US20190101254A1 - Method for manufacturing light strip and winding rack for manufacturing the same - Google Patents

Method for manufacturing light strip and winding rack for manufacturing the same Download PDF

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Publication number
US20190101254A1
US20190101254A1 US16/029,357 US201816029357A US2019101254A1 US 20190101254 A1 US20190101254 A1 US 20190101254A1 US 201816029357 A US201816029357 A US 201816029357A US 2019101254 A1 US2019101254 A1 US 2019101254A1
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US
United States
Prior art keywords
wires
winding
winding rack
hollow portion
led chips
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US16/029,357
Inventor
Nai-Chen Tsai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Cosmo Lighting Inc
Original Assignee
Cosmo Lighting Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cosmo Lighting Inc filed Critical Cosmo Lighting Inc
Priority to US16/029,357 priority Critical patent/US20190101254A1/en
Assigned to COSMO LIGHTING INC. reassignment COSMO LIGHTING INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: TSAI, NAI-CHEN
Publication of US20190101254A1 publication Critical patent/US20190101254A1/en
Abandoned legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/12—Moulds or cores; Details thereof or accessories therefor with incorporated means for positioning inserts, e.g. labels
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S4/00—Lighting devices or systems using a string or strip of light sources
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P21/00—Machines for assembling a multiplicity of different parts to compose units, with or without preceding or subsequent working of such parts, e.g. with programme control
    • B23P21/004—Machines for assembling a multiplicity of different parts to compose units, with or without preceding or subsequent working of such parts, e.g. with programme control the units passing two or more work-stations whilst being composed
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/42—Moulds or cores; Details thereof or accessories therefor characterised by the shape of the moulding surface, e.g. ribs or grooves
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
    • B29C39/02—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles
    • B29C39/10—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. casting around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H54/00—Winding, coiling, or depositing filamentary material
    • B65H54/02—Winding and traversing material on to reels, bobbins, tubes, or like package cores or formers
    • B65H54/10—Winding and traversing material on to reels, bobbins, tubes, or like package cores or formers for making packages of specified shapes or on specified types of bobbins, tubes, cores, or formers
    • B65H54/14—Winding and traversing material on to reels, bobbins, tubes, or like package cores or formers for making packages of specified shapes or on specified types of bobbins, tubes, cores, or formers on tubes, cores, or formers having generally parallel sides, e.g. cops or packages to be loaded into loom shuttles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H75/00—Storing webs, tapes, or filamentary material, e.g. on reels
    • B65H75/02—Cores, formers, supports, or holders for coiled, wound, or folded material, e.g. reels, spindles, bobbins, cop tubes, cans, mandrels or chucks
    • B65H75/04—Kinds or types
    • B65H75/08—Kinds or types of circular or polygonal cross-section
    • B65H75/14—Kinds or types of circular or polygonal cross-section with two end flanges
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H75/00—Storing webs, tapes, or filamentary material, e.g. on reels
    • B65H75/50—Methods of making reels, bobbins, cop tubes, or the like by working an unspecified material, or several materials
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/90—Methods of manufacture
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S4/00—Lighting devices or systems using a string or strip of light sources
    • F21S4/10—Lighting devices or systems using a string or strip of light sources with light sources attached to loose electric cables, e.g. Christmas tree lights
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S4/00—Lighting devices or systems using a string or strip of light sources
    • F21S4/20—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports
    • F21S4/22—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports flexible or deformable, e.g. into a curved shape
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S4/00—Lighting devices or systems using a string or strip of light sources
    • F21S4/20—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports
    • F21S4/22—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports flexible or deformable, e.g. into a curved shape
    • F21S4/26—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports flexible or deformable, e.g. into a curved shape of rope form, e.g. LED lighting ropes, or of tubular form
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/04—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages the fastening being onto or by the light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/0015—Fastening arrangements intended to retain light sources
    • F21V19/0025—Fastening arrangements intended to retain light sources the fastening means engaging the conductors of the light source, i.e. providing simultaneous fastening of the light sources and their electric connections
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/001—Arrangement of electric circuit elements in or on lighting devices the elements being electrical wires or cables
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/26—Power supply means, e.g. regulation thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B7/00—Insulated conductors or cables characterised by their form
    • H01B7/02—Disposition of insulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
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    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
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    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/13—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L33/00
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    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/20—Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders
    • H01M50/204—Racks, modules or packs for multiple batteries or multiple cells
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/20—Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders
    • H01M50/269—Mechanical means for varying the arrangement of batteries or cells for different uses, e.g. for changing the number of batteries or for switching between series and parallel wiring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/28—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for wire processing before connecting to contact members, not provided for in groups H01R43/02 - H01R43/26
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02G—INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
    • H02G1/00—Methods or apparatus specially adapted for installing, maintaining, repairing or dismantling electric cables or lines
    • H02G1/12—Methods or apparatus specially adapted for installing, maintaining, repairing or dismantling electric cables or lines for removing insulation or armouring from cables, e.g. from the end thereof
    • H02G1/1202—Methods or apparatus specially adapted for installing, maintaining, repairing or dismantling electric cables or lines for removing insulation or armouring from cables, e.g. from the end thereof by cutting and withdrawing insulation
    • H02G1/1248—Machines
    • H02G1/1251—Machines the cutting element not rotating about the wire or cable
    • H02G1/1253—Machines the cutting element not rotating about the wire or cable making a transverse cut
    • H02G1/1256—Machines the cutting element not rotating about the wire or cable making a transverse cut using wire or cable-clamping means
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
    • H02J7/00—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries
    • H02J7/0063—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries with circuits adapted for supplying loads from the battery
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
    • H02J7/00—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries
    • H02J7/007—Regulation of charging or discharging current or voltage
    • H02J7/00712—Regulation of charging or discharging current or voltage the cycle being controlled or terminated in response to electric parameters
    • H02J7/007182—Regulation of charging or discharging current or voltage the cycle being controlled or terminated in response to electric parameters in response to battery voltage
    • H02J7/007184—Regulation of charging or discharging current or voltage the cycle being controlled or terminated in response to electric parameters in response to battery voltage in response to battery voltage gradient
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/10—Controlling the intensity of the light
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/40—Details of LED load circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/40—Details of LED load circuits
    • H05B45/42—Antiparallel configurations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/40—Details of LED load circuits
    • H05B45/44—Details of LED load circuits with an active control inside an LED matrix
    • H05B45/48—Details of LED load circuits with an active control inside an LED matrix having LEDs organised in strings and incorporating parallel shunting devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B47/00—Circuit arrangements for operating light sources in general, i.e. where the type of light source is not relevant
    • H05B47/10—Controlling the light source
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/747—Lightning equipment
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
    • F21Y2103/10—Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
    • H02J2007/0067—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B20/00—Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps
    • Y02B20/40—Control techniques providing energy savings, e.g. smart controller or presence detection
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10—Energy storage using batteries
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
    • Y02W30/00—Technologies for solid waste management
    • Y02W30/50—Reuse, recycling or recovery technologies
    • Y02W30/82—Recycling of waste of electrical or electronic equipment [WEEE]

Definitions

  • the present disclosure relates to a method for manufacturing a light strip and a winding rack for manufacturing a light strip, and in particular, to a method for automatic production of an LED light strip and a winding rack for manufacturing a light strip.
  • LED light strips are often used in festive occasions or special occasions as decorations; however, conventional methods for manufacturing the LED light strips cannot achieve automatic production, leading to low productivity and high costs.
  • the present disclosure is to provide a method for manufacturing a light strip that can automatically manufacture an LED light strip so as to lower the costs associated therewith.
  • a method for manufacturing a light strip includes at least the following steps:
  • winding a plurality of wires providing a winding rack having a wire fixing portion at both ends of the winding rack, forming a hollow portion at the winding rack along a longitudinal direction, and winding the plurality of the wires around the winding rack.
  • Each of the wires has an insulation layer, and the wires are repeatedly wound across the hollow portion;
  • removing the insulation layer removing a part of the insulation layer from each of the wire along the hollow portion to expose a core wire therein;
  • Another purpose of the present disclosure is to provide a winding rack for manufacturing a light strip that can participate in automatic production of the LED light strip to lower costs.
  • a winding rack for manufacturing a light strip has cross sections that are substantially the same along a longitudinal direction, a top surface, at least one hollow portion along the longitudinal direction and a plurality of anti-slip strips configured around the winding rack and partially exposed to the top surface.
  • FIG. 1 is a flow chart of a method for manufacturing a light strip according to the present disclosure.
  • FIG. 2 is a schematic view of a winding rack wound with wires according to the present disclosure.
  • FIG. 2A is a partially enlarged view of the winding rack according to the present disclosure.
  • FIG. 2B is a sectional view of the winding rack according to the present disclosure.
  • FIG. 3 is a schematic view of removing an insulation layer according to the present disclosure.
  • FIG. 4 is a top view of the wires after the removal of the insulation layer according to the present disclosure.
  • FIG. 5 is a schematic view of spreading a conductive material according to the present disclosure.
  • FIG. 6 is a schematic view of attaching a chip according to the present disclosure.
  • FIG. 7 is a schematic view of fixing the chip according to the present disclosure.
  • FIG. 8 is a schematic view of dispensing glue according to the present disclosure.
  • FIG. 9 is a schematic view of the winding rack and a carrier according to the present disclosure.
  • FIG. 10 is a sectional view of a winding rack combination according to the present disclosure.
  • FIG. 11 is a schematic view of a solder paste groove seat according to the present disclosure.
  • FIG. 12 is a sectional view of another winding rack combination according to the present disclosure.
  • FIG. 1 is a flow chart of a method for manufacturing a light strip according to the present disclosure.
  • the method of the present disclosure includes the steps of: winding a plurality of wires S 10 , removing an insulation layer S 20 , spreading a conductive material S 30 , attaching chips S 40 , fixing the chips in position S 50 , testing and maintaining S 60 , dispensing glue S 70 , solidifying the glue S 80 and extracting the light strip S 90 , which will be respectively described in detail in the following.
  • a winding rack 10 is provided in the step of winding a plurality of wires S 10 .
  • a wire fixing portion 12 is formed at both ends of the winding rack 10 .
  • a hollow portion 14 is formed at the winding rack 10 along a longitudinal direction of the winding rack 10 .
  • the winding rack 10 may be a metal component, such as but not limited to a metal component made of an aluminum material extruded from aluminum, or may be made of a thermal plastic material.
  • the hollow portion 14 may be a partially open groove.
  • the winding rack 10 preferably has a plurality of anti-slip strips 15 configured around the winding rack 10 and being able to slightly protrude from a surface of the winding rack 10 , but not limited thereto, so as to prevent wires W 1 and W 2 from slipping.
  • the anti-slip strips 15 may be, for example, rubber, plastic, and so on.
  • two of the anti-slip strips 15 are disposed opposite to each other at two sides of the hollow portion 14 of the winding rack 10 , and partially exposed from the top surface of the winding rack 10 .
  • the term “exposed from” may include the meaning of “protruding from”.
  • the anti-slip strips 15 are replaceably configured on the winding rack 10 .
  • the plurality of the wires W 1 and W 2 are wound around the winding rack 10 in a plurality of coils so that the wires W 1 and W 2 extend repeatedly across the hollow portion 14 .
  • the ends of the wires W 1 and W 2 are fixedly wound to the wire fixing portion 12 .
  • the wire fixing portion 12 includes a concave portion 120 and a winding pin 123 .
  • the concave portion 120 is formed at an end of the winding rack 10 , and the winding pin 123 is fixed in the concave portion 120 , wherein an end of the wires W 1 and W 2 is wound to the winding pin 123 .
  • a motor M rotates the winding rack 10 .
  • the wires W 1 and W 2 may be, for example, enameled wires, but are not limited thereto.
  • Each of the wires W 1 and W 2 has an insulation layer covered on the outside (the outer layer shown in FIG. 2 , not labeled).
  • the insulation layer of each of the wires W 1 and W 2 can be an enamel covering.
  • the two wires W 1 and W 2 are taken as an exemplary example, but the present disclosure is not limited thereto.
  • the number of the wires may be two or more, depending on the requirements of the light strip.
  • a part of the insulation layer is removed from each of the wires W 1 and W 2 along the hollow portion 14 to expose core wires C 1 and C 2 .
  • removal of the insulation layer may be performed by a laser light source L emitting a laser ray to radiate the plurality of the wires W 1 and W 2 along the hollow portion 14 .
  • the process of attaching and fixing the LED chips C include the steps S 30 , S 40 and S 50 .
  • a conductive material S is coated on each of the core wires C 1 and C 2 exposed from the wires W 1 and W 2 .
  • the conductive material S can be coated at a preset position.
  • the conductive material S may be a solder paste, a silver paste, a conductive paste and so on, but is not limited thereto.
  • a practical example is given by using the solder paste as the conductive material S, and the specific steps are as follows. Referring to FIG. 9 , for batch production, this embodiment preferably provides a carrier 100 .
  • the plurality of the winding racks 10 with the wires W 1 and W 2 wound thereon are fixed side by side to the carrier 100 , the carrier 100 has a pair of positioning seats 102 , each of the positioning seats 102 is formed with a plurality of insertion concaves 1020 , and two ends of each of the winding racks 10 are respectively placed in the insertion concaves 1020 to print the conductive material S on the wires W 1 and W 2 in a printing manner.
  • a pair of grips 103 can also be configured on two sides of the carrier 100 .
  • the plurality of the LED chips C are placed on the conductive material S in the step of attaching the LED chips C.
  • chip placing positions where the insulated layers are removed from the wires W 1 and W 2 are obtained by visual determination, and the LED chips C are held and moved by a suction head 30 to the chip placing positions.
  • the step of fixing the chips in position S 50 the conductive material S is baked along the hollow portion 14 of the winding rack 10 at a predetermined temperature so that tin powder in the conductive material S is melted to fixedly connect the LED chips C to the wires W 1 and W 2 .
  • the step of fixing the chips includes baking the positions where the LED chips C are disposed by a hot air device H along the hollow portion 14 .
  • a purpose of the step of testing and maintaining S 60 is to inspect whether the LED chips C are able to emit light by being electrically connected to the wires W 1 and W 2 , before being fixedly welded. If the LED chips C fail to emit light, they should be checked and replaced.
  • the LED chip C is covered by a glue g with a glue gun G.
  • the glue g is usually solidified by baking with, for example, an oven.
  • the plurality of the wires W 1 and W 2 are unwound from the winding rack 10 .
  • the winding rack 10 in the method for manufacturing the light strip of the present disclosure, besides having cross sections that are substantially the same along a longitudinal direction, the winding rack 10 has a top surface, a hollow portion 14 along the longitudinal direction, and a plurality of anti-slip strips 15 configured around the winding rack 10 and partially exposed from the top surface. Further, the present disclosure provides a winding rack 10 for manufacturing the light strip having relevant auxiliary elements.
  • the winding rack 10 further has a top wire seat 20 and an outer seat 30 .
  • the top wire seat 20 is movably inserted in the winding rack 10 , the winding rack 10 is placed in the outer seat 30 , the top wire seat 20 includes a bottom 21 and a protrusion 22 protruding upward from the bottom 21 , the bottom 21 of the top wire seat 20 has a bottom pad 28 , and a wire groove 220 can be formed on the top surface of the top wire seat 20 to fix the wires W 1 and W 2 in position so as to prevent slippage.
  • a depth of the wire groove 220 is smaller than the diameter of the wires W 1 and W 2 , and the wires W 1 and W 2 can be slightly exposed from the top surface of the top wire seat 20 .
  • FIG. 11 shows another way of coating the conductive material.
  • a solder paste groove seat 95 is provided, and the winding rack 10 is inverted to coat the conductive material S on the wires W 1 and W 2 .
  • a winding rack 10 a has a plurality of insertion portions 17 a and 17 b , and a bottom 21 a of a top wire seat 20 a can be inserted into the different insertion portions 17 a and 17 b such that the length of winding the wires W 1 and W 2 would be different, namely, a circumference of the wires W 1 and W 2 would be different. Accordingly, the chip placing positions of the LED chips can be adjusted to manufacture a light strip having the LED chips with different spacing.
  • the feature of the present disclosure is that the LED light strip can be automatically manufactured to lower the costs associated therewith.

Abstract

A method for manufacturing a light strip at least includes: winding a plurality of wires, removing an insulation layer, and attaching and fixing LED chips. The step of winding the wires includes providing a winding rack having a wire fixing portion at both ends of the winding rack, forming the winding rack with a hollow portion along a longitudinal direction, and winding the wires around the winding rack, wherein each of the wires has an insulation layer, and the wires are repeatedly wound across the hollow portion. The step of removing the insulation layer includes removing a part of the insulation layer from each of the wires to expose a core wire therein. The step of attaching and fixing the LED chips is attaching and fixing the LED chips on the core wires of the wires. Accordingly, the LED chips are firmly and electrically connected to the wires.

Description

    CROSS-REFERENCE TO RELATED PATENT APPLICATION
  • This Application claims priority to U.S. provisional application Ser. No. 62/565,327, filed Sep. 29, 2017 entitled LIGHT STRIP ASSEMBLY, and U.S. provisional application Ser. No. 62/584,619, filed Nov. 10, 2017, entitled LIGHT STRIP ASSEMBLY, now pending.
    • FIELD OF THE DISCLOSURE
  • The present disclosure relates to a method for manufacturing a light strip and a winding rack for manufacturing a light strip, and in particular, to a method for automatic production of an LED light strip and a winding rack for manufacturing a light strip.
    • BACKGROUND OF THE DISCLOSURE
  • LED light strips are often used in festive occasions or special occasions as decorations; however, conventional methods for manufacturing the LED light strips cannot achieve automatic production, leading to low productivity and high costs.
    • SUMMARY OF THE DISCLOSURE
  • The present disclosure is to provide a method for manufacturing a light strip that can automatically manufacture an LED light strip so as to lower the costs associated therewith.
  • In order to solve the technical issue mentioned above, according to one of the technical solutions of the present disclosure, a method for manufacturing a light strip is provided and includes at least the following steps:
  • winding a plurality of wires: providing a winding rack having a wire fixing portion at both ends of the winding rack, forming a hollow portion at the winding rack along a longitudinal direction, and winding the plurality of the wires around the winding rack. Each of the wires has an insulation layer, and the wires are repeatedly wound across the hollow portion;
  • removing the insulation layer: removing a part of the insulation layer from each of the wire along the hollow portion to expose a core wire therein; and
  • attaching and fixing a plurality of LED chips on the core wires of the wires so that the LED chips are firmly and electrically connected to the wires.
  • Another purpose of the present disclosure is to provide a winding rack for manufacturing a light strip that can participate in automatic production of the LED light strip to lower costs.
  • In order to solve the above technical issue, according to one of the technical solutions of the present disclosure, a winding rack for manufacturing a light strip is provided. The winding rack has cross sections that are substantially the same along a longitudinal direction, a top surface, at least one hollow portion along the longitudinal direction and a plurality of anti-slip strips configured around the winding rack and partially exposed to the top surface.
  • These and other aspects of the present disclosure will become apparent from the following description of the embodiment taken in conjunction with the following drawings and their captions, although variations and modifications therein may be affected without departing from the spirit and scope of the novel concepts of the disclosure.
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • The present disclosure will become more fully understood from the detailed description and the accompanying drawings, in which:
  • FIG. 1 is a flow chart of a method for manufacturing a light strip according to the present disclosure.
  • FIG. 2 is a schematic view of a winding rack wound with wires according to the present disclosure.
  • FIG. 2A is a partially enlarged view of the winding rack according to the present disclosure.
  • FIG. 2B is a sectional view of the winding rack according to the present disclosure.
  • FIG. 3 is a schematic view of removing an insulation layer according to the present disclosure.
  • FIG. 4 is a top view of the wires after the removal of the insulation layer according to the present disclosure.
  • FIG. 5 is a schematic view of spreading a conductive material according to the present disclosure.
  • FIG. 6 is a schematic view of attaching a chip according to the present disclosure.
  • FIG. 7 is a schematic view of fixing the chip according to the present disclosure.
  • FIG. 8 is a schematic view of dispensing glue according to the present disclosure.
  • FIG. 9 is a schematic view of the winding rack and a carrier according to the present disclosure.
  • FIG. 10 is a sectional view of a winding rack combination according to the present disclosure.
  • FIG. 11 is a schematic view of a solder paste groove seat according to the present disclosure.
  • FIG. 12 is a sectional view of another winding rack combination according to the present disclosure.
    •  DETAILED DESCRIPTION OF THE EXEMPLARY EMBODIMENTS
  • FIG. 1 is a flow chart of a method for manufacturing a light strip according to the present disclosure. The method of the present disclosure includes the steps of: winding a plurality of wires S10, removing an insulation layer S20, spreading a conductive material S30, attaching chips S40, fixing the chips in position S50, testing and maintaining S60, dispensing glue S70, solidifying the glue S80 and extracting the light strip S90, which will be respectively described in detail in the following.
  • Referring to FIG. 2 to FIG. 2B, a winding rack 10 is provided in the step of winding a plurality of wires S10. A wire fixing portion 12 is formed at both ends of the winding rack 10. A hollow portion 14 is formed at the winding rack 10 along a longitudinal direction of the winding rack 10. The winding rack 10 may be a metal component, such as but not limited to a metal component made of an aluminum material extruded from aluminum, or may be made of a thermal plastic material. The hollow portion 14 may be a partially open groove.
  • As shown in FIG. 2 and FIG. 2B, regarding the winding rack 10 made of metal, the winding rack 10 preferably has a plurality of anti-slip strips 15 configured around the winding rack 10 and being able to slightly protrude from a surface of the winding rack 10, but not limited thereto, so as to prevent wires W1 and W2 from slipping. The anti-slip strips 15 may be, for example, rubber, plastic, and so on. In this embodiment, two of the anti-slip strips 15 are disposed opposite to each other at two sides of the hollow portion 14 of the winding rack 10, and partially exposed from the top surface of the winding rack 10. In the present disclosure, the term “exposed from” may include the meaning of “protruding from”. Preferably, the anti-slip strips 15 are replaceably configured on the winding rack 10.
  • In FIG. 2, the plurality of the wires W1 and W2 are wound around the winding rack 10 in a plurality of coils so that the wires W1 and W2 extend repeatedly across the hollow portion 14. During the winding process, the ends of the wires W1 and W2 are fixedly wound to the wire fixing portion 12. In FIG. 2A, the wire fixing portion 12 includes a concave portion 120 and a winding pin 123. The concave portion 120 is formed at an end of the winding rack 10, and the winding pin 123 is fixed in the concave portion 120, wherein an end of the wires W1 and W2 is wound to the winding pin 123. Then, a motor M rotates the winding rack 10. The wires W1 and W2 may be, for example, enameled wires, but are not limited thereto. Each of the wires W1 and W2 has an insulation layer covered on the outside (the outer layer shown in FIG. 2, not labeled). When the wires W1 and W2 are the enameled wires, the insulation layer of each of the wires W1 and W2 can be an enamel covering. In this embodiment, the two wires W1 and W2 are taken as an exemplary example, but the present disclosure is not limited thereto. The number of the wires may be two or more, depending on the requirements of the light strip.
  • Referring to FIG. 3 and FIG. 4, in the step of removing an insulation layer in S20, a part of the insulation layer is removed from each of the wires W1 and W2 along the hollow portion 14 to expose core wires C1 and C2. In FIG. 3, removal of the insulation layer may be performed by a laser light source L emitting a laser ray to radiate the plurality of the wires W1 and W2 along the hollow portion 14.
  • Then, LED chips C are attached and fixed to the core wires C1 and C2 of the wires W1 and W2, so that the LED chips C are fixedly connected to the wires W1 and W2. Specifically, the process of attaching and fixing the LED chips C include the steps S30, S40 and S50.
  • Referring to FIG. 5, in the step of spreading a conductive material S30, a conductive material S is coated on each of the core wires C1 and C2 exposed from the wires W1 and W2. For example, with a combination of a screen plate 90 and a scraper 92, the conductive material S can be coated at a preset position. The conductive material S may be a solder paste, a silver paste, a conductive paste and so on, but is not limited thereto. A practical example is given by using the solder paste as the conductive material S, and the specific steps are as follows. Referring to FIG. 9, for batch production, this embodiment preferably provides a carrier 100. The plurality of the winding racks 10 with the wires W1 and W2 wound thereon are fixed side by side to the carrier 100, the carrier 100 has a pair of positioning seats 102, each of the positioning seats 102 is formed with a plurality of insertion concaves 1020, and two ends of each of the winding racks 10 are respectively placed in the insertion concaves 1020 to print the conductive material S on the wires W1 and W2 in a printing manner. A pair of grips 103 can also be configured on two sides of the carrier 100.
  • Referring to FIG. 6, the plurality of the LED chips C are placed on the conductive material S in the step of attaching the LED chips C. In this embodiment, chip placing positions where the insulated layers are removed from the wires W1 and W2 are obtained by visual determination, and the LED chips C are held and moved by a suction head 30 to the chip placing positions.
  • Referring to FIG. 7, in the step of fixing the chips in position S50, the conductive material S is baked along the hollow portion 14 of the winding rack 10 at a predetermined temperature so that tin powder in the conductive material S is melted to fixedly connect the LED chips C to the wires W1 and W2. In this embodiment, the step of fixing the chips includes baking the positions where the LED chips C are disposed by a hot air device H along the hollow portion 14.
  • A purpose of the step of testing and maintaining S60 is to inspect whether the LED chips C are able to emit light by being electrically connected to the wires W1 and W2, before being fixedly welded. If the LED chips C fail to emit light, they should be checked and replaced.
  • In the step of dispensing glue S70, referring to FIG. 8, the LED chip C is covered by a glue g with a glue gun G.
  • In the step of solidifying the glue S80, the glue g is usually solidified by baking with, for example, an oven.
  • In the step of extracting the light strip S90, the plurality of the wires W1 and W2 are unwound from the winding rack 10.
  • Referring to FIG. 10 and FIG. 11, in the method for manufacturing the light strip of the present disclosure, besides having cross sections that are substantially the same along a longitudinal direction, the winding rack 10 has a top surface, a hollow portion 14 along the longitudinal direction, and a plurality of anti-slip strips 15 configured around the winding rack 10 and partially exposed from the top surface. Further, the present disclosure provides a winding rack 10 for manufacturing the light strip having relevant auxiliary elements. The winding rack 10 further has a top wire seat 20 and an outer seat 30. The top wire seat 20 is movably inserted in the winding rack 10, the winding rack 10 is placed in the outer seat 30, the top wire seat 20 includes a bottom 21 and a protrusion 22 protruding upward from the bottom 21, the bottom 21 of the top wire seat 20 has a bottom pad 28, and a wire groove 220 can be formed on the top surface of the top wire seat 20 to fix the wires W1 and W2 in position so as to prevent slippage. A depth of the wire groove 220 is smaller than the diameter of the wires W1 and W2, and the wires W1 and W2 can be slightly exposed from the top surface of the top wire seat 20.
  • FIG. 11 shows another way of coating the conductive material. A solder paste groove seat 95 is provided, and the winding rack 10 is inverted to coat the conductive material S on the wires W1 and W2.
  • As shown in FIG. 12, a winding rack 10 a has a plurality of insertion portions 17 a and 17 b, and a bottom 21 a of a top wire seat 20 a can be inserted into the different insertion portions 17 a and 17 b such that the length of winding the wires W1 and W2 would be different, namely, a circumference of the wires W1 and W2 would be different. Accordingly, the chip placing positions of the LED chips can be adjusted to manufacture a light strip having the LED chips with different spacing.
  • The feature of the present disclosure is that the LED light strip can be automatically manufactured to lower the costs associated therewith.
  • The foregoing description of the exemplary embodiments of the disclosure has been presented only for the purposes of illustration and description and is not intended to be exhaustive or to limit the disclosure to the precise forms disclosed. Many modifications and variations are possible in light of the above teaching.
  • The embodiments were chosen and described in order to explain the principles of the disclosure and their practical application so as to enable others skilled in the art to utilize the disclosure and various embodiments and with various modifications as are suited to the particular use contemplated. Alternative embodiments will become apparent to those skilled in the art to which the present disclosure pertains without departing from its spirit and scope.

Claims (13)

What is claimed is:
1. A method for manufacturing a light strip, comprising:
winding a plurality of wires: providing a winding rack having a wire fixing portion at both ends of the winding rack, forming a hollow portion at the winding rack along a longitudinal direction, winding the plurality of the wires around the winding rack, wherein each of the wires has an insulation layer, and the wires are repeatedly wound across the hollow portion;
removing the insulation layer: removing a part of the insulation layer from each of the wires along the hollow portion to expose a core wire therein; and
attaching and fixing a plurality of LED chips on the core wires of the wires to have the LED chips firmly and electrically connected to the wires.
2. The method of claim 1, wherein the wire fixing portion includes a concave portion and a winding pin, the concave portion is formed at an end of the winding rack, and the winding pin is fixed in the concave portion, and wherein an end of the wires is fixedly wound to the winding pin.
3. The method of claim 1, wherein the winding rack further has a plurality of anti-slip strips configured around the winding rack to prevent the wires from slipping.
4. The method of claim 3, wherein two of the anti-slip strips are opposite to each other at two sides of the hollow portion of the winding rack and partially exposed on the top surface of the winding rack.
5. The method of claim 1, wherein the removal of the insulation layer is performed by radiating the plurality of the wires along the hollow portion with a laser ray.
6. The method of claim 1, wherein the hollow portion is a partially open groove.
7. The method of claim 1, wherein the attaching and fixing of the plurality of LED chips includes the steps of:
spreading a conductive material: coating the conductive material on each of the core wires exposed from each of the wires;
attaching the chips: placing the plurality of LED chips on the conductive material; and
fixing the chips in position: fixedly connecting the LED chips on the wires; and
wherein the method of claim 1 further includes:
dispensing glue: covering the LED chips in the glue along the hollow portion;
solidifying the glue: solidifying the glue; and
extracting the light strip: unwinding the plurality of the wires from the winding rack.
8. The method of claim 7, wherein the conductive material is a solder paste and in the step of fixing the chips in position, the solder paste is baked along the hollow portion at a predetermined temperature to fixedly connect the LED chips to the wires.
9. The method of claim 7, wherein the conductive material is a solder paste, and the step of spreading the conductive material includes providing a carrier to fix the plurality of the winding racks wound with the wires to the carrier side by side, the carrier having a pair of positioning seats, each positioning seat forming a plurality of insertion concaves, and two ends of each of the winding racks being respectively placed in the insertion concaves to print the conductive material on the wires in a printing manner.
10. The method of claim 9, wherein the attachment of the chips includes obtaining chip placing positions where the insulated layers are removed from the wires by visual determination, and holding and moving the LED chips by a suction head to the chip placing positions.
11. The method of claim 1, wherein the fixing of the chips includes baking the positions where the LED chips are disposed by a hot air device along the hollow portion.
12. A winding rack for manufacturing a light strip, comprising cross sections that are substantially the same along a longitudinal direction, a top surface, at least one hollow portion along the longitudinal direction, and a plurality of anti-slip strips configured around the winding rack and partially exposed from the top surface.
13. The winding rack of claim 12, wherein the winding rack further comprises a top wire seat movably inserted in the winding rack.
US16/029,357 2017-09-29 2018-07-06 Method for manufacturing light strip and winding rack for manufacturing the same Abandoned US20190101254A1 (en)

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US201762565327P 2017-09-29 2017-09-29
US201762584619P 2017-11-10 2017-11-10
US16/029,357 US20190101254A1 (en) 2017-09-29 2018-07-06 Method for manufacturing light strip and winding rack for manufacturing the same

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US16/059,848 Active US10264631B1 (en) 2017-09-29 2018-08-09 Light set circuit with time control function
US16/059,923 Active 2039-04-10 US10993304B2 (en) 2017-09-29 2018-08-09 Wire, stripping method and light strip
US16/142,084 Active US10609800B2 (en) 2017-09-29 2018-09-26 Light string and automatic assembly apparatus and method thereof
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US16/059,923 Active 2039-04-10 US10993304B2 (en) 2017-09-29 2018-08-09 Wire, stripping method and light strip
US16/142,084 Active US10609800B2 (en) 2017-09-29 2018-09-26 Light string and automatic assembly apparatus and method thereof
US16/143,990 Active US10631388B2 (en) 2017-09-29 2018-09-27 Power supply device
US16/145,268 Abandoned US20190103505A1 (en) 2017-09-29 2018-09-28 Apparatus and method for attaching led chips

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