TW362226B - Temporary attachment adhesive tape for multilayer ceramic capacitor and method for producing multilayer ceramic capacitor - Google Patents
Temporary attachment adhesive tape for multilayer ceramic capacitor and method for producing multilayer ceramic capacitorInfo
- Publication number
- TW362226B TW362226B TW086103000A TW86103000A TW362226B TW 362226 B TW362226 B TW 362226B TW 086103000 A TW086103000 A TW 086103000A TW 86103000 A TW86103000 A TW 86103000A TW 362226 B TW362226 B TW 362226B
- Authority
- TW
- Taiwan
- Prior art keywords
- polymer
- multilayer ceramic
- ceramic capacitor
- adhesive tape
- temporary attachment
- Prior art date
Links
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Ceramic Capacitors (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP05974396A JP3485412B2 (ja) | 1996-03-15 | 1996-03-15 | 積層セラミックコンデンサ積層工程用の仮止め粘着テープ及び積層セラミックコンデンサの製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW362226B true TW362226B (en) | 1999-06-21 |
Family
ID=13122024
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW086103000A TW362226B (en) | 1996-03-15 | 1997-03-11 | Temporary attachment adhesive tape for multilayer ceramic capacitor and method for producing multilayer ceramic capacitor |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP3485412B2 (zh) |
KR (1) | KR100334418B1 (zh) |
MY (1) | MY127834A (zh) |
TW (1) | TW362226B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI395242B (zh) * | 2010-12-21 | 2013-05-01 | Samsung Electro Mech | 對同一印刷電路板焊盤圖形之具有多層陶瓷電容在其上之印刷電路板固定結構及其方法,多層陶瓷電容水平粘貼及排列方法之封裝單元 |
Families Citing this family (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4391623B2 (ja) * | 1999-06-10 | 2009-12-24 | ニッタ株式会社 | セラミック電子部品用生シートの仮止め粘着テープ及びセラミック電子部品の製造方法 |
JP3565411B2 (ja) * | 1999-06-10 | 2004-09-15 | ニッタ株式会社 | セラミック電子部品用生シートの仮止め粘着テープ及びセラミック電子部品の製造方法 |
JP2000355684A (ja) * | 1999-06-15 | 2000-12-26 | Nitta Ind Corp | 部品の仮止め粘着テープ |
JP4050485B2 (ja) * | 2001-07-31 | 2008-02-20 | Tdk株式会社 | 積層部品の製造方法および積層部品製造用シート |
JP4321673B2 (ja) * | 2002-06-21 | 2009-08-26 | フジコピアン株式会社 | セラミック電子部品用生シートの仮止め密着シート |
JP2005336681A (ja) * | 2004-05-31 | 2005-12-08 | Nitta Ind Corp | カツラ固定用粘着剤およびカツラ固定用粘着テープ |
JP4729268B2 (ja) * | 2004-05-31 | 2011-07-20 | ニッタ株式会社 | カツラの易着脱テープ |
JP5379455B2 (ja) * | 2008-11-25 | 2013-12-25 | ニッタ株式会社 | 感温性粘着剤 |
WO2010092906A1 (ja) | 2009-02-16 | 2010-08-19 | ニッタ株式会社 | 感温性粘着剤および感温性粘着テープ |
JP5408774B2 (ja) * | 2009-04-24 | 2014-02-05 | ニッタ株式会社 | 感温性粘着剤および感温性粘着テープ |
JP5551959B2 (ja) * | 2010-04-09 | 2014-07-16 | ニッタ株式会社 | 易剥離性粘着シートおよび易剥離性粘着テープ |
JP2012052038A (ja) | 2010-09-01 | 2012-03-15 | Nitto Denko Corp | 電子部品製造工程用仮固定シート |
JP5661537B2 (ja) * | 2011-03-31 | 2015-01-28 | ニッタ株式会社 | 感温性粘着剤 |
JP6005387B2 (ja) * | 2012-04-13 | 2016-10-12 | ニッタ株式会社 | セラミック部品の製造方法 |
CN103788900B (zh) * | 2012-11-02 | 2016-09-28 | 蔡正仁 | 固定电子零件用胶带的胶层与结构 |
JP6734010B2 (ja) * | 2014-03-18 | 2020-08-05 | ニッタ株式会社 | 感温性粘着シートおよび感温性粘着テープ |
JP6289960B2 (ja) | 2014-03-27 | 2018-03-07 | ニッタ株式会社 | 感温性粘着剤 |
JP6898226B2 (ja) | 2015-04-01 | 2021-07-07 | ニッタ株式会社 | 感温性粘着剤組成物 |
KR102453521B1 (ko) | 2015-04-03 | 2022-10-12 | 니타 가부시키가이샤 | 감온성 점착 테이프 및 감온성 점착 시트 |
JP6399565B2 (ja) * | 2016-07-14 | 2018-10-03 | ソマール株式会社 | 粘着剤組成物及び粘着シート |
JP6989277B2 (ja) * | 2017-04-05 | 2022-01-05 | スリーエム イノベイティブ プロパティズ カンパニー | 接着剤、該接着剤を含む物品、及びその使用方法 |
JP6829142B2 (ja) * | 2017-04-21 | 2021-02-10 | ニッタ株式会社 | 感温性粘着剤および被加工物の加工方法 |
CN110312760B (zh) * | 2017-06-23 | 2022-03-01 | 积水化学工业株式会社 | 树脂组合物、无机微粒分散浆料组合物、无机微粒分散片 |
CN108559425B (zh) * | 2018-05-11 | 2020-01-17 | 华南协同创新研究院 | 一种防fdm打印器件翘曲的无溶剂型胶黏剂、打印平台及其制作方法 |
KR20220117274A (ko) | 2020-01-16 | 2022-08-23 | 니타 가부시키가이샤 | 감온성 미립자 |
CN117043297A (zh) | 2021-03-26 | 2023-11-10 | 霓达株式会社 | 温敏性粘合剂及被加工物的加工方法 |
-
1996
- 1996-03-15 JP JP05974396A patent/JP3485412B2/ja not_active Expired - Lifetime
-
1997
- 1997-03-11 TW TW086103000A patent/TW362226B/zh not_active IP Right Cessation
- 1997-03-13 MY MYPI9701054 patent/MY127834A/en unknown
- 1997-03-14 KR KR1019970008768A patent/KR100334418B1/ko active IP Right Grant
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI395242B (zh) * | 2010-12-21 | 2013-05-01 | Samsung Electro Mech | 對同一印刷電路板焊盤圖形之具有多層陶瓷電容在其上之印刷電路板固定結構及其方法,多層陶瓷電容水平粘貼及排列方法之封裝單元 |
Also Published As
Publication number | Publication date |
---|---|
JPH09251923A (ja) | 1997-09-22 |
KR100334418B1 (ko) | 2002-10-25 |
JP3485412B2 (ja) | 2004-01-13 |
MY127834A (en) | 2006-12-29 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |