TW333709B - DRAM cell arrangement and method for its production - Google Patents
DRAM cell arrangement and method for its productionInfo
- Publication number
- TW333709B TW333709B TW086106647A TW86106647A TW333709B TW 333709 B TW333709 B TW 333709B TW 086106647 A TW086106647 A TW 086106647A TW 86106647 A TW86106647 A TW 86106647A TW 333709 B TW333709 B TW 333709B
- Authority
- TW
- Taiwan
- Prior art keywords
- trenches
- storage capacitors
- neighbored
- flank
- polar
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
- H10B12/30—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells
- H10B12/39—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells the capacitor and the transistor being in a same trench
- H10B12/395—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells the capacitor and the transistor being in a same trench the transistor being vertical
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
- H10B12/01—Manufacture or treatment
- H10B12/02—Manufacture or treatment for one transistor one-capacitor [1T-1C] memory cells
- H10B12/03—Making the capacitor or connections thereto
- H10B12/038—Making the capacitor or connections thereto the capacitor being in a trench in the substrate
- H10B12/0383—Making the capacitor or connections thereto the capacitor being in a trench in the substrate wherein the transistor is vertical
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19620625A DE19620625C1 (de) | 1996-05-22 | 1996-05-22 | DRAM-Zellenanordnung und Verfahren zu deren Herstellung |
Publications (1)
Publication Number | Publication Date |
---|---|
TW333709B true TW333709B (en) | 1998-06-11 |
Family
ID=7795030
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW086106647A TW333709B (en) | 1996-05-22 | 1997-05-19 | DRAM cell arrangement and method for its production |
Country Status (3)
Country | Link |
---|---|
DE (1) | DE19620625C1 (de) |
TW (1) | TW333709B (de) |
WO (1) | WO1997044826A1 (de) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6383864B2 (en) * | 1997-09-30 | 2002-05-07 | Siemens Aktiengesellschaft | Memory cell for dynamic random access memory (DRAM) |
CN1213182A (zh) * | 1997-09-30 | 1999-04-07 | 西门子公司 | 用于动态随机存取存储器的存储单元 |
DE19800340A1 (de) * | 1998-01-07 | 1999-07-15 | Siemens Ag | Halbleiterspeicheranordnung und Verfahren zu deren Herstellung |
US6093614A (en) * | 1998-03-04 | 2000-07-25 | Siemens Aktiengesellschaft | Memory cell structure and fabrication |
DE19811882A1 (de) * | 1998-03-18 | 1999-09-23 | Siemens Ag | DRAM-Zellenanordnung und Verfahren zu deren Herstellung |
WO2002073657A2 (de) * | 2001-03-09 | 2002-09-19 | Infineon Technologies Ag | Halbleiterspeicherzelle mit grabenkondensator und verfahren zu ihrer herstellung |
JP2003101025A (ja) * | 2001-09-26 | 2003-04-04 | Toshiba Corp | 半導体装置 |
EP1302982A1 (de) * | 2001-10-12 | 2003-04-16 | Infineon Technologies AG | Verfahren zum Ausbilden einer vertikalen Feldeffekttransistoreinrichtung |
US7473596B2 (en) | 2003-12-19 | 2009-01-06 | Micron Technology, Inc. | Methods of forming memory cells |
US7122425B2 (en) | 2004-08-24 | 2006-10-17 | Micron Technology, Inc. | Methods of forming semiconductor constructions |
US7547945B2 (en) | 2004-09-01 | 2009-06-16 | Micron Technology, Inc. | Transistor devices, transistor structures and semiconductor constructions |
US7282401B2 (en) | 2005-07-08 | 2007-10-16 | Micron Technology, Inc. | Method and apparatus for a self-aligned recessed access device (RAD) transistor gate |
US7867851B2 (en) | 2005-08-30 | 2011-01-11 | Micron Technology, Inc. | Methods of forming field effect transistors on substrates |
US7602001B2 (en) | 2006-07-17 | 2009-10-13 | Micron Technology, Inc. | Capacitorless one transistor DRAM cell, integrated circuitry comprising an array of capacitorless one transistor DRAM cells, and method of forming lines of capacitorless one transistor DRAM cells |
US7772632B2 (en) | 2006-08-21 | 2010-08-10 | Micron Technology, Inc. | Memory arrays and methods of fabricating memory arrays |
US7923373B2 (en) | 2007-06-04 | 2011-04-12 | Micron Technology, Inc. | Pitch multiplication using self-assembling materials |
CN113078116B (zh) * | 2021-03-29 | 2024-01-23 | 长鑫存储技术有限公司 | 半导体结构的制备方法及半导体结构 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4737829A (en) * | 1985-03-28 | 1988-04-12 | Nec Corporation | Dynamic random access memory device having a plurality of one-transistor type memory cells |
JPS62298156A (ja) * | 1986-06-18 | 1987-12-25 | Matsushita Electric Ind Co Ltd | 半導体記憶装置 |
US4959698A (en) * | 1986-10-08 | 1990-09-25 | Mitsubishi Denki Kabushiki Kaisha | Memory cell of a semiconductor memory device |
US4763180A (en) * | 1986-12-22 | 1988-08-09 | International Business Machines Corporation | Method and structure for a high density VMOS dynamic ram array |
JPS63170955A (ja) * | 1987-01-09 | 1988-07-14 | Sony Corp | 半導体記憶装置 |
JPS63245954A (ja) * | 1987-04-01 | 1988-10-13 | Hitachi Ltd | 半導体メモリ |
JPH0815208B2 (ja) * | 1987-07-01 | 1996-02-14 | 三菱電機株式会社 | 半導体記憶装置 |
DE3741186A1 (de) * | 1987-12-04 | 1989-06-15 | Siemens Ag | Dreidimensionale ein-transistorzelle und anordnung von ein-transistorzellen fuer dynamische halbleiterspeicher und verfahren zu ihrer herstellung |
KR910000246B1 (ko) * | 1988-02-15 | 1991-01-23 | 삼성전자 주식회사 | 반도체 메모리장치 |
JPH07109875B2 (ja) * | 1988-08-31 | 1995-11-22 | 株式会社東芝 | ダイナミック型メモリ |
US4894697A (en) * | 1988-10-31 | 1990-01-16 | International Business Machines Corporation | Ultra dense dram cell and its method of fabrication |
JPH0379073A (ja) * | 1989-08-22 | 1991-04-04 | Toshiba Corp | 半導体記憶装置 |
TW313677B (de) * | 1991-08-14 | 1997-08-21 | Gold Star Electronics |
-
1996
- 1996-05-22 DE DE19620625A patent/DE19620625C1/de not_active Expired - Fee Related
-
1997
- 1997-04-23 WO PCT/DE1997/000812 patent/WO1997044826A1/de active Application Filing
- 1997-05-19 TW TW086106647A patent/TW333709B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
WO1997044826A1 (de) | 1997-11-27 |
DE19620625C1 (de) | 1997-10-23 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |