JP4264403B2 - ボンディング装置 - Google Patents

ボンディング装置 Download PDF

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Publication number
JP4264403B2
JP4264403B2 JP2004303260A JP2004303260A JP4264403B2 JP 4264403 B2 JP4264403 B2 JP 4264403B2 JP 2004303260 A JP2004303260 A JP 2004303260A JP 2004303260 A JP2004303260 A JP 2004303260A JP 4264403 B2 JP4264403 B2 JP 4264403B2
Authority
JP
Japan
Prior art keywords
camera
bonding
target
imaging
correction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2004303260A
Other languages
English (en)
Japanese (ja)
Other versions
JP2006114841A (ja
Inventor
耕平 瀬山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Priority to JP2004303260A priority Critical patent/JP4264403B2/ja
Priority to TW094127068A priority patent/TW200620507A/zh
Priority to KR1020050084939A priority patent/KR100672227B1/ko
Publication of JP2006114841A publication Critical patent/JP2006114841A/ja
Application granted granted Critical
Publication of JP4264403B2 publication Critical patent/JP4264403B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)
JP2004303260A 2004-10-18 2004-10-18 ボンディング装置 Expired - Fee Related JP4264403B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2004303260A JP4264403B2 (ja) 2004-10-18 2004-10-18 ボンディング装置
TW094127068A TW200620507A (en) 2004-10-18 2005-08-10 Bonding apparatus
KR1020050084939A KR100672227B1 (ko) 2004-10-18 2005-09-13 본딩 장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004303260A JP4264403B2 (ja) 2004-10-18 2004-10-18 ボンディング装置

Publications (2)

Publication Number Publication Date
JP2006114841A JP2006114841A (ja) 2006-04-27
JP4264403B2 true JP4264403B2 (ja) 2009-05-20

Family

ID=36383077

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004303260A Expired - Fee Related JP4264403B2 (ja) 2004-10-18 2004-10-18 ボンディング装置

Country Status (3)

Country Link
JP (1) JP4264403B2 (enExample)
KR (1) KR100672227B1 (enExample)
TW (1) TW200620507A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20170019061A (ko) * 2015-08-11 2017-02-21 (주)다원넥스뷰 프로브 본딩장치 및 이를 이용한 프로브 본딩방법

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101090816B1 (ko) * 2011-05-04 2011-12-12 주식회사 아이. 피. 에스시스템 반도체 칩 본딩장치
JP6217491B2 (ja) * 2014-03-27 2017-10-25 村田機械株式会社 搬送制御システム及びデータ処理装置
JP7022340B2 (ja) * 2018-08-01 2022-02-18 日本電気硝子株式会社 カメラのキャリブレーション方法、キャリブレーション装置及びキャリブレーション用ターゲット
TWI775198B (zh) * 2019-12-17 2022-08-21 日商新川股份有限公司 半導體裝置的製造裝置以及半導體裝置的製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20170019061A (ko) * 2015-08-11 2017-02-21 (주)다원넥스뷰 프로브 본딩장치 및 이를 이용한 프로브 본딩방법
KR101718717B1 (ko) 2015-08-11 2017-04-04 (주)다원넥스뷰 프로브 본딩장치 및 이를 이용한 프로브 본딩방법

Also Published As

Publication number Publication date
JP2006114841A (ja) 2006-04-27
TWI329900B (enExample) 2010-09-01
KR100672227B1 (ko) 2007-01-22
KR20060051227A (ko) 2006-05-19
TW200620507A (en) 2006-06-16

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