KR100672227B1 - 본딩 장치 - Google Patents

본딩 장치 Download PDF

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Publication number
KR100672227B1
KR100672227B1 KR1020050084939A KR20050084939A KR100672227B1 KR 100672227 B1 KR100672227 B1 KR 100672227B1 KR 1020050084939 A KR1020050084939 A KR 1020050084939A KR 20050084939 A KR20050084939 A KR 20050084939A KR 100672227 B1 KR100672227 B1 KR 100672227B1
Authority
KR
South Korea
Prior art keywords
camera
bonding
target
correction
bonding tool
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020050084939A
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English (en)
Korean (ko)
Other versions
KR20060051227A (ko
Inventor
고헤이 세야마
Original Assignee
가부시키가이샤 신가와
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시키가이샤 신가와 filed Critical 가부시키가이샤 신가와
Publication of KR20060051227A publication Critical patent/KR20060051227A/ko
Application granted granted Critical
Publication of KR100672227B1 publication Critical patent/KR100672227B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/26—Auxiliary equipment

Landscapes

  • Wire Bonding (AREA)
  • Die Bonding (AREA)
KR1020050084939A 2004-10-18 2005-09-13 본딩 장치 Expired - Fee Related KR100672227B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2004-00303260 2004-10-18
JP2004303260A JP4264403B2 (ja) 2004-10-18 2004-10-18 ボンディング装置

Publications (2)

Publication Number Publication Date
KR20060051227A KR20060051227A (ko) 2006-05-19
KR100672227B1 true KR100672227B1 (ko) 2007-01-22

Family

ID=36383077

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020050084939A Expired - Fee Related KR100672227B1 (ko) 2004-10-18 2005-09-13 본딩 장치

Country Status (3)

Country Link
JP (1) JP4264403B2 (enExample)
KR (1) KR100672227B1 (enExample)
TW (1) TW200620507A (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101090816B1 (ko) * 2011-05-04 2011-12-12 주식회사 아이. 피. 에스시스템 반도체 칩 본딩장치
JP6217491B2 (ja) * 2014-03-27 2017-10-25 村田機械株式会社 搬送制御システム及びデータ処理装置
KR101718717B1 (ko) * 2015-08-11 2017-04-04 (주)다원넥스뷰 프로브 본딩장치 및 이를 이용한 프로브 본딩방법
JP7022340B2 (ja) * 2018-08-01 2022-02-18 日本電気硝子株式会社 カメラのキャリブレーション方法、キャリブレーション装置及びキャリブレーション用ターゲット
TWI775198B (zh) * 2019-12-17 2022-08-21 日商新川股份有限公司 半導體裝置的製造裝置以及半導體裝置的製造方法

Also Published As

Publication number Publication date
KR20060051227A (ko) 2006-05-19
TWI329900B (enExample) 2010-09-01
TW200620507A (en) 2006-06-16
JP2006114841A (ja) 2006-04-27
JP4264403B2 (ja) 2009-05-20

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