KR20010079845A - 정온도 계수 소자 및 그 제조 방법 - Google Patents
정온도 계수 소자 및 그 제조 방법 Download PDFInfo
- Publication number
- KR20010079845A KR20010079845A KR1020017003431A KR20017003431A KR20010079845A KR 20010079845 A KR20010079845 A KR 20010079845A KR 1020017003431 A KR1020017003431 A KR 1020017003431A KR 20017003431 A KR20017003431 A KR 20017003431A KR 20010079845 A KR20010079845 A KR 20010079845A
- Authority
- KR
- South Korea
- Prior art keywords
- powder
- molded body
- composition
- electrode
- conductor
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 23
- 239000000843 powder Substances 0.000 claims abstract description 102
- 239000000203 mixture Substances 0.000 claims abstract description 96
- 239000004020 conductor Substances 0.000 claims abstract description 39
- 229920000642 polymer Polymers 0.000 claims abstract description 34
- 238000007747 plating Methods 0.000 claims abstract description 32
- 239000000945 filler Substances 0.000 claims abstract description 27
- 238000000034 method Methods 0.000 claims description 32
- 230000004888 barrier function Effects 0.000 claims description 16
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 14
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 8
- 238000002788 crimping Methods 0.000 claims description 4
- 239000000956 alloy Substances 0.000 claims description 3
- 229910045601 alloy Inorganic materials 0.000 claims description 3
- 238000004898 kneading Methods 0.000 claims description 3
- 238000002156 mixing Methods 0.000 claims description 3
- 229920001169 thermoplastic Polymers 0.000 claims description 3
- 230000002349 favourable effect Effects 0.000 abstract description 2
- 230000000052 comparative effect Effects 0.000 description 40
- 239000002184 metal Substances 0.000 description 19
- 229910052751 metal Inorganic materials 0.000 description 19
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 18
- 239000000463 material Substances 0.000 description 8
- 238000005259 measurement Methods 0.000 description 8
- 238000012360 testing method Methods 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 5
- 229920001903 high density polyethylene Polymers 0.000 description 5
- 239000004700 high-density polyethylene Substances 0.000 description 5
- 238000000465 moulding Methods 0.000 description 5
- 230000003252 repetitive effect Effects 0.000 description 5
- 230000007613 environmental effect Effects 0.000 description 4
- 239000004816 latex Substances 0.000 description 4
- 229920000126 latex Polymers 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 239000011231 conductive filler Substances 0.000 description 3
- -1 polyethylene Polymers 0.000 description 3
- 229920002959 polymer blend Polymers 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 239000004743 Polypropylene Substances 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000005238 degreasing Methods 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 238000005868 electrolysis reaction Methods 0.000 description 2
- 239000003792 electrolyte Substances 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 1
- 229920001328 Polyvinylidene chloride Polymers 0.000 description 1
- 230000005856 abnormality Effects 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 229920001684 low density polyethylene Polymers 0.000 description 1
- 239000004702 low-density polyethylene Substances 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 239000005033 polyvinylidene chloride Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/02—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
- H01C17/065—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
- H01C17/06506—Precursor compositions therefor, e.g. pastes, inks, glass frits
- H01C17/06513—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the resistive component
- H01C17/0652—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the resistive component containing carbon or carbides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
- H01C1/142—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors the terminals or tapping points being coated on the resistive element
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/02—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
- H01C7/027—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient consisting of conducting or semi-conducting material dispersed in a non-conductive organic material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/04—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient
- H01C7/049—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient mainly consisting of organic or organo-metal substances
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
- H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
- H05B3/14—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
- H05B3/146—Conductive polymers, e.g. polyethylene, thermoplastics
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Thermistors And Varistors (AREA)
- Resistance Heating (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11202617A JP2001035640A (ja) | 1999-07-16 | 1999-07-16 | Ｐｔｃ素子及びその製造方法 |
| JP1999-202617 | 1999-07-16 | ||
| PCT/JP2000/004777 WO2001006521A1 (fr) | 1999-07-16 | 2000-07-14 | Dispositif a coefficient de temperature positif et son procede de fabrication |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20010079845A true KR20010079845A (ko) | 2001-08-22 |
Family
ID=16460357
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020017003431A KR20010079845A (ko) | 1999-07-16 | 2000-07-14 | 정온도 계수 소자 및 그 제조 방법 |
Country Status (8)
| Country | Link |
|---|---|
| EP (1) | EP1126478A4 (no) |
| JP (1) | JP2001035640A (no) |
| KR (1) | KR20010079845A (no) |
| CN (1) | CN1318201A (no) |
| CA (1) | CA2344532A1 (no) |
| NO (1) | NO20011325L (no) |
| TW (1) | TW472499B (no) |
| WO (1) | WO2001006521A1 (no) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100420470B1 (ko) * | 2001-10-31 | 2004-03-02 | 엘지전선 주식회사 | 정온도 특성 소자 제조를 위한 솔더링 공법 |
| EP1686632B1 (en) * | 2003-09-25 | 2010-06-02 | Panasonic Corporation | Piezoelectric element, ink-jet head with same, and their manufacturing methods |
| EP2922124B1 (en) * | 2012-11-19 | 2017-06-21 | UACJ Corporation | Collector, electrode structure, electricity storage component, and composition for collectors |
| DE102017121060A1 (de) * | 2017-05-24 | 2018-11-29 | Webasto SE | Elektrisches Heizgerät |
| CN112153765B (zh) * | 2020-11-25 | 2021-03-09 | 广东康烯科技有限公司 | 多孔碳化钼MXene/还原氧化石墨烯基发热膜 |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06318504A (ja) * | 1993-05-10 | 1994-11-15 | Daito Tsushinki Kk | Ｐｔｃ素子 |
| JPH09153402A (ja) * | 1995-09-27 | 1997-06-10 | Tdk Corp | 有機質正特性サーミスタ |
| JPH10144502A (ja) * | 1996-11-08 | 1998-05-29 | Tdk Corp | 有機質正特性サーミスタの製造方法および有機質正特性サーミスタ |
| JPH10241907A (ja) * | 1997-02-28 | 1998-09-11 | Mitsubishi Electric Corp | 回路保護装置 |
| JPH1116707A (ja) * | 1997-06-27 | 1999-01-22 | Tdk Corp | 有機質正特性サーミスタ |
| JPH1187106A (ja) * | 1997-09-08 | 1999-03-30 | Unitika Ltd | Ｐｔｃ素子の製造方法 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0969409A (ja) * | 1995-08-31 | 1997-03-11 | Mitsubishi Electric Corp | Ｐｔｃ素子 |
| JPH10125504A (ja) * | 1996-10-17 | 1998-05-15 | Tdk Corp | 有機質正特性サーミスタとその製造方法 |
| JPH10140004A (ja) * | 1996-11-05 | 1998-05-26 | Daicel Huels Ltd | 高分子感温体用樹脂組成物および高分子感温体 |
| JPH10208902A (ja) * | 1997-01-21 | 1998-08-07 | Tdk Corp | 有機ｐｔｃサーミスタの製造方法 |
| JPH11144906A (ja) * | 1997-11-13 | 1999-05-28 | Tokin Corp | Ｐｔｃ組成物 |
-
1999
- 1999-07-16 JP JP11202617A patent/JP2001035640A/ja not_active Withdrawn
-
2000
- 2000-07-14 EP EP00946362A patent/EP1126478A4/en not_active Withdrawn
- 2000-07-14 KR KR1020017003431A patent/KR20010079845A/ko not_active Application Discontinuation
- 2000-07-14 CN CN00801438A patent/CN1318201A/zh active Pending
- 2000-07-14 CA CA002344532A patent/CA2344532A1/en not_active Abandoned
- 2000-07-14 WO PCT/JP2000/004777 patent/WO2001006521A1/ja not_active Application Discontinuation
- 2000-07-15 TW TW089114201A patent/TW472499B/zh not_active IP Right Cessation
-
2001
- 2001-03-15 NO NO20011325A patent/NO20011325L/no unknown
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06318504A (ja) * | 1993-05-10 | 1994-11-15 | Daito Tsushinki Kk | Ｐｔｃ素子 |
| JPH09153402A (ja) * | 1995-09-27 | 1997-06-10 | Tdk Corp | 有機質正特性サーミスタ |
| JPH10144502A (ja) * | 1996-11-08 | 1998-05-29 | Tdk Corp | 有機質正特性サーミスタの製造方法および有機質正特性サーミスタ |
| JPH10241907A (ja) * | 1997-02-28 | 1998-09-11 | Mitsubishi Electric Corp | 回路保護装置 |
| JPH1116707A (ja) * | 1997-06-27 | 1999-01-22 | Tdk Corp | 有機質正特性サーミスタ |
| JPH1187106A (ja) * | 1997-09-08 | 1999-03-30 | Unitika Ltd | Ｐｔｃ素子の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2001006521A1 (fr) | 2001-01-25 |
| JP2001035640A (ja) | 2001-02-09 |
| TW472499B (en) | 2002-01-11 |
| EP1126478A4 (en) | 2002-01-09 |
| NO20011325L (no) | 2001-05-16 |
| EP1126478A1 (en) | 2001-08-22 |
| CA2344532A1 (en) | 2001-01-25 |
| CN1318201A (zh) | 2001-10-17 |
| NO20011325D0 (no) | 2001-03-15 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A201 | Request for examination | ||
| E902 | Notification of reason for refusal | ||
| E902 | Notification of reason for refusal | ||
| E601 | Decision to refuse application |