KR100786463B1 - 두 물체의 위치 정렬 방법, 두 물체의 중첩 상태의 검출방법 및 두 물체의 위치 정렬 장치 - Google Patents

두 물체의 위치 정렬 방법, 두 물체의 중첩 상태의 검출방법 및 두 물체의 위치 정렬 장치 Download PDF

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KR100786463B1
KR100786463B1 KR1020010069418A KR20010069418A KR100786463B1 KR 100786463 B1 KR100786463 B1 KR 100786463B1 KR 1020010069418 A KR1020010069418 A KR 1020010069418A KR 20010069418 A KR20010069418 A KR 20010069418A KR 100786463 B1 KR100786463 B1 KR 100786463B1
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image
image data
color
imaging
electrode pads
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KR20020036732A (ko
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오비히로키
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동경 엘렉트론 주식회사
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7088—Alignment mark detection, e.g. TTR, TTL, off-axis detection, array detector, video detection
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N7/00—Television systems
    • H04N7/18—Closed-circuit television [CCTV] systems, i.e. systems in which the video signal is not broadcast

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  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Image Processing (AREA)
  • Image Analysis (AREA)
  • Measuring Leads Or Probes (AREA)
  • Tests Of Electronic Circuits (AREA)
KR1020010069418A 2000-11-09 2001-11-08 두 물체의 위치 정렬 방법, 두 물체의 중첩 상태의 검출방법 및 두 물체의 위치 정렬 장치 Expired - Fee Related KR100786463B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2000341265A JP4740405B2 (ja) 2000-11-09 2000-11-09 位置合わせ方法及びプログラム記録媒体
JPJP-P-2000-00341265 2000-11-09

Publications (2)

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KR20020036732A KR20020036732A (ko) 2002-05-16
KR100786463B1 true KR100786463B1 (ko) 2007-12-17

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KR1020010069418A Expired - Fee Related KR100786463B1 (ko) 2000-11-09 2001-11-08 두 물체의 위치 정렬 방법, 두 물체의 중첩 상태의 검출방법 및 두 물체의 위치 정렬 장치

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US (2) US6917698B2 (enExample)
JP (1) JP4740405B2 (enExample)
KR (1) KR100786463B1 (enExample)
TW (1) TW511216B (enExample)

Cited By (1)

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KR101074376B1 (ko) 2010-06-23 2011-10-17 주식회사 아이엠티 실시간 탐침 정렬장치 및 방법

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US20040184654A1 (en) * 2001-07-04 2004-09-23 Nicolas Villain Optimizing selection of reference markings used in estimating the position of an imaging device
JP4510403B2 (ja) * 2003-05-08 2010-07-21 富士フイルム株式会社 カメラモジュール及びカメラモジュールの製造方法
US7529432B2 (en) * 2003-10-22 2009-05-05 Sony Corporation Data processing apparatus, data processing method, program, and recording medium
US7679389B2 (en) * 2005-03-07 2010-03-16 Kabushiki Kaisha Nihon Micronics Probe for electrical test and electrical connecting apparatus using it
JP4908138B2 (ja) * 2005-12-09 2012-04-04 ルネサスエレクトロニクス株式会社 プローブ検査装置
JP4484844B2 (ja) * 2006-05-16 2010-06-16 東京エレクトロン株式会社 画像二値化処理方法、画像処理装置及びコンピュータプログラム
JP4795146B2 (ja) * 2006-07-10 2011-10-19 株式会社日立ハイテクノロジーズ 電子ビーム装置，プローブ制御方法及びプログラム
KR100807119B1 (ko) * 2006-08-11 2008-02-28 세크론 주식회사 프로빙 검사장치용 광학 시스템 및 이를 이용하는 프로빙검사 방법
JP2008053411A (ja) * 2006-08-24 2008-03-06 Nec Electronics Corp プローブ検査装置およびプローブ検査方法
JP4939156B2 (ja) 2006-09-19 2012-05-23 東京エレクトロン株式会社 位置合わせ対象物の再登録方法及びその方法を記録した記録媒体
JP4808135B2 (ja) * 2006-11-09 2011-11-02 株式会社日本マイクロニクス プローブ位置合わせ方法及び可動式プローブユニット機構並びに検査装置
JP4783271B2 (ja) * 2006-11-27 2011-09-28 東京エレクトロン株式会社 ウエハ電極の登録方法及びウエハのアライメント方法並びにこれらの方法を記録した記録媒体
JP5120027B2 (ja) 2007-09-28 2013-01-16 東京エレクトロン株式会社 プローブ装置及びプロービング方法
SG195592A1 (en) * 2007-12-27 2013-12-30 Lam Res Corp Arrangements and methods for determining positions and offsets in plasma processing system
CN101911276B (zh) * 2007-12-27 2012-04-25 朗姆研究公司 使用至少一个光源校准末端执行器对准的系统和方法
US8751047B2 (en) * 2007-12-27 2014-06-10 Lam Research Corporation Systems and methods for calibrating end effector alignment in a plasma processing system
US9269529B2 (en) * 2007-12-27 2016-02-23 Lam Research Corporation Systems and methods for dynamic alignment beam calibration
US8159243B2 (en) * 2008-11-13 2012-04-17 Dcg Systems, Inc. Probe tip to device pad alignment in obscured view probing applications
JP5621313B2 (ja) 2010-05-14 2014-11-12 セイコーエプソン株式会社 電子部品検査装置及び電子部品搬送方法
TW201209776A (en) * 2010-08-18 2012-03-01 Chunghwa Picture Tubes Ltd LCD panel assembling and alignment system and alignment method thereof
JP5832345B2 (ja) * 2012-03-22 2015-12-16 株式会社ニューフレアテクノロジー 検査装置および検査方法
CN103365107B (zh) * 2012-04-11 2015-05-13 上海微电子装备有限公司 一种多离轴对准系统匹配测校方法
JP2014089218A (ja) * 2014-02-21 2014-05-15 Seiko Epson Corp 電子部品検査装置及び電子部品検査方法
US20160110859A1 (en) * 2014-10-17 2016-04-21 Macronix International Co., Ltd. Inspection method for contact by die to database
US9966290B2 (en) 2015-07-30 2018-05-08 Lam Research Corporation System and method for wafer alignment and centering with CCD camera and robot
CN111562413A (zh) * 2019-02-14 2020-08-21 均豪精密工业股份有限公司 检测方法及检测系统
JP7458161B2 (ja) * 2019-09-24 2024-03-29 東京エレクトロン株式会社 検査装置の制御方法および検査装置
US11821912B2 (en) * 2020-05-29 2023-11-21 Formfactor, Inc. Methods of producing augmented probe system images and associated probe systems
GB202010350D0 (en) * 2020-07-06 2020-08-19 Univ Strathclyde Methods and apparatus for use in the spatial registration of objects
JP7750468B2 (ja) * 2021-03-19 2025-10-07 ニデックアドバンステクノロジー株式会社 画像処理装置、画像処理方法、及び検査装置
CN114944127B (zh) * 2022-06-30 2025-08-08 昆山国显光电有限公司 显示面板的对位方法、显示面板的伽马调试方法及装置

