TW457168B - Chemical mechanical polishing processes and components - Google Patents

Chemical mechanical polishing processes and components Download PDF

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Publication number
TW457168B
TW457168B TW089102325A TW89102325A TW457168B TW 457168 B TW457168 B TW 457168B TW 089102325 A TW089102325 A TW 089102325A TW 89102325 A TW89102325 A TW 89102325A TW 457168 B TW457168 B TW 457168B
Authority
TW
Taiwan
Prior art keywords
layer
polishing
grinding
slurry
substrate
Prior art date
Application number
TW089102325A
Other languages
English (en)
Chinese (zh)
Inventor
Raymond R Jin
Jeffrey D David
Fred C Redeker
Thomas H Osterheld
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Application granted granted Critical
Publication of TW457168B publication Critical patent/TW457168B/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/403—Chemomechanical polishing [CMP] of conductive or resistive materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/0056—Control means for lapping machines or devices taking regard of the pH-value of lapping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H10P95/06—Planarisation of inorganic insulating materials
    • H10P95/062—Planarisation of inorganic insulating materials involving a dielectric removal step

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
TW089102325A 1999-02-11 2000-07-21 Chemical mechanical polishing processes and components TW457168B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11976399P 1999-02-11 1999-02-11

Publications (1)

Publication Number Publication Date
TW457168B true TW457168B (en) 2001-10-01

Family

ID=22386234

Family Applications (1)

Application Number Title Priority Date Filing Date
TW089102325A TW457168B (en) 1999-02-11 2000-07-21 Chemical mechanical polishing processes and components

Country Status (6)

Country Link
US (1) US6435942B1 (https=)
EP (1) EP1068928A3 (https=)
JP (1) JP4575539B2 (https=)
KR (1) KR20000058021A (https=)
SG (1) SG87886A1 (https=)
TW (1) TW457168B (https=)

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US6595830B1 (en) * 2001-03-26 2003-07-22 Advanced Micro Devices, Inc. Method of controlling chemical mechanical polishing operations to control erosion of insulating materials
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CN103753356A (zh) * 2014-01-21 2014-04-30 曼盛包装（上海）有限公司 一种透明pmma注射成型合模线的抛光消除方法
KR102677387B1 (ko) * 2018-03-13 2024-06-24 어플라이드 머티어리얼스, 인코포레이티드 화학적 기계적 연마 동안 진동들의 모니터링
US12055821B2 (en) 2020-11-20 2024-08-06 Applied Materials, Inc. Structure and method of bi-layer pixel isolation in advanced LCOS back-plane
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Also Published As

Publication number Publication date
JP2000301454A (ja) 2000-10-31
US6435942B1 (en) 2002-08-20
EP1068928A2 (en) 2001-01-17
SG87886A1 (en) 2002-04-16
EP1068928A3 (en) 2003-08-13
JP4575539B2 (ja) 2010-11-04
KR20000058021A (ko) 2000-09-25

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