TW448331B - Thermo-compressing bonding method and thermo-compressing bonding apparatus - Google Patents
Thermo-compressing bonding method and thermo-compressing bonding apparatus Download PDFInfo
- Publication number
- TW448331B TW448331B TW86102633A TW86102633A TW448331B TW 448331 B TW448331 B TW 448331B TW 86102633 A TW86102633 A TW 86102633A TW 86102633 A TW86102633 A TW 86102633A TW 448331 B TW448331 B TW 448331B
- Authority
- TW
- Taiwan
- Prior art keywords
- conductive adhesive
- anisotropic conductive
- conductor
- temperature
- electronic component
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims abstract description 42
- 239000000853 adhesive Substances 0.000 claims abstract description 86
- 230000001070 adhesive effect Effects 0.000 claims abstract description 86
- 239000004020 conductor Substances 0.000 claims abstract description 56
- 238000007906 compression Methods 0.000 claims abstract description 38
- 239000000758 substrate Substances 0.000 claims abstract description 32
- 229920001187 thermosetting polymer Polymers 0.000 claims abstract description 22
- 230000006835 compression Effects 0.000 claims description 36
- 238000003825 pressing Methods 0.000 claims description 24
- 239000011159 matrix material Substances 0.000 claims description 16
- 238000010438 heat treatment Methods 0.000 claims description 15
- 238000002788 crimping Methods 0.000 claims description 12
- 239000004973 liquid crystal related substance Substances 0.000 claims description 10
- 238000007731 hot pressing Methods 0.000 claims description 9
- 239000007787 solid Substances 0.000 claims description 3
- 239000003795 chemical substances by application Substances 0.000 claims 2
- 239000011248 coating agent Substances 0.000 claims 1
- 230000002093 peripheral effect Effects 0.000 claims 1
- 239000004848 polyfunctional curative Substances 0.000 claims 1
- 239000002313 adhesive film Substances 0.000 abstract 1
- 235000015170 shellfish Nutrition 0.000 description 7
- 230000000875 corresponding effect Effects 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 238000013007 heat curing Methods 0.000 description 4
- 230000002079 cooperative effect Effects 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000001723 curing Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 241000252233 Cyprinus carpio Species 0.000 description 1
- 229910001111 Fine metal Inorganic materials 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000013256 coordination polymer Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 208000010727 head pressing Diseases 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
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- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/18—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated tools
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
- B29C65/4805—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the type of adhesives
- B29C65/483—Reactive adhesives, e.g. chemically curing adhesives
- B29C65/4835—Heat curing adhesives
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
- B29C65/4855—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by their physical properties, e.g. being electrically-conductive
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- B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
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- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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- B29C66/40—General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
- B29C66/41—Joining substantially flat articles ; Making flat seams in tubular or hollow articles
- B29C66/43—Joining a relatively small portion of the surface of said articles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
- B29C66/72—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the structure of the material of the parts to be joined
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- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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- B29C66/80—General aspects of machine operations or constructions and parts thereof
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
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- B29C66/824—Actuating mechanisms
- B29C66/8242—Pneumatic or hydraulic drives
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- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/80—General aspects of machine operations or constructions and parts thereof
- B29C66/83—General aspects of machine operations or constructions and parts thereof characterised by the movement of the joining or pressing tools
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- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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- B29C66/90—Measuring or controlling the joining process
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- B29C66/91211—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by measuring the temperature, the heat or the thermal flux by measuring the temperature with special temperature measurement means or methods
- B29C66/91212—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by measuring the temperature, the heat or the thermal flux by measuring the temperature with special temperature measurement means or methods involving measurement means being part of the welding jaws, e.g. integrated in the welding jaws
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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- B29C66/91—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux
- B29C66/914—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux
- B29C66/9141—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux by controlling or regulating the temperature
- B29C66/91421—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux by controlling or regulating the temperature of the joining tools
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/90—Measuring or controlling the joining process
- B29C66/91—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux
- B29C66/914—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux
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- B29C66/91441—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux by controlling or regulating the temperature the temperature being non-constant over time
- B29C66/91443—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux by controlling or regulating the temperature the temperature being non-constant over time following a temperature-time profile
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/90—Measuring or controlling the joining process
- B29C66/91—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux
- B29C66/914—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux
- B29C66/9161—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux by controlling or regulating the heat or the thermal flux, i.e. the heat flux
- B29C66/91651—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux by controlling or regulating the heat or the thermal flux, i.e. the heat flux by controlling or regulating the heat generated by Joule heating or induction heating
- B29C66/91653—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux by controlling or regulating the heat or the thermal flux, i.e. the heat flux by controlling or regulating the heat generated by Joule heating or induction heating by controlling or regulating the voltage, i.e. the electric potential difference or electric tension
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/90—Measuring or controlling the joining process
- B29C66/91—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux
- B29C66/914—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux
- B29C66/9161—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux by controlling or regulating the heat or the thermal flux, i.e. the heat flux
- B29C66/91651—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux by controlling or regulating the heat or the thermal flux, i.e. the heat flux by controlling or regulating the heat generated by Joule heating or induction heating
- B29C66/91655—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux by controlling or regulating the heat or the thermal flux, i.e. the heat flux by controlling or regulating the heat generated by Joule heating or induction heating by controlling or regulating the current intensity
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
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- B29C66/90—Measuring or controlling the joining process
- B29C66/91—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux
- B29C66/919—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux characterised by specific temperature, heat or thermal flux values or ranges
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/90—Measuring or controlling the joining process
- B29C66/91—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux
- B29C66/919—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux characterised by specific temperature, heat or thermal flux values or ranges
- B29C66/9192—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux characterised by specific temperature, heat or thermal flux values or ranges in explicit relation to another variable, e.g. temperature diagrams
- B29C66/91921—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux characterised by specific temperature, heat or thermal flux values or ranges in explicit relation to another variable, e.g. temperature diagrams in explicit relation to another temperature, e.g. to the softening temperature or softening point, to the thermal degradation temperature or to the ambient temperature
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/90—Measuring or controlling the joining process
- B29C66/91—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux
- B29C66/919—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux characterised by specific temperature, heat or thermal flux values or ranges
- B29C66/9192—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux characterised by specific temperature, heat or thermal flux values or ranges in explicit relation to another variable, e.g. temperature diagrams
- B29C66/91951—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux characterised by specific temperature, heat or thermal flux values or ranges in explicit relation to another variable, e.g. temperature diagrams in explicit relation to time, e.g. temperature-time diagrams
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/90—Measuring or controlling the joining process
- B29C66/96—Measuring or controlling the joining process characterised by the method for implementing the controlling of the joining process
- B29C66/961—Measuring or controlling the joining process characterised by the method for implementing the controlling of the joining process involving a feedback loop mechanism, e.g. comparison with a desired value
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
- B29C65/4865—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding containing additives
- B29C65/487—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding containing additives characterised by their shape, e.g. being fibres or being spherical
- B29C65/4875—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding containing additives characterised by their shape, e.g. being fibres or being spherical being spherical, e.g. particles or powders
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
- B29C65/4865—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding containing additives
- B29C65/4885—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding containing additives characterised by their composition being non-plastics
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
- B29C65/4865—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding containing additives
- B29C65/4885—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding containing additives characterised by their composition being non-plastics
- B29C65/489—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding containing additives characterised by their composition being non-plastics being metals
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/90—Measuring or controlling the joining process
- B29C66/92—Measuring or controlling the joining process by measuring or controlling the pressure, the force, the mechanical power or the displacement of the joining tools
- B29C66/929—Measuring or controlling the joining process by measuring or controlling the pressure, the force, the mechanical power or the displacement of the joining tools characterized by specific pressure, force, mechanical power or displacement values or ranges
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/90—Measuring or controlling the joining process
- B29C66/94—Measuring or controlling the joining process by measuring or controlling the time
- B29C66/949—Measuring or controlling the joining process by measuring or controlling the time characterised by specific time values or ranges
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/90—Measuring or controlling the joining process
- B29C66/95—Measuring or controlling the joining process by measuring or controlling specific variables not covered by groups B29C66/91 - B29C66/94
- B29C66/959—Measuring or controlling the joining process by measuring or controlling specific variables not covered by groups B29C66/91 - B29C66/94 characterised by specific values or ranges of said specific variables
- B29C66/9592—Measuring or controlling the joining process by measuring or controlling specific variables not covered by groups B29C66/91 - B29C66/94 characterised by specific values or ranges of said specific variables in explicit relation to another variable, e.g. X-Y diagrams
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10681—Tape Carrier Package [TCP]; Flexible sheet connector
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49126—Assembling bases
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- Engineering & Computer Science (AREA)
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- Physics & Mathematics (AREA)
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- Microelectronics & Electronic Packaging (AREA)
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- Fluid Mechanics (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Combinations Of Printed Boards (AREA)
- Liquid Crystal (AREA)
- Wire Bonding (AREA)
Description
經濟部中央標率局貝工消費合作社印聚 83 3 i A7 ___ B7 五、發明説明(1 ) 〔發明所屬之技術領域〕 本發明,係關於使用熱硬化型的各向異性導電粘著劑 將印刷電路基板等之電子零件互相電性且機械性地連接的 熱壓著方法及熱壓著裝置。 〔習知技藝〕 近年來,做爲電子零件,將分別有導體圖型的2張電 路基板互相連接時,已利用使用各向異性導電粘著劑連接 之熱壓著方法。亦即,根據熱壓著方法時|要把具有多數 的平行之導體圖型的電路基板,和具有和該電路基板之配 線圖型相同節路的多數之平行的配線圖型之其他電路基板 ,電性且機械性地連接時•把此等電路基板配置成配線圖 型互相面對,使熱硬化型的各向異性導電粘著性介在於此 等配線圖型之間。以此狀態,根據從一方的電路基板上根 據加熱,加壓頭加上熱及壓力,只在各向異性導電粘著劑 的厚度方向產生導電性*據此將電路基板互相機械性及電 性地正式壓著。 在此,熱硬化型的各向異性導電粘著劑,係使金屬微 粉末(鎳、碳)分散在熱硬化樹脂中者,根據加熱加壓使 樹脂軟化後硬化,而將電路基板互相機械性地連接,同時 分散在樹脂中之金屬微粉末會形成導電性的結構•而把配 線圓型互相電性地連接。 在熱壓著方法的施加熱和壓力之方法,做爲代表性者 ,已知有固定加熱方式和脈波加熱方式* 本紙張尺度適用中國國家搮準(CNS ) A4说格(210X297公釐) ^^^1 In n^it m ί - ^^^1 —^1 —^ϋ In ¾. 、言 (請先閲讀背面之注意事項再填寫本頁) 一 4 - 44B3 3 \ 經濟部中央樣率局貝工消费合作社印製 A7 ___B7五、發明説明(2 ) 根據固定加熱方式時,在熱壓著工程之間,根據一面 將加熱,加壓頭的溫度保持一定,只有所定時間在電路基 板施加壓力,而使各向異性導電粘著劑之溫度變化。 此時,雖然在固定加熱方式•能夠以比較低廉的裝置 實現熱壓著1但是因溫度控制之自由度低,不能對不同的 每品種進行溫度波形之最適當化。 相對地,在脈波加熱方式,因溫度控制的自由度高, 故有容易選擇最適切溫度波形之優點》 可是,在上述脈波加熱方式的熱壓著方法,因根據力口 熱,加壓頭之溫度上升陡峭,故各向異性導電粘著劑會急 激地軟化,熔解而擴展。因此,會發生對電路基板的加壓 力之急激降低,變成難以抑制電路基板的熱膨脹,而將產 生電路基板之偏位。同時,根據對電路基板的加壓力之急 激降低,也會產生電路基板的相對偏位。 根據如此之電路基板的偏位,將在導體圖型互相間產 生電性之連接不良,具有會使電性連接的可靠性明顯降低 之問題點。 〔發明之概要〕 本發明,係鑑於上速情況而開發者,其目的,係在提 供不會產生偏位而能確保電子零件互相的安定之電性連接 的熱壓著方法及熱壓著裝置》 爲了達成上速目的,關於本發明之熱壓著方法,係使 熱硬化型各向異性導電粘著劑介在於第1及第2導體之間 本紙張尺度適用中國國家標车(CNS ) A4洗格(210X297公釐) ^n· ^^^1 ^^^1 ^^^1 ^^^1 I ^^^1 ^^^1 ^^^1 ^^^1 an— 1^1 (請先閲讀背面之注意事項再填寫本頁) -5 - 4483 3 1 47 A / B7 五、發明説明(3 ) ,同時根據從此等第1及第2導體上加以熱和壓力使之電 性及機械性地連接的熱壓著方法,其特徵爲,使各向異性 導電粘著劑之溫度根據至其熱硬化終了溫度爲止緩和地上 升》 同時,根據本發明的熱壓著方法時,主要係,在第1 導體和第2導體之間使熱硬化型各向異性導電粘著劑介在 *同時從此等第1及第2導體上施加熱及壓力而使第1及 第2導體上施加熱及壓力使第1及第2導體電性及機械性 連接的熱壓著方法,其特徵爲,將各向異性導電粘著劑之 溫度瞬時地上升至軟化開始溫度後,使之緩和地上升至硬 化終了溫度爲止。 如此地,關於本發明的熱壓著方法,係根據使各向異 性導電粘著劑之加熱溫度緩和上升至硬化完了溫度爲止· 而防止各向異性導電粘著劑急激地熔化崩潰。據此,防止 對第1及第2導體的施加壓力急激地減低,能夠防止第1 及第2導體間之偏位。 經濟部中央標準局員工消费合作社印製 ----------"-----1 訂 (請先閲讀背面之注意事項再填寫本頁) 更且•關於本發明的熱壓著方法,係將第1電子零件 之導體,和第2電子零件的導體,把熱硬化型之各向異性 導電粘著劑挾在中間重疊:根據以施加的電流使之發生焦 耳熱的熱壓著頭•經由上述第1及第2電子零件之一方在 上述各向異性導電粘著劑施加壓力:同時一面施加上述壓 力,對上述熱壓著頭,供給具有第1電平領域,比上述第 1電平高的第2電平領域,及包含上述第1電平領域和第 2電平領域之間的傾斜領域之波形的電流,使上述各向異 本紙張尺度適用中國國家標準(CMS ) A4規格(210X297公釐) —6 - 經濟部中央標準局貝工消费合作社印聚 44B3311 A7 B7 五、發明説明(4 ) 性導電粘著劑至其硬化終了溫度爲止緩和地加熱軟化後硬 化,根據上述各向異性導電粘著劑把第1電子零件的導體 和第2電子零件之導體熱壓著。 同時,關於本發明的熱壓著裝置,具有發生按照施加 之電流發生焦耳熱的熱壓著頭;和在上述導體間挾住熱硬 化型的各向異性導電粘著劑疊合之上述第1及第2電子零 件把上述熱壓著頭按壓,經由上述第1及第2電子零件的 一方在上述各向異性導電粘著劑施加所定壓力之按壓裝置 ,和對上述熱壓著頭,供給具有第1電平領域,等第1電 平領域高的第2電領域,及包含上述第1及第2領域間之 傾斜領域的波形之電流的電流供給裝置。 〔實施例〕 以下,參照圖面詳細說明關於本發明的實施例之熱壓 著方法及熱壓著裝置。 在本實施例,對做爲第1電子零件,構成液晶顯示面 板的行列基板,將做爲第2電子零件,在由聚醯亞胺等所 成之可撓配線板上實裝驅動元件的帶載送封裝(tape car r-ier package,以下簡稱爲TCP)熱壓著,把行列基 板上之多數引出線和TC P的引出線電性且機械性地連接 時之熱壓著方法及熱壓著裝置說明。 首先,說明關於本實施例的熱壓著裝置。如圓1所示 ,熱壓著裝置,且有基台1 0和安裝在基台上之支持框 1 2。在基台1 〇的上面設有X — y台桌14,在該X — 本紙張尺度適用中國國家標準(CNS > A4規格(210X2SI7公釐) ----------私— (請先閲讀背面之注意事項再填寫本頁) 訂 "7 - 448331 A7 _B7_ 五、發明説明(5 ) y台桌上設有將載置後述之做爲被加工物的液晶顯示板之 級1 6。 在級1 6的上方,設有具備後述之加熱器工具1 8的 熱壓著頭裝置2 0。熱壓著頭裝置2 0,係經由做爲加壓 裝置機能的氣缸2 2安裝在可動台2 4,而可動台2 4, 係設在支持框1 2內,在級1 6的上方向水平延伸之水平 框26 »據此,熱壓著頭裝置20,係成爲對級16能夠 升降及水平移動》 同時,在支持框1 2的前部,設有控制x_y台桌 14,氣缸22,加熱器工具18等的動作之操作板28 〇 如圖2A及圖2B所示,熱壓著頭裝置20,具有固 定在氣缸2 2的板狀之基部3 0,在基部支持成能轉動的 直方體狀之支持塊3 2 ·及固定在支持塊的加熱器工具1 8。 經濟部中央標率局貞工消費合作社印製 (請先閲讀背面之注意事項再填寫本頁) 支持3 2,具有在其中央貫通形成的斷面圖形之通孔 3 4,該通孔係在支持塊的表面3 2 a及背面3 2 b開口 。在通孔34,從支持塊32之表面32a側插通有圓筒 狀的支持套简3 6。支持套筒3 6係對通孔3 4形成所定 之徑,以所定的嵌合在通孔3 4嵌合成能夠轉動。 支持套筒3 6的一端係從支持塊3 2之背面3 2 b突 出,而嵌合在基部3 0。同時,在支持套筒3 6的他端將 形成凸緣3 8,和支持塊3 2之表面3 2 a隔著所定間隔 對向》 本紙張尺度逡用中國國家標準(CNS > A4規格(2丨Οχ297公釐) " —8 ~ 經濟部中央標準局員工消f合作社印裝 44833 1 at ______B7 五、發明説明(6 ) 同時,在支持套筒3 6從凸緣3 8側插通有旋轉軸 4 0。該旋轉軸4 0也對支持套筒3 6的內孔以所定之嵌 合而嵌合’成爲對支持套筒自由旋轉。然後,旋轉軸4 0 有從支持套筒36突出之前端部41,在該前端部41將 形成螺紋部而螺入在基部3 0。在旋轉軸4 0的他端側將 形成大徑之頭部4 2 ,隔著平墊圈4 4及彈簧墊圈4 5擋 接在凸緣3 8。 根據經由該頭部4 2將旋轉軸4 0的前端部4 1螺入 基部3 0,把支持套筒3 6旋緊固定在基部。然後,支持 塊3 2,根據支持套筒3 6自由轉動地支持。 同時,在支持套筒3 6的凸緣3 8和支持塊3 2的表 面3 2 a之間,以捲裝在支持套筒3 6的狀態配置有一對 盤彈簧4 6。支持塊3 2,係根據此等盤彈簧4 6向基部 30加勢,而背面32b密接在基部30 *據此,把支持 塊3 2的沿支持套筒3 6之軸方向的擺動抑制。 更且•有做爲鎖固裝置而作用的一對固定螺絲4 8, 從支持塊3 2之表面3 2 a側穿過支持塊螺入至基部3 0 。然後,根據把此等固定螺絲4 8旋緊,而將支持塊3 2 鎖固在所定的轉動位置。在各固定螺絲4 8之頭部和支持 塊表面3 2 a間,介在有未圖示的平墊圈及彈簧墊圈5 1 〇 一方面,做爲墊壓著頭作用的加熱器工具1 8,具有 互相向平行離開所定間隔對向之一對腳部50,和將此等 腳部的一端互相連結之前端部5 2,形成略Η字形狀。前 本紙張尺度適用中國國家標準(CNS ) Α4規格(210X297公釐) ^^1 ^^1 ί HI— ^^1 I - I 1 d^i ^^^1 ^^1 1^1 (請先閲讀背面之注f項再填寫本頁) -9 - 448331 A7 B7 五、發明説明(7 ) 端部5 2的底面5 2 a,係形成平坦而向水平延伸。