CN109585627A - The patch device and method of LED chip - Google Patents

The patch device and method of LED chip Download PDF

Info

Publication number
CN109585627A
CN109585627A CN201811081651.2A CN201811081651A CN109585627A CN 109585627 A CN109585627 A CN 109585627A CN 201811081651 A CN201811081651 A CN 201811081651A CN 109585627 A CN109585627 A CN 109585627A
Authority
CN
China
Prior art keywords
conducting wire
led chip
chip
fixing base
sticked
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201811081651.2A
Other languages
Chinese (zh)
Inventor
蔡乃成
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kosmo Lighting Co
Cosmo Lighting Inc
Original Assignee
Kosmo Lighting Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kosmo Lighting Co filed Critical Kosmo Lighting Co
Publication of CN109585627A publication Critical patent/CN109585627A/en
Pending legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S4/00—Lighting devices or systems using a string or strip of light sources
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/12—Moulds or cores; Details thereof or accessories therefor with incorporated means for positioning inserts, e.g. labels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P21/00—Machines for assembling a multiplicity of different parts to compose units, with or without preceding or subsequent working of such parts, e.g. with programme control
    • B23P21/004—Machines for assembling a multiplicity of different parts to compose units, with or without preceding or subsequent working of such parts, e.g. with programme control the units passing two or more work-stations whilst being composed
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/42—Moulds or cores; Details thereof or accessories therefor characterised by the shape of the moulding surface, e.g. ribs or grooves
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
    • B29C39/02—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles
    • B29C39/10—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. casting around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H54/00—Winding, coiling, or depositing filamentary material
    • B65H54/02—Winding and traversing material on to reels, bobbins, tubes, or like package cores or formers
    • B65H54/10—Winding and traversing material on to reels, bobbins, tubes, or like package cores or formers for making packages of specified shapes or on specified types of bobbins, tubes, cores, or formers
    • B65H54/14—Winding and traversing material on to reels, bobbins, tubes, or like package cores or formers for making packages of specified shapes or on specified types of bobbins, tubes, cores, or formers on tubes, cores, or formers having generally parallel sides, e.g. cops or packages to be loaded into loom shuttles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H75/00—Storing webs, tapes, or filamentary material, e.g. on reels
    • B65H75/02—Cores, formers, supports, or holders for coiled, wound, or folded material, e.g. reels, spindles, bobbins, cop tubes, cans, mandrels or chucks
    • B65H75/04—Kinds or types
    • B65H75/08—Kinds or types of circular or polygonal cross-section
    • B65H75/14—Kinds or types of circular or polygonal cross-section with two end flanges
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H75/00—Storing webs, tapes, or filamentary material, e.g. on reels
    • B65H75/50—Methods of making reels, bobbins, cop tubes, or the like by working an unspecified material, or several materials
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/90—Methods of manufacture
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S4/00—Lighting devices or systems using a string or strip of light sources
    • F21S4/10—Lighting devices or systems using a string or strip of light sources with light sources attached to loose electric cables, e.g. Christmas tree lights
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S4/00—Lighting devices or systems using a string or strip of light sources
    • F21S4/20—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports
    • F21S4/22—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports flexible or deformable, e.g. into a curved shape
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S4/00—Lighting devices or systems using a string or strip of light sources
    • F21S4/20—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports
    • F21S4/22—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports flexible or deformable, e.g. into a curved shape
    • F21S4/26—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports flexible or deformable, e.g. into a curved shape of rope form, e.g. LED lighting ropes, or of tubular form
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/04—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages the fastening being onto or by the light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/0015—Fastening arrangements intended to retain light sources
    • F21V19/0025—Fastening arrangements intended to retain light sources the fastening means engaging the conductors of the light source, i.e. providing simultaneous fastening of the light sources and their electric connections
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/001—Arrangement of electric circuit elements in or on lighting devices the elements being electrical wires or cables
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/26—Power supply means, e.g. regulation thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B7/00—Insulated conductors or cables characterised by their form
    • H01B7/02—Disposition of insulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/13—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L33/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/20—Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders
    • H01M50/204—Racks, modules or packs for multiple batteries or multiple cells
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/20—Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders
    • H01M50/269—Mechanical means for varying the arrangement of batteries or cells for different uses, e.g. for changing the number of batteries or for switching between series and parallel wiring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/28—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for wire processing before connecting to contact members, not provided for in groups H01R43/02 - H01R43/26
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02G—INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
    • H02G1/00—Methods or apparatus specially adapted for installing, maintaining, repairing or dismantling electric cables or lines
    • H02G1/12—Methods or apparatus specially adapted for installing, maintaining, repairing or dismantling electric cables or lines for removing insulation or armouring from cables, e.g. from the end thereof
    • H02G1/1202—Methods or apparatus specially adapted for installing, maintaining, repairing or dismantling electric cables or lines for removing insulation or armouring from cables, e.g. from the end thereof by cutting and withdrawing insulation
    • H02G1/1248—Machines
    • H02G1/1251—Machines the cutting element not rotating about the wire or cable
    • H02G1/1253—Machines the cutting element not rotating about the wire or cable making a transverse cut
    • H02G1/1256—Machines the cutting element not rotating about the wire or cable making a transverse cut using wire or cable-clamping means
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
    • H02J7/00—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries
    • H02J7/0063—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries with circuits adapted for supplying loads from the battery
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
    • H02J7/00—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries
    • H02J7/007—Regulation of charging or discharging current or voltage
    • H02J7/00712—Regulation of charging or discharging current or voltage the cycle being controlled or terminated in response to electric parameters
    • H02J7/007182—Regulation of charging or discharging current or voltage the cycle being controlled or terminated in response to electric parameters in response to battery voltage
    • H02J7/007184—Regulation of charging or discharging current or voltage the cycle being controlled or terminated in response to electric parameters in response to battery voltage in response to battery voltage gradient
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/10—Controlling the intensity of the light
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/40—Details of LED load circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/40—Details of LED load circuits
    • H05B45/42—Antiparallel configurations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/40—Details of LED load circuits
    • H05B45/44—Details of LED load circuits with an active control inside an LED matrix
    • H05B45/48—Details of LED load circuits with an active control inside an LED matrix having LEDs organised in strings and incorporating parallel shunting devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B47/00—Circuit arrangements for operating light sources in general, i.e. where the type of light source is not relevant
    • H05B47/10—Controlling the light source
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/747—Lightning equipment
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
    • F21Y2103/10—Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
    • H02J2007/0067—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B20/00—Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps
    • Y02B20/40—Control techniques providing energy savings, e.g. smart controller or presence detection
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10—Energy storage using batteries
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
    • Y02W30/00—Technologies for solid waste management
    • Y02W30/50—Reuse, recycling or recovery technologies
    • Y02W30/82—Recycling of waste of electrical or electronic equipment [WEEE]

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Electrochemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Theoretical Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Circuit Arrangement For Electric Light Sources In General (AREA)
  • Led Device Packages (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Charge And Discharge Circuits For Batteries Or The Like (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Battery Mounting, Suspending (AREA)

Abstract

The present invention provides the patch device and method of a kind of LED chip.Pasting method includes step: the first conducting wire of winding and the second conducting wire are on each fixing base；Multiple fixing bases are installed on workbench；The image of workbench is captured by video capture device；The image and coordinate position of fixing base, the first conducting wire and the second conducting wire are shown using electronic device；Input is intended to the LED chip amount being sticked on the first conducting wire and the second conducting wire to electronic device；The coordinate position of the second line segment of the first line segment and the second conducting wire of first conducting wire of the two sides by electronic device based on fixing base analyzes the coordinate position of other LED chips according to the quantity of multiple LED chips；And LED chip is sticked on the first conducting wire and the second conducting wire by chip mounter.

Description

The patch device and method of LED chip
Technical field
The invention relates to a kind of patch device and methods, and in particular to a kind of patch device of LED chip And method.
Background technique
Currently, as the big step of hyundai electronics component develops to micromation, integrated and high reliability direction, especially face To increasingly fierce market competition, the production of electronic product and manufacturing equipment are just towards high speed, high-precision, intelligence, multi-functional The equal direction Quan Zihua is developed.In recent years, with the development of LED industry, new challenge is brought to the overall performance of LED chip mounter. Existing LED chip mounter, the patch process executed substantially need to assist just being able to achieve by manpower, and working efficiency is low, cannot Meet large-scale production.
Summary of the invention
For the missing for solving background technique, it to include work that the purpose of the present invention is to provide a kind of patch devices of LED chip Make platform, multiple fixing bases, multiple conducting wires, video capture device, multiple LED chips, electronic device and chip mounter.Multiple fixings Seat is mounted on workbench.Multiple fixing bases are mounted on workbench.Multiple conducting wires include multiple first conducting wires and more A second conducting wire.Multiple first line segments of each first conducting wire are wound around along the longitudinal direction of each fixing base with a predetermined space each solid It holds on seat.Multiple second line segments of each second conducting wire are wound around each fixing base along the longitudinal direction of each fixing base at a predetermined interval On.Video capture device is arranged above workbench.Video capture device configuration is with towards workbench pick-up image.Each LED chip It is sticked between the first conducting wire and the second conducting wire on corresponding fixing base.One between second conducting wire and the first conducting wire is predetermined Distance depends on each LED core chip size.Electronic device connects video capture device, and configuration is to provide first on each fixing base of input The quantity for the multiple LED chips to be sticked between conducting wire and the second conducting wire shows image and is based on video capture device pick-up image Position analysis, record and show two the first line segments and second in the first conducting wire of each fixing base two sides respectively Multiple coordinate positions of two second line segments in conducting wire, according to multiple coordinate positions, predetermined space, preset distance and quantity, Analyze other multiple LED chips other multiple coordinate positions to be sticked.Chip mounter connects electronic device.Chip mounter configuration with according to According to the coordinate position of each LED chip, each LED chip is sticked between the first line segment and adjacent second line segment.
Preferably, the display screen of the electronic device is configured to show graphical user interface, is connect in the graphical user Image area in mouthful shows the image that the video capture device is captured；The display screen configuration in the graphical user to connect The segment area of mouth shows multiple segments with the first color, respectively represents described in not being sticked above the multiple fixing base The multiple LED chip between first conducting wire and second conducting wire.
Preferably, a processor of the electronic device is configured to be sticked in each LED chip in the fixing base When between first conducting wire and second conducting wire of top, the segment area that the display screen changes display is controlled First color of the middle each segment for representing each LED chip is the second color；Wherein second color and institute State the first color difference.
Preferably, the patch device of the LED chip also includes platform conveying device, connects the workbench, described The configuration of platform conveying device is arranged with first conducting wire and second conducting wire but is not sticked the multiple will install The workbench of the multiple fixing base of LED chip is delivered in the chip mounter from an outside of the chip mounter Multiple spray gun directions below；The platform conveying device configuration has been sticked described in the multiple LED chip with that will be equipped with The workbench of multiple fixing bases is delivered to the chip mounter below the multiple spray gun direction in the chip mounter Another outside.
Preferably, the chip mounter also includes actuator, connects multiple spray guns, the actuator configuration is with the multiple material of movement Rifle, by each spray gun mouth be aligned wait first conducting wire for the multiple LED chip that is sticked and second conducting wire it Between；The actuator configuration is to pass through the multiple spray gun of the actuator activation close to first conducting wire and described second Conducting wire, with the dispensing on each first conducting wire and each second conducting wire wait the multiple LED chip that is sticked, Yi Ji Dispensing completes to activate the multiple spray gun far from first conducting wire and second conducting wire.
Preferably, the chip mounter also includes multiple chip conveying devices and actuator, the multiple chip conveying dress Set adjacent with the chip mounter, the actuator connects multiple spray guns of the chip mounter, the multiple chip conveying device point It Pei Zhi not be respectively to have multiple bands of the multiple LED chip towards the conveying of the direction of the multiple spray gun of the chip mounter； The actuator, which is configured such that move the multiple spray gun and be moved to, respectively there is the multiple item of the multiple LED chip to take Side, the multiple spray gun obtain the multiple LED chip respectively, and the actuator then activates the multiple spray gun and moves back to institute It states above the first conducting wire and second conducting wire；The actuator, which is configured such that, moves the multiple spray gun, by each material Muzzle is aligned between first conducting wire and second conducting wire wait the LED chip that is sticked, and each spray gun pastes respectively If each LED chip is between first conducting wire and second conducting wire on the fixing base.
The present invention provides a kind of pasting method of LED chip comprising the steps of: along each fixing base of multiple fixing bases Longitudinal direction, with multiple first line segments of first conducting wire of predetermined space winding, and the second conducting wire of winding at a predetermined interval Multiple second line segments on each fixing base, wherein the preset distance that each second line segment and adjacent every one first line segment are separated by Depending on LED core chip size；Multiple fixing bases are installed on workbench；By video capture device, shadow is captured towards workbench Picture；Using electronic device, respectively near two of each fixing base two sides in the image of recording and displaying fixing base, the first conducting wire In the coordinate position of first line segment and the second conducting wire respectively near each fixing base two sides two second line segments coordinate bit It sets；The quantity of each fixing base multiple LED chips to be sticked above the chip mounter is inputted to electronic device；It is filled by electronics It sets, based near two the first line segments of the two sides of each fixing base and coordinate position, the predetermined space of two second line segments And preset distance, according to the quantity of multiple LED chips, analyze other multiple LED chips be intended to be sticked on each fixing base Coordinate position between one conducting wire and the second conducting wire；And by chip mounter, according to the coordinate position of multiple LED chips, patch If each LED chip is between the adjacent second line segment of the first line segment of the first conducting wire and the second conducting wire.
Preferably, the pasting method of the LED chip, which is also comprised the steps of:, shows that figure is used by the electronic device Family interface, the image area in the graphical user interface show the image that the video capture device is captured；By described Electronic device shows multiple segments with the first color in the segment area of the graphical user interface, respectively represents and be not sticked The multiple LED chip between first conducting wire and second conducting wire above the multiple fixing base.
Preferably, the pasting method of the LED chip is also comprised the steps of: when the LED chip has been sticked described When between first conducting wire and second conducting wire above fixing base, the electronic device changes the shown figure Block Qu Zhong represents first color of each segment of each LED chip as the second color；Wherein second color It is different from first color.
Preferably, the pasting method of the LED chip is also comprised the steps of: through platform conveying device, will have been installed It is arranged with the institute of first conducting wire and second conducting wire but the multiple fixing base for the multiple LED chip that is not sticked Workbench is stated, is delivered to below multiple spray gun directions in the chip mounter from an outside of the chip mounter；And pass through The platform conveying device will be equipped with the workbench of the multiple fixing base for the multiple LED chip that has been sticked Another outside of the chip mounter is delivered to below the multiple spray gun direction in the chip mounter.
Preferably, the pasting method of the LED chip also comprises the steps of: the actuator by the chip mounter, moves The multiple spray guns for moving the chip mounter, by each spray gun mouth be aligned first line segment wait the LED chip that is sticked with And between the second line segment；And by the actuator, the multiple spray gun is activated close to first conducting wire and institute The second conducting wire is stated, with the dispensing on each first conducting wire and each second conducting wire wait the LED chip that is sticked, and Complete to activate the multiple spray gun far from first conducting wire and second conducting wire in dispensing.
Preferably, the pasting method of the LED chip is also comprised the steps of: by multiple chip conveying devices, respectively Respectively there are multiple bands of multiple LED chips towards the direction conveying of multiple spray guns of the chip mounter；Pass through the chip mounter Actuator activates the multiple spray gun and is moved to above respectively multiple bands with multiple LED chips, to pass through the multiple material Rifle obtains multiple LED chips respectively；By the actuator of the chip mounter, activates the multiple spray gun and move back to described first and lead Above line and second conducting wire, by each spray gun mouth be aligned first conducting wire wait the LED chip that is sticked with And between second conducting wire；And by the multiple spray gun, the multiple LED chip is sticked the multiple solid respectively It holds between first conducting wire and second conducting wire on seat.
Preferably, the pasting method of the LED chip is also comprised the steps of: through each chip conveying device, according to According to the anode for the LED chip for being intended to be sticked between first conducting wire and second conducting wire and the configuration side of cathode To decision is placed on anode and the configuration direction of cathode for each LED chip that the item takes.
As described above, the present invention provides the patch device and method of LED chip, use automation control chip mounter with reality Existing patch operation replaces the manpower operation for the LED chip that is sticked manually, with effectively improve the LED chip that is sticked position precision and The efficiency of production realizes the effect of the lamp string of mass production high quality to reduce the processing time of each LED chip.
Detailed description of the invention
Fig. 1 is the outer of the workbench of the patch device of the LED chip of the embodiment of the present invention, electronic device and chip mounter See schematic diagram.
Fig. 2A is the internal structure chart of the chip mounter of the patch device of the LED chip of the embodiment of the present invention.
Fig. 2 B is the first configuration of multiple LED chips that the item of the patch device of the LED chip of the embodiment of the present invention takes Schematic diagram.
Fig. 2 C is the second configuration of multiple LED chips that the item of the patch device of the LED chip of the embodiment of the present invention takes Schematic diagram.
Fig. 3 is winding with guiding-wire and the LED core that is sticked above the fixing base of the patch device of the LED chip of the embodiment of the present invention The schematic diagram of piece.
Fig. 4 is that the electronic device of the patch device of the LED chip of the embodiment of the present invention shows in graphical user interface have The schematic diagram of fixing base image.
Fig. 5 is the electronic device input LED chip coordinate to be sticked of the patch device of the LED chip of the embodiment of the present invention The schematic diagram of amount.
Fig. 6 is that the electronic device of the patch device of the LED chip of the embodiment of the present invention shows the generation in graphical user interface Table has been sticked or the segment for the LED chip that is not sticked.
Fig. 7 is the first pass figure of the pasting method of the LED chip of the embodiment of the present invention.
Fig. 8 is the second flow chart of the pasting method of the LED chip of the embodiment of the present invention.
Fig. 9 is the third flow chart of the pasting method of the LED chip of the embodiment of the present invention.
Specific embodiment
It is to illustrate that disclosed herein embodiment for the present invention, abilities by particular specific embodiment below Field technique personnel can understand advantages of the present invention and effect by content disclosed by this specification.The present invention can pass through other differences Specific embodiment implemented or applied, the various details in this specification may be based on different viewpoints and application, be not contrary to From carrying out various modifications and change under design of the invention.In addition, attached drawing of the invention is only simple schematically illustrate, not according to reality The description of border size is stated in advance.The relevant technologies content of the invention, but institute will be explained in further detail in the following embodiments and the accompanying drawings The protection scope that the content of exposure is not intended to limit the invention.
It should be understood that although various assemblies or signal may be described using term first, second, third, etc. herein, But these components or signal should not be limited by these terms.These terms are mainly to distinguish a component and another group Part or a signal and another signal.In addition, term "or" used herein, should may include correlation depending on actual conditions Connection lists any of project or multiple combinations.
In order to get across, in some cases, this technology can be rendered as including the separate functional blocks comprising functional block, It includes the steps or routing or the combination of hardware and software in the method implemented in device, device assembly, software.
Implement to may include hardware, firmware and/or software according to the device that these disclose method, and can take any each Kind body.The typical example of this body includes laptop, smart phone, small sized personal computer, personal digital assistant Etc..The function being described herein also can be implemented in peripheral equipment or internal card.By further illustrating, this function can also be with Implement in different chips or the circuit board of the distinct program executed on single device.
The instruction, the medium for transmitting such instruction, the computing resource for executing it or such for supporting The other structures of computing resource are for for providing the means of the function described in disclosing at these.
It please refers to Fig.1 to Fig.3, wherein Fig. 1 is the workbench of the patch device of the LED chip of the embodiment of the present invention, electricity The appearance diagram of sub-device and chip mounter, Fig. 2A are the chip mounters of the patch device of the LED chip of the embodiment of the present invention Internal structure chart, Fig. 3 are the fixing base top winding with guiding-wire of the patch device of the LED chip of the embodiment of the present invention and are sticked The schematic diagram of LED chip.As shown in figure 1 and 2 a, the patch device of LED chip 51 includes workbench 10, platform conveying dress Set 12, multiple fixing bases 20, multiple conducting wires 31,32, video capture device 40, multiple LED chips 51, electronic device and chip mounter 70.Electronic device includes the processor in input module 61, display screen 62 and host 63.
As shown in figure 3, multiple first line segments of the first conducting wire 31 can along each fixing base 20 longitudinal direction at a predetermined interval It is wound around on each fixing base 20, i.e., every two adjacent first line segment is separated by same distance.Multiple the of second conducting wire 32 Two line segments are wound around on each fixing base 20 along the longitudinal direction of each fixing base 20 with identical predetermined space, i.e., every two adjacent Second line segment is separated by same distance, and separated by a distance between multiple second line segments is separated by between multiple first line segments Apart from identical.In addition, what is be separated by between the first line segment of the first conducting wire 31 and the second line segment of the second adjacent conducting wire 32 is predetermined Distance depends on each 51 size of LED chip, more specifically, depending on the first line segment and second wait be connected across the first conducting wire 31 The width of LED chip 51 between the second line segment of conducting wire 32.
As shown in Figure 1, being arranged with multiple fixing bases 20 of the first conducting wire 31 and the second conducting wire 32 can arrange with being separated Column are mounted on the workbench 10 in 70 outside of chip mounter.Workbench 10 can be placed on platform conveying together with fixing base 20 On device 12, with the workbench 10 by the conveying carrying fixing base 20 of platform conveying device 12 from chip mounter as shown in Figure 1 70 outside enters in chip mounter 70 as shown in Figure 2 A.
Chip mounter 70 may include multiple spray guns 71, actuator 72 and multiple chip conveying devices 52.Multiple chip conveyings Device 52 may be provided at the downside of spray gun 71.Each chip conveying device 52 can be defeated towards the direction of multiple spray guns 71 of chip mounter 70 The band 50 with multiple LED chips 51 is sent, and actuator 72 may be actuated multiple spray guns 71 and move toward the direction of multiple LED chips 51 It is dynamic.The present embodiment is that have 6 spray guns 71 with chip mounter 70, and correspond to 6 chip conveying device 52 and 6 LED cores For the band 50 of piece 51, but invention is not limited thereto.LED chip 51 on a section of band 50 is taken away by spray gun 71 Afterwards, chip conveying device 52 can furl the section of band 50, and have the another of the band 50 of LED chip 51 towards the conveying of spray gun 71 One section.
Configuration direction below for multiple LED chips on band 50 is the present invention for example, please refer to Fig. 2 B First configuration schematic diagram of multiple LED chips that the item of the patch device of the LED chip of embodiment takes.As shown in Figure 2 B, it shows One of band 50 in six bands 50 in diagram 2A, it is pre- that multiple LED chips 51 on this band 50 are separated by one respectively Set a distance, and the cathode of multiple LED chips 51 is all towards left, i.e., the side of the positioning region 22 towards fixing base 20 shown in Fig. 2A To；And multiple LED chips 51 anode towards right, i.e., the direction of the positioning region 21 towards fixing base 20 shown in Fig. 2A.? In the present embodiment, anode and cathode the configuration direction of multiple LED chips 51 of each band 50 are all identical, but in practice, multiple The mutual configuration direction of LED chip 51 also can be difference.
Further, multiple LED chips 51 on other one or more bands 50 anode and cathode configuration direction also Configuration same as described above can be used, or reverse configuration can be used.Additionally or alternatively, Fig. 2 C is please referred to, is of the invention real Apply the second configuration schematic diagram of multiple LED chips that the item of the patch device of the LED chip of example takes.As shown in Figure 2 C, it shows The alternative in vitro test 50 in six bands 50 in Fig. 2A, the anode of multiple LED chips 51 on this band 50 all towards left, The direction of positioning region 22 i.e. towards fixing base 20 shown in Fig. 2A；And the cathode of multiple LED chips 51 is towards right, i.e., towards The direction of the positioning region 21 of fixing base 20 shown in Fig. 2A.
In practice, the anode for the multiple LED chips 51 placed on each band 50 and the configuration direction of cathode are depended on (being identical to) is intended to anode and the configuration of cathode for the multiple LED chips 51 being crossed between the first conducting wire 31 and the second conducting wire 32 Direction is so then not required to activate multiple 71 rotation directions of spray gun by actuator 72 or be not required to through platform conveying device 12 or volume Outer actuating assembly actuating fixing base 10 carries out patch after overturning again, can save the patch activity duration whereby, and then promote patch Efficiency.
Referring to please referring to Fig.1 to Fig.3, actuator 72 may be provided at 71 top of multiple spray guns of chip mounter 70, even Connect multiple spray guns 71 of chip mounter 70.Actuator 72 can synchronously or asynchronously control multiple 71 levels of spray guns, vertically or along other Direction is mobile.For example, multiple spray guns 71 of the horizontally moveable chip mounter 70 of actuator 72, by the muzzle pair of each spray gun 71 One of them first line segment of first conducting wire 31 of standard LED chip 51 to be sticked and the adjacent second line segment of the second conducting wire 32 Between.Actuator 72 can then activate multiple spray guns 71 towards mobile, the example close to the direction of the first conducting wire 31 and the second conducting wire 32 Such as multiple spray guns 71 that vertically move down.At this point, multiple spray guns 71 can be simultaneously or sequentially respectively wait multiple LED chips 51 that are sticked Multiple first line segments of the first conducting wire 31 and multiple second line segments of the second conducting wire 32 on dispensing, such as coating electric conductivity is glutinous Glue.When implementation, also above-mentioned dispensing operation can be executed by other additional assemblies with the similar functions such as dispensing or gluing.
