TW202328290A - 聚醯亞胺樹脂、感光性樹脂組成物、硬化物、有機el顯示器、電子零件、及半導體裝置 - Google Patents

聚醯亞胺樹脂、感光性樹脂組成物、硬化物、有機el顯示器、電子零件、及半導體裝置 Download PDF

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Publication number
TW202328290A
TW202328290A TW111133315A TW111133315A TW202328290A TW 202328290 A TW202328290 A TW 202328290A TW 111133315 A TW111133315 A TW 111133315A TW 111133315 A TW111133315 A TW 111133315A TW 202328290 A TW202328290 A TW 202328290A
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TW
Taiwan
Prior art keywords
formula
polyimide resin
residues
diamine
represented
Prior art date
Application number
TW111133315A
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English (en)
Chinese (zh)
Inventor
佐伯昭典
石川曉宏
Original Assignee
日商東麗股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商東麗股份有限公司 filed Critical 日商東麗股份有限公司
Publication of TW202328290A publication Critical patent/TW202328290A/zh

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/14—Polyamide-imides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/037—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polyamides or polyimides
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/12—Light sources with substantially two-dimensional radiating surfaces
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/12—Light sources with substantially two-dimensional radiating surfaces
    • H05B33/22—Light sources with substantially two-dimensional radiating surfaces characterised by the chemical or physical composition or the arrangement of auxiliary dielectric or reflective layers

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Electroluminescent Light Sources (AREA)
TW111133315A 2021-09-15 2022-09-02 聚醯亞胺樹脂、感光性樹脂組成物、硬化物、有機el顯示器、電子零件、及半導體裝置 TW202328290A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021149993 2021-09-15
JP2021-149993 2021-09-15

Publications (1)

Publication Number Publication Date
TW202328290A true TW202328290A (zh) 2023-07-16

Family

ID=85602131

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111133315A TW202328290A (zh) 2021-09-15 2022-09-02 聚醯亞胺樹脂、感光性樹脂組成物、硬化物、有機el顯示器、電子零件、及半導體裝置

Country Status (4)

Country Link
KR (1) KR20240054961A (ja)
CN (1) CN117836352A (ja)
TW (1) TW202328290A (ja)
WO (1) WO2023042608A1 (ja)

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008081718A (ja) 2006-09-01 2008-04-10 Kaneka Corp ポリイミド樹脂粒子の製造方法
KR101167483B1 (ko) * 2006-12-15 2012-07-27 코오롱인더스트리 주식회사 무색투명한 폴리이미드 수지와 이를 이용한 액정 배향막 및필름
JP2008297231A (ja) * 2007-05-30 2008-12-11 Nippon Kayaku Co Ltd ヒドロキシアミド基含有脂環式ポリイミド及びその前駆体、並びにそれらを用いたポジ型感光性樹脂組成物、並びにそれらの硬化物
CN104054200B (zh) * 2012-01-31 2017-02-22 独立行政法人产业技术综合研究所 锂离子电池正极用树脂组合物
KR101827071B1 (ko) * 2013-04-04 2018-03-22 미쓰이 가가쿠 가부시키가이샤 폴리아마이드산 및 이것을 포함하는 바니쉬, 및 폴리이미드 필름
CN106795283B (zh) * 2014-09-02 2020-07-10 东丽株式会社 树脂及感光性树脂组合物
CN108779251B (zh) * 2016-04-25 2021-05-18 东丽株式会社 树脂组合物
KR102430152B1 (ko) * 2017-12-08 2022-08-08 주식회사 두산 폴리아믹산 용액, 이를 이용한 투명 폴리이미드 수지 필름 및 투명 기판
KR20200135312A (ko) 2018-03-23 2020-12-02 도레이 카부시키가이샤 경화막의 제조 방법 및 유기 el 디스플레이의 제조 방법

Also Published As

Publication number Publication date
WO2023042608A1 (ja) 2023-03-23
CN117836352A (zh) 2024-04-05
KR20240054961A (ko) 2024-04-26

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