TW529111B - Top infrared heating for bonding operations - Google Patents

Top infrared heating for bonding operations Download PDF

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Publication number
TW529111B
TW529111B TW090113541A TW90113541A TW529111B TW 529111 B TW529111 B TW 529111B TW 090113541 A TW090113541 A TW 090113541A TW 90113541 A TW90113541 A TW 90113541A TW 529111 B TW529111 B TW 529111B
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TW
Taiwan
Prior art keywords
substrate
bonding
infrared
heater
flip chip
Prior art date
Application number
TW090113541A
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English (en)
Chinese (zh)
Inventor
Pak C Wong
Original Assignee
Advanced Micro Devices Inc
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Publication date
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Application granted granted Critical
Publication of TW529111B publication Critical patent/TW529111B/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/1579—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)
TW090113541A 2000-06-12 2001-06-05 Top infrared heating for bonding operations TW529111B (en)

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JP (1) JP2004503939A (ko)
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CN (1) CN1229857C (ko)
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Also Published As

Publication number Publication date
CN1454393A (zh) 2003-11-05
EP1290725A1 (en) 2003-03-12
US6384366B1 (en) 2002-05-07
KR100747131B1 (ko) 2007-08-09
CN1229857C (zh) 2005-11-30
KR20070034630A (ko) 2007-03-28
KR20030011887A (ko) 2003-02-11
WO2001097278A1 (en) 2001-12-20
JP2004503939A (ja) 2004-02-05
KR100747134B1 (ko) 2007-08-09

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