該加 熱器工具1 8係例如以鐵形成,同時前端部5 2係使電阻 會成爲最高地,形成充份地薄。前端部5 2之寬度,係設 定爲約20至30mm。 上述構成的加熱器工具1 8,係根據將其一對腳部 5 0螺止在支持塊3 2之下面固定的柄5 4,在支持塊固 定成能裝卸。柄5 4,係在導電性物質,例如銅的表面實 施鍍金而形成,同時通過電流供給線5 6連接在電流供給 電路5 8及控制部5 9。然後,根據從該電流供給電路 5 8供給電流,經由柄5 4對加熱器工具1 8通電,電阻 高的加熱器工具的前端部5 2 *將會發生按照供給之電流 的焦耳熱》 同時,在加熱器工具1 8,將安裝用以檢出加熱器工 具的溫度之熱電偶6 0,該熱電偶6 0將地檢出信號輸入 至電流供給電路5 8。 鯉濟部中央標準局貝工消費合作杜印聚 ί請先閲讀背面之注項再填寫本頁) 在支持塊3 2的上面,將經由托架固定調整桿5 7, 沿著支持套筒3 6之徑方向伸出。調整桿5 7的長度,係 例如,設定爲80至150mm。然後,根據推壓該調整 桿5 7之前端部,使支持塊3 2在支持套筒3 6的周圍轉 動’加熱器工具1 8會和支持塊一齊轉動,而能夠調整對 被壓著部的加熱器工具前端部5 2之平行度。 一方面,熱壓著裝置,具有做爲對加熱器工具1 8供 給電流而加熱的電流供給裝置之電流供給電路5 8,及控 制電流供給電路的動作之控制部5 9。 本紙張尺度適用中國國家榡率(CNS)A4規格(210X297公釐) ' -10 - 448331 A7 B7 經濟部中央標準局貝工消費合作社印衆 五、發明説明 ( 8 ) 1 | 首 先 > 參 照 圖 3 及 圖 4 說 明 控 制 部 5 9 〇 控 制 部 5 9 1 1 有 加 法 器 6 2 在 該 加 熱 器 , 將 輸 入 所 定 的 設 定 值 1 0 設 1 1 定 值 1 係 例 如 0 5 V 之 電 壓 0 在 加 法 器 6 2 將 從 積 | 分 器 6 4 輸 入 以 所 定 的 比 例 ( 時 常 數 T 可 變 ) 增 加 的 輸 請 先 閱 1 I 出 而 加 在 設 定 值 1 〇 據 此 從 加 法 器 6 2 之 輸 出 將 逐 漸 讀 背 面 1 I 增 加 0 之 注 意 古 1 1 I 從 加 法 器 6 2 的 輸 出 將 根 據 比 較 器 7 0 和 設 定值 事 項 再 1 1 1 2 例 如 1 5 V 之 電 壓 比 較 並 且 輸 入 至 減 法 器 6 2 % % 本 的 一 方 之 輸 入 端 子 〇 然 後 該 輸 出 將 例 如 以 約 3 秒 鐘 達 頁 1 1 到 設 定 值 2 在 此 時 刻 曾 切 換 開 關 6 5 0 據 此 以 後在減 1 1 法 器 6 2 將 輸 入 約 1 7 秒 對 應 於設 定 值 2 之 輸 出 0 在 ΓΒ1 圖 I 4 中 實 線 X 係 表 示 經 由 開 關 6 5 輸 入 減 法 器 6 6 的 一 訂 I 方 之 輸 入 端 子 的 設 定 電 壓 波 形 在 本 實 施 例 將根 據 該 設 1 1 I 定 電 壓 波 形 設 定 加 熱 器 工 具 1 8 之 溫 度 0 1 1 上 述 的 設 定 電 壓 波 形 將 如 圓 4 所 示 成 爲 包 含 對 應 1 1 設 定 值 1 的 第 1 電 平 領域 a > 和 對 應 設 定 值 2 之第 2 電 平 r Ί 領 域 b 和 介 在於此 等 第 1 及 第 2 電 平領域 間 的 傾斜領域 1 1 C 之 波 形 〇 在 此 根 據 將 積 分 器 6 4 的 時 常 數 度 更 爲 T 1 ! I > T 2 T 3 ( T 1 < T 2 < T 3 ) 調 整 輸 入 至 減 法 器 1 I 6 6 之 電 壓 C 能 夠 细 調 整 傾 斜 領 域 C 的 傾 斜 〇 該 調 整 將 1 1 I 按 照 從 掃 描 板 2 8 之 輸 入 操 作 而 進 行 〇 1 一 方 面 在 減 法 器 6 6 的 他 方 之 輸 入 端 子 將 連 接 變 換 1 1 部 6 7 該 變 換部 將 把根 據 固 定 在 加 熱 器 X 具 1 8 的 熱 1 電 偶 6 0 檢 出 之 溫 度變 換 爲 電 壓 而 輸 入 至 減 法 器 6 6 〇 1 1 本紙張尺度逍用中國國家標準(CNS } A4说格(210X297公釐} -11 - 448331 A7 B7 經濟部中央輮率局貝工消費合作社印掣 五、發明説明(9 ) 據此,加熱器工具1 8的溫度波形,將會成爲和設定電壓 波形相似之波形地進行反饋控制。 然後,經反饋控制的電壓將根據放大器6 8放大,而 輸出至電流供給電路5 8。如圖3所示,電流供給電路 5 8 ·具備有閘流體單元的電壓電流變換部7 1 ,和由變 壓器而成之電流供給部7 3,會按照输的電壓,把所希望 之交流電流供給加熱器工具1 8。在圖4中•以虛線表示 的曲線Y,係把實際供給加熱器工具1 8之交流電流模式 性地顯示。 根據從上述構成的控制部5 9及電流供給電路5 8將 電流供給加熱器工具1 8,加熱器工具1 8及各向異性導 電粘著劑之溫度,將如圊5所示地上升。在此,係做爲各 向異性導電粘著劑,使用SONY CHEMICAL株式會社製C P 7 13 1- 如在圖5以曲線d所示,加熱器工具1 8的溫度將瞬 時地上升至2 0 0°C,隨之各向異性導電粘著劑,會如以 曲線e所示,以約0 . 3秒,升溫至比軟化開始溫度T 1 的50 °C高之80 °C程度。加熱器工具1 8的初始溫度, 係比各向異性導電粘著劑之軟化開始溫度T 1高,並且, 比硬化終了溫度T 3低爲理想,雖然也依各向異性導電粘 著劑的種類而異,但是以4 0~ 1 0 0°C程度爲理想》 在本發明中,所謂軟化開始溫度T 1 ,係表示在加熱 器工具1 8的加壓下,顯示實質地各向異性導電粘著劑從 初始之變位更變位之溫度,例如,顯示在5 k g/cm2 本紙張尺度適用中國國家標半(CNS ) A4規格(2丨OX297公釐) ---.--------------訂 (請先閲讀背面之注意事項再填寫本頁) -12 - 經濟部中央標率局—工消费合作社印製 4483 3 t' A7 ____B7 五、發明説明(10 ) 的壓力下之溫度。在本實施形態,各向異性導電粘著劑的 軟化開始溫度,爲5 0°C。 然後,根據前述的設定電壓波形,在經過3秒之間, 加熱器工具1 8的溫度•將從200 °C至270 °C緩和地 上升•以後,約17秒間,將維持270 °C。隨之各向異 性導電粘著劑,至熱硬化終了溫度T 3的1 8 0°C緩和地 升溫後,約1 7秒間,將維持在此溫度。 雖然在本實施形態,係將各向異性導電粘著劑,設定 爲以大約3秒鐘加熱至熱硬化終了溫度,但是該升溫時間 ,能夠根據調整前述的時常數變更設定電壓波形之傾斜領 域C的傾斜,而適當地變更。 例如,在行列基板和TC P間不發生偏位的範圍時, 也能夠使升溫時間做爲比3秒短,或者,比3秒長•可是 ,減少傾斜領域C的傾斜而加長升溫時間,因將招致熱壓 著時間之增大*故盡可能做爲短的升溫時間爲理想,特別 係,做爲1〜5秒之範圍內爲理想》 以下,說明使用上述熱壓著裝置熱壓著的液晶顯示板 ,TCP及驅動電路基板。如圖6至圓8所示•液晶顯示 板9 0,具有隔著所定間隙互相對向配置的行列基板7 2 及對向基板7 4 |和封入此等基板間之未圖示的液晶。在 行列基板7 2上,將形成包含信號線,掃描線等之導體圖 型,而在行列基板的周緣部’有導通在導體圖型之多數的 引導線7 6 (第1導體),互相平行且隔著所定間隔設置 本紙張尺度適用中國國家標準(CNS ) A4規格(2丨0><297公釐) ----------V-----^--訂-------V -1 (請先閱讀背面之注意事項再填寫本頁) 4483 3 A7 B7 五、發明説明(11 ) 一方面,連接在行列基板72的多數之TCP78, 具有分別矩形狀的可撓性印刷電路基板8 0 (以下簡稱爲 F P C ),和實裝在FPC上之驅動用的1C晶片82 9 同時,F P C 8 0,具有設在其一端側的多數之輸出引出 線8 4 (第2導體),和設在他端側的多數之輸入引出線 85。引出線84,係導通在I C晶片82 *同時和行列 基板7 2的引出線7 6以同一間隔平行排列而設置。引導 線85,係導通在I C晶片82,同時和驅動電路基板 8 7的未圖示之引出線以同一間隔平行排而設置。 接著,說明使用熱壓著裝置,將TC P 7 8熱壓著在 液晶顯示板90的行列基板72,並且,在TCP將驅動 電路基板8 7熱壓著之情況。 如圖8所示|首先,在T C P 8 0的一端側設置之多 數的引出線8 4上粘貼細長片狀之各向異性導電粘著劑 8 6。各向異性導電粘著劑8 6,係例如在熱硬化性樹脂 中使鎳、焊錫等導電粒子分散而形成薄片狀》 經濟部中央標準局員工消費合作社印製 (請先Μ讀背面之注意事項再填寫本頁) 接著,如圖6,圖9及圖1 0所示,一面將設在行列 基板7 2的所定之引出線7 6和T C F 7 8的引出線8 4 正確地對位,把各向異性導電粘著劑8 6挾在中間,將 TC P 7 8的一端部重畳在行列基板7 2上,進行暫時壓 著。然後*以此狀態,把液晶顯示板9 0及多數的TCP 7 8載置在熱壓著裝置之級1 6上· 接著,經由操作板2 8使x_ y台桌1 4動作,使級 16移動至液晶顯示板90和TCP78的暫時壓著部會 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) -14 - 經濟部中央標準局貝工消費合作社印架 448331 A7 _____B7 _ 五、發明説明(12 ) 和加熱器工具1 8之前端部5 2整列的位置。其後,驅動 氣缸2 2使熱壓著頭裝置2 0降低,把加熱器工具1 8的 前端部5 2之底面5 2 a從上方推壓在TC P 7 8的連接 部,將TC P向行列基板推壓。然後,根據加熱器工具 18,在TCP78,行列基板72及各向異性導電粘著 劑8 6施加熱及壓力,將此等之間機械性及電性地正式壓 著。 此時的根據加熱器工具18之熱及壓力的施加方法, 係如圖1 1之曲線B所示,首先,根據氣缸2 2將從加熱 器工具1 8施加在T C P 7 8的加壓力急激地上升至所定 之值(10〜20kg),其後,一定時間維持加壓狀態 。據此,在TCP78,各向異性導電粘著劑86,及行 列基板7 2施加充份之壓力。 同時,從電流供給電路5 8向加熱器工具1 8供給電 流,如圖1 1的曲線A所示,把加熱器工具之溫度,和屋 力上升同時,從室溫至對應於設定值1的2 0 0°C急激地 上升,接著,緩和地上升至對應於設定值2之2 7 0 °C後 ,保持一定時間β據此,根據加熱器工具1 8經由TC P 7 8,將各向異性導電粘著劑86加熱,如圖1 1的曲線 c所示,從室溫至比軟化開始溫度Τ 1 ( 5 0度)稍高之 溫度(8 0°C)急激地加熱後,經硬化開始溫度Τ 2緩和 地將溫度上升至熱硬化終了溫度T3 (180 °C)。其後 ,把各向異性導電粘著劑8 6,保持在熱硬化終了溫度 T 3約1 7秒鐘。 本紙張尺度適用中國固家標準(CNS ) A4规格(210X297公釐) ^Ίϋ ^ i (請先閲讀背面之注意事項再填寫本頁) -15 - A7 B7 • 448331 五、發明説明(13 ) 其後,驅動氣缸2 2將熱壓著頭裝置2 0上升》以後 ,也可以不必等加熱器工具1 8的溫度降低至常溫’在降 低至對應設定值1的溫度之時刻,重覆進行熱壓著作業。 根據以上的動作,各向異性導電粘著劑8 6之樹脂會 加熱而一旦軟化壓潰後硬化,將T C P 7 8機械性地固定 在行列基板7 2。同時,分散在各向異性導電粘著劑8 6 的樹脂中之導電粒子會部份地導通,把行列基板7 2的引 出線7 6和TCP 7 8之引出線電性地連接。 一方面,設在TCP78的他端部之引出線85,和 驅動電路基板8 7的未圖示之電極的連接,也會根據和上 述相同之動作進行。但是,此時將代替各向異性導電粘著 劑而使用焊錫。同時•在加熱器工具1 8,將施加例如4 k g程度之壓力· 根據如上述構成的熱壓著方法及熱壓著裝置時,係使 各向異性導電粘著劑8 6的溫度,從室溫至熱硬化終了溫 度T 3緩和地上升,而進行熱壓著。因此,將會防止各向 異性導電粘著劑在熱壓著時急激地軟化擴展》使對T C P 7 8的施加壓力失去。因此,能夠在熱壓著之間,經常對 TCP78,各向異性導電牯著劑,及行列基板72施加 所定的壓力,防止此等間之偏位。結果,能夠防止引出線 7 6,8 4間的電性連接不良,而經常確保安定之連接狀 態。 再者,根據加熱器工具1 8的熱及壓力的施加方法, 也可以如圖1 2所示。亦即,首先將根據加熱器工具1 8 本紙張尺度適用中國國家標率(CNS > A4規格(210X297公釐) ' 16 - -----------^-- (請先閲讀背面之注意事項再填寫本頁) 訂-' 經濟部中央標準局貝工消费合作社印製 4483 3 1 1 A7 ___ B7 五、發明説明(Η ) 的壓力,如曲線B所示,急激地上升至所定之壓力,把 TCP 7 8,各向異性導電粘著劑8 6及行列基板7 2充 份加壓。接著,如曲線A所示,將加熱器工具18,急激 地上升至各向異性導電粘著劑8 6達到軟化開始溫度T 1 後,將溫度緩和地上升至對應設定值2的2 7 0 °C。據此 *如以線C所示,各向異性導電粘著劑8 6,會從室溫瞬 時地加熱至軟化開始溫度T 1後,緩和地加熱至硬化終了 溫度T 3。 如此時,因係將各方異性導電粘著劑8 6的溫度,一 旦,瞬時地上升至軟化開始溫度T 1 ,由此緩和地上升至 硬化終了溫度T 3爲止,故能夠和上述實施一樣,防止各 向異性導電粘著劑的急激軟化及崩潰,防止T C P 7 8和 行列基板之間的偏位。同時,各向異性導電粘著劑8 6之 硬化反應時間,將變成從硬化開始溫度T 2至硬化終了溫 度T 3,能夠縮短熱壓著所需時間。 經濟部中央橾牟局貝工消費合作社印裝 κ. ......-II ^^1 In ft— I— I ^^1 ^^1 ·ϋ_· ^^1 (請先聞讀背面之注$項再填寫本頁) 再者,本發明並不限於上述實施例,而能夠在本發明 的範圍內進行各種變形》例如•關於本發明之熱壓著方法 及熱壓著裝置,並不限於T C P和行列基板的熱壓著•也 能夠適用在其他電子零件互相之熱壓著。 圓面之簡單說明 圖1至圖5 ,係顯示關於本發明的實施例之熱壓著裝 圖1 ·爲顯示上述裝置全體的斜視圖。 本紙張尺度通用中國國家標準(CNS ) A4規格(2丨0x297公釐) -17 - 4483 3 1 A7 ______B7 五、發明説明(15 ) 圖2 A及圖2 B爲上述裝置之熱壓著頭裝置的正面圖 及斷面圖。 圖3,爲顯示上述熱壓著裝置的電流供給電路之方塊 圖。 圓4,爲模式性地顯示設定電壓波形及電流波形之圖 表β 圖5 ,爲顯示在上述熱壓著頭裝置的加熱器工具及各 異性導電粘著劑之溫度變化的圖表。 圖6,爲顯示根據上述熱壓著裝置熱壓著之液晶顯示 板,TCP及驅動電路的斜視圖* 圖7,爲將上述液晶顯示板的一部份放大顯示之斜視 圖。 圖8,係將上述T C P放大而顯示之斜視圖。 圖9,係顯示將上述TC P在液晶顯示板的行列基板 上定位之狀態的平面圖。 圖1 0,係顯示將上述T C P在液晶顯示板的行列基 板上定位之狀態的斷面圖。 鲤濟部中*標準局貝工消費合作社印製 ^1 ^^1 I - - - - - - -- 3^1^1 I— f] - I I ^^1 (請先閲讀背面之注意事項再填寫本頁) 圖1 1 ,係分別顯示熱壓著時之加熱器工具的壓力, 溫度,及各向異性導電粘著劑之溫度變化的圖表。 圖1 2 *係分別顯示關於其他實施例的熱壓著時之, 加熱器工具的壓力,溫度,及各向異性導電粘著劑之溫度 變化的圓表。 本紙張尺度適用中國固家標準(CNS ) A4规格(210X297公嫠) -18 -
Claims (1)
- 448331 A8 BS C8 D8 六、申請專利範圍 經濟部中央標準局員工消費合作社印製 體和第 著劑熱 其 零件之 疊合, 經 導電粘 初始溫 據上述 電子零 2 ,將上 所定值 上升時 化終了 3 體和第 著劑熱 其 零件之 重疊, 經 導電粘 .一種熱壓著方法,主要係,將第1電子零件的導 經由熱硬化型的各向異性導電粘 性地連接之熱壓著方法| 1電子零件的導體,和第2電子 的各向異性導電粘著劑挾在中間 2電子零件之導體 壓著而電性及機械 特徵爲,把上述第 導體,將熱硬化型 由上述第1 著劑施加壓 度至硬化終 各向異性導 件之導體熱 .如申請專 述施加在各 後一定時間 刻開始上述 溫度爲止使 .一種熱壓 及第2 力及熱 了溫度 電粘著 壓著。 利範圍 向異性 維持在 各向異 溫度緩 著方法 2電子零件之導體 壓著而電性及機械 特徵爲,將上述第 導體,把熱硬化型 由上述第1及第2 著劑施加壓力及熱 電子零件之一方在上述各向異性 ,把上述各向異性導電粘著劑從 緩和地加熱軟化後使之硬化,根 劑把第1電子零件的導體和第2 第1項所述的熱壓著方法,其中 導電粘著劑之壓力急激地上升至 上述所定值•同時在上述壓力的 性導電粘著劑之加熱,至上述硬 和地上升。 ,主要係,將第1電子零件的導 經由熱硬化型的各向異性導電粘 性地連接之熱壓著方法, 1電子零件的導體,和第2電子 的各向異性導電粘著劑挾在中間 電子零件之一方在上述各向異性 ,將上述各向異性導電粘著劑瞬 (請先鬩讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準(CNS > A4規格(210X297公董) -19 - 4483 3 1 A8 D8 六、申請專利範圍 時地加熱至其軟化開始溫度後,緩和地加熱至硬化終了溫 度使之軟化後硬化,根據上述各向異性導電粘著劑把第1 電子零件的導體和第2電子零件之導體熱壓著。 (請先閲讀背面之注意事項再填寫本頁) 4. 如申請專利範圍第3項所述的熱壓著方法•其中 ,將上述施加在各向異性導電粘著劑之壓力急激地上升至 所定值後一定時間維持上述所定值,同時在上述壓力的上 升後,把上述各向異性導電粘著劑瞬時加熱至軟化開始溫 度,其後,使之緩和地將溫度上升至熱硬化終了溫度。 5. —種熱壓著方法,主要係,將第1電子零件的導 體和第2電子零件之導體經由熱硬化型的各向異性導電粘 著熱壓著而電性及機械性地連接之熱壓著方法, 其特徵爲,將上述第1電子零件的導體,和第2電子 零件之導體,把熱硬化型的各向異性導電粘著劑挾在中間 疊合, 根據施加的電流使之發生焦耳熱的熱壓著頭,經由上 述第1及第2電子零件之一方在上述各向異性導電粘著劑 施加壓力, 經濟部中央揉準局貝工消費合作社印製 一面施加上述壓力•在上述熱壓著頭,供給根據包含 第1電平領域,比上述第1電平領域高的第2電平領域, 及上述第1電平領域和第2電平領域之間的傾斜領域之設 定電壓波形的電流,將上述各向異性導電粘著劑緩和地加 熱至其硬化終了溫度爲止軟化後使之硬化,根據上述各向 異性導電粘著劑把第1電子零件的導體和第2電子零件之 導體熱壓著》 本紙張尺度適用中國國家樣隼(CNS ) A4規格(210X297公釐) 4483 3 1 A8 B8 C8 * m 六、申請專利範圍 6 .如申請專利範圍第5項所述的熱壓著方法,其中 ,將上述熱壓頭之溫度測定,根據測定溫度和上述設定電 壓波形,調整上述傾斜領域之傾斜。 7 . —種熱壓著方法,主要係|將第1電子零件的導 體和第2電子零件之導體經由熱硬化型的各向異性導電粘 著劑熱壓著,而電性及機械性地連接之熱壓著方法, 其特徵爲,將上述第1電子零件的導體,和第2電子 零件之導體,把熱硬化型的各向異性導電粘著劑挾在中間 重疊, 一面經由上述第1及第2電子零件的一方向上述各向 異性導電粘著劑施加壓力,從第1溫度熱加至第2溫度, 調整從第1溫度加熱至第2溫度時的溫度上升之傾斜 〇 8 . —種構成液晶顯示板的行列基板之周緣部 的多數之第1導設在帶載送封裝的多數之第2導體 熱壓11而電性及機械性地連接之熱壓著方法, 經濟部中央標牟局員工消費合作社印製 其,以在上述第1導體和第2導體之間挾住熱 硬化型的各向異性導電粘著劑的狀態,在上述行列基板上 重疊帶載送封裝, 經由上述帶載送封裝向上述各向異性導電粘著劑施加 壓力及熱,將上述各向異性導電粘著劑緩和地加熱至硬化 終了溫度軟化後使之硬化,根據上述各向異性導電粘著劑 把第1導體和第2導體熱壓著《 9 . 一種熱壓著裝置,主要係,將第1電子零件的導 本紙張尺度適用中圉國家標準(CNS ) A4规格(210X297公釐) (諳先閱讀背面之注意事項再填寫本頁) -21 - d483 3 1 A8 it _ D8 六、申請專利範圍 體和第2電子零件之導體,經由熱硬化型的各向異性導電 粘著劑熱壓著,而電性及機械性地連接之熱壓著裝置, 其特徵爲|具有按照施加的電流發生焦耳熱之熱壓著 頭, 和在上述導體間挾住熱硬化型的各向異性導電粘著劑 重疊之上述第1及第2電子零件上將上述熱壓著頭接壓, 經由上述第1及第2電子零件的一方,向上述各向異性導 電粘著劑施加所定壓力之接壓裝置, 和在前述熱壓著頭,根據第1電平領域,比第1電平 高的第2電平領域,及包含上述第1及第2電平間之傾斜 領域的設定電壓波形供給電流之電流供給裝置。 10. 如申請專利範圍第9項所述的熱壓著裝置,其 中, 經濟部中央標準局員工消費合作社印裝 ^^^1 n^i ^^1 HI ί ^^1 1· i ‘ _ 二· n ^^1 1^1 (請先閲讀背面之注意事項再填寫本1) 上述電流供給裝置*具有;輸入對應上述第1電平的 第1輸入裝置,和將按照時間增加之加算值加算在上述第 1設定值輸出的加算裝置*和把從上述加算裝置之輸出放 大而供給上述熱壓著頭的放大裝置,和輸入對應於上述第 2電平之第2設定值的第2输入裝置,和把從上述加算裝 置之輸出與上述第2設定值比較,在從上述加算裝置的輸 出達到上述第2設定值之時刻,把上述第2設定值輸入至 上述放大裝置之比較裝置。 11. 一種熱壓著裝置,主要係,將第1電子零件的 導體和第2電子零件之導^ 經由熱硬化型的各向異性導 電粘著劑熱壓著,而電性連接之熱壓著裝置, 本紙張尺度適用中國固家標本(CNS ) A4規格(21〇ΧΜ7公羶 -22 - 4483 31 A8 B8 C8 · D8 六、申請專利範圍 其特徵爲,具有;將發生按照所施加的電流之焦耳熱 的熱壓著頭, 和在上述導體間挾住熱硬化型之各向異性導電粘著劑 畳合的上述第1及第2電子零件把上述熱壓著頭按壓,經 由上述第1及第2電子零件之一方向上述各向異性導電粘 著劑施加所定壓力的按壓裝置, 和根據對上述熱壓著頭供給電流把上述熱壓著頭加熱 ,而將上述各向異性導電粘著劑從第1溫度加熱至第2溫 度,同時調整從第1溫度至第2溫度爲止的溫度上升之傾 斜的電流供給裝置。 t^n ^^^1 ^^^1 ^^^1 (^n i i n^i 津'vs (請先閱讀背面之注項再填寫本頁) 經濟部中央標準局負工消费合作社印製 本紙張尺度逡用中國國家標率(CNS ) A4说格(210X297公釐) -23 -
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JP03904297A JP3842362B2 (ja) | 1996-02-28 | 1997-02-24 | 熱圧着方法および熱圧着装置 |
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US (2) | US5810959A (zh) |
JP (1) | JP3842362B2 (zh) |
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MY (1) | MY116860A (zh) |
TW (1) | TW448331B (zh) |
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- 1997-02-24 JP JP03904297A patent/JP3842362B2/ja not_active Expired - Fee Related
- 1997-02-27 US US08/807,081 patent/US5810959A/en not_active Expired - Fee Related
- 1997-02-27 TW TW86102633A patent/TW448331B/zh not_active IP Right Cessation
- 1997-02-28 KR KR1019970006425A patent/KR100270356B1/ko not_active IP Right Cessation
- 1997-02-28 MY MYPI97000809A patent/MY116860A/en unknown
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US7556190B2 (en) | 2003-07-11 | 2009-07-07 | Sony Corporation | Method and device for mounting electric component |
CN104914595A (zh) * | 2014-03-10 | 2015-09-16 | 旭东机械工业股份有限公司 | 基板压制机构 |
CN104914595B (zh) * | 2014-03-10 | 2018-01-09 | 旭东机械工业股份有限公司 | 基板压制机构 |
Also Published As
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KR19980069373A (ko) | 1998-10-26 |
US6336990B1 (en) | 2002-01-08 |
US5810959A (en) | 1998-09-22 |
JP3842362B2 (ja) | 2006-11-08 |
MY116860A (en) | 2004-04-30 |
JPH09292625A (ja) | 1997-11-11 |
KR100270356B1 (ko) | 2000-12-01 |
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