TW472499B - PTC device and method for producing the same - Google Patents
PTC device and method for producing the same Download PDFInfo
- Publication number
- TW472499B TW472499B TW089114201A TW89114201A TW472499B TW 472499 B TW472499 B TW 472499B TW 089114201 A TW089114201 A TW 089114201A TW 89114201 A TW89114201 A TW 89114201A TW 472499 B TW472499 B TW 472499B
- Authority
- TW
- Taiwan
- Prior art keywords
- powder
- conductive
- composition
- electrode
- conductive powder
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 25
- 239000000843 powder Substances 0.000 claims abstract description 104
- 229920000642 polymer Polymers 0.000 claims abstract description 36
- 238000000034 method Methods 0.000 claims abstract description 35
- 238000007747 plating Methods 0.000 claims abstract description 23
- 239000004020 conductor Substances 0.000 claims abstract description 15
- 239000002131 composite material Substances 0.000 claims abstract description 9
- 229910003178 Mo2C Inorganic materials 0.000 claims abstract description 7
- 239000000203 mixture Substances 0.000 claims description 79
- 239000000463 material Substances 0.000 claims description 33
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 19
- 230000004888 barrier function Effects 0.000 claims description 18
- 230000002079 cooperative effect Effects 0.000 claims description 10
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 7
- 229910045601 alloy Inorganic materials 0.000 claims description 3
- 239000000956 alloy Substances 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 238000004898 kneading Methods 0.000 claims description 3
- 229920001169 thermoplastic Polymers 0.000 claims description 3
- 101100001642 Caenorhabditis elegans amt-1 gene Proteins 0.000 claims 1
- 238000010030 laminating Methods 0.000 claims 1
- 239000004416 thermosoftening plastic Substances 0.000 claims 1
- 239000000945 filler Substances 0.000 abstract 2
- 230000000052 comparative effect Effects 0.000 description 39
- 239000002184 metal Substances 0.000 description 21
- 229910052751 metal Inorganic materials 0.000 description 21
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical group [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 19
- 238000005259 measurement Methods 0.000 description 8
- 238000012360 testing method Methods 0.000 description 7
- 238000010438 heat treatment Methods 0.000 description 5
- 229920001903 high density polyethylene Polymers 0.000 description 5
- 239000004700 high-density polyethylene Substances 0.000 description 5
- 230000007613 environmental effect Effects 0.000 description 4
- 239000004816 latex Substances 0.000 description 4
- 229920000126 latex Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 238000003860 storage Methods 0.000 description 4
- 239000011231 conductive filler Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000005611 electricity Effects 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 235000015170 shellfish Nutrition 0.000 description 3
- 239000004743 Polypropylene Substances 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- NIHNNTQXNPWCJQ-UHFFFAOYSA-N fluorene Chemical compound C1=CC=C2CC3=CC=CC=C3C2=C1 NIHNNTQXNPWCJQ-UHFFFAOYSA-N 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- -1 polypropylene Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- OEPOKWHJYJXUGD-UHFFFAOYSA-N 2-(3-phenylmethoxyphenyl)-1,3-thiazole-4-carbaldehyde Chemical compound O=CC1=CSC(C=2C=C(OCC=3C=CC=CC=3)C=CC=2)=N1 OEPOKWHJYJXUGD-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- 101000892301 Phomopsis amygdali Geranylgeranyl diphosphate synthase Proteins 0.000 description 1
- 230000005856 abnormality Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 230000000875 corresponding effect Effects 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 229920001684 low density polyethylene Polymers 0.000 description 1
- 239000004702 low-density polyethylene Substances 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/02—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
- H01C17/065—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
- H01C17/06506—Precursor compositions therefor, e.g. pastes, inks, glass frits
- H01C17/06513—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the resistive component
- H01C17/0652—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the resistive component containing carbon or carbides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
- H01C1/142—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors the terminals or tapping points being coated on the resistive element
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/02—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
- H01C7/027—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient consisting of conducting or semi-conducting material dispersed in a non-conductive organic material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/04—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient
- H01C7/049—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient mainly consisting of organic or organo-metal substances
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
- H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
- H05B3/14—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
- H05B3/146—Conductive polymers, e.g. polyethylene, thermoplastics
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Ceramic Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Thermistors And Varistors (AREA)
- Resistance Heating (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11202617A JP2001035640A (ja) | 1999-07-16 | 1999-07-16 | Ｐｔｃ素子及びその製造方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW472499B true TW472499B (en) | 2002-01-11 |
Family
ID=16460357
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW089114201A TW472499B (en) | 1999-07-16 | 2000-07-15 | PTC device and method for producing the same |
Country Status (8)
| Country | Link |
|---|---|
| EP (1) | EP1126478A4 (no) |
| JP (1) | JP2001035640A (no) |
| KR (1) | KR20010079845A (no) |
| CN (1) | CN1318201A (no) |
| CA (1) | CA2344532A1 (no) |
| NO (1) | NO20011325L (no) |
| TW (1) | TW472499B (no) |
| WO (1) | WO2001006521A1 (no) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100420470B1 (ko) * | 2001-10-31 | 2004-03-02 | 엘지전선 주식회사 | 정온도 특성 소자 제조를 위한 솔더링 공법 |
| CN100407468C (zh) * | 2003-09-25 | 2008-07-30 | 松下电器产业株式会社 | 压电元件及备有该压电元件的喷墨头以及它们的制造方法 |
| KR20150087372A (ko) * | 2012-11-19 | 2015-07-29 | 가부시키가이샤 유에이씨제이 | 집전체, 전극 구조체, 축전부품 및 집전체용 조성물 |
| DE102017121039A1 (de) * | 2017-05-24 | 2018-11-29 | Webasto SE | Luftheizgerät |
| CN112153765B (zh) * | 2020-11-25 | 2021-03-09 | 广东康烯科技有限公司 | 多孔碳化钼MXene/还原氧化石墨烯基发热膜 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06318504A (ja) * | 1993-05-10 | 1994-11-15 | Daito Tsushinki Kk | Ｐｔｃ素子 |
| JP2810351B2 (ja) * | 1995-09-27 | 1998-10-15 | ティーディーケイ株式会社 | 有機質正特性サーミスタ |
| JPH0969409A (ja) * | 1995-08-31 | 1997-03-11 | Mitsubishi Electric Corp | Ｐｔｃ素子 |
| JPH10125504A (ja) * | 1996-10-17 | 1998-05-15 | Tdk Corp | 有機質正特性サーミスタとその製造方法 |
| JPH10140004A (ja) * | 1996-11-05 | 1998-05-26 | Daicel Huels Ltd | 高分子感温体用樹脂組成物および高分子感温体 |
| JP3214546B2 (ja) * | 1996-11-08 | 2001-10-02 | ティーディーケイ株式会社 | 有機質正特性サーミスタの製造方法および有機質正特性サーミスタ |
| JPH10208902A (ja) * | 1997-01-21 | 1998-08-07 | Tdk Corp | 有機ｐｔｃサーミスタの製造方法 |
| JPH10241907A (ja) * | 1997-02-28 | 1998-09-11 | Mitsubishi Electric Corp | 回路保護装置 |
| JPH1116707A (ja) * | 1997-06-27 | 1999-01-22 | Tdk Corp | 有機質正特性サーミスタ |
| JPH1187106A (ja) * | 1997-09-08 | 1999-03-30 | Unitika Ltd | Ｐｔｃ素子の製造方法 |
| JPH11144906A (ja) * | 1997-11-13 | 1999-05-28 | Tokin Corp | Ｐｔｃ組成物 |
-
1999
- 1999-07-16 JP JP11202617A patent/JP2001035640A/ja not_active Withdrawn
-
2000
- 2000-07-14 CN CN00801438A patent/CN1318201A/zh active Pending
- 2000-07-14 CA CA002344532A patent/CA2344532A1/en not_active Abandoned
- 2000-07-14 WO PCT/JP2000/004777 patent/WO2001006521A1/ja not_active Application Discontinuation
- 2000-07-14 EP EP00946362A patent/EP1126478A4/en not_active Withdrawn
- 2000-07-14 KR KR1020017003431A patent/KR20010079845A/ko not_active Application Discontinuation
- 2000-07-15 TW TW089114201A patent/TW472499B/zh not_active IP Right Cessation
-
2001
- 2001-03-15 NO NO20011325A patent/NO20011325L/no unknown
Also Published As
| Publication number | Publication date |
|---|---|
| NO20011325L (no) | 2001-05-16 |
| EP1126478A4 (en) | 2002-01-09 |
| CN1318201A (zh) | 2001-10-17 |
| NO20011325D0 (no) | 2001-03-15 |
| JP2001035640A (ja) | 2001-02-09 |
| KR20010079845A (ko) | 2001-08-22 |
| WO2001006521A1 (fr) | 2001-01-25 |
| CA2344532A1 (en) | 2001-01-25 |
| EP1126478A1 (en) | 2001-08-22 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GD4A | Issue of patent certificate for granted invention patent | ||
| MM4A | Annulment or lapse of patent due to non-payment of fees |