TW529111B - Top infrared heating for bonding operations - Google Patents
Top infrared heating for bonding operations Download PDFInfo
- Publication number
- TW529111B TW529111B TW090113541A TW90113541A TW529111B TW 529111 B TW529111 B TW 529111B TW 090113541 A TW090113541 A TW 090113541A TW 90113541 A TW90113541 A TW 90113541A TW 529111 B TW529111 B TW 529111B
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate
- bonding
- infrared
- heater
- flip chip
- Prior art date
Links
- 238000010438 heat treatment Methods 0.000 title claims abstract description 16
- 239000000758 substrate Substances 0.000 claims abstract description 74
- 238000000034 method Methods 0.000 claims abstract description 26
- 229910000679 solder Inorganic materials 0.000 claims abstract description 22
- 239000013078 crystal Substances 0.000 claims description 15
- 239000004065 semiconductor Substances 0.000 claims description 8
- 230000001678 irradiating effect Effects 0.000 claims description 4
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims 1
- 229910052750 molybdenum Inorganic materials 0.000 claims 1
- 239000011733 molybdenum Substances 0.000 claims 1
- 230000005855 radiation Effects 0.000 abstract description 7
- 239000000463 material Substances 0.000 description 8
- 239000000919 ceramic Substances 0.000 description 7
- 239000002650 laminated plastic Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 230000002079 cooperative effect Effects 0.000 description 3
- 238000004806 packaging method and process Methods 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 230000002411 adverse Effects 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000000875 corresponding effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920006332 epoxy adhesive Polymers 0.000 description 1
- 239000013305 flexible fiber Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- -1 structures Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000002604 ultrasonography Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/156—Material
- H01L2924/157—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
- H01L2924/15738—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950 C and less than 1550 C
- H01L2924/15747—Copper [Cu] as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/156—Material
- H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
- H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/156—Material
- H01L2924/1579—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Wire Bonding (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/592,275 US6384366B1 (en) | 2000-06-12 | 2000-06-12 | Top infrared heating for bonding operations |
Publications (1)
Publication Number | Publication Date |
---|---|
TW529111B true TW529111B (en) | 2003-04-21 |
Family
ID=24370021
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW090113541A TW529111B (en) | 2000-06-12 | 2001-06-05 | Top infrared heating for bonding operations |
Country Status (7)
Country | Link |
---|---|
US (1) | US6384366B1 (ko) |
EP (1) | EP1290725A1 (ko) |
JP (1) | JP2004503939A (ko) |
KR (2) | KR100747134B1 (ko) |
CN (1) | CN1229857C (ko) |
TW (1) | TW529111B (ko) |
WO (1) | WO2001097278A1 (ko) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
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DE10147789B4 (de) * | 2001-09-27 | 2004-04-15 | Infineon Technologies Ag | Vorrichtung zum Verlöten von Kontakten auf Halbleiterchips |
US7288472B2 (en) * | 2004-12-21 | 2007-10-30 | Intel Corporation | Method and system for performing die attach using a flame |
JP2006261519A (ja) * | 2005-03-18 | 2006-09-28 | Sharp Corp | 半導体装置及びその製造方法 |
US7677432B2 (en) * | 2005-05-03 | 2010-03-16 | Texas Instruments Incorporated | Spot heat wirebonding |
US20080152829A1 (en) * | 2006-12-20 | 2008-06-26 | Dean Roy E | Coating compositions, coatings formed therefrom and methods of making the same |
SG155779A1 (en) * | 2008-03-10 | 2009-10-29 | Micron Technology Inc | Apparatus and methods of forming wire bonds |
CN102054658B (zh) * | 2009-10-30 | 2013-03-27 | 日月光封装测试(上海)有限公司 | 封装打线工艺的加热治具及其方法 |
US7871860B1 (en) * | 2009-11-17 | 2011-01-18 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method of semiconductor packaging |
KR101739752B1 (ko) * | 2010-11-05 | 2017-05-26 | 삼성전자 주식회사 | 와이어 본딩 장치 및 이를 이용한 와이어 본딩 방법 |
US8533936B1 (en) | 2011-01-26 | 2013-09-17 | Western Digital (Fremont), Llc | Systems and methods for pre-heating adjacent bond pads for soldering |
US8440503B1 (en) * | 2011-11-16 | 2013-05-14 | Taiwan Semiconductor Manufacturing Company, Ltd. | Methods for performing reflow in bonding processes |
CN102915933A (zh) * | 2012-09-11 | 2013-02-06 | 厦门锐迅达电子有限公司 | 一种祼晶的表面贴装焊接工艺 |
EP3759733A1 (en) | 2018-02-28 | 2021-01-06 | Raytheon Company | A system and method for reworking a flip chip mounted on an electronic device using a mill to remove the chip and replacing the chip with a new chip in the milled area |
CN109003969A (zh) * | 2018-08-21 | 2018-12-14 | 佛山市国星光电股份有限公司 | 一种基于高密度显示的cob封装方法、系统及cob器件 |
US11410961B2 (en) * | 2020-03-17 | 2022-08-09 | Micron Technology, Inc. | Methods and apparatus for temperature modification in bonding stacked microelectronic components and related substrates and assemblies |
US11804467B2 (en) * | 2020-06-25 | 2023-10-31 | Micron Technology, Inc. | Radiative heat collective bonder and gangbonder |
Family Cites Families (23)
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US4170326A (en) * | 1978-01-09 | 1979-10-09 | Gte Automatic Electric Laboratories Incorporated | Method and holding fixture for soldering lead frames to hybrid substrates |
JPS5565443A (en) * | 1978-11-10 | 1980-05-16 | Mitsubishi Electric Corp | Manufacture of semiconductor device |
US4915565A (en) * | 1984-03-22 | 1990-04-10 | Sgs-Thomson Microelectronics, Inc. | Manipulation and handling of integrated circuit dice |
JPS61168233A (ja) | 1985-01-21 | 1986-07-29 | Hitachi Ltd | 半導体装置の修理方法 |
JPS62188233A (ja) * | 1986-02-13 | 1987-08-17 | Matsushima Kogyo Co Ltd | 半導体ボンデイング装置 |
JPH0238046B2 (ja) * | 1986-12-27 | 1990-08-28 | Sakamoto Tetsukosho Jugen | Kanjozainosenkosochi |
JPS63232438A (ja) * | 1987-03-20 | 1988-09-28 | Matsushita Electric Ind Co Ltd | ワイヤボンデイング方法 |
JPH0296394A (ja) * | 1988-09-30 | 1990-04-09 | Matsushita Electric Ind Co Ltd | はんだ付けリフロー方法 |
JPH02310939A (ja) | 1989-05-25 | 1990-12-26 | Toshiba Corp | ワイヤーボンディング方法 |
GB2244374B (en) | 1990-05-22 | 1994-10-05 | Stc Plc | Improvements in hybrid circuits |
JPH04151844A (ja) | 1990-09-05 | 1992-05-25 | Nec Corp | アウターリードボンディング装置 |
JPH05109811A (ja) * | 1991-10-15 | 1993-04-30 | Mitsubishi Electric Corp | ワイヤボンデイング装置 |
JPH05243722A (ja) * | 1992-02-28 | 1993-09-21 | Nec Corp | 半導体装置の実装方法 |
JP2813507B2 (ja) | 1992-04-23 | 1998-10-22 | 三菱電機株式会社 | ボンディング方法およびボンディング装置 |
JP3195970B2 (ja) | 1992-05-29 | 2001-08-06 | 澁谷工業株式会社 | 半導体チップボンダにおけるチップ加熱機構 |
US5346857A (en) | 1992-09-28 | 1994-09-13 | Motorola, Inc. | Method for forming a flip-chip bond from a gold-tin eutectic |
JP3583462B2 (ja) * | 1993-04-05 | 2004-11-04 | フォード モーター カンパニー | 電子成分のための微小はんだ付け装置および方法 |
US5783025A (en) * | 1994-06-07 | 1998-07-21 | Texas Instruments Incorporated | Optical diebonding for semiconductor devices |
US6041994A (en) * | 1994-06-07 | 2000-03-28 | Texas Instruments Incorporated | Rapid and selective heating method in integrated circuit package assembly by means of tungsten halogen light source |
JPH1050766A (ja) * | 1996-08-02 | 1998-02-20 | Toshiba Corp | フェース・ダウン・ボンディング方法およびその装置 |
JPH10189643A (ja) * | 1996-12-18 | 1998-07-21 | Texas Instr Inc <Ti> | タングステン・ハロゲン光源を用いる集積回路パッケージ・アッセンブリの高速及び選択的加熱方法 |
JPH118270A (ja) * | 1997-06-16 | 1999-01-12 | Tokai Rika Co Ltd | 半導体チップの搭載方法、チップオンチップ構造体の製造方法及びチップオンボード構造体の製造方法 |
JP3344289B2 (ja) * | 1997-07-18 | 2002-11-11 | 松下電器産業株式会社 | バンプ付ワークの実装方法 |
-
2000
- 2000-06-12 US US09/592,275 patent/US6384366B1/en not_active Expired - Lifetime
- 2000-12-01 CN CNB008196419A patent/CN1229857C/zh not_active Expired - Fee Related
- 2000-12-01 KR KR1020077003602A patent/KR100747134B1/ko not_active IP Right Cessation
- 2000-12-01 KR KR1020027016900A patent/KR100747131B1/ko not_active IP Right Cessation
- 2000-12-01 JP JP2002511381A patent/JP2004503939A/ja active Pending
- 2000-12-01 EP EP00988009A patent/EP1290725A1/en active Pending
- 2000-12-01 WO PCT/US2000/032700 patent/WO2001097278A1/en not_active Application Discontinuation
-
2001
- 2001-06-05 TW TW090113541A patent/TW529111B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
CN1454393A (zh) | 2003-11-05 |
EP1290725A1 (en) | 2003-03-12 |
US6384366B1 (en) | 2002-05-07 |
KR100747131B1 (ko) | 2007-08-09 |
CN1229857C (zh) | 2005-11-30 |
KR20070034630A (ko) | 2007-03-28 |
KR20030011887A (ko) | 2003-02-11 |
WO2001097278A1 (en) | 2001-12-20 |
JP2004503939A (ja) | 2004-02-05 |
KR100747134B1 (ko) | 2007-08-09 |
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