TWM516227U - Surface attachment type LED module molding structure - Google Patents

Description

Forming structure of surface-mount LED module

The present invention relates to a molding structure of a surface-mount LED module, in particular to a design of a surface-mounted LED light bar, a positioning mold and a separation mold, which can process a large number of LED lamps on a circuit board at a time, and has a manufacturing process. The molding structure of the surface-mount LED module that is simple and cost-effective.

LED light-emitting diodes are widely used in daily life, and LED products can be seen from the common indicators on electrical products to outdoor signs.

Conventional dot matrix modules are used to crimp the pins on the PCB, fix the LED chips, and solder the wires. After that, after the test is completed, the semi-finished product of the LED solid wafer soldering wire is implanted into a plastic reflective cover (the process of injecting epoxy resin first, vacuuming and removing the bubble), and finally, baking and heating, The glue is solidified to form a dot matrix module. After the dot matrix module is sealed by the glue and sealed into the plastic reflective cover, if there is a bad quality (for example, the LED cannot be illuminated, the contact pin on the PCB is in poor contact, or the plating on the PCB is poor), the conventional dot matrix module has The completed machining program is completed, so it will not be easy to repair, and the entire dot matrix module must be replaced. In addition, the entire dot matrix module must be replaced or repaired if it is defective during the testing process of the semi-finished product. Therefore, if any bad situation occurs, it must be discarded to increase the cost. In addition, the dot matrix module is implanted on the module board according to the level, after welding or wave soldering. Into a module module. If the module of the module is defective, you must remove the module and discard it.

There is also a conventional surface-mounted lamp (such as SMD 3528, 5050 specifications, etc.), which is made of iron and copper as the carrier, and is first stamped, and then injection molded into a bowl-shaped outer casing to form a bracket. The wafer is implanted into the cup of the stent to be fixed and soldered, and then glued to the glue to cure. The formed SMD lamp is stamped to separate the lamp from the original support, and the lamp is tested to remove the bad, and then the light level is graded, and then the same level is taped to become the finished product of the SMD lamp. The SMD lamp is then assembled and processed by a placement machine, and the SMD lamp is attached to a fixed pad on the module board, and is reheated by reflow soldering to form a surface mount module.

If the above surface mount module is defective, it is necessary to remove one of the SMD lamps. It is convenient, but in production, the cost is too high, and it costs a separate placement machine, and the work time of the SMD lamp on the module is quite time-consuming and labor-intensive. In addition, generally only a single unit can be used. The SMD lamp is fixed on the circuit board, and it is not possible to fix a plurality of SMD lamps to the circuit board in one time, which is time consuming and labor-intensive. Therefore, the conventional surface-mount module obviously still has a missing existence, and needs to be improved.

The detailed features and advantages of the present invention are described in detail below in the embodiments, which are sufficient for any skilled person to understand the technical contents of the present invention and to implement the contents, the scope of the patent application and the drawings according to the present specification. Anyone skilled in the art can easily understand the purpose and advantages associated with this creation.

The main purpose of this creation is to form an LED light bar by connecting a plurality of LED lights to each other through the design of the surface-mounted LED light bar, and then assembling the LED light bar on the circuit board, thereby facilitating one-time processing. A large number of LED lights are on the board. And, by positioning the mold, it is easy to The LED strips are aligned on the circuit board to accurately connect the LEDs and the positive and negative poles on the board. In addition, by disassembling the connecting blocks by using a separating mold, each LED lamp on each LED strip can be independently positioned on the circuit board to facilitate the covering of the lamp cover. Thereby, the molding structure design of the surface-mount LED module has a simple manufacturing process, no semi-finished products are not repaired, and directly seals into a finished product, and a few defective LED lights in the finished product are cut off, and the entire LED light bar is not discarded, and there is a table. The convenience of attaching the lamp, but without the need for splitting, braiding, and surface-applied patching, has the effect of reducing the manufacturing cost.

In order to achieve the above object, the present invention provides a molded structure of a surface-mount LED module, which comprises a circuit board, a plurality of LED light strips, a positioning mold and a separation mold; wherein the circuit board is arranged with a plurality of separation holes, And a plurality of conductive vias are disposed on one side of the circuit board, and the conductive vias are respectively connected to and pass through the circuit board to the positive and negative electrodes on the back surface; the plurality of LED light strips are disposed on the surface of the circuit board, and each LED The light bar comprises a plurality of LED lights and a connecting block connecting the two LED lights, each connecting block is provided with a positioning hole and a plurality of pre-cut segments, each pre-cut segment is formed between each connecting block and each LED lamp and a positioning die is disposed on the connecting block of the positioning hole; the positioning die is disposed on the bottom surface of the circuit board, the positioning die includes at least two guiding pins, each guiding pin passes through the corresponding separating holes to each positioning hole; and the separating die replaces the positioning die The separation mold is disposed on the bottom surface of the circuit board, and the separation mold includes at least two protruding needles, and the protruding needles penetrate the corresponding separation holes to push against the outer peripheral wall of each positioning hole, so that each connecting block and each LED lamp are broken by each pre-cutting segment. Separate so that each L The LED lights on the ED light bar are independently positioned on the circuit board, and a large number of LED lights can be processed on the circuit board at one time. After the LED lights cover the lamp cover, the surface-mounted LED module products are completed, and the manufacturing process is simple. The effect of reducing costs.

According to an embodiment of the present invention, each of the pre-cut segments of each of the LED strips has a depth of 2/3 of the thickness of the connecting block.

According to an embodiment of the present invention, each pre-cut segment of each LED strip is formed in each connection Block one side, the other side, or both.

According to an embodiment of the present invention, each of the protruding needles of the separation mold has an outer diameter larger than an outer diameter of each positioning guide needle of the positioning mold.

According to an embodiment of the present invention, the aperture of each of the separation holes on the circuit board is larger than the aperture of each of the positioning holes on each of the LED strips.

According to an embodiment of the present invention, a plurality of lampshades are further included, and each of the lampshades covers a circuit board at each LED lamp where each of the LED light bars has been separated from each of the connection blocks.

1‧‧‧Molded structure

2‧‧‧ boards

3‧‧‧Separation hole

4‧‧‧LED strips

5‧‧‧LED lights

6‧‧‧Connection block

7‧‧‧Positioning holes

8‧‧‧ Precut

9‧‧‧ Positioning mold

10‧‧‧ guide needle

11‧‧‧Separation mould

12‧‧‧ needle

13‧‧‧shade

Fig. 1 is a schematic view showing the appearance of an embodiment of the present invention.

Fig. 2 is a schematic view showing the appearance of the creation partially enlarged when assembled using a positioning mold.

Figure 3: Partial enlarged view of a pre-cut segment of an LED light strip.

Figure 4: Partial enlarged view of the pre-cut segment of another LED light strip for this creation.

Figure 5: A side view of a partial enlargement of the creation of the creation using a positioning mold.

Figure 6: A side view of a partial enlargement of the creation after assembly using a positioning mold.

Figure 7: A partial enlarged view of the separation mold used for this creation.

Figure 8: A side elevational view of a partial enlargement of the use of a separate mold.

Figure 9: A side view of the separation mold for the creation of the separation block.

Figure 10: Schematic diagram of the appearance of the LED lamp covering the lamp cover.

The embodiments of the present invention are described below by way of specific examples, and those skilled in the art can readily appreciate other advantages and effects of the present invention from the disclosure of the present specification.

The structures, proportions, sizes, and the like, which are illustrated in the specification of the present specification, are only used to cope with the contents disclosed in the specification for understanding and reading by those skilled in the art, and are not intended to limit the qualifications that can be implemented by the present invention. Any modification of the structure, change of the proportional relationship or adjustment of the size shall not fall within the scope of the technical content disclosed in this creation without affecting the efficacy and the purpose of the creation. .

Referring to FIG. 1 , a schematic diagram of the appearance of an embodiment of the present invention is an embodiment of the molded structure 1 of the surface-mount LED module of the present invention. In this embodiment, the molding of the surface-mount LED module is shown. The structure 1 includes a circuit board 2 (PCB) and a plurality of LED strips 4.

Please refer to FIG. 1 and FIG. 2 , and FIG. 2 is a schematic view showing the appearance of the creation part when the assembly is assembled by using the positioning mold. In the embodiment, the circuit board 2 is a multi-circuit board 2 and the circuit board 2 A plurality of winding lines are included, and two sides of the position of the plurality of LED lamps 5 (COB LEDs) are placed on one side of the circuit board 2, and a plurality of separation holes 3 are formed by punching or drilling to make the separation holes 3 The plurality of LED lamps 5 are directly disposed on the positive and negative positions by solid crystal, wire bonding, dispensing or sealing.

Referring to FIG. 1 and FIG. 2 again, in the embodiment, the circuit board 2 includes a positive and negative contact on one side, and the circuit board 2 has a plurality of separation holes 3 penetrating the circuit board 2 according to the matrix. The bottom surface of each LED lamp 5 (COB LED) includes a plurality of pads, and the LED lamps 5 (COB LEDs) have through holes at opposite corners thereof, and the wafers on the LED lamps 5 are solidified and soldered, and each The LED lamp 5 has been covered by the sealant and electrically connected to the pad through the conductive via, and each pad is respectively connected to the positive and negative contacts of the circuit board 2.

Please refer to FIG. 3, FIG. 5 and FIG. 6. FIG. 3 is a partially enlarged schematic view showing a pre-cut section 8 of an LED light bar 4, and FIG. 5 is partially enlarged to use a positioning die set. A side view of the assembly, and Fig. 6 is a side elevational view showing a partial enlargement after assembly using a positioning mold. In this embodiment, the plurality of LED strips 4 include a plurality of LED lamps 5 that combine positive and negative contacts, and a connection block 6 that connects the two LED lamps 5. A plurality of LED strips 4 are disposed on the surface of the circuit board 2, and each of the LED lamps 5 is connected to the circuit board 2 via a pad; each of the connecting blocks 6 is provided with a positioning hole 7 and a plurality of pre-cut segments 8, each pre-cut A segment 8 is formed between each of the connecting blocks 6 and each of the LED lamps 5 and across the connecting block 6 of the positioning holes 7, and the diameter of each of the separating holes 3 is larger than the diameter of each of the positioning holes 7.

Referring to FIG. 1 , in the embodiment, the description of the eight LED lamps 5 on each of the LED strips 4 is only an example, and not limited thereto. In some embodiments, the LEDs are used. The number of the lamps 5 is not limited, and may be two, four, six, etc., and each LED lamp 5 is directly disposed at each of the positive and negative positions by solid crystal, wire bonding, dispensing or sealing. , fixed by baking.

Referring to FIG. 2, FIG. 5 and FIG. 6, in the embodiment, the positioning mold 9 is disposed on the bottom surface of the circuit board 2, and the positioning mold 9 includes at least two or more guiding pins 10, by means of guiding The needles 10 are inserted through the corresponding separation holes 3 to the positioning holes 7 to provide accurate alignment of the LED strips 4 at the positions of the positive and negative contacts on the circuit board 2.

Please refer to FIG. 7, FIG. 8 and FIG. 9. FIG. 7 is a partially enlarged schematic view showing the use of a separation mold, and FIG. 8 is a side elevational view showing a partial enlargement of the separation mold, and FIG. 9 is a separation. A side view of the mold from the connection block. In this embodiment, after the plurality of LED strips 4 are fixed on the circuit board 2, the separation mold 11 is disposed on the bottom surface of the circuit board 2 instead of the positioning mold 9, and the separation mold 11 includes at least two or more protrusions 12, and the separation mold is to be separated. 11 abuts against the circuit board 2, so that the protruding pins 12 pass through the corresponding separating holes 3 and push against the outer peripheral wall surfaces of the positioning holes 7, and then apply a force to cause the protruding pins 12 to press the connecting blocks 6 to form each Each pre-cut segment 8 on the connecting block 6 is broken, each connecting block 6 and each LED lamp 5 are disconnected, and each connecting block 6 is separated from each LED lamp 5 to make each LED The LED lamps 5 on the light bar 4 are stably and independently positioned on the circuit board 2 (as shown in FIG. 9), and after the connection blocks 6 are removed, the lamp cover 13 is covered on the circuit board 2 at each LED lamp 5. (As shown in Figure 10), a large number of LED lamps can be processed on the circuit board 2 at a time.

Referring to FIG. 3, in the embodiment, the depth of each pre-cut segment 8 is 2/3 of the thickness of the connecting block 6, but the depth of each pre-cut segment 8 may be 1/3 of the thickness of the connecting block 6. The depth is equal, and the non-restricted depth is sufficient to provide a function between the connection blocks 6 and the LED lamp 5 when the protruding pin 12 of the separation mold 11 is provided against the application force.

Referring to FIG. 4, in the present embodiment, each pre-cut segment 8 may be formed on one side, the other side of the connecting blocks 6, or both, so that the connecting block 6 can be provided by the protruding pin 12 of the separating die 11 By applying the force, it is convenient to break the interaction between each connecting block 6 and the LED lamp 5.

Referring to FIG. 5 and FIG. 8 , in the present embodiment, the outer diameter of each of the protruding pins 12 of the separating die 11 is larger than the outer diameter of each of the guiding pins 10 of the positioning die 9 to facilitate the insertion of the protruding pins 12 through the corresponding separating holes. 3, the outer peripheral wall surface of each of the positioning holes 7 is pushed, and the outer diameter of each of the guiding pins 10 of the positioning die 9 is smaller than the respective protruding pins 12 of the separating die 11 and can penetrate through the corresponding separating holes 3 to the positioning holes 7.

The design of the surface-mounted LED light bar is to connect the plurality of LED lights to the connecting block 6 to form an LED light bar, and the LED light bar 4 is assembled on the circuit board 2, so that a large number of LED lights 5 can be processed at one time in the circuit. On board 5. Moreover, the positioning of the LEDs 4 facilitates the alignment of the LED strips 4 on the circuit board 2, and accurately connects the positive and negative electrodes of each of the LED lamps 5 and the circuit board 2. In addition, each of the connecting blocks 6 is removed by the separating die 11, and the LED lamps 5 on each of the LED strips 4 are independently positioned, and then the lamp cover 13 is covered thereon (as shown in FIG. 10), and one processing can be completed. A large number of LED lamps 5 are fabricated on the circuit board 2. Thereby, the molding structure design of the surface-mount LED module has a simple manufacturing process, no semi-finished products are not repaired, and directly seals into a finished product, and a few defective LED lights in the finished product are cut off. It is not necessary to discard the entire LED strip 4, and it has the convenience of attaching the lamp, but it does not need to be split, braided, and not attached to the machine patch, which has the effect of reducing the manufacturing cost.

The above embodiments are used to describe the purpose, technical features and effects of the present invention in detail, and are only some of the embodiments of the present invention. When it is not possible to limit the scope of implementation of the present creation, those skilled in the art will be described above. And the transformation or modification of the structural features and the equivalence of efficacy in the scope of the following patent application, the nature of which does not depart from the spirit and scope of the present invention, should be included in the scope of the patent.

1‧‧‧Molded structure

2‧‧‧ boards

3‧‧‧Separation hole

4‧‧‧LED strips

5‧‧‧LED lights

6‧‧‧Connection block

7‧‧‧Positioning holes

9‧‧‧ Positioning mold

10‧‧‧ guide needle

Claims (6)

A molding structure of a surface-mount LED module, comprising: a circuit board, a plurality of separation holes are arranged on the circuit board, and a plurality of conduction holes are arranged on one side of the circuit board, and the conduction holes are respectively connected and worn Each of the positive and negative electrodes on the pad to the back of the circuit board; a plurality of LED strips disposed on the surface of the circuit board, each LED strip includes a plurality of LED lights combined with positive and negative electrodes and two LED lights Each of the connecting blocks is provided with a positioning hole and a plurality of pre-cut segments, and each of the pre-cut segments is formed between the connecting block and each of the LED lamps and the connecting block spanning the positioning hole. a positioning mold disposed on a bottom surface of the circuit board, the positioning mold includes at least two guiding pins, each of the guiding pins penetrating through the corresponding separating holes to each of the positioning holes; and a separating mold, replacing the Positioning the mold on the bottom surface of the circuit board, the separation mold includes at least two protruding needles, each of the protruding pins penetrating through the corresponding separating holes to push against the outer peripheral wall of each of the positioning holes, and each of the connecting blocks and each of the connecting blocks The LED lamp is divided by each pre-cut segment , Each LED on the light bar independent of each LED positioned on a circuit board. The molded structure of the surface-mount LED module according to claim 1, wherein the depth of each of the pre-cut segments is 2/3 of the thickness of the connecting block. The molded structure of the surface-mount LED module according to claim 1, wherein each of the pre-cut segments is formed on one side, the other side or both of the connecting blocks. The molded structure of the surface-mount LED module according to claim 1, wherein the aperture of each of the separation holes is larger than the aperture of each of the positioning holes. The molded structure of the surface-mount LED module according to claim 1, wherein each of the protruding needles has an outer diameter larger than an outer diameter of each of the guiding pins. The molding structure of the surface-mount LED module according to claim 1, further comprising a plurality of lamp covers, each of the lamp covers covering the circuit board at each of the LED lamps from which the connection blocks have been separated.