TW202236009A - 積層體之製造方法、電路配線基板之製造方法、轉印薄膜 - Google Patents

積層體之製造方法、電路配線基板之製造方法、轉印薄膜 Download PDF

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Publication number
TW202236009A
TW202236009A TW110140279A TW110140279A TW202236009A TW 202236009 A TW202236009 A TW 202236009A TW 110140279 A TW110140279 A TW 110140279A TW 110140279 A TW110140279 A TW 110140279A TW 202236009 A TW202236009 A TW 202236009A
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TW
Taiwan
Prior art keywords
mass
intermediate layer
meth
preferable
photosensitive layer
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TW110140279A
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English (en)
Chinese (zh)
Inventor
鬼塚悠
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日商富士軟片股份有限公司
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Publication of TW202236009A publication Critical patent/TW202236009A/zh

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/38—Treatment before imagewise removal, e.g. prebaking
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/40—Treatment after imagewise removal, e.g. baking
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Materials For Photolithography (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
TW110140279A 2020-10-30 2021-10-29 積層體之製造方法、電路配線基板之製造方法、轉印薄膜 TW202236009A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020183145 2020-10-30
JP2020-183145 2020-10-30

Publications (1)

Publication Number Publication Date
TW202236009A true TW202236009A (zh) 2022-09-16

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TW110140279A TW202236009A (zh) 2020-10-30 2021-10-29 積層體之製造方法、電路配線基板之製造方法、轉印薄膜

Country Status (4)

Country Link
JP (2) JP7761581B2 (https=)
CN (1) CN116472494A (https=)
TW (1) TW202236009A (https=)
WO (1) WO2022092160A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024004430A1 (ja) * 2022-06-30 2024-01-04 富士フイルム株式会社 転写フィルム、パターンの形成方法、及び回路配線の製造方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003107719A (ja) 2001-09-28 2003-04-09 Fuji Photo Film Co Ltd 感光性転写材料、フォトマスク材料、並びにフォトマスク及びその製造方法
JP2004272182A (ja) * 2002-04-24 2004-09-30 Mitsubishi Chemicals Corp 画像形成方法
CN1950750B (zh) * 2004-05-12 2012-10-24 旭化成电子材料株式会社 图案形成材料、图案形成设备和图案形成方法
JP2010060841A (ja) * 2008-09-03 2010-03-18 Fujifilm Corp 感光性転写材料、樹脂パターンの形成方法、樹脂パターン付き基板、表示装置及び液晶表示装置
JP2014006364A (ja) * 2012-06-22 2014-01-16 Toppan Printing Co Ltd 露光装置及び露光方法
JP6126570B2 (ja) * 2013-12-13 2017-05-10 富士フイルム株式会社 パターン形成方法、電子デバイスの製造方法
JP6284891B2 (ja) * 2015-02-26 2018-02-28 富士フイルム株式会社 タッチパネル電極保護膜形成用組成物、転写フィルム、透明積層体、タッチパネル用電極の保護膜及びその形成方法、静電容量型入力装置、並びに、画像表示装置
JP2018165765A (ja) * 2017-03-28 2018-10-25 日立化成株式会社 感光性エレメント、感光層の硬化物、半導体装置、及びレジストパターンの形成方法
JP6683890B2 (ja) * 2017-03-30 2020-04-22 富士フイルム株式会社 感光性転写材料、及び、回路配線の製造方法
CN111201488A (zh) * 2017-10-13 2020-05-26 富士胶片株式会社 电路布线的制造方法、触控面板的制造方法及带图案基材的制造方法
JP7074776B2 (ja) * 2018-01-24 2022-05-24 富士フイルム株式会社 感光性転写材料及びその製造方法、樹脂パターンの製造方法、並びに、回路配線の製造方法
JP7144509B2 (ja) * 2018-03-29 2022-09-29 富士フイルム株式会社 感光性転写材料、電極保護膜、積層体、静電容量型入力装置、及び、タッチパネルの製造方法
CN112740107A (zh) * 2018-09-28 2021-04-30 富士胶片株式会社 带图案的基材的制造方法、电路基板的制造方法及触摸面板的制造方法

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JPWO2022092160A1 (https=) 2022-05-05
JP2025188224A (ja) 2025-12-25
CN116472494A (zh) 2023-07-21
WO2022092160A1 (ja) 2022-05-05
JP7761581B2 (ja) 2025-10-28

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