TW201916528A - 電源供應裝置 - Google Patents

電源供應裝置 Download PDF

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Publication number
TW201916528A
TW201916528A TW107130119A TW107130119A TW201916528A TW 201916528 A TW201916528 A TW 201916528A TW 107130119 A TW107130119 A TW 107130119A TW 107130119 A TW107130119 A TW 107130119A TW 201916528 A TW201916528 A TW 201916528A
Authority
TW
Taiwan
Prior art keywords
power supply
battery packs
supply device
series
battery
Prior art date
Application number
TW107130119A
Other languages
English (en)
Other versions
TWI718406B (zh
Inventor
蔡乃成
Original Assignee
美商科斯莫燈飾公司
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Publication date
Application filed by 美商科斯莫燈飾公司 filed Critical 美商科斯莫燈飾公司
Publication of TW201916528A publication Critical patent/TW201916528A/zh
Application granted granted Critical
Publication of TWI718406B publication Critical patent/TWI718406B/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/12—Moulds or cores; Details thereof or accessories therefor with incorporated means for positioning inserts, e.g. labels
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S4/00—Lighting devices or systems using a string or strip of light sources
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P21/00—Machines for assembling a multiplicity of different parts to compose units, with or without preceding or subsequent working of such parts, e.g. with programme control
    • B23P21/004—Machines for assembling a multiplicity of different parts to compose units, with or without preceding or subsequent working of such parts, e.g. with programme control the units passing two or more work-stations whilst being composed
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/42—Moulds or cores; Details thereof or accessories therefor characterised by the shape of the moulding surface, e.g. ribs or grooves
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
    • B29C39/02—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles
    • B29C39/10—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. casting around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H54/00—Winding, coiling, or depositing filamentary material
    • B65H54/02—Winding and traversing material on to reels, bobbins, tubes, or like package cores or formers
    • B65H54/10—Winding and traversing material on to reels, bobbins, tubes, or like package cores or formers for making packages of specified shapes or on specified types of bobbins, tubes, cores, or formers
    • B65H54/14—Winding and traversing material on to reels, bobbins, tubes, or like package cores or formers for making packages of specified shapes or on specified types of bobbins, tubes, cores, or formers on tubes, cores, or formers having generally parallel sides, e.g. cops or packages to be loaded into loom shuttles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H75/00—Storing webs, tapes, or filamentary material, e.g. on reels
    • B65H75/02—Cores, formers, supports, or holders for coiled, wound, or folded material, e.g. reels, spindles, bobbins, cop tubes, cans, mandrels or chucks
    • B65H75/04—Kinds or types
    • B65H75/08—Kinds or types of circular or polygonal cross-section
    • B65H75/14—Kinds or types of circular or polygonal cross-section with two end flanges
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H75/00—Storing webs, tapes, or filamentary material, e.g. on reels
    • B65H75/50—Methods of making reels, bobbins, cop tubes, or the like by working an unspecified material, or several materials
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/90—Methods of manufacture
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S4/00—Lighting devices or systems using a string or strip of light sources
    • F21S4/10—Lighting devices or systems using a string or strip of light sources with light sources attached to loose electric cables, e.g. Christmas tree lights
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S4/00—Lighting devices or systems using a string or strip of light sources
    • F21S4/20—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports
    • F21S4/22—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports flexible or deformable, e.g. into a curved shape
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S4/00—Lighting devices or systems using a string or strip of light sources
    • F21S4/20—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports
    • F21S4/22—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports flexible or deformable, e.g. into a curved shape
    • F21S4/26—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports flexible or deformable, e.g. into a curved shape of rope form, e.g. LED lighting ropes, or of tubular form
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/04—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages the fastening being onto or by the light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/0015—Fastening arrangements intended to retain light sources
    • F21V19/0025—Fastening arrangements intended to retain light sources the fastening means engaging the conductors of the light source, i.e. providing simultaneous fastening of the light sources and their electric connections
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/001—Arrangement of electric circuit elements in or on lighting devices the elements being electrical wires or cables
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/26—Power supply means, e.g. regulation thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B7/00—Insulated conductors or cables characterised by their form
    • H01B7/02—Disposition of insulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/13—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L33/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/20—Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders
    • H01M50/204—Racks, modules or packs for multiple batteries or multiple cells
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/20—Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders
    • H01M50/269—Mechanical means for varying the arrangement of batteries or cells for different uses, e.g. for changing the number of batteries or for switching between series and parallel wiring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/28—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for wire processing before connecting to contact members, not provided for in groups H01R43/02 - H01R43/26
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02G—INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
    • H02G1/00—Methods or apparatus specially adapted for installing, maintaining, repairing or dismantling electric cables or lines
    • H02G1/12—Methods or apparatus specially adapted for installing, maintaining, repairing or dismantling electric cables or lines for removing insulation or armouring from cables, e.g. from the end thereof
    • H02G1/1202—Methods or apparatus specially adapted for installing, maintaining, repairing or dismantling electric cables or lines for removing insulation or armouring from cables, e.g. from the end thereof by cutting and withdrawing insulation
    • H02G1/1248—Machines
    • H02G1/1251—Machines the cutting element not rotating about the wire or cable
    • H02G1/1253—Machines the cutting element not rotating about the wire or cable making a transverse cut
    • H02G1/1256—Machines the cutting element not rotating about the wire or cable making a transverse cut using wire or cable-clamping means
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
    • H02J7/00—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries
    • H02J7/0063—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries with circuits adapted for supplying loads from the battery
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
    • H02J7/00—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries
    • H02J7/007—Regulation of charging or discharging current or voltage
    • H02J7/00712—Regulation of charging or discharging current or voltage the cycle being controlled or terminated in response to electric parameters
    • H02J7/007182—Regulation of charging or discharging current or voltage the cycle being controlled or terminated in response to electric parameters in response to battery voltage
    • H02J7/007184—Regulation of charging or discharging current or voltage the cycle being controlled or terminated in response to electric parameters in response to battery voltage in response to battery voltage gradient
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/10—Controlling the intensity of the light
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/40—Details of LED load circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/40—Details of LED load circuits
    • H05B45/42—Antiparallel configurations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/40—Details of LED load circuits
    • H05B45/44—Details of LED load circuits with an active control inside an LED matrix
    • H05B45/48—Details of LED load circuits with an active control inside an LED matrix having LEDs organised in strings and incorporating parallel shunting devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B47/00—Circuit arrangements for operating light sources in general, i.e. where the type of light source is not relevant
    • H05B47/10—Controlling the light source
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/747—Lightning equipment
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
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Abstract

本發明提供一種電源供應裝置，包含多個電池組以及多個單向導通元件。多個電池組彼此同向並聯。多個單向導通元件分別串聯連接多個電池組。每一單向導通元件的正引腳串聯連接對應的電池組的正極端，每一單向導通元件的負引腳並聯連接其他單向導通元件的負引腳。因此，本發明可有效防止高電壓電池組對低電壓的電池組充電，進而延長電池的使用壽命，並避免影響電池組對電源接收電路的電力供應。

Description

電源供應裝置
本發明是有關於一種電源供應裝置，且特別是有關於一種可避免相互並聯的多個電池組相互充電的電源供應裝置。
隨著電子技術的蓬勃發展，中型、大型電池組的用量越來越大。而在這些電池組的生產、測試與使用過程中，要用到許多充電和放電過程。現有的充電設備或放電設備仍存在以下缺點：電池組需要使用相同型號的電池組進行並聯使用，即並聯的電池組要求每個電池電壓相同，不能將完全不一樣類型、電壓等級的電池組進行並聯。因為在電池組中，單體之間的差異總是存在的，以電容量為例，在使用上，電容量大的電池組可能對電容量小的電池組充電或放電，造成電容量小的電池組損壞，進而降低電池組的使用壽命。
為解決習知技術之缺失，本發明的目的在於提供一種電源供應裝置，其簡單易行、便於操作、可靠性強地解決多個電池組之間相互充放電的問題。
本發明提供的電源供應裝置，包含多個電池組以及多個單向導通元件。多個電池組彼此同向並聯。多個單向導通元件具有彼 此相同或不同的額定電壓，且相互同向並聯。多個單向導通元件分別串聯連接所有多個第一電池組中具有相對較低額定電壓的部分多個第一電池組，其中多個第一低單向導通元件相互同向並聯。
如上所述，本發明提供的電源供應裝置，其將所有電池組或僅針對低電壓的電池組分別串聯連接至少一個單向導通元件例如發光二極體，以利用單向導通元件的單向導通特性，有效防止相互並聯的多個電池組相互充電或放電，而損壞電池組的內部電池，導致電池發熱、漏液，更甚者發生電池組的爆炸的問題發生。
BP1~BPn、BPP1~BPPn、BS1、BSP1‧‧‧電池組
DB1~DBn‧‧‧單向導通元件
SW、S1‧‧‧開關
D0、LED1、LED2、D1、D2‧‧‧發光二極體
R1、R2、R11、R12‧‧‧電阻
100‧‧‧控制電路
VDD、VDD1、VDD2‧‧‧電壓源
C1、C2、C3‧‧‧電容
Y1‧‧‧石英震盪器
Q1、Q2‧‧‧電晶體
10‧‧‧第一積體電路
20‧‧‧第二積體電路
圖1是本發明第一實施例的電源供應裝置的各具多顆電池的多個電池組的正極端各串接單向導通元件的正引腳並且多個串聯電路相互並聯的電路佈局圖。
圖2是本發明第二實施例的電源供應裝置的各具多顆電池的多個電池組的正極端各串接單向導通元件的正引腳並且多個串聯電路以及控制電路相互並聯的電路佈局圖。
圖3是本發明第三實施例的電源供應裝置的各具單顆電池的兩個電池組的正極端各串接單向導通元件的正引腳並且兩個串聯電路以及控制電路相互並聯的電路佈局圖。
圖4是本發明第四實施例的電源供應裝置的各具單顆電池的多個電池組的正極端各串接單向導通元件的正引腳並且多個串聯電路以及控制電路相互並聯的電路佈局圖。
圖5是本發明第五實施例的電源供應裝置的各具多顆電池的兩個電池組的正極端各串接單向導通元件的正引腳並且兩個串聯電路以及控制電路相互並聯的電路佈局圖。
圖6是本發明第六實施例的電源供應裝置的各具多顆電池的多個電池組的正極端各串接單向導通元件的正引腳並且多個串聯 電路以及控制電路相互並聯的電路佈局圖。
圖7是本發明第七實施例的電源供應裝置的各具單顆電池的兩個電池組的正極端各串接單向導通元件的正引腳的串聯電路相互並聯後再串接具單顆電池的電池組以及控制電路的電路佈局圖。
圖8是本發明第八實施例的電源供應裝置的各具多顆電池的多個電池組的正極端各串接單向導通元件的正引腳的串聯電路相互並聯後再串接具多顆電池的電池組以及控制電路的電路佈局圖。
圖9是本發明實施例的電源供應裝置的控制電路的電路佈局圖。
圖10是本發明第九實施例的電源供應裝置的多個電池組的負極端各串接單向導通元件的負引腳的串聯電路相互並聯後再串接具多顆電池的電池組以及控制電路的電路佈局圖。
圖11是本發明第十實施例的電源供應裝置的多個電池組的負極端各串接單向導通元件的負引腳的串聯電路相互並聯後再串接具多顆電池的電池組的電路佈局圖。
圖12是本發明第十一實施例的電源供應裝置的多個電池組的正極端各串接單向導通元件的正引腳的串聯電路相互並聯後再串接具多顆電池的電池組的電路佈局圖。
以下是通過特定的具體實施例來說明本發明所揭露有關本發明的實施方式，本領域技術人員可由本說明書所揭露的內容瞭解本發明的優點與效果。本發明可通過其他不同的具體實施例加以施行或應用，本說明書中的各項細節也可基於不同觀點與應用，在不悖離本發明的構思下進行各種修改與變更。另外，本發明的附圖僅為簡單示意說明，並非依實際尺寸的描繪，事先聲明。以 下的實施方式將進一步詳細說明本發明的相關技術內容，但所揭露的內容並非用以限制本發明的保護範圍。
應理解，雖然本文中可能使用術語第一、第二、第三等來描述各種元件或者訊號，但這些元件或者訊號不應受這些術語的限制。這些術語主要是用以區分一元件與另一元件，或者一訊號與另一訊號。另外，本文中所使用的術語“或”，應視實際情況可能包括相關聯的列出項目中的任一個或者多個的組合。
為了解釋清楚，在一些情況下，本技術可被呈現為包括包含功能塊的獨立功能塊，其包含裝置、裝置元件、軟體中實施的方法中的步驟或路由，或硬體及軟體的組合。
實施根據這些揭露方法的裝置可以包括硬體、韌體及/或軟體，且可以採取任何各種形體。這種形體的典型例子包括筆記型電腦、智慧型電話、小型個人電腦、個人數位助理等等。本文描述之功能也可以實施於週邊設備或內置卡。透過進一步舉例，這種功能也可以實施在不同晶片或在單個裝置上執行的不同程序的電路板。
該指令、用於傳送這樣的指令的介質、用於執行其的計算資源或用於支持這樣的計算資源的其他結構，係為用於提供在這些揭露中所述的功能的手段。
請參閱圖1，其是本發明第一實施例的電源供應裝置的各具多顆電池的多個電池組的正極端各串接單向導通元件的正引腳並且多個串聯電路相互並聯的電路佈局圖。如圖1所示，電源供應裝置包含多個電池組BP1~BPn以及多個單向導通元件DB1~DBn，其中n可為大於1的任意正整數。
在本實施例中，每一個電池組BP1~BPn可包含多個電池，實務上，每一個電池組BP1~BPn亦可僅具有單一個電池。電池組BP1~BPn可彼此具有不同數量的電池。同一電池組BP1~BPn的多個電池彼此同向串聯，即每一電池的正極端連接相鄰的電池的負 極端。不同電池組BP1~BPn的多個電池彼此同向並聯，即所有電池的正極端皆面向與電池相互串聯的單向導通元件DB1~DBn設置的方向。
值得注意的是，多個單向導通元件DB1~DBn分別串聯連接多個電池組BP1~BPn，如單向導通元件DB1串聯連接電池組BP1，而單向導通元件DBn串聯連接電池組BPn。在本實施例中，單向導通元件DB1~DBn為發光二極體，例如矽或鍺發光二極體，在此舉例說明，不以此為限。每一單向導通元件DB1~DBn可具有正引腳以及負引腳。每一單向導通元件DB1~DBn的正引腳串聯連接對應的電池組BP1~BPn的正極端，每一單向導通元件DB1~DBn的負引腳並聯連接其他單向導通元件DB1~DBn的負引腳。換言之，多個單向導通元件DB1~DBn彼此同向並聯。
本實施例的每一個電池組BP1~BPn僅串接一個單向導通元件DB1~DBn，即電池組BP1~BPn的數量與單向導通元件DB1~DBn的數量相同。然而，實務上，若有需求，例如為了更有效地避免多個電池組相互充電，可增加每一電池組DB1~DBn串接的單向導通元件的數量。
電池組(非充電電池組)可能包含新舊混用或不同品牌同型號混用的多個電池，使電池組BP1~BPn的電壓不一致。因此，本實施利針對電池組BP1~BPn分別配置單向導通元件DB1~DBn，利用單向導通元件DB1~DBn的單向導通特性，以有效防止電池組BP1~BPn相互充放電的情況發生，例如高額定電壓的電池組BPn對低電壓的電池組BP1充電，而損壞低額定電壓的電池組BP1，甚至使電池發熱、漏液，更甚者發生電池組BP1~BPn的爆炸的問題發生。
另外，電源供應裝置(包含多個電池組BP1~BPn以及多個單向導通元件DB1~DBn)的輸出端可連接電源接收電路。每一電池組BP1~BPn以及對應的單向導通元件DB1~DBn的串聯電路與電 源接收電路並聯。藉此，利用電池組BP1~BPn供應電力至電源接收電路。電源接收電路可例如為需利用電力始可作業的任何耗能的電子元件。
舉例來說，如圖1所示，電源接收電路可包含發光二極體D0以及電阻R1。發光二極體D0與電阻R1相互串聯。另外，發光二極體D0以及電阻R1之間更可選擇性串聯連接開關SW。發光二極體D0與單向導通元件DB1~DBn反向並聯，即發光二極體D0的正引腳透過開關SW以及電阻R1並聯連接單向導通元件DB1~DBn的負引腳，發光二極體D0的負引腳並聯連接各電池組BP1~BPn的負極端。
實施上，在開關SW導通的情況下，電源供應裝置透過電池組BP1~BPn供應電力時，每一電池組BP1~BPn的電流將從電池的正極端流向單向導通元件DB1~DBn的正引腳，接著從單向導通元件DB1~DBn的負引腳流出至電阻R1，並接著流過發光二極體D0，使得發光二極體D0發光。在此過程中，由於單向導通元件DB1~DBn的單向導通特性限制了電流的流向，使得電流無法從任一電池組BP1~BPn的正極端流至其他電池組BP1~BPn的正極端並從其他電池組BP1~BPn的負極端流出。因此，單向導通元件DB1~DBn的配置可有效避免相互並聯的多個電池組BP1~BPn相互充電而影響電池組BP1~BPn對發光二極體D0的電力供應。
應理解的是，電池組BP1~BPn供應的電力至少需大於單向導通元件DB1~DBn的障壁電壓，例如單向導通元件DB1~DBn為矽發光二極體時，電池組BP1~BPn供應的電力至少需大於0.7伏特的障壁電壓。
在本實施例中，電池組BP1~BPn彼此具有相同或不同的額定電壓，即工作電壓。每一個電池組BP1~BPn串接一個單向導通元件DB1~DBn。然而，單向導通元件DB1~DBn的配置，主要為了防止高額定電壓的電池組BP1~BPn對低額定電壓的電池組 BP1~BPn充電。因此，實務上，可僅針對每一個低額定電壓的電池組BP1~BPn串接一個單向導通元件DB1~DBn，避免低額定電壓的電池組BP1~BPn接收高額定電壓的電池組BP1~BPn的電流，而高額定電壓的電池組BP1~BPn則可省略不串接單向導通元件DB1~DBn，以節省電路成本。
請參閱圖2，其是本發明第二實施例的電源供應裝置的各具多顆電池的多個電池組的正極端各串接單向導通元件的正引腳並且多個串聯電路以及控制電路相互並聯的電路佈局圖。如圖2所示，電源供應裝置包含多個電池組BP1~BPn以及多個單向導通元件DB1~DBn。電源供應裝置適用於電源接收電路，電源接收電路可包含電阻R2以及發光二極體D0。控制電路100連接在電源供應裝置以及電源接收電路之間，以控制電源供應裝置供應至電源接收電路的電力。
電源接收電路的發光二極體D0的正引腳可串聯連接開關SW，而發光二極體D0的負引腳則串聯連接電阻R2。控制電路100可控制開關SW關閉，即如圖2所示在打開位置，使得電池組BP1~BPn供應的電流無法流至發光二極體D0。相反地，控制電路100可控制開關SW從如圖2所示的打開位置切換至閉合位置，即從截止狀態轉為導通狀態，使得電池組BP1~BPn的電流可供應至發光二極體D0，使發光二極體D0發光。
進一步地，每一個電池組BP1~BPn與對應的單向導通元件DB1~DBn的串聯電路可串聯連接另一開關，例如此開關設置在彼此串聯連接的電池組BP1~BPn以及單向導通元件DB1~DBn之間，或串聯連接單向導通元件DB1~DBn的負引腳。控制電路100可基於發光二極體D0所需的電力或其他特性，開啟特定的電池組BP1~BPn的開關，並關閉其他電池組BP1~BPn的開關，以從所有電池組BP1~BPn中選擇由特定(部分或全部)的電池組BP1~BPn，例如透過選擇使用不同特性例如電池壽命、電壓大小、電池組數、 電池數量的電池組BP1~BPn，以供應適當的電力至電源接收電路的發光二極體D0。
請參閱圖3，其是本發明第三實施例的電源供應裝置的各具單顆電池的兩個電池組的正極端各串接單向導通元件的正引腳並且兩個串聯電路以及控制電路相互並聯的電路佈局圖。如圖3所示，電源供應裝置包含兩個電池組BPP1、BPP2以及兩個單向導通元件DB1、DB2。電源供應裝置適用於電源接收電路，電源接收電路可包含發光二極體D0。控制電路100連接在電源供應裝置以及電源接收電路之間，以控制電源供應裝置供應至電源接收電路的電力。
不同於第一和第二實施例的每一個電池組BPP1~BPPn具有多個電池，本實施例的每一電池組BPP1、BPP2僅具有一個電池，分別串聯連接一個單向導通元件DB1、DB2。具體地，單向導通元件DB1的正引腳串聯連接單向導通元件DB1的正極端，單向導通元件DB2的正引腳串聯連接單向導通元件DB2的正極端。電池組BPP1與單向導通元件DB1的串聯電路以及單向導通元件DB2與單向導通元件DB2的串聯電路相互並聯。
多個單向導通元件DB1、DB2的負引腳通過控制電路100的正極端連接發光二極體D0的正引腳，多個電池組BPP1、BPP2的負極端則通過控制電路100的負極端連接發光二極體D0的負引腳。實施上，當電源供應裝置透過兩個電池組BPP1、BPP2分別供應兩個相同或不同大小的電流時，兩電流將分別從兩個電池組BPP1、BPP2的正極端流出，接著分別通過單向導通元件DB1以及單向導通元件DB2至控制電路100。
控制電路100可允許兩電流非同步地流過發光二極體D0，使得發光二極體D0依序利用電池組BPP1、BPP2所供應的相同或不同大小的電流，而在不同時間點分別發射出具有相同或不同的亮度的光線，從而使發光二極體D0以相同或不同的亮度閃爍發光。 或者，控制電路100可允許電池組BPP1、BPP2的兩電流同步地流過發光二極體D0，使得發光二極體D0以兩電流加總的較大電流，以發射具有相對較大光強度的光線。
請參閱圖4，其是本發明第四實施例的電源供應裝置的各具單顆電池的多個電池組的正極端各串接單向導通元件的正引腳並且多個串聯電路以及控制電路相互並聯的電路佈局圖。如圖4所示，電源供應裝置包含多個電池組BPP1~BPPn以及多個單向導通元件DB1~DBn，其中n可為大於1的任意正整數。每一電池組BPP1、BPP2僅具有一個電池，各連接一個單向導通元件DB1、DB2。相比於第三實施例僅配置兩組電池，本實施例可進一步擴增電池組BPP1~BPPn的數量，即n>2，並對應擴增單向導通元件DB1~DBn的數量，即單向導通元件DB1~DBn的數量取決於電池組BPP1~BPPn的數量。透過並聯更多電池組可使電源供應裝置的電容量增加，如此可降低在供應電力的過程中需更換沒電或損壞的電池的頻率，從而延長電源供應裝置供電的使用時間，提升使用上的方便性。
請參閱圖5，其是本發明第五實施例的電源供應裝置的各具多顆電池的兩個電池組的正極端各串接單向導通元件的正引腳並且兩個串聯電路以及控制電路相互並聯的電路佈局圖。如圖5所示，電源供應裝置包含兩個電池組BP1、BP2以及兩個單向導通元件DB1、DB2。電池組BP1串聯連接單向導通元件DB1，而電池組BP2串聯連接單向導通元件DB2。電池組BP1與單向導通元件DB1的串聯電路以及電池組BP2與單向導通元件DB2的串聯電路相互並聯連接。相比於如圖3所示的第三實施例的每一電池組BPP1、BPP2僅具有一個電池，本實施例的每一電池組BP1、BP2具有多個電池彼此同向串聯連接。
詳言之，電池組BP1最上方電池的正極端連接單向導通元件DB1的正引腳，通過單向導通元件DB1以及控制電路100連接至 發光二極體D0的正引腳，而電池組BP1的最下方電池的負極端通過控制電路100連接發光二極體D0的負引腳。類似地，電池組BP2最上方電池的正極端連接單向導通元件DB2的正引腳，通過單向導通元件DB2以及控制電路100連接至發光二極體D0的正引腳，而電池組BP2的最下方電池的負極端通過控制電路100連接發光二極體D0的負引腳。
請參閱圖6，其是本發明第六實施例的電源供應裝置的各具多顆電池的多個電池組的正極端各串接單向導通元件的正引腳並且多個串聯電路以及控制電路相互並聯的電路佈局圖。如圖6所示，電源供應裝置包含多個電池組BP1~BPn以及多個單向導通元件DB1~DBn。每一電池組BP1~BPn具有多個電池。不同電池組BP1~BPn的電池數量可為相同或不同。相比於如圖5所示的第五實施例僅設置兩個電池組BP1、BP2，即n=2，本實施例的電源供應裝置可包含更多個電池組BP1~BPn，即n可為大於2的任意正整數，以擴增電源供應裝置的電容量。
請參閱圖7，其是本發明第七實施例的電源供應裝置的各具單顆電池的兩個電池組的正極端各串接單向導通元件的正引腳的串聯電路相互並聯後再串接具單顆電池的電池組以及控制電路的電路佈局圖。如圖7所示，電源供應裝置包含電池組BPP1、BPP2、BSP1以及兩個單向導通元件DB1、DB2。電源供應裝置適用於電源接收電路，電源接收電路可包含發光二極體D0。控制電路100連接在電源供應裝置以及電源接收電路之間。
電池組BPP1的正極端串聯連接單向導通元件DB1的正引腳，而電池組BPP2的正極端串聯連接單向導通元件DB2的正引腳。單向導通元件DB1、DB2的負引腳並聯連接控制電路100的輸入端，通過控制電路100的輸出端連接發光二極體D0的正引腳。值得注意的是，電池組BPP1與單向導通元件DB1的串聯電路以及電池組BPP2與單向導通元件DB2的串聯電路並聯，並且 此並聯電路與另一電池組BSP1串聯。電池組BSP1的正極端連接兩個電池組BPP1、BPP2的負極端，電池組BSP1的負極端通過控制電路100連接發光二極體D0的負引腳。
實施上，當控制電路100欲驅動電源接收電路例如發光二極體D0發光時，可選擇性控制相互並聯的電池組BPP1、BPP2以及與電池組BPP1、BPP2的並聯電路串聯的電池組BSP1的電力供應。電池組BSP1供應的電流可從電池組BSP1的正極端流過電池組BPP1以及單向導通元件DB1，並通過控制電路100供應至發光二極體D0。或者，電池組BSP1供應的電流可從電池組BSP1的正極端流過電池組BPP2以及單向導通元件DB2，並通過控制電路100供應至發光二極體D0。或者，電池組BSP1供應的電流將分成兩分路電流，其中第一分路電流流過電池組BPP1與單向導通元件DB1的串聯電路，而第二分路電流流過電池組BPP2與單向導通元件DB2的串聯電路，最後通過控制電路100流過發光二極體D0。而在電池組BSP1供應電流的同時，控制電路100可允許電池組BPP1、BPP2的電流供應至發光二極體D0，使發光二極體D0可在同一時間點接收較大的電流而具有較大的發光強度。
請參閱圖8，其是本發明第八實施例的電源供應裝置的各具多顆電池的多個電池組的正極端各串接單向導通元件的正引腳的串聯電路相互並聯後再串接具多顆電池的電池組以及控制電路的電路佈局圖。
如圖8所示，電源供應裝置包含多個電池組BP1~BPn、BS1以及多個單向導通元件DB1~DBn，其中n可為任意正整數。多個單向導通元件DB1~DBn的數量取決於電池組BP1~BPn的數量。多個電池組BP1~BPn分別串聯連接多個單向導通元件DB1~DBn，並且所有串聯電路相互並聯。相比於第七實施例的每一電池組BPP1、BPP2、BSP1僅具有一個電池，本實施例的每一電池組BP1、BP2、BS1可具有多個電池彼此同向串聯連接。
應理解，本實施例僅針對相互並聯的電池組BP1~BPn配置單向導通元件DB1~DBn，而與電池組BP1~BPn的並聯電路串接的電池組BS1僅為一個而未配置單向導通元件。實務上，若增設更多電池組(BS2~BSn，未標示於圖中)與電池組BS1相互並聯，則亦可將每一個電池組(BS1~BSn)或具有相對較低額定電壓的部分電池組(BS1~BSn)串接單向導通元件。每一電池組(BS1~BSn)可具有多個電池相互串聯。
替換地，電池組BP1~BPn以及電池組(BS1~BSn)中的每一電池組可與其他電池組具有相同或不同的額定電壓。電池組BP1~BPn以及電池組(BS1~BSn)中具有相對較低額定電壓的一或多個電池組BP1~BPn及/或一或多個電池組(BS1~BSn)串聯連接單向導通元件。換言之，具有最高額定電壓的一或多個電池組BP1~BPn及/或一或多個電池組(BS1~BSn)不需串聯單向導通元件，藉此節省電路成本。
請參閱圖9，其是本發明實施例的電源供應裝置的控制電路的電路布局圖，可應用於本文其他實施例中任一實施例所述的控制電路100。如圖9所示，控制電路100可包含第一積體電路10、第二積體電路20、諧振電路以及多個開關電路。第一積體電路10可作為控制器，例如為SOP8積體電路晶片。第二積體電路20可作為驅動器，例如為XJX-M005積體電路晶片。
第一積體電路10的第一引腳可連接電壓源VDD。第一積體電路10的第二引腳和第三引腳可連接諧振電路。詳言之，諧振電路包含石英震盪器Y1以及電容C2、C3。第一積體電路10的第二引腳連接在諧振電路的石英震盪器Y1及電容C2的各一端之間，而第一積體電路10的第三引腳連接在諧振電路的石英震盪器Y1的另一端及電容C3的一端之間。電容C2以及電容C3的各另一端接地。
第一積體電路10的第四引腳可連接多個開關電路。開關電路 包含電晶體Q2、電阻R12以及發光二極體D2。在本實施例中，電晶體Q2為PMOS電晶體，但實務上亦可替換為其他開關元件，並對應調整其與其他元件的配置關係。電阻R12的兩端可分別連接第一積體電路10的第四引腳以及電晶體Q2的閘極端。電晶體Q2的源極端連接電壓源VDD1，而電晶體Q2的汲極端連接電壓源VDD。發光二極體D2的正極端連接電晶體Q2的源極端，而發光二極體D2的負極端連接電壓源VDD。
類似地，另一開關電路包含電晶體Q1、電阻R11以及發光二極體D1。在本實施例中，電晶體Q1亦為PMOS電晶體，但本發明不以此為限。電阻R11的兩端分別連接第一積體電路10的第四引腳以及電晶體Q1的閘極端。電晶體Q1的源極端連接電壓源VDD2，而電晶體Q1的汲極端連接電壓源VDD。發光二極體D1的正極端連接電晶體Q1的源極端，而發光二極體D2的負極端連接電壓源VDD。
進一步地，電容可跨接在第一積體電路10的第一引腳和第八引腳之間。第一積體電路10的第八引腳可接地。開關S1的一端可連接第一積體電路10的第七引腳，而開關S1的另一端接地。第一積體電路10的第六引腳可連接第二積體電路20的第三引腳，並且第一積體電路10的第五引腳可連接第二積體電路20的第四引腳。第二積體電路20的第五引腳可連接電壓源VDD，並且第二積體電路20的第二引腳接地。第二積體電路20的第一引腳可連接發光二極體LED1、LED2的正引腳，而第二積體電路20的第六引腳可連接發光二極體LED1、LED2的負引腳。
請參閱圖10，其是本發明第九實施例的電源供應裝置的多個電池組的負極端各串接單向導通元件的負引腳的串聯電路相互並聯後再串接具多顆電池的電池組以及控制電路的電路佈局圖。
如圖10所示，電源供應裝置包含多個電池組BP1~BPn、BS1以及多個單向導通元件DB1~DBn。多個電池組BP1~BPn分別串 聯連接多個單向導通元件DB1~DBn，而這些串聯電路相互並聯，且並聯電路與電池組BS1串聯。
值得注意的是，本實施例與第八實施例差異在於，如圖8所示的每個電池組BP1~BPn的正極端連接對應的單向導通元件DB1~DBn的正引腳，而如圖10所示的每個電池組BP1~BPn的負極端連接對應的單向導通元件DB1~DBn的負引腳。另外，如圖10所示，多個單向導通元件DB1~DBn的正引腳連接控制電路的負極輸入端。電池組BS1的正極端連接控制電路100的正極輸入端，而電池組BS1的負極端連接多個電池組BP1~BPn的正極端。控制電路的輸出端連接發光二極體D0。
請參閱圖11，其是本發明第十實施例的電源供應裝置的多個電池組的負極端各串接單向導通元件的負引腳的串聯電路相互並聯後再串接具多顆電池的電池組的電路佈局圖。如圖11所示，電源供應裝置包含多個電池組BP1~BPn、BS1以及多個單向導通元件DB1~DBn。
相比於如圖10所示的第九實施例在電源供應裝置以及電源接收電路例如發光二極體D0之間設置控制電路100，如圖11所示則是以電阻R3、開關SW、發光二極體D0取代控制電路100的配置。電阻R3、開關SW以及發光二極體D0相互串聯。開關SW連接在電阻R3的一端以及發光二極體D0的正引腳之間。電阻R3的另一端連接電池組BS1的正極端。發光二極體D0的負引腳連接多個單向導通元件DB1~DBn的正引腳。
請參閱圖12，其是本發明第十一實施例的電源供應裝置的多個電池組的正極端各串接單向導通元件的正引腳的串聯電路相互並聯後再串接具多顆電池的電池組的電路佈局圖。如圖11所示，電源供應裝置包含多個電池組BP1~BPn、BS1以及多個單向導通元件DB1~DBn。
相比於如圖8所示的第八實施例在電源供應裝置以及電源接 收電路例如發光二極體D0之間設置控制電路100，如圖12所示則是以電阻R4、開關SW、發光二極體D0取代控制電路100的配置。電阻R4、開關SW以及發光二極體D0相互串聯。開關SW連接在電阻R4的一端以及發光二極體D0的正引腳之間。電阻R4的另一端連接多個單向導通元件DB1~DBn的負引腳。發光二極體D0的負引腳連接電池組BS1的負極端。
本發明提供的電源供應裝置，其將所有電池組或僅針對低額定電壓的電池組分別串聯連接至少一個單向導通元件例如發光二極體，以利用單向導通元件的單向導通特性，有效防止相互並聯的多個電池組相互充電或放電，而損壞電池組的內部電池，導致電池發熱、漏液，更甚者發生電池組的爆炸的問題發生。
最後須說明地是，於前述說明中，儘管已將本發明技術的概念以多個示例性實施例具體地示出與闡述，然而在此項技術的領域中具有通常知識者將理解，在不背離由以下申請專利範圍所界定的本發明技術的概念之範圍的條件下，可對其作出形式及細節上的各種變化。

Claims (21)

  1. 一種電源供應裝置，包含：多個第一電池組，具有彼此相同或不同的額定電壓，且相互同向並聯；以及多個第一低單向導通元件，分別串聯連接所有該多個第一電池組中具有相對較低額定電壓的部分該多個第一電池組，該多個第一低單向導通元件相互同向並聯。
  2. 如請求項1所述的電源供應裝置，其中各該第一低單向導通元件的正引腳串聯連接對應的該第一電池組的正極端。
  3. 如請求項1所述的電源供應裝置，其中各該第一低單向導通元件的負引腳串聯連接對應的該第一電池組的負極端。
  4. 如請求項1所述的電源供應裝置，其中各該第一電池組包含一或多個電池，同一該第一電池組的該多個電池彼此同向串聯，任一該第一電池組的該多個電池與其他該多個第一電池組的該多個電池彼此同向並聯。
  5. 如請求項1所述的電源供應裝置，其中該電源供應裝置連接一電源接收電路，該電源接收電路的輸入端連接各該第一低單向導通元件的負引腳以及該第一電池組的正極端，該電源接收電路的輸出端連接各該第一電池組的負極端。
  6. 如請求項5所述的電源供應裝置，其中該電源接收電路包含一或多個發光元件，該發光元件的正引腳連接各該第一低單向導通元件的負引腳以及該第一電池組的正極端，該發光元件的負引腳連接各該第一電池組的負極端。
  7. 如請求項5所述的電源供應裝置，其中該電源接收電路連接一控制電路，該控制電路連接各該第一低單向導通元件的負引腳以及各該第一電池組的負極端，該控制電路配置以控制或調整該電源供應裝置的該多個第一電池組的電力供應至該電源接收電路。
  8. 如請求項1所述的電源供應裝置，更包含一或多個第一高單向導通元件，分別串聯連接所有該多個第一電池組中具有最高額定電壓的該一或多個第一電池組。
  9. 如請求項8所述的電源供應裝置，其中各該第一高單向導通元件的正引腳串聯連接對應的該第一電池組的正極端。
  10. 如請求項8所述的電源供應裝置，其中各該第一高單向導通元件的負引腳串聯連接對應的該第一電池組的負極端。
  11. 如請求項1或8所述的電源供應裝置，其中該第一低單向導通元件或該第一高單向導通元件為發光二極體。
  12. 如請求項1所述的電源供應裝置，更包含一或多個第二電池組，具有彼此相同或不同的額定電壓，且相互同向並聯，該第二電池組的並聯電路與該多個第一電池組的並聯電路串聯，各該第二電池組的正極端連接各該第一電池組的負極端，該第二電池組的負極端連接一電源接收電路。
  13. 如請求項12所述的電源供應裝置，其中各該第二電池組包含一或多個電池，同一該第二電池組的該多個電池彼此同向串聯，任一該第二電池組的該多個電池與其他該多個第二電池組的該多個電池彼此同向並聯。
  14. 如請求項12所述的電源供應裝置，其中該電源供應裝置以及該電源接收電路連接一控制電路，該控制電路連接各該第一低單向導通元件的負引腳、該第一電池組的正極端、各該第二電池組的負極端以及該電源接收電路，該控制電路配置以控制或調整該電源供應裝置的該第一電池組以及該第二電池組的電力供應至該電源接收電路。
  15. 如請求項12所述的電源供應裝置，更包含多個第二單向導通元件，分別串聯連接所有該多個第二電池組。
  16. 如請求項12所述的電源供應裝置，更包含多個第二單向導通元件，分別串聯連接所有該多個第二電池組中具有相對較低 額定電壓的部分該多個第二電池組，具有最高額定電壓的該一或多個第二電池組則不連接任何該第二單向導通元件。
  17. 如請求項15或16所述的電源供應裝置，其中各該第二單向導通元件的正引腳串聯連接對應的該第二電池組的正極端。
  18. 如請求項15或16所述的電源供應裝置，其中各該第二單向導通元件的負引腳串聯連接對應的該第二電池組的負極端。
  19. 如請求項12所述的電源供應裝置，其中該多個第一電池組以及該多個第二電池組具有相同或不同的額定電壓，除了該多個第一電池組以及該多個第二電池組中具有最高額定電壓的該一或多個第一電池組及/或該一或多個第二電池組以外，其餘具有相對較低額定電壓的各該第一電池組串聯連接各該第一低單向導通元件以及各該第二電池組串聯連接一第二單向導通元件。
  20. 如請求項19所述的電源供應裝置，其中各該第一高單向導通元件的正引腳串聯連接對應的該第一電池組的正極端，各該第二單向導通元件的正引腳串聯連接對應的該第二電池組的正極端。
  21. 如請求項19所述的電源供應裝置，其中各該第一高單向導通元件的負引腳串聯連接對應的該第一電池組的負極端，各該第二單向導通元件的負引腳串聯連接對應的該第二電池組的負極端。
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