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JPH0513518A (ja) * 1991-07-02 1993-01-22 Nec Corp ウエーハプローバ
JPH07297242A (ja) * 1994-04-19 1995-11-10 Tokyo Electron Ltd プローブ方法及びその装置
JPH08335612A (ja) * 1994-03-31 1996-12-17 Tokyo Electron Ltd プロ−ブ装置およびその方法
KR100422722B1 (ko) * 1995-09-19 2005-04-06 우시오덴키 가부시키가이샤 마스크와작업편의위치맞춤방법및장치

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JPH06232254A (ja) * 1993-02-01 1994-08-19 Sumitomo Electric Ind Ltd 半導体ウェーハの切断ライン位置検出方法及び装置
JP2570585B2 (ja) * 1993-07-22 1997-01-08 日本電気株式会社 プローブ装置
JP3384504B2 (ja) * 1993-10-18 2003-03-10 株式会社アドバンテスト 荷電粒子ビームを利用したｉｃテスタ
JP2986142B2 (ja) * 1994-04-19 1999-12-06 東京エレクトロン株式会社 プローブ方法
JP3424138B2 (ja) * 1994-05-11 2003-07-07 カシオ計算機株式会社 透明基板の位置合わせ方法
JP3202577B2 (ja) * 1996-01-18 2001-08-27 東京エレクトロン株式会社 プローブ方法
US5777485A (en) * 1995-03-20 1998-07-07 Tokyo Electron Limited Probe method and apparatus with improved probe contact
US6002426A (en) * 1997-07-02 1999-12-14 Cerprobe Corporation Inverted alignment station and method for calibrating needles of probe card for probe testing of integrated circuits
KR100476539B1 (ko) 2002-09-05 2005-03-18 동연내장(주) 자동차용 일체형 플로워 시트 및 그 제조방법

Patent Citations (4)

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JPH0513518A (ja) * 1991-07-02 1993-01-22 Nec Corp ウエーハプローバ
JPH08335612A (ja) * 1994-03-31 1996-12-17 Tokyo Electron Ltd プロ−ブ装置およびその方法
JPH07297242A (ja) * 1994-04-19 1995-11-10 Tokyo Electron Ltd プローブ方法及びその装置
KR100422722B1 (ko) * 1995-09-19 2005-04-06 우시오덴키 가부시키가이샤 마스크와작업편의위치맞춤방법및장치

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101074376B1 (ko) 2010-06-23 2011-10-17 주식회사 아이엠티 실시간 탐침 정렬장치 및 방법

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TW511216B (en) 2002-11-21
JP2002151555A (ja) 2002-05-24
US6917698B2 (en) 2005-07-12
US7382914B2 (en) 2008-06-03
KR20020036732A (ko) 2002-05-16
US20020054209A1 (en) 2002-05-09
JP4740405B2 (ja) 2011-08-03
US20050232479A1 (en) 2005-10-20

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