TW200620507A - Bonding apparatus - Google Patents

Bonding apparatus

Info

Publication number
TW200620507A
TW200620507A TW094127068A TW94127068A TW200620507A TW 200620507 A TW200620507 A TW 200620507A TW 094127068 A TW094127068 A TW 094127068A TW 94127068 A TW94127068 A TW 94127068A TW 200620507 A TW200620507 A TW 200620507A
Authority
TW
Taiwan
Prior art keywords
camera
correction
viewed
height
bonding apparatus
Prior art date
Application number
TW094127068A
Other languages
English (en)
Chinese (zh)
Other versions
TWI329900B (enExample
Inventor
Kohei Seyama
Original Assignee
Shinkawa Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Kk filed Critical Shinkawa Kk
Publication of TW200620507A publication Critical patent/TW200620507A/zh
Application granted granted Critical
Publication of TWI329900B publication Critical patent/TWI329900B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/26—Auxiliary equipment

Landscapes

  • Wire Bonding (AREA)
  • Die Bonding (AREA)
TW094127068A 2004-10-18 2005-08-10 Bonding apparatus TW200620507A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004303260A JP4264403B2 (ja) 2004-10-18 2004-10-18 ボンディング装置

Publications (2)

Publication Number Publication Date
TW200620507A true TW200620507A (en) 2006-06-16
TWI329900B TWI329900B (enExample) 2010-09-01

Family

ID=36383077

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094127068A TW200620507A (en) 2004-10-18 2005-08-10 Bonding apparatus

Country Status (3)

Country Link
JP (1) JP4264403B2 (enExample)
KR (1) KR100672227B1 (enExample)
TW (1) TW200620507A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102769997A (zh) * 2011-05-04 2012-11-07 Ips系统股份有限公司 半导体芯片接合设备

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6217491B2 (ja) * 2014-03-27 2017-10-25 村田機械株式会社 搬送制御システム及びデータ処理装置
KR101718717B1 (ko) * 2015-08-11 2017-04-04 (주)다원넥스뷰 프로브 본딩장치 및 이를 이용한 프로브 본딩방법
JP7022340B2 (ja) * 2018-08-01 2022-02-18 日本電気硝子株式会社 カメラのキャリブレーション方法、キャリブレーション装置及びキャリブレーション用ターゲット
TWI775198B (zh) * 2019-12-17 2022-08-21 日商新川股份有限公司 半導體裝置的製造裝置以及半導體裝置的製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102769997A (zh) * 2011-05-04 2012-11-07 Ips系统股份有限公司 半导体芯片接合设备

Also Published As

Publication number Publication date
KR20060051227A (ko) 2006-05-19
TWI329900B (enExample) 2010-09-01
JP2006114841A (ja) 2006-04-27
JP4264403B2 (ja) 2009-05-20
KR100672227B1 (ko) 2007-01-22

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