WO1997029400A1 - Structure de contact pour cablage multicouche, substrat a matrice active et leur procede de fabrication - Google Patents
Structure de contact pour cablage multicouche, substrat a matrice active et leur procede de fabrication Download PDFInfo
- Publication number
- WO1997029400A1 WO1997029400A1 PCT/JP1997/000338 JP9700338W WO9729400A1 WO 1997029400 A1 WO1997029400 A1 WO 1997029400A1 JP 9700338 W JP9700338 W JP 9700338W WO 9729400 A1 WO9729400 A1 WO 9729400A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- contact structure
- manufacturing
- same
- active matrix
- multilayer wiring
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000011159 matrix material Substances 0.000 title 1
- 239000000758 substrate Substances 0.000 title 1
- 150000001875 compounds Chemical class 0.000 abstract 3
- 230000004888 barrier function Effects 0.000 abstract 2
- 239000000463 material Substances 0.000 abstract 2
- 239000000956 alloy Substances 0.000 abstract 1
- 229910045601 alloy Inorganic materials 0.000 abstract 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract 1
- 229910052782 aluminium Inorganic materials 0.000 abstract 1
- 230000015572 biosynthetic process Effects 0.000 abstract 1
- 229910052710 silicon Inorganic materials 0.000 abstract 1
- 239000010703 silicon Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/45—Ohmic electrodes
- H01L29/456—Ohmic electrodes on silicon
- H01L29/458—Ohmic electrodes on silicon for thin film silicon, e.g. source or drain electrode
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/136286—Wiring, e.g. gate line, drain line
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Nonlinear Science (AREA)
- General Physics & Mathematics (AREA)
- Mathematical Physics (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Ceramic Engineering (AREA)
- Optics & Photonics (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Thin Film Transistor (AREA)
- Liquid Crystal (AREA)
Abstract
Structure de contact pour une interconnexion multicouche entre un premier câblage comprenant de l'aluminium ou un alliage d'aluminium et un second câblage, comprenant un film conducteur transparent, caractérisé en ce qu'une couche d'arrêt est formée entre le premier et le second câblage, ladite couche contenant des matériaux présentant un niveau d'énergie libre de formation d'oxyde supérieur à celui du silicium; ou un composé de ces derniers; ou encore un composé contenant principalement ces matériaux ou leur composé.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP52351697A JP3646311B2 (ja) | 1996-02-09 | 1997-02-07 | 多層配線のコンタクト構造、アクティブマトリクス基板及びその製造方法 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8/24517 | 1996-02-09 | ||
JP2451796 | 1996-02-09 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO1997029400A1 true WO1997029400A1 (fr) | 1997-08-14 |
Family
ID=12140374
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP1997/000338 WO1997029400A1 (fr) | 1996-02-09 | 1997-02-07 | Structure de contact pour cablage multicouche, substrat a matrice active et leur procede de fabrication |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP3646311B2 (fr) |
WO (1) | WO1997029400A1 (fr) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001230321A (ja) * | 1999-12-31 | 2001-08-24 | Samsung Electronics Co Ltd | 配線の接触構造及びその形成方法並びにこれを含む薄膜トランジスタ基板及びその製造方法 |
JP2001281694A (ja) * | 2000-03-29 | 2001-10-10 | Semiconductor Energy Lab Co Ltd | 半導体装置およびその作製方法 |
JP2008306043A (ja) * | 2007-06-08 | 2008-12-18 | Ulvac Japan Ltd | 配線膜の形成方法、トランジスタ、及び電子装置 |
JP2015061952A (ja) * | 2010-06-30 | 2015-04-02 | エイチ.シー.スターク インク. | モリブデンを含有したターゲット |
US9334565B2 (en) | 2012-05-09 | 2016-05-10 | H.C. Starck Inc. | Multi-block sputtering target with interface portions and associated methods and articles |
US9837253B2 (en) | 2010-06-30 | 2017-12-05 | H.C. Starck Inc. | Molybdenum containing targets for touch screen device |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02132833A (ja) * | 1988-11-11 | 1990-05-22 | Matsushita Electric Ind Co Ltd | 薄膜配線 |
JPH04256324A (ja) * | 1991-02-08 | 1992-09-11 | Toshiba Corp | 薄膜半導体素子の製造方法 |
JPH05235360A (ja) * | 1992-02-21 | 1993-09-10 | Seiko Epson Corp | 液晶表示装置 |
-
1997
- 1997-02-07 WO PCT/JP1997/000338 patent/WO1997029400A1/fr unknown
- 1997-02-07 JP JP52351697A patent/JP3646311B2/ja not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02132833A (ja) * | 1988-11-11 | 1990-05-22 | Matsushita Electric Ind Co Ltd | 薄膜配線 |
JPH04256324A (ja) * | 1991-02-08 | 1992-09-11 | Toshiba Corp | 薄膜半導体素子の製造方法 |
JPH05235360A (ja) * | 1992-02-21 | 1993-09-10 | Seiko Epson Corp | 液晶表示装置 |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001230321A (ja) * | 1999-12-31 | 2001-08-24 | Samsung Electronics Co Ltd | 配線の接触構造及びその形成方法並びにこれを含む薄膜トランジスタ基板及びその製造方法 |
JP2001281694A (ja) * | 2000-03-29 | 2001-10-10 | Semiconductor Energy Lab Co Ltd | 半導体装置およびその作製方法 |
JP4522529B2 (ja) * | 2000-03-29 | 2010-08-11 | 株式会社半導体エネルギー研究所 | 半導体装置およびその作製方法 |
JP2008306043A (ja) * | 2007-06-08 | 2008-12-18 | Ulvac Japan Ltd | 配線膜の形成方法、トランジスタ、及び電子装置 |
JP2015061952A (ja) * | 2010-06-30 | 2015-04-02 | エイチ.シー.スターク インク. | モリブデンを含有したターゲット |
JP2016194159A (ja) * | 2010-06-30 | 2016-11-17 | エイチ.シー.スターク インク. | モリブデンを含有したターゲット |
US9837253B2 (en) | 2010-06-30 | 2017-12-05 | H.C. Starck Inc. | Molybdenum containing targets for touch screen device |
US9945023B2 (en) | 2010-06-30 | 2018-04-17 | H.C. Starck, Inc. | Touch screen device comprising Mo-based film layer and methods thereof |
US9334565B2 (en) | 2012-05-09 | 2016-05-10 | H.C. Starck Inc. | Multi-block sputtering target with interface portions and associated methods and articles |
US10643827B2 (en) | 2012-05-09 | 2020-05-05 | H.C. Starck Inc. | Multi-block sputtering target with interface portions and associated methods and articles |
Also Published As
Publication number | Publication date |
---|---|
JP3646311B2 (ja) | 2005-05-11 |
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