CN116472494A - 层叠体的制造方法、电路配线基板的制造方法、转印膜 - Google Patents

层叠体的制造方法、电路配线基板的制造方法、转印膜 Download PDF

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Publication number
CN116472494A
CN116472494A CN202180066830.2A CN202180066830A CN116472494A CN 116472494 A CN116472494 A CN 116472494A CN 202180066830 A CN202180066830 A CN 202180066830A CN 116472494 A CN116472494 A CN 116472494A
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intermediate layer
mass
compound
meth
photosensitive layer
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CN202180066830.2A
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English (en)
Chinese (zh)
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鬼塚悠
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Fujifilm Corp
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Fujifilm Corp
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Publication of CN116472494A publication Critical patent/CN116472494A/zh
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/38—Treatment before imagewise removal, e.g. prebaking
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/40—Treatment after imagewise removal, e.g. baking
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Materials For Photolithography (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
CN202180066830.2A 2020-10-30 2021-10-27 层叠体的制造方法、电路配线基板的制造方法、转印膜 Pending CN116472494A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020183145 2020-10-30
JP2020-183145 2020-10-30
PCT/JP2021/039686 WO2022092160A1 (ja) 2020-10-30 2021-10-27 積層体の製造方法、回路配線基板の製造方法、転写フィルム

Publications (1)

Publication Number Publication Date
CN116472494A true CN116472494A (zh) 2023-07-21

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CN202180066830.2A Pending CN116472494A (zh) 2020-10-30 2021-10-27 层叠体的制造方法、电路配线基板的制造方法、转印膜

Country Status (4)

Country Link
JP (2) JP7761581B2 (https=)
CN (1) CN116472494A (https=)
TW (1) TW202236009A (https=)
WO (1) WO2022092160A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024004430A1 (ja) * 2022-06-30 2024-01-04 富士フイルム株式会社 転写フィルム、パターンの形成方法、及び回路配線の製造方法

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JP2003107719A (ja) * 2001-09-28 2003-04-09 Fuji Photo Film Co Ltd 感光性転写材料、フォトマスク材料、並びにフォトマスク及びその製造方法
JP2004272182A (ja) * 2002-04-24 2004-09-30 Mitsubishi Chemicals Corp 画像形成方法
CN1950750A (zh) * 2004-05-12 2007-04-18 富士胶片株式会社 图案形成材料、图案形成设备和图案形成方法
JP2010060841A (ja) * 2008-09-03 2010-03-18 Fujifilm Corp 感光性転写材料、樹脂パターンの形成方法、樹脂パターン付き基板、表示装置及び液晶表示装置
CN103513517A (zh) * 2012-06-22 2014-01-15 株式会社有泽制作所 曝光装置及曝光方法
WO2015087689A1 (ja) * 2013-12-13 2015-06-18 富士フイルム株式会社 パターン形成方法、電子デバイスの製造方法
CN107109131A (zh) * 2015-02-26 2017-08-29 富士胶片株式会社 触摸面板电极保护膜形成用组合物、转印薄膜、透明层叠体、触摸面板用电极的保护膜及其形成方法、静电电容型输入装置及图像显示装置
CN110312965A (zh) * 2017-03-30 2019-10-08 富士胶片株式会社 感光性转印材料以及电路配线的制造方法
WO2020066351A1 (ja) * 2018-09-28 2020-04-02 富士フイルム株式会社 パターン付き基材の製造方法、回路基板の製造方法及びタッチパネルの製造方法
CN111201488A (zh) * 2017-10-13 2020-05-26 富士胶片株式会社 电路布线的制造方法、触控面板的制造方法及带图案基材的制造方法
CN111417900A (zh) * 2018-01-24 2020-07-14 富士胶片株式会社 感光性转印材料及其制造方法、树脂图案的制造方法以及电路布线的制造方法
CN111742260A (zh) * 2018-03-29 2020-10-02 富士胶片株式会社 感光性转印材料、电极保护膜、层叠体、静电电容型输入装置及触摸面板的制造方法

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018165765A (ja) * 2017-03-28 2018-10-25 日立化成株式会社 感光性エレメント、感光層の硬化物、半導体装置、及びレジストパターンの形成方法

Patent Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003107719A (ja) * 2001-09-28 2003-04-09 Fuji Photo Film Co Ltd 感光性転写材料、フォトマスク材料、並びにフォトマスク及びその製造方法
JP2004272182A (ja) * 2002-04-24 2004-09-30 Mitsubishi Chemicals Corp 画像形成方法
CN1950750A (zh) * 2004-05-12 2007-04-18 富士胶片株式会社 图案形成材料、图案形成设备和图案形成方法
JP2010060841A (ja) * 2008-09-03 2010-03-18 Fujifilm Corp 感光性転写材料、樹脂パターンの形成方法、樹脂パターン付き基板、表示装置及び液晶表示装置
CN103513517A (zh) * 2012-06-22 2014-01-15 株式会社有泽制作所 曝光装置及曝光方法
WO2015087689A1 (ja) * 2013-12-13 2015-06-18 富士フイルム株式会社 パターン形成方法、電子デバイスの製造方法
CN107109131A (zh) * 2015-02-26 2017-08-29 富士胶片株式会社 触摸面板电极保护膜形成用组合物、转印薄膜、透明层叠体、触摸面板用电极的保护膜及其形成方法、静电电容型输入装置及图像显示装置
CN110312965A (zh) * 2017-03-30 2019-10-08 富士胶片株式会社 感光性转印材料以及电路配线的制造方法
CN111201488A (zh) * 2017-10-13 2020-05-26 富士胶片株式会社 电路布线的制造方法、触控面板的制造方法及带图案基材的制造方法
CN111417900A (zh) * 2018-01-24 2020-07-14 富士胶片株式会社 感光性转印材料及其制造方法、树脂图案的制造方法以及电路布线的制造方法
CN111742260A (zh) * 2018-03-29 2020-10-02 富士胶片株式会社 感光性转印材料、电极保护膜、层叠体、静电电容型输入装置及触摸面板的制造方法
WO2020066351A1 (ja) * 2018-09-28 2020-04-02 富士フイルム株式会社 パターン付き基材の製造方法、回路基板の製造方法及びタッチパネルの製造方法
CN112740107A (zh) * 2018-09-28 2021-04-30 富士胶片株式会社 带图案的基材的制造方法、电路基板的制造方法及触摸面板的制造方法

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Title
郭福忠;郑致刚;宋静;刘永刚;邓舒鹏;宣丽;: "表面活性剂含量对全息聚合物分散液晶光栅电光特性的影响", 光子学报, no. 09, 15 September 2008 (2008-09-15), pages 24 - 27 *

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TW202236009A (zh) 2022-09-16
JPWO2022092160A1 (https=) 2022-05-05
JP2025188224A (ja) 2025-12-25
WO2022092160A1 (ja) 2022-05-05
JP7761581B2 (ja) 2025-10-28

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