TWI329900B - - Google Patents
Download PDFInfo
- Publication number
- TWI329900B TWI329900B TW094127068A TW94127068A TWI329900B TW I329900 B TWI329900 B TW I329900B TW 094127068 A TW094127068 A TW 094127068A TW 94127068 A TW94127068 A TW 94127068A TW I329900 B TWI329900 B TW I329900B
- Authority
- TW
- Taiwan
- Prior art keywords
- camera
- target
- deviation
- substrate
- wafer
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Wire Bonding (AREA)
- Die Bonding (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004303260A JP4264403B2 (ja) | 2004-10-18 | 2004-10-18 | ボンディング装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200620507A TW200620507A (en) | 2006-06-16 |
| TWI329900B true TWI329900B (enExample) | 2010-09-01 |
Family
ID=36383077
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW094127068A TW200620507A (en) | 2004-10-18 | 2005-08-10 | Bonding apparatus |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP4264403B2 (enExample) |
| KR (1) | KR100672227B1 (enExample) |
| TW (1) | TW200620507A (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI677773B (zh) * | 2014-03-27 | 2019-11-21 | 村田機械股份有限公司 | 搬運控制系統 |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101090816B1 (ko) * | 2011-05-04 | 2011-12-12 | 주식회사 아이. 피. 에스시스템 | 반도체 칩 본딩장치 |
| KR101718717B1 (ko) * | 2015-08-11 | 2017-04-04 | (주)다원넥스뷰 | 프로브 본딩장치 및 이를 이용한 프로브 본딩방법 |
| JP7022340B2 (ja) * | 2018-08-01 | 2022-02-18 | 日本電気硝子株式会社 | カメラのキャリブレーション方法、キャリブレーション装置及びキャリブレーション用ターゲット |
| TWI775198B (zh) * | 2019-12-17 | 2022-08-21 | 日商新川股份有限公司 | 半導體裝置的製造裝置以及半導體裝置的製造方法 |
-
2004
- 2004-10-18 JP JP2004303260A patent/JP4264403B2/ja not_active Expired - Fee Related
-
2005
- 2005-08-10 TW TW094127068A patent/TW200620507A/zh unknown
- 2005-09-13 KR KR1020050084939A patent/KR100672227B1/ko not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI677773B (zh) * | 2014-03-27 | 2019-11-21 | 村田機械股份有限公司 | 搬運控制系統 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2006114841A (ja) | 2006-04-27 |
| JP4264403B2 (ja) | 2009-05-20 |
| KR100672227B1 (ko) | 2007-01-22 |
| KR20060051227A (ko) | 2006-05-19 |
| TW200620507A (en) | 2006-06-16 |
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