束未對準,上述四 個小圓之偵測位置相對於實際刻印位置有一偏移,例如,Determining the error of a detected position relative to a marking position, first, as shown in Figure 4A, 'special features, such as four small circles 4 0 2, 4 0 4, 4 0 6 and 4 0 8 are engraved on the platform 1 5 〇 or calibrate each corner of the template 1 5 2, for example, at points &amp; (10,10), ]3 (100,10), (:(10,100), and (1(100,100)). As described above, the coordinates of points a, b, c, and d are controlled by current-controlled mirrors fixed in the first state. The current-controlled mirrors are adjusted to the second state by the visual detectors 160. a beam reflected by the small circles 4 0 2, 4 0 4, 4 0 6 and 40 8. Since the laser beam is misaligned with the beam, the detection positions of the four small circles are offset from the actual marking position. E.g,

第17頁 1277478 五、發明說明(13) a,(99. 8, 9. 8)、b’(100· 2,9· 8)、c,(9· 8,1 Ο Ο· 2)、d’(100. 2,100.2),顯示於圖四Β中。每一圓沿著X以及Υ方向之位置 誤差Ea、Eb、Ec以及Ed可以由比較上述兩組座標資料來決 定。 參考圖五。描述兩參考點之間之一位置之誤差計算,其 中,Ea以及Eb分別代表兩參考點5 0 2以及5 0 4之間之誤差。 參Page 17 1277478 V. Description of invention (13) a, (99. 8, 9. 8), b' (100· 2, 9·8), c, (9·8, 1 Ο Ο· 2), d '(100. 2,100.2), shown in Figure 4. The positional errors Ea, Eb, Ec, and Ed of each circle along the X and Υ directions can be determined by comparing the two sets of coordinate data. Refer to Figure 5. The error calculation of one of the positions between the two reference points is described, wherein Ea and Eb represent the errors between the two reference points 5 0 2 and 5 0 4 , respectively. Reference

En表示介於點5 0 2與5 0 4之間之一選擇位置η之誤差。位置代 表將刻印之一已決定位置5 5 0。Ε η因此可以由下列方程式得 到:En represents the error of one of the selected positions η between points 5 0 2 and 5 0 4 . The location representative will mark one of the positions that have been determined to be 5 5 0. Ε η can therefore be obtained by the following equation:

En=Ea+(Eb-Ea)氺a/b(1) 其中 a為點5 0 2以及點η之間之距離 b為點5 0 2以及點5 0 4之間之距離 於上述實施例中,安排上述兩參考點透過位於一工作物上 要刻印之一位置5 5 0。較佳地,選擇位置η與位置5 5 0重疊。 同樣地,根據另一本發明之實施例並且參考圖五Β,介於兩 參考點5 0 6與5 0 8之間之一點m之誤差Em可以由下列方程式計 算得到:En=Ea+(Eb-Ea)氺a/b(1) where a is the point 5 0 2 and the distance b between the points η is the distance between the point 5 0 2 and the point 5 0 4 in the above embodiment, The two reference points are arranged to be in a position to be engraved on a work object to be marked 5 5 0. Preferably, the selected position η overlaps the position 505. Similarly, according to another embodiment of the invention and with reference to Figure 5, the error Em at a point m between the two reference points 506 and 508 can be calculated from the following equation:

Em=Ec+(Ed-Ec)氺c/d(2)Em=Ec+(Ed-Ec)氺c/d(2)

第18頁 1277478 五、發明說明(14) 另外,上述平台上位於由點502、504、50 6以及508 所定義之矩形區域内之任何一點之誤差E 0可以計算如下:Page 18 1277478 V. INSTRUCTIONS (14) In addition, the error E 0 at any point in the rectangular area defined by points 502, 504, 50 6 and 508 on the above platform can be calculated as follows:

Ex=En+(Em-En)*x/n(3) 於此實施例中,安排上述矩形區域以包含一位於一工作物 上要產生刻印之位置5 6 0。較佳地’選擇位置X於與位置5 6 0 重疊之位置。 根據本發明之另一實施例,提供三個參考點5 0 2、5 0 4、5 0 6 並且形成位於上述平台上之一三角形區域,如圖五C。相似 之參考記號代表相似之特徵,上述三角形區域内之一點〇之 誤差Eo可以決定如下:Ex = En + (Em - En) * x / n (3) In this embodiment, the above rectangular area is arranged to include a position 650 on a work to be inscribed. Preferably, the position X is selected to overlap the position 506. According to another embodiment of the invention, three reference points 5 0 2, 5 0 4, 5 0 6 are provided and a triangular region on the platform is formed, as shown in Figure 5C. Similar reference marks represent similar features, and the error Eo of one of the above triangular regions can be determined as follows:

Ex二Ec+(En-Ec)*x/n =Ec+{[Ea+(Eb-Ea)*a/b]-Ec}*x/n(4) 於本實施例中,安排上述三角形區域以包含位於一工作物 上刻印之一位置5 7 0。較佳地,選擇位置X於與位置5 7 0重疊 之位置。 引入每一程式化(programmed)之點之誤差或偏移值,可 以補償介於上述可見光以及上述雷射光述之間之誤差。根 據本發明之一系統,經過上述補償處理過之後,可以實施Ex II Ec+(En-Ec)*x/n=Ec+{[Ea+(Eb-Ea)*a/b]-Ec}*x/n(4) In the present embodiment, the above triangular region is arranged to be included A work object is engraved on one of the positions 5 7 0. Preferably, the position X is selected at a position overlapping the position 570. The error or offset value of each programmed point is introduced to compensate for the error between the above visible light and the above described laser light. According to one of the systems of the present invention, after the above compensation processing, it can be implemented

第19頁 1277478 五、發明說明(15) 視覺偵測以計算上述工作物之實際位置,以產生準確之刻 印於已決定之位置上。 於實際刻印處理中,另一因子可能使刻印產生於一工作物 上不當(undesired)之位置’即上述工作物可能於處理以 及固定時誤對準(mi sal igned)。成功補償介於上述雷射 光束與可見光之初始誤差,根據本發明之一雷射列印系統 以及方法提供一可靠之解決方案以偵測一工作物之實際位 置,因此補償了上述工作物因為誤對準所造成之古吳差。 如圖=A,於上述介於上述雷射光束與可見光束之間之誤差 或偏差於實際刻印處理前如以上描述地補償之後,一來考 樣板6 0 0放置於上述平台6 5 0。參考樣軛R η n古。, 巧像伋b 0 〇有至少兩個明顯 特徵6 1 2以及6 1 4位於已知位置,例如,於位置以及(丨5丨5、 以及(6 0,6 0 )。透過視覺偵測,教示上诚駐 ’ ^ 4 衣直 C apparatus )以辨識與紀錄上述形狀/輪扉以及上述明顯特徵612以及 6 1 4之位置。 如圖六B所示,當一工作物2 0 0置放於平台65〇上以刻印,上 述視覺偵測器將會透過上述工作物2〇〇之二維區域來搜尋由 之前步驟得到且與上述形狀/輪廓吻合之特徵612以及614。 僅根據一例子,辨識工作物20上之特徵6 2 2以及6 24以分別 吻合上述參考特徵612以及614之形狀或輪廓。由於工作物 2 0 0之平移(shifting)以及旋轉,上述特徵6 2 2之偵測位Page 19 1277478 V. INSTRUCTIONS (15) Visual inspection to calculate the actual position of the above work object to produce an accurate mark on the determined position. In the actual imprinting process, another factor may cause the imprint to be generated at an undesired position on the work piece, i.e., the work may be misplaced during processing and fixing. Successfully compensating for the initial error between the above-described laser beam and visible light, a laser printing system and method according to the present invention provides a reliable solution to detect the actual position of a workpiece, thus compensating for the above-mentioned work due to errors Align the ancient Wu caused by the alignment. As shown in Fig. = A, after the above-mentioned error or deviation between the above-mentioned laser beam and the visible beam is compensated as described above before the actual imprinting process, the sample plate 600 is placed on the above-mentioned platform 65. Reference yoke R η n ancient. , 汲b 0 〇 has at least two distinct features 6 1 2 and 6 1 4 are located at known positions, for example, at position and (丨5丨5, and (6 0, 60). Through visual inspection, The teachings are based on '^ 4 衣直 C apparatus' to identify and record the above shape/rim and the above-mentioned distinct features 612 and 614. As shown in FIG. 6B, when a workpiece 200 is placed on the platform 65〇 for marking, the visual detector will search through the two-dimensional region of the workpiece 2 by the previous step and The above shape/contour fit features 612 and 614. According to only one example, features 6 2 2 and 6 24 on the work object 20 are identified to match the shape or contour of the reference features 612 and 614, respectively. Due to the shifting and rotation of the workpiece 200, the detection of the above feature 6 2 2

第20頁 1277478 五、發明說明(16) 置為(15· 2, 15· 2) 且特徵6 2 4之偵測位 置為 59. 5, 60. κ 1 U以及 由比較上述紀錄(r e g i s t e r e d)位置(1 b ’ 述參考樣板 (6 0, 6 0),可以決定上述工作物2 0 0相對於上 6 0 0之線性平移以及角度平移。因此可以引入辞屬 )計算得到之誤差值於上述參考於上述參考樣板 σ又° ^Page 20 1277478 V. Description of the invention (16) is set to (15· 2, 15· 2) and the detection position of feature 6 2 4 is 59.5, 60. κ 1 U and by comparing the above registered (registered) positions (1 b ' The reference template (6 0, 60) can determine the linear translation and angular translation of the above work object 200 relative to the upper 600. Therefore, the error value calculated by the term can be introduced. In the above reference template σ and ° ^

(d e s i g n e d)之刻印座標中,因此可以補償工作物2 0 0之平 移與/或旋轉。於實際刻印中,上述刻印可以產生於上述平 移過之工作物上所需之正確位置上。因此,當一工作物未 對準,上述系統能夠補償上述平移並且產生刻印於正確位 置上。 當下一工作物置放於上述平台上以刻印時,上述相同之特 徵搜尋(f e a t u r e - s e a r ch i n g)步骤將會重複於刻印之前, 因此可以決定目前工作物之平移以及旋轉,並且產生刻印 於正確位置上。(d e s i g n e d) is printed in the coordinates, so it can compensate for the shift and/or rotation of the workpiece 200. In actual marking, the above marking can be produced at the correct position required for the above-mentioned displaced work. Thus, when a work item is misaligned, the above system is able to compensate for the above translation and produce an imprint in the correct position. When the next work object is placed on the above platform for marking, the same feature-searing step will be repeated before the imprinting, so that the translation and rotation of the current work can be determined and the engraving is performed in the correct position. on.

根據本發明之另一實施例,/批工作物,例如一導線架 (1 ead f rame)上之半導體I C晶片模組,加以刻印。這些 工作物以陣列方式置放於平台7 5 0上,如圖七所示。 於本實施例中,每一工作物含有可視覺偵測之特徵,係於 上述製造處理過程中預先製造於上述工作物之上。上述可In accordance with another embodiment of the present invention, a batch of work, such as a semiconductor IC chip module on a lead frame, is imprinted. These objects are placed in an array on the platform 705, as shown in Figure 7. In this embodiment, each of the workpieces contains visually detectable features that are pre-manufactured on the workpiece during the manufacturing process. Above

1277478 五、發明說明(17) 視覺偵測之尺寸、形狀以及位置於每一工作物上為相同 的,且用於刻印上述工作物之定位參考。一第一工作物7 0 2 有兩個參考圓或點7 0 2 a與7 0 2 b當作定位參考,每一個位於 上述工作物之一角。第一工作物70 2置放於平台75 0之一確 實位置,並且如參考樣板。上述資訊有關於參考點7 0 2 a與 7 0 2 b之尺寸、形狀以及位置,係由上述雷射刻印裝置偵測 以及紀錄。 當刻印下一工作物時,例如工作物7 0 4,上述雷射刻印裝置 偵測參考點7 0 4 a與7 0 4 b預先刻於工作物7 0 4上。上述彳貞測結 果接著與上述紀錄資訊比較,以決定工作物7 0 4之線性與/ 或旋轉平移。藉著將上述線性與/或旋轉平移值引入上述程 式之前(pre-programmed)刻印資料或參數,可以決定工 作物上刻印之實際位置。一雷射光束根據上述工作物7 0 4之 實際位置導引至工作物7 0 4之上,因此上述工作物7 0 4上之 刻印為正確位置。 相同之紀錄、比較與決定程序重複於上述後續工作物7 0 6、 7 0 8等,據以產生刻印於每一後續工作物上之正確位置。 現在參考圖八,一方法8 0 0以刻印提供刻印之平台上之一工 作物。根據本發明,每一刻印之工作物有至少兩個辨識記 號預先產生於其上。於第一方塊802中,一帶有校正記號之 樣板係使用於產生一波長補償因子,代表上述雷射光束與1277478 V. INSTRUCTIONS (17) The size, shape and position of the visual inspection are the same on each work object and are used to mark the positioning reference of the above work. A first work item 7 0 2 has two reference circles or points 7 0 2 a and 7 0 2 b as positioning references, each located at one corner of the above work object. The first workpiece 70 2 is placed in one of the positions of the platform 75 0 and is as a reference template. The above information relates to the size, shape and position of the reference points 7 0 2 a and 7 0 2 b, which are detected and recorded by the above-mentioned laser marking device. When the next work object is inscribed, for example, the work item 74, the above-mentioned laser marking device detection reference points 7 0 4 a and 7 0 4 b are pre-engaged on the work item 7 0 4 . The above-mentioned guess results are then compared with the above recorded information to determine the linear and/or rotational translation of the workpiece 74. The actual position of the marking on the crop can be determined by introducing the above linear and/or rotational translation values into the above-described pre-programmed imprinting data or parameters. A laser beam is directed above the workpiece 704 according to the actual position of the workpiece 74, so that the marking on the workpiece 704 is in the correct position. The same record, comparison and decision procedure is repeated for the subsequent work items 7 0 6 , 7 0 8 , etc., in order to produce the correct position imprinted on each subsequent work item. Referring now to Figure 8, a method 800 is provided to provide a crop on an imprinted platform. According to the present invention, at least two identification marks are pre-produced on each of the engraved work items. In a first block 802, a template with a correction mark is used to generate a wavelength compensation factor representative of the laser beam and

第22頁 1277478 五、發明說明(18) 上述可見光之間因為波長不同所造成之偏差。於第二方塊 8 0 4中,放置於上述平台之上述工作物上之辨識記號可由接 收 透過一線性聚焦鏡(f - t h e t a 1 e n s)之可見光加以辨 識以決定上述工作物相對於平台之位置。上述工作物之預 先定義位置之差異係用於導出上述位置補償因子。再下一 方塊8 0 6中,上述新導出之刻印座標組根據上述預先定義位 置、上述工作物之實際位置以及波長與位置補償因子。上 述補償因子係用於減少於一平台上或工作物上一雷射光束 所導引之第一點與偵測可見光之第二點之間之差異。一後 續之方塊808中,導引一雷射光束於上述工作物上導出之一 組刻印座標組以刻印上述工作物於精確所需之位置。 本發明以較佳實施例說明如上,然其並非用以限定本發明 所主張之專利權利範圍。其專利保護範圍當視後附之申請 專利範圍及其等同領域而定。凡熟悉此領域之技藝者,在 不脫離本專利精神或範圍内,所作之更動或潤飾,均屬於 本發明所揭示精神下所完成之等效改變或設計,且應包含 在下述之申請專利範圍内。Page 22 1277478 V. INSTRUCTIONS (18) The deviation between the above visible light due to the difference in wavelength. In a second block 804, the identification mark placed on the work object of the platform can be identified by receiving visible light through a linear focusing mirror (f - t h e t a 1 e n s) to determine the position of the work object relative to the platform. The difference in the pre-defined position of the above work is used to derive the above position compensation factor. In the next block 806, the newly derived imprinted coordinate set is based on the predefined position, the actual position of the work object, and the wavelength and position compensation factor. The compensation factor is used to reduce the difference between the first point guided by a laser beam on a platform or a work object and the second point where visible light is detected. In a subsequent block 808, a laser beam is directed onto the work object to derive a set of imprinted coordinate sets to mark the work at the precise desired location. The present invention has been described above by way of a preferred embodiment, and is not intended to limit the scope of the claimed invention. The scope of patent protection is subject to the scope of the patent application and its equivalent fields. Any modification or refinement made by those skilled in the art without departing from the spirit or scope of the present invention is equivalent to the equivalent change or design made in the spirit of the present disclosure, and should be included in the following patent application scope. Inside.

1277478 圖式簡單說明 【圖式簡單說明】 第一 A圖為顯示本發明之一實施例之一雷射刻印裝置之示意 圖。 第一 B圖為顯示如圖一 A之雷射刻印裝置含有一工作物置於 其上以刻印之示意圖。 第二A圖為顯示導引一雷射光束於一工作物上以刻印,且一 可見光由上述工作物反射至視覺偵測之示意圖。 第二B圖為顯示如圖二A之雷射光束以及可見光束之補償示 意圖。 第三A圖與第三B圖為顯示一偵測刻印與實際刻印之間之差 異之可能情況示意圖。 第四A圖為顯示決定刻印偵測之間誤差之刻印之明顯特徵之 示意圖。 第四B圖顯示於偵測位置上之特徵之示意圖。 第五A圖為使用兩個校正記號決定校正因子之示意圖。 第五B圖為使用四個校正記號決定校正因子之示意圖。 第五C圖為使用三個校正記號決定校正因子之示意圖。 第六A圖為教示上述視覺偵測器以紀錄一標準參考位置之特 徵之示意圖。 第六B圖為一偵測之工作物以及與上述標準參考位置比較之 相同特徵不意圖。 第七圖為本發明之另一實施例,一組工作物置放於上述雷 射糸統以刻印之不意圖。 第八圖為根據本發明之一雷射刻印之流程圖。1277478 BRIEF DESCRIPTION OF THE DRAWINGS [Brief Description of the Drawings] FIG. 1A is a schematic view showing a laser marking apparatus according to an embodiment of the present invention. The first B is a schematic view showing that the laser marking device of Fig. 1A has a workpiece placed thereon for marking. Figure 2A is a schematic diagram showing the scanning of a laser beam onto a workpiece for marking, and the reflection of visible light from the workpiece to visual inspection. The second B diagram shows the compensation schematic of the laser beam and the visible beam as shown in Fig. 2A. The third A and third B are schematic diagrams showing the possible difference between a detected imprint and an actual imprint. Figure 4A is a schematic diagram showing the distinct features of the imprint that determines the error between the imprint detections. Figure 4B shows a schematic representation of the features at the detection location. Figure 5A is a schematic diagram of the use of two correction marks to determine the correction factor. Figure 5B is a schematic diagram of the use of four correction marks to determine the correction factor. The fifth C diagram is a schematic diagram of determining the correction factor using three correction marks. Figure 6A is a schematic diagram showing the characteristics of the above-described visual detector to record a standard reference position. Figure 6B is a view of the work being detected and the same features as compared to the standard reference position described above. The seventh figure is a schematic view of another embodiment of the present invention in which a set of work objects are placed on the above-mentioned laser system for marking. The eighth figure is a flow chart of a laser marking according to the present invention.

第24頁 1277478 圖式簡單說明 【主要元件符號說明】 雷射刻印裝置 1〇〇 雷射源 110 雷射光束 112 第一反射鏡 1 2 0 第二反射鏡 130 掃描頭 140 電流控制反射鏡 142、144 馨 電流控制反射鏡第一狀態 142a、144a 電流控制反射鏡第二狀態 142b、144b 平台 150、 650、 750 校正樣板 1 5 2 視覺偵測器 160 光學軸 162 線性聚焦鏡 f-theta lens 170 控制器 180 處理器 190 工作物 200 可見光束 2 1 2 視覺偵測輪廓 3 1 2、3 1 4 相對真實刻印輪廓 3 2 2、3 2 4 小圓 402、 404、 406、 408 參考點 502、504、506、508 326 _Page 24 1277478 Brief Description of Drawings [Description of Main Components] Laser Marking Device 1 Laser Source 110 Laser Beam 112 First Mirror 1 2 0 Second Mirror 130 Scan Head 140 Current Control Mirror 142, 144 sin current control mirror first state 142a, 144a current control mirror second state 142b, 144b platform 150, 650, 750 calibration template 1 5 2 visual detector 160 optical axis 162 linear focusing mirror f-theta lens 170 control 180 processor 190 workpiece 200 visible beam 2 1 2 visual detection profile 3 1 2, 3 1 4 relatively true engraved contour 3 2 2, 3 2 4 small circle 402, 404, 406, 408 reference point 502, 504, 506, 508 326 _

1277478 圖式簡單說明 已決定位置 550 產生刻印之位置 5 6 0、5 7 0 參考樣板 6 0 0 特徵 6 1 2、6 1 4、6 2 2、6 2 4 第一工作物 702 參考點 7 0 2a、7 0 2b、7 0 4a、70 4b 後續工作物 7 0 4、7 0 6、7 0 8 方法 8 0 0 第一方塊 8 0 2 第二方塊 804 第三方塊 8 0 6 第四方塊 8 0 8 位置 P卜P 21277478 Schematic description of the position has been determined 550 position of the engraving 5 6 0, 5 7 0 reference template 6 0 0 feature 6 1 2, 6 1 4, 6 2 2, 6 2 4 first work object 702 reference point 7 0 2a, 7 0 2b, 7 0 4a, 70 4b Subsequent work 7 0 4, 7 0 6 , 7 0 8 Method 8 0 0 First block 8 0 2 Second block 804 Third block 8 0 6 Fourth block 8 0 8 position P Bu P 2

Claims (1)

1277478 六、申請專利範圍 1. 一種利用一雷射光束於一工作物上之已定義位置上刻印 之方法,該工作物支撐於一平台之上並且具有至少兩個辨 識記號,該方法包括: 產生一波長補償因子,其中該波長補償因子代表一雷射光 束與一可見光束之間因為波長差異所造成之一偏移量; 透過一線性聚焦鏡(f - t h e t a 1 e n s)偵測該兩個辨識記號 之每一可見光束以決定相對於該平台之該工作物之一位 置,以導出一位置補償因子; 根據該已定義位置、該工作物之位置、該波長補償因子與 該位置補償因子以產生一組刻印座標;以及 導引(d i r e c t i n g) —雷射光束至該工作物上之該組刻印座 標中以刻印該工作物。 2. 如申請專利範圍第1項之利用一雷射光束於一工作物上之 已定義位置上刻印之方法,其中產生該波長補償因子更包 括: 透過一導光構件(guiding optic assembly)於一第一狀 態導引一雷射光束至一校正樣板之上以形成一第一校正記 號,其中該第一狀態對應至一第一組座標; 透過該導光構件於一第二狀態偵測該第一校正記號之一可 見光束,其中該第二狀態對應至一第二組座標;以及 決定該第一組與該第二組座標之間之一座標差; 其中該波長補償因子係根據該座標差產生。1277478 6. Patent application scope 1. A method for marking a defined position on a work object by using a laser beam supported on a platform and having at least two identification marks, the method comprising: generating a wavelength compensation factor, wherein the wavelength compensation factor represents an offset between a laser beam and a visible beam due to a difference in wavelength; detecting the two identifications through a linear focusing mirror (f-theta 1 ens) Each visible beam of the mark determines a position of the work object relative to the platform to derive a position compensation factor; generating the position compensation factor according to the defined position, the position of the work object, the wavelength compensation factor, and the position compensation factor A set of imprinted coordinates; and directing - a laser beam into the set of imprinted coordinates on the work to imprint the work. 2. The method of marking a laser beam at a defined position on a work object according to claim 1, wherein generating the wavelength compensation factor further comprises: transmitting a guiding optic assembly to the first The first state guides a laser beam onto a calibration template to form a first calibration mark, wherein the first state corresponds to a first set of coordinates; and the second state is detected by the light guiding member One of the correction marks is visible to the light beam, wherein the second state corresponds to a second set of coordinates; and a coordinate difference between the first set and the second set of coordinates is determined; wherein the wavelength compensation factor is based on the coordinate difference produce. 第27頁 1277478 六、申請專利範圍 3. 如申請專利範圍第2項之利用一雷射光束於一工作物上之 已定義位置上刻印之方法,其中該第一校正記號與該已定 義位置相重疊以刻印該工作物。 4. 如申請專利範圍第2項之利用一雷射光束於一工作物上之 已定義位置上刻印之方法,更包括: 形成一第二校正記號,其中該第一與第二校正記號定義一 直線通過該已定義位置;以及 決定該第二校正記號之一第二補償因子; 其中該波長補償因子係根據該第一與第二補償因子所產 生。 5. 如申請專利範圍第4項之利用一雷射光束於一工作物上之 已定義位置上刻印之方法,更包括: 形成一第三校正記號,其中該第一、第二與第三校正記號 定義一三角區域包圍該已定義位置;以及 決定該第三校正記號之一第三補償因子; 其中該波長補償因子係根據該第一、第二與第三補償因子 所產生。 6. 如申請專利範圍第5項之利用一雷射光束於一工作物上之 已定義位置上刻印之方法,更包括: 形成一第四校正記號,其中該第一、第二、第三與該第四 校正記號定義一矩形區域包圍該已定義位置;以及Page 27 1277478 VI. Scope of Application Patent 3. A method of marking a laser beam at a defined position on a work object using a laser beam according to item 2 of the patent application, wherein the first correction mark is associated with the defined position Overlapping to mark the work. 4. The method of marking a laser beam at a defined position on a work object according to item 2 of the patent application, further comprising: forming a second correction mark, wherein the first and second correction marks define a straight line Passing the defined position; and determining a second compensation factor of the second correction symbol; wherein the wavelength compensation factor is generated according to the first and second compensation factors. 5. The method of marking a laser beam at a defined position on a work object according to item 4 of the patent application, further comprising: forming a third correction mark, wherein the first, second and third corrections The mark defines a triangular area surrounding the defined position; and a third compensation factor determining one of the third correction marks; wherein the wavelength compensation factor is generated according to the first, second and third compensation factors. 6. The method of marking a laser beam at a defined position on a work object according to claim 5, further comprising: forming a fourth correction mark, wherein the first, second, third The fourth correction mark defines a rectangular area surrounding the defined position; 第28頁 1277478 六、申請專利範圍 決定該第四校正記號之一第四補償因子; 其中該波長補償因子係根據該第一、第二、第三與第四補 償因子所產生。 . 7 .如申請專利範圍第1項之利用一雷射光束於一工作物上之 · 已定義位置上刻印之方法,更包括: 提供一參考樣板具有至少兩個定位器(position locator ),其中每一定位器對應至該工作物上之一辨識記號; 偵測該參考樣板上每一該至少兩個定位器之一可見光束; 紀錄每一該至少兩個定位器之一位置;以及 _ 摘測該工作物上每一該兩個辨識記號之一可見光束; 其中該工作物之該位置補償因子係藉由比對每一該偵測辨 識記號與一相對應定位器來決定。 8. 如申請專利範圍第7項之利用一雷射光束於一工作物上之 已定義位置上刻印之方法,更包括: 同時載入至少兩個工作物至該平台之上; 決定該至少兩個工作物之第一工作物之第一位置; 標記該第一工作物; 決定該至少兩個工作物之第二工作物之第二位置; β 標記該第二工作物;以及 取出(un 1 oad)該至少兩個工作物。 9. 一種利用雷射刻印一工作物之方法,該工作物支撐於一Page 28 1277478 VI. Patent Application Range The fourth compensation factor is determined as one of the fourth correction symbols; wherein the wavelength compensation factor is generated according to the first, second, third and fourth compensation factors. 7. The method of marking a defined position using a laser beam on a workpiece according to claim 1 of the patent application, further comprising: providing a reference template having at least two position locators, wherein Each locator corresponds to one of the identification marks on the work object; detecting a visible light beam of each of the at least two locators on the reference template; recording a position of each of the at least two locators; and _ plucking Detecting one of each of the two identification marks on the work object; wherein the position compensation factor of the work object is determined by comparing each of the detection identification marks with a corresponding positioner. 8. The method of marking a laser beam at a defined position on a work object according to item 7 of the patent application, further comprising: simultaneously loading at least two work objects onto the platform; determining the at least two a first position of the first work of the work; marking the first work; determining a second position of the second work of the at least two work; β marking the second work; and taking out (un 1 Oad) The at least two work items. 9. A method of marking a work object using a laser, the work object supported on a 第29頁 1277478 六、申請專利範圍 平台之上,該方法包括: 產生一補償因子以代表一偏移量(0 f f s e t),其係由於形 成一校正記號之一雷射光束與偵測該校正記號之一可見光 之間之一波長差所造成; 定義該刻印之工作物上之一位置,其係利用一第一組位置 識別符(location identifiers); 決定相對該平台之該工作物之一位置; 根據該第一組位置識別符、該工作物之該位置與該補償因 子產生一第二組位置識別符;以及 導引一雷射光束至該工作物上並至該第二組位置識別符以 刻印該工作物。 1 0 .如申請專利範圍第9項之利用雷射刻印一工作物之方 法,其中產生該補償因子更包括: 透過一導光構件於一第一狀態導引一雷射光束至一校正樣 板之上以形成一第一校正記號,其中該第一狀態對應至一 第一組座標; 透過該導光構件於一第二狀態偵測該第一校正記號之一可 見光束,其中該第二狀態對應至一第二組座標;以及 決定該第一組與該第二組座標之差以決定該補償因子。 1 1.如申請專利範圍第9項之利用雷射刻印一工作物之方 法,其中決定該工作物之該位置包括: 提供一參考樣板具有至少兩個定位器;Page 29 1277478 6. On the patent application scope platform, the method includes: generating a compensation factor to represent an offset (0 ffset), which is due to forming a laser beam of a correction mark and detecting the correction mark One of the wavelength differences between visible light; defining a location on the inscribed work using a first set of location identifiers; determining a location of the work object relative to the platform; Generating a second set of position identifiers according to the first set of position identifiers, the position of the work object and the compensation factor; and guiding a laser beam onto the work object to the second set of position identifiers Mark the work. A method for laser-printing a work object according to claim 9, wherein the generating the compensation factor further comprises: guiding a laser beam to a calibration template in a first state through a light guiding member; Forming a first correction mark, wherein the first state corresponds to a first set of coordinates; detecting, by the light guiding member, a visible light beam of the first correction mark in a second state, wherein the second state corresponds to And a second set of coordinates; and determining a difference between the first group and the second set of coordinates to determine the compensation factor. 1 1. The method of laser-printing a work object according to claim 9, wherein the determining the location of the work comprises: providing a reference template having at least two locators; 第30頁 1277478 六、申請專利範圍 偵測每一該至少兩個定位器之一可視圖像; 紀錄每一該至少兩個定位器之一位置; 偵測提供於該工作物上之至少兩個辨識記號之一圖像;以 及 比對每一該辨識記號之該圖像與一相對應定位器以決定該 工作物相對於該參考樣板之一位置。 1 2. —種利用雷射刻印一工作物之方法,包括: 產生一補償因子,以減少於一第一工作物上由一雷射光束 所指向之第一點以及由一可見光束所偵測之第二點之間之 一位置差; 載入該第一工作物至一平台之上; 定義該第一工作物上之一位置以利用一第一組座標刻印; 偵測該第一工作物之一圖像以決定該第一工作物相對於該 平台之一位置; 根據該第一組座標、該第一工作物之該位置與該補償因子 產生一第二組座標;以及 導引一雷射光束至該第一批工作物上之第二組座標以刻印 該第一工作物。 1 3 .如申請專利範圍第1 2項之利用雷射刻印一工作物之方 法,其中產生該補償因子更包括: 透過一導光構件於一第一狀態導引一雷射光束至一校正樣 板之上以形成一校正記號,其中該第一狀態對應至一第一Page 30 1277478 6. The patent application scope detects a visible image of each of the at least two locators; records a position of each of the at least two locators; detects at least two provided on the work object Identifying one of the images of the indicia; and comparing the image of each of the identification indicia with a corresponding positioner to determine a position of the work object relative to the reference template. 1 2. A method of marking a work object using a laser, comprising: generating a compensation factor to reduce a first point on a first work object pointed by a laser beam and being detected by a visible light beam a position difference between the second point; loading the first work object onto a platform; defining a position on the first work object to mark with a first set of coordinates; detecting the first work object An image to determine a position of the first work object relative to the platform; generating a second set of coordinates according to the first set of coordinates, the position of the first work object and the compensation factor; and guiding a mine A second set of coordinates is emitted to the first batch of work to imprint the first work. A method for laser-printing a work object according to claim 12, wherein the generating the compensation factor further comprises: guiding a laser beam to a calibration template in a first state through a light guiding member Forming a correction mark, wherein the first state corresponds to a first 第31頁 1277478 六、申請專利範圍 組座標; 透過該導光構件於一第二狀態偵測該第一校正記號之一可 見光束,其中該第二狀態對應至一第二組座標;以及 決定該第一組與該第二組座標之差以決定該補償因子。 1 4 .如申請專利範圍第1 2項之利用雷射刻印一工作物之方 法,更包括: 載入至少一後續之工作物於該平台與該第一工作物之上; 決定該第一工作物之一第一位置; 刻印該第一工作物; 決定該至少一後續之工作物之一第二位置;以及 刻印該至少一後續之工作物。Page 31 1277478 6. Applying a patent range group coordinate; detecting, by the light guiding member, a visible light beam of the first correction mark in a second state, wherein the second state corresponds to a second set of coordinates; and determining the The difference between the first set and the second set of coordinates determines the compensation factor. 1 4 . The method of laser-printing a work object according to claim 12, further comprising: loading at least one subsequent work object on the platform and the first work object; determining the first work a first position of the object; marking the first work object; determining a second position of the at least one subsequent work item; and marking the at least one subsequent work item. 第32頁Page 32
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8669507B2 (en) 2010-10-22 2014-03-11 Industrial Technology Research Institute Laser scanning device
US9423248B2 (en) 2013-05-10 2016-08-23 Industrial Technology Research Institute Visual error calibration method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8669507B2 (en) 2010-10-22 2014-03-11 Industrial Technology Research Institute Laser scanning device
US9423248B2 (en) 2013-05-10 2016-08-23 Industrial Technology Research Institute Visual error calibration method

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