JPH03264176A - Laser marker - Google Patents

Laser marker

Info

Publication number
JPH03264176A
JPH03264176A JP2060431A JP6043190A JPH03264176A JP H03264176 A JPH03264176 A JP H03264176A JP 2060431 A JP2060431 A JP 2060431A JP 6043190 A JP6043190 A JP 6043190A JP H03264176 A JPH03264176 A JP H03264176A
Authority
JP
Japan
Prior art keywords
condenser lens
incident
semiconductor laser
work
irradiation point
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2060431A
Other languages
Japanese (ja)
Inventor
Nobuyuki Miyamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Electric Co Ltd
Original Assignee
Fuji Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Electric Co Ltd filed Critical Fuji Electric Co Ltd
Priority to JP2060431A priority Critical patent/JPH03264176A/en
Publication of JPH03264176A publication Critical patent/JPH03264176A/en
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/046Automatically focusing the laser beam
    • B23K26/048Automatically focusing the laser beam by controlling the distance between laser head and workpiece

Abstract

PURPOSE: To miniaturize the device and to allow an exact distance measurement in a short period of time by making a ray for measurement incident on the position of an irradiation point and receiving the reflected light thereof again through a condenser lens, thereby measuring the distance from the irradiation point.
CONSTITUTION: The semiconductor laser from an optical range finder 6 is made incident on the surface of a work 9 through a condenser lens 4 from diagonal above. Troubles are then eliminated even if the spacing between the condenser lens 4 and the work 9 is narrow. Since the semiconductor laser can be made incident on the condenser lens 4 at a relatively small incident angle, the accu racy of the distance measurement is improved.
COPYRIGHT: (C)1991,JPO&Japio
JP2060431A 1990-03-12 1990-03-12 Laser marker Pending JPH03264176A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2060431A JPH03264176A (en) 1990-03-12 1990-03-12 Laser marker

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2060431A JPH03264176A (en) 1990-03-12 1990-03-12 Laser marker

Publications (1)

Publication Number Publication Date
JPH03264176A true JPH03264176A (en) 1991-11-25

Family

ID=13142050

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2060431A Pending JPH03264176A (en) 1990-03-12 1990-03-12 Laser marker

Country Status (1)

Country Link
JP (1) JPH03264176A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007118051A (en) * 2005-10-28 2007-05-17 Keyence Corp Processing data setup device, processing data setup method, processing data setup program, computer readable recording medium, recorded apparatus, and laser beam processing apparatus
US8153931B2 (en) 2006-06-30 2012-04-10 Keyence Corporation Method of and system for setting laser processing conditions, laser processing system, computer program for setting laser processing conditions, computer readable media and recording device on which laser processing conditions are recorded

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007118051A (en) * 2005-10-28 2007-05-17 Keyence Corp Processing data setup device, processing data setup method, processing data setup program, computer readable recording medium, recorded apparatus, and laser beam processing apparatus
US8153931B2 (en) 2006-06-30 2012-04-10 Keyence Corporation Method of and system for setting laser processing conditions, laser processing system, computer program for setting laser processing conditions, computer readable media and recording device on which laser processing conditions are recorded

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