After the completion of dispensing, multiple spray guns 71 are may be actuated towards far from the first conducting wire 31 and the second conducting wire 32 in actuator 72 Direction is mobile, such as actuator 72 can drive multiple spray guns 71 to be moved on respectively multiple bands 50 with multiple LED chips 51 Side.Each spray gun 71 can obtain a LED chip 51 from the chip conveying device 52 being correspondingly arranged.For example, the material of chip mounter 70 The muzzle front end of rifle 71 may be provided with suction nozzle, and suction nozzle connects air extractor.When implementation, it is separated by one in spray gun 71 and LED chip 51 Apart from when can obtain LED chip 51 by suction, and LED chip 51 be sticked to the first conducting wire 31 and the second conducting wire 32 it Preceding maintenance is adsorbed at the muzzle of spray gun 71.
Multiple spray guns 71 that actuator 72 can then activate chip mounter 70 move back to the first conducting wire 31 and the second conducting wire 32 The muzzle for being adsorbed with each spray gun 71 of LED chip 51 is directed at the First Line of the first conducting wire 31 of LED chip 51 to be sticked by top Between section and the second line segment of the second conducting wire 32.Then, the positive pin of LED chip 51 can be placed on the first conducting wire by spray gun 71 On 31 electric conductivity viscose, while the negative pin of LED chip 51 being placed on the electric conductivity viscose of the second conducting wire 32, otherwise also It can.By that can be attached on LED chip 51 on first conducting wire 31 and the second conducting wire 32 on electric conductivity viscose, make LED chip 51 It is connected across between the first line segment of the first conducting wire 31 and the second line segment of the second conducting wire 32 securely.In LED chip to be sticked During 51, except through the mobile spray gun 71 of actuator 72, also can by 12 mobile working platform 10 of platform conveying device, with Change the work of the multiple fixing bases 20 of the spray gun 71 for obtaining LED chip 51 and carrying with the first conducting wire 31 and the second conducting wire 32 Make the relative position of platform 10, to improve the efficiency for the LED chip 51 that is sticked.
Further, to make the be sticked achievement of LED chip 51 of chip mounter 70 more meet actual demand, using electronic device Such as the image according to the acquisition such as camera of video capture device 40 such as computer, to control the running of chip mounter 70.Specifically Ground, video capture device 40 can be other components with pick-up image function such as camera, may be provided on workbench 10 Side includes the first conducting wire 31 and the on multiple fixing bases 20 and each fixing base 20 to capture the image of workbench 10 The image of two conducting wires 32.Then, the processor in the host 63 of electronic device can analyze the image that video capture device 40 is captured 41, and image 41 and analysis can be shown as a result, being described as follows by the display screen 62 of electronic device.
Referring to Figure 4 together, be the embodiment of the present invention LED chip patch device electronic device show figure use With the schematic diagram of fixing base image in the interface of family.As shown in figure 4, the display screen 62 of electronic device shows graphical user interface 621.In the image area of graphical user interface 621, the image that real-time display video capture device 40 takes, such as shown in Fig. 2A Fixing base 20 positioning region 21 image 41.
For example, the button in image 41 or graphical user interface 621 shown by graphical user interface 621 can be clicked, with Open window W1, have in window W1 upwards, downwards, to the left, right-hand arrow schema button, pass through these button adjustable images The range of 40 filmed image 41 of acquisition device.And before or during movable image acquisition device 40, it can be by this window W1 The movement speed of slider adjustment video capture device 40.
During movable image acquisition device 40, the image 41 of the display of graphical user interface 621 can refer to, first find solid Hold the positioning region 21 of 20 two sides of seat.It then, will be in the image area of graphical user interface 621 by the input module of electronic device 61 Reticle alignment positioning region 21 image 41 nearly center at, then pressing in this window W1 has " obtain coordinate " text Button, