TW514594B - Structure of piezoelectric element and liquid discharge recording head, and method of manufacture therefor - Google Patents

Structure of piezoelectric element and liquid discharge recording head, and method of manufacture therefor Download PDF

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Publication number
TW514594B
TW514594B TW90115010A TW90115010A TW514594B TW 514594 B TW514594 B TW 514594B TW 90115010 A TW90115010 A TW 90115010A TW 90115010 A TW90115010 A TW 90115010A TW 514594 B TW514594 B TW 514594B
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TW
Taiwan
Prior art keywords
layer
liquid discharge
piezoelectric film
recording head
piezoelectric
Prior art date
Application number
TW90115010A
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English (en)
Inventor
Akira Unno
Tetsuro Fukui
Takanori Matsuda
Kiyotaka Wasa
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Kiyotaka Wasa
Canon Kk
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Publication of TW514594B publication Critical patent/TW514594B/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1607—Production of print heads with piezoelectric elements
    • B41J2/161—Production of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1623—Manufacturing processes bonding and adhesion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1626—Manufacturing processes etching
    • B41J2/1628—Manufacturing processes etching dry etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1626—Manufacturing processes etching
    • B41J2/1629—Manufacturing processes etching wet etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/164—Manufacturing processes thin film formation
    • B41J2/1642—Manufacturing processes thin film formation thin film formation by CVD [chemical vapor deposition]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/164—Manufacturing processes thin film formation
    • B41J2/1646—Manufacturing processes thin film formation thin film formation by sputtering
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
    • H10N30/074—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing
    • H10N30/076—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing by vapour phase deposition
    • H10N30/704—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/85—Piezoelectric or electrostrictive active materials
    • H10N30/853—Ceramic compositions
    • H10N30/8548—Lead based oxides
    • H10N30/8554—Lead zirconium titanate based
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/14201—Structure of print heads with piezoelectric elements
    • B41J2/14233—Structure of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm
    • B41J2002/14258—Multi layer thin film type piezoelectric element
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/42—Piezoelectric device making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base

Description

514594 A8 B8 C8 D8 六、申請專利範圍 (請先閲讀背面之注意事項再填寫本頁) 24. —霍製造液體排放記錄頭的方法，此液體排放記 錄頭具主體部位，主體部位具有液體排放埠，具開口部位 的壓力室，及用以關閉該開口部位的壓電振動部位，壓力 室與該開口部位相連，此方法包括步驟： 在基底上形成振動板及電極； 在該電極上形成具有含鉛及鈦之perovskite結構的第 一層，在第一層上形成具有含銷，鉛及鈦之perovs kite結 構的第二層，並將形成溫度設爲500°C以上，接著以 30°C/min的冷卻速度快速地冷卻至450°C，以形成含該第 一層及第二層的壓電薄膜； 在形成對應於該壓力室的壓電薄膜後，分離該壓電薄 膜； 形成上電極與對應至該壓電薄膜的壓力室；及 接合形成有液體排放璋的噴嘴板， 其中在形成該壓電薄膜的驟中，使第一層不含鉻，或 使第一層的含銷量小於第二層的含銷量。 經濟部智慧財產局員工消費合作社印製 25 . —種製造液體排放記錄頭的方法，此液體排放記 錄頭具主體部位，主體部位具有液體排放璋，具開口部位 的壓力室，及用以關閉該開口部位的壓電振動部位，壓力 室與該開口部位相連，此方法包括步驟：. 在支持基底上形成具有含錯及駄之perovskite結構的 第一層，在第一層上形成具有含鉻，鉛及鈦之perovskite 結構的第二層，並將形成溫度設爲500°C以'上，接著以 30QC/min的冷卻速度快速地冷卻至450°C，以形成含該第 i紙張尺度適用中國國家梂準（CNS ) A4規格（210X29*7公釐） JT] ： _ 514594 A8 B8 C8 __D8 六、申請專利範圍 一層及第二層的壓電薄膜；及在該支持基底上形成具該 perovskite薄膜的壓.電振動部位； 不利用接合劑，直接連接該主體部位之開口部位的_ 邊及壓電振動板的周邊；及 移除該支持基底， 其中在形成該壓電薄膜的步驟中，使第一層不含錯， 或使第一層的含鍩量小於第二層的含锆量。 26·如甲請專利範圍第25項之製造液體排放記錄頭白勺 方法，其中利用濺鍍及CVD法的蒸著法，形成該第〜層 ，第二層，振動板及電極。 27. 如申請專利範圍第24項之製造液體排放記錄頭的 方法，其中使用矽基底作爲該基底，並以鹽酸，硝酸之混 合酸進行蝕刻，來移除該基底，以在其內形成壓力室。 28. 如申請專利範圍第27項之製造液體排放記錄頭的 方法，其中以氫氟酸溶液或p 01 a s s i u m氫氧化物溶液進行 蝕刻，來移除該基底。 Γ碕先閑讀背面之注意事項再填寫本頁j 經濟部智慧財產局員工消費合作社印製 本紙張尺度適用中國國家樣率（CNS ) A4規格（210X297公釐） -6 -
TW90115010A 2000-06-21 2001-06-20 Structure of piezoelectric element and liquid discharge recording head, and method of manufacture therefor TW514594B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000185795A JP3796394B2 (ja) 2000-06-21 2000-06-21 圧電素子の製造方法および液体噴射記録ヘッドの製造方法

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TW514594B true TW514594B (en) 2002-12-21

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Country Status (8)

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US (2) US7120978B2 (zh)
EP (1) EP1168465B1 (zh)
JP (1) JP3796394B2 (zh)
KR (1) KR100485551B1 (zh)
CN (1) CN1296210C (zh)
CA (1) CA2351199C (zh)
DE (1) DE60128863T2 (zh)
TW (1) TW514594B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
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TWI601581B (zh) * 2014-05-30 2017-10-11 佳能股份有限公司 壓電材料、壓電元件、壓電元件製造方法和電子設備

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US7120978B2 (en) 2006-10-17
CA2351199A1 (en) 2001-12-21
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EP1168465B1 (en) 2007-06-13
DE60128863T2 (de) 2008-02-07

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