TW511216B - Method for aligning two objects, method for detecting superimposing state of two objects, and apparatus for aligning two objects - Google Patents
Method for aligning two objects, method for detecting superimposing state of two objects, and apparatus for aligning two objects Download PDFInfo
- Publication number
- TW511216B TW511216B TW090127178A TW90127178A TW511216B TW 511216 B TW511216 B TW 511216B TW 090127178 A TW090127178 A TW 090127178A TW 90127178 A TW90127178 A TW 90127178A TW 511216 B TW511216 B TW 511216B
- Authority
- TW
- Taiwan
- Prior art keywords
- image
- image data
- color
- objects
- aligning
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims abstract description 53
- 239000000523 sample Substances 0.000 claims abstract description 115
- 230000007246 mechanism Effects 0.000 claims description 71
- 238000001514 detection method Methods 0.000 claims description 23
- 238000013461 design Methods 0.000 claims description 14
- 239000003086 colorant Substances 0.000 claims description 11
- 230000003287 optical effect Effects 0.000 claims description 10
- 238000007689 inspection Methods 0.000 claims description 9
- 238000012546 transfer Methods 0.000 claims description 6
- 230000008859 change Effects 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims description 4
- 238000005259 measurement Methods 0.000 claims 1
- 230000001568 sexual effect Effects 0.000 claims 1
- 235000012431 wafers Nutrition 0.000 description 39
- 238000012360 testing method Methods 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 3
- 230000007423 decrease Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 238000003384 imaging method Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000004040 coloring Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7088—Alignment mark detection, e.g. TTR, TTL, off-axis detection, array detector, video detection
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N7/00—Television systems
- H04N7/18—Closed-circuit television [CCTV] systems, i.e. systems in which the video signal is not broadcast
Landscapes
- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Image Processing (AREA)
- Image Analysis (AREA)
- Measuring Leads Or Probes (AREA)
- Tests Of Electronic Circuits (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000341265A JP4740405B2 (ja) | 2000-11-09 | 2000-11-09 | 位置合わせ方法及びプログラム記録媒体 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW511216B true TW511216B (en) | 2002-11-21 |
Family
ID=18816031
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW090127178A TW511216B (en) | 2000-11-09 | 2001-11-01 | Method for aligning two objects, method for detecting superimposing state of two objects, and apparatus for aligning two objects |
Country Status (4)
| Country | Link |
|---|---|
| US (2) | US6917698B2 (enExample) |
| JP (1) | JP4740405B2 (enExample) |
| KR (1) | KR100786463B1 (enExample) |
| TW (1) | TW511216B (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111562413A (zh) * | 2019-02-14 | 2020-08-21 | 均豪精密工业股份有限公司 | 检测方法及检测系统 |
| WO2024000898A1 (zh) * | 2022-06-30 | 2024-01-04 | 昆山国显光电有限公司 | 显示面板的对位方法、显示面板的伽马调试方法及装置 |
Families Citing this family (31)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004536300A (ja) * | 2001-07-04 | 2004-12-02 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | 画像装置の位置の迅速な判断を可能にする基準のしるしの選択 |
| US20040184654A1 (en) * | 2001-07-04 | 2004-09-23 | Nicolas Villain | Optimizing selection of reference markings used in estimating the position of an imaging device |
| JP4510403B2 (ja) * | 2003-05-08 | 2010-07-21 | 富士フイルム株式会社 | カメラモジュール及びカメラモジュールの製造方法 |
| US7529432B2 (en) * | 2003-10-22 | 2009-05-05 | Sony Corporation | Data processing apparatus, data processing method, program, and recording medium |
| US7679389B2 (en) * | 2005-03-07 | 2010-03-16 | Kabushiki Kaisha Nihon Micronics | Probe for electrical test and electrical connecting apparatus using it |
| JP4908138B2 (ja) * | 2005-12-09 | 2012-04-04 | ルネサスエレクトロニクス株式会社 | プローブ検査装置 |
| JP4484844B2 (ja) * | 2006-05-16 | 2010-06-16 | 東京エレクトロン株式会社 | 画像二値化処理方法、画像処理装置及びコンピュータプログラム |
| JP4795146B2 (ja) * | 2006-07-10 | 2011-10-19 | 株式会社日立ハイテクノロジーズ | 電子ビーム装置,プローブ制御方法及びプログラム |
| KR100807119B1 (ko) * | 2006-08-11 | 2008-02-28 | 세크론 주식회사 | 프로빙 검사장치용 광학 시스템 및 이를 이용하는 프로빙검사 방법 |
| JP2008053411A (ja) * | 2006-08-24 | 2008-03-06 | Nec Electronics Corp | プローブ検査装置およびプローブ検査方法 |
| JP4939156B2 (ja) | 2006-09-19 | 2012-05-23 | 東京エレクトロン株式会社 | 位置合わせ対象物の再登録方法及びその方法を記録した記録媒体 |
| JP4808135B2 (ja) * | 2006-11-09 | 2011-11-02 | 株式会社日本マイクロニクス | プローブ位置合わせ方法及び可動式プローブユニット機構並びに検査装置 |
| JP4783271B2 (ja) * | 2006-11-27 | 2011-09-28 | 東京エレクトロン株式会社 | ウエハ電極の登録方法及びウエハのアライメント方法並びにこれらの方法を記録した記録媒体 |
| JP5120027B2 (ja) | 2007-09-28 | 2013-01-16 | 東京エレクトロン株式会社 | プローブ装置及びプロービング方法 |
| SG195592A1 (en) * | 2007-12-27 | 2013-12-30 | Lam Res Corp | Arrangements and methods for determining positions and offsets in plasma processing system |
| CN101911276B (zh) * | 2007-12-27 | 2012-04-25 | 朗姆研究公司 | 使用至少一个光源校准末端执行器对准的系统和方法 |
| US8751047B2 (en) * | 2007-12-27 | 2014-06-10 | Lam Research Corporation | Systems and methods for calibrating end effector alignment in a plasma processing system |
| US9269529B2 (en) * | 2007-12-27 | 2016-02-23 | Lam Research Corporation | Systems and methods for dynamic alignment beam calibration |
| US8159243B2 (en) * | 2008-11-13 | 2012-04-17 | Dcg Systems, Inc. | Probe tip to device pad alignment in obscured view probing applications |
| JP5621313B2 (ja) | 2010-05-14 | 2014-11-12 | セイコーエプソン株式会社 | 電子部品検査装置及び電子部品搬送方法 |
| KR101074376B1 (ko) | 2010-06-23 | 2011-10-17 | 주식회사 아이엠티 | 실시간 탐침 정렬장치 및 방법 |
| TW201209776A (en) * | 2010-08-18 | 2012-03-01 | Chunghwa Picture Tubes Ltd | LCD panel assembling and alignment system and alignment method thereof |
| JP5832345B2 (ja) * | 2012-03-22 | 2015-12-16 | 株式会社ニューフレアテクノロジー | 検査装置および検査方法 |
| CN103365107B (zh) * | 2012-04-11 | 2015-05-13 | 上海微电子装备有限公司 | 一种多离轴对准系统匹配测校方法 |
| JP2014089218A (ja) * | 2014-02-21 | 2014-05-15 | Seiko Epson Corp | 電子部品検査装置及び電子部品検査方法 |
| US20160110859A1 (en) * | 2014-10-17 | 2016-04-21 | Macronix International Co., Ltd. | Inspection method for contact by die to database |
| US9966290B2 (en) | 2015-07-30 | 2018-05-08 | Lam Research Corporation | System and method for wafer alignment and centering with CCD camera and robot |
| JP7458161B2 (ja) * | 2019-09-24 | 2024-03-29 | 東京エレクトロン株式会社 | 検査装置の制御方法および検査装置 |
| US11821912B2 (en) * | 2020-05-29 | 2023-11-21 | Formfactor, Inc. | Methods of producing augmented probe system images and associated probe systems |
| GB202010350D0 (en) * | 2020-07-06 | 2020-08-19 | Univ Strathclyde | Methods and apparatus for use in the spatial registration of objects |
| JP7750468B2 (ja) * | 2021-03-19 | 2025-10-07 | ニデックアドバンステクノロジー株式会社 | 画像処理装置、画像処理方法、及び検査装置 |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5917260A (ja) | 1982-07-20 | 1984-01-28 | Mitsubishi Electric Corp | 半導体ウエハの試験方法 |
| JP2897465B2 (ja) | 1991-07-02 | 1999-05-31 | 日本電気株式会社 | ウェーハプローバ |
| JPH06232254A (ja) * | 1993-02-01 | 1994-08-19 | Sumitomo Electric Ind Ltd | 半導体ウェーハの切断ライン位置検出方法及び装置 |
| JP2570585B2 (ja) * | 1993-07-22 | 1997-01-08 | 日本電気株式会社 | プローブ装置 |
| JP3384504B2 (ja) * | 1993-10-18 | 2003-03-10 | 株式会社アドバンテスト | 荷電粒子ビームを利用したicテスタ |
| JP2986141B2 (ja) * | 1994-03-31 | 1999-12-06 | 東京エレクトロン株式会社 | プローブ装置 |
| JP2986142B2 (ja) * | 1994-04-19 | 1999-12-06 | 東京エレクトロン株式会社 | プローブ方法 |
| JP3156192B2 (ja) * | 1994-04-19 | 2001-04-16 | 東京エレクトロン株式会社 | プローブ方法及びその装置 |
| JP3424138B2 (ja) * | 1994-05-11 | 2003-07-07 | カシオ計算機株式会社 | 透明基板の位置合わせ方法 |
| JP3202577B2 (ja) * | 1996-01-18 | 2001-08-27 | 東京エレクトロン株式会社 | プローブ方法 |
| US5777485A (en) * | 1995-03-20 | 1998-07-07 | Tokyo Electron Limited | Probe method and apparatus with improved probe contact |
| JP2994991B2 (ja) * | 1995-09-19 | 1999-12-27 | ウシオ電機株式会社 | マスクとワークの位置合わせ方法および装置 |
| US6002426A (en) * | 1997-07-02 | 1999-12-14 | Cerprobe Corporation | Inverted alignment station and method for calibrating needles of probe card for probe testing of integrated circuits |
| KR100476539B1 (ko) | 2002-09-05 | 2005-03-18 | 동연내장(주) | 자동차용 일체형 플로워 시트 및 그 제조방법 |
-
2000
- 2000-11-09 JP JP2000341265A patent/JP4740405B2/ja not_active Expired - Fee Related
-
2001
- 2001-11-01 TW TW090127178A patent/TW511216B/zh not_active IP Right Cessation
- 2001-11-08 US US09/986,287 patent/US6917698B2/en not_active Expired - Fee Related
- 2001-11-08 KR KR1020010069418A patent/KR100786463B1/ko not_active Expired - Fee Related
-
2005
- 2005-06-14 US US11/151,534 patent/US7382914B2/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111562413A (zh) * | 2019-02-14 | 2020-08-21 | 均豪精密工业股份有限公司 | 检测方法及检测系统 |
| WO2024000898A1 (zh) * | 2022-06-30 | 2024-01-04 | 昆山国显光电有限公司 | 显示面板的对位方法、显示面板的伽马调试方法及装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2002151555A (ja) | 2002-05-24 |
| US6917698B2 (en) | 2005-07-12 |
| US7382914B2 (en) | 2008-06-03 |
| KR100786463B1 (ko) | 2007-12-17 |
| KR20020036732A (ko) | 2002-05-16 |
| US20020054209A1 (en) | 2002-05-09 |
| JP4740405B2 (ja) | 2011-08-03 |
| US20050232479A1 (en) | 2005-10-20 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GD4A | Issue of patent certificate for granted invention patent | ||
| MM4A | Annulment or lapse of patent due to non-payment of fees |