TW344145B - Semiconductor laser diode and method of manufacture - Google Patents

Semiconductor laser diode and method of manufacture

Info

Publication number
TW344145B
TW344145B TW084106634A TW84106634A TW344145B TW 344145 B TW344145 B TW 344145B TW 084106634 A TW084106634 A TW 084106634A TW 84106634 A TW84106634 A TW 84106634A TW 344145 B TW344145 B TW 344145B
Authority
TW
Taiwan
Prior art keywords
layer
substrate
contact layer
semiconductor
consisted
Prior art date
Application number
TW084106634A
Other languages
English (en)
Inventor
Norio Hayafuji
Yoshihira Kawatsu
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Application granted granted Critical
Publication of TW344145B publication Critical patent/TW344145B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
    • H01S5/18—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities
    • H01S5/183—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]
    • H01S5/18305—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL] with emission through the substrate, i.e. bottom emission
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
    • H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
    • H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005—Processes
    • H01L33/0062—Processes for devices with an active region comprising only III-V compounds
    • H01L33/0066—Processes for devices with an active region comprising only III-V compounds with a substrate not being a III-V compound
    • H01L33/007—Processes for devices with an active region comprising only III-V compounds with a substrate not being a III-V compound comprising nitride compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/0206—Substrates, e.g. growth, shape, material, removal or bonding
    • H01S5/0207—Substrates having a special shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/0206—Substrates, e.g. growth, shape, material, removal or bonding
    • H01S5/0213—Sapphire, quartz or diamond based substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
    • H01S5/18—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities
    • H01S5/183—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]
    • H01S5/18361—Structure of the reflectors, e.g. hybrid mirrors
    • H01S5/18369—Structure of the reflectors, e.g. hybrid mirrors based on dielectric materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/30—Structure or shape of the active region; Materials used for the active region
    • H01S5/32—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures
    • H01S5/323—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser
    • H01S5/32308—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser emitting light at a wavelength less than 900 nm
    • H01S5/32341—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser emitting light at a wavelength less than 900 nm blue laser based on GaN or GaP

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Semiconductor Lasers (AREA)
  • Led Devices (AREA)
TW084106634A 1995-04-28 1995-06-28 Semiconductor laser diode and method of manufacture TW344145B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7105763A JPH08307001A (ja) 1995-04-28 1995-04-28 半導体レ−ザダイオ−ドおよびその製造方法

Publications (1)

Publication Number Publication Date
TW344145B true TW344145B (en) 1998-11-01

Family

ID=14416243

Family Applications (1)

Application Number Title Priority Date Filing Date
TW084106634A TW344145B (en) 1995-04-28 1995-06-28 Semiconductor laser diode and method of manufacture

Country Status (7)

Country Link
US (1) US5701321A (zh)
EP (1) EP0740376B1 (zh)
JP (1) JPH08307001A (zh)
KR (1) KR960039454A (zh)
CN (1) CN1136720A (zh)
DE (1) DE69601477D1 (zh)
TW (1) TW344145B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
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TWI769899B (zh) * 2021-07-28 2022-07-01 宏捷科技股份有限公司 背面出光之面射型雷射裝置的製作方法與結構

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US5805624A (en) * 1996-07-30 1998-09-08 Hewlett-Packard Company Long-wavelength infra-red vertical cavity surface-emitting laser on a gallium arsenide substrate
JPH10200204A (ja) * 1997-01-06 1998-07-31 Fuji Xerox Co Ltd 面発光型半導体レーザ、その製造方法およびこれを用いた面発光型半導体レーザアレイ
JP4264992B2 (ja) * 1997-05-28 2009-05-20 ソニー株式会社 半導体装置の製造方法
US6233267B1 (en) * 1998-01-21 2001-05-15 Brown University Research Foundation Blue/ultraviolet/green vertical cavity surface emitting laser employing lateral edge overgrowth (LEO) technique
US6086673A (en) * 1998-04-02 2000-07-11 Massachusetts Institute Of Technology Process for producing high-quality III-V nitride substrates
US6160833A (en) * 1998-05-06 2000-12-12 Xerox Corporation Blue vertical cavity surface emitting laser
JP4267122B2 (ja) * 1999-02-19 2009-05-27 アバゴ・テクノロジーズ・イーシービーユー・アイピー（シンガポール）プライベート・リミテッド フォトリソグラフィ方法及びフォトリソグラフィを行うための装置構成
US6696223B2 (en) 1999-02-19 2004-02-24 Agilent Technologies, Inc. Method for performing photolithography
US6803603B1 (en) * 1999-06-23 2004-10-12 Kabushiki Kaisha Toshiba Semiconductor light-emitting element
JP2001144331A (ja) * 1999-09-02 2001-05-25 Toyoda Gosei Co Ltd 発光装置
JP2003532298A (ja) * 2000-04-26 2003-10-28 オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング 発光半導体素子
DE10051465A1 (de) * 2000-10-17 2002-05-02 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung eines Halbleiterbauelements auf GaN-Basis
WO2001084640A1 (de) * 2000-04-26 2001-11-08 Osram Opto Semiconductors Gmbh LUMINESZENZDIODENCHIP AUF DER BASIS VON GaN UND VERFAHREN ZUM HERSTELLEN EINES LUMINESZENZDIODENBAUELEMENTS
FR2809534B1 (fr) * 2000-05-26 2005-01-14 Commissariat Energie Atomique Dispositif semiconducteur a injection electronique verticale et son procede de fabrication
TWI292227B (en) 2000-05-26 2008-01-01 Osram Opto Semiconductors Gmbh Light-emitting-dioed-chip with a light-emitting-epitaxy-layer-series based on gan
US6693935B2 (en) * 2000-06-20 2004-02-17 Sony Corporation Semiconductor laser
DE10040448A1 (de) * 2000-08-18 2002-03-07 Osram Opto Semiconductors Gmbh Halbleiterchip und Verfahren zu dessen Herstellung
KR100374796B1 (ko) * 2001-02-02 2003-03-03 삼성전기주식회사 Ｐ형 전극과 활성층 사이에 효과적인 정공 확산을 위한 스페이서를 구비하는 ＧａＮ 면 발광 레이저 다이오드 및그 제조 방법
JP4724924B2 (ja) * 2001-02-08 2011-07-13 ソニー株式会社 表示装置の製造方法
US6611002B2 (en) * 2001-02-23 2003-08-26 Nitronex Corporation Gallium nitride material devices and methods including backside vias
US7233028B2 (en) 2001-02-23 2007-06-19 Nitronex Corporation Gallium nitride material devices and methods of forming the same
JP3767496B2 (ja) 2002-03-01 2006-04-19 セイコーエプソン株式会社 面発光型発光素子およびその製造方法、光モジュール、光伝達装置
JP4074498B2 (ja) * 2002-09-25 2008-04-09 セイコーエプソン株式会社 面発光型発光素子、光モジュールおよび光伝達装置
US6936486B2 (en) * 2002-11-19 2005-08-30 Jdsu Uniphase Corporation Low voltage multi-junction vertical cavity surface emitting laser
EP1480302B1 (en) * 2003-05-23 2007-07-11 Rohm and Haas Electronic Materials, L.L.C. External cavity semiconductor laser comprising an etalon and method for fabrication thereof
CN100386890C (zh) * 2004-04-05 2008-05-07 清华大学 一种GaN基发光二极管的制作方法
KR100541110B1 (ko) * 2004-06-25 2006-01-11 삼성전기주식회사 다파장 반도체 레이저 제조방법
KR100541111B1 (ko) * 2004-06-25 2006-01-11 삼성전기주식회사 다파장 반도체 레이저 제조방법
US7786491B2 (en) * 2006-02-02 2010-08-31 Panasonic Corporation Semiconductor light-emitting device comprising a plurality of semiconductor layers
JP5225549B2 (ja) * 2006-03-15 2013-07-03 日本碍子株式会社 半導体素子
JP2008171941A (ja) * 2007-01-10 2008-07-24 Ngk Insulators Ltd 発光素子
CN104078837B (zh) * 2013-03-29 2017-12-15 山东华光光电子股份有限公司 一种GaN基蓝绿光激光二极管器件及制作方法
JP6183045B2 (ja) 2013-08-09 2017-08-23 ソニー株式会社 発光素子及びその製造方法
TWI525863B (zh) * 2013-09-10 2016-03-11 The wafer package structure is packaged using a wafer package structure A module, and a method of manufacturing the wafer package structure
US10439360B1 (en) * 2014-12-04 2019-10-08 Ii-Vi Delaware, Inc. VCSEL with emission on substrate side
US9960127B2 (en) 2016-05-18 2018-05-01 Macom Technology Solutions Holdings, Inc. High-power amplifier package
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI769899B (zh) * 2021-07-28 2022-07-01 宏捷科技股份有限公司 背面出光之面射型雷射裝置的製作方法與結構

Also Published As

Publication number Publication date
DE69601477D1 (de) 1999-03-18
CN1136720A (zh) 1996-11-27
US5701321A (en) 1997-12-23
EP0740376B1 (en) 1999-02-03
JPH08307001A (ja) 1996-11-22
KR960039454A (ko) 1996-11-25
EP0740376A1 (en) 1996-10-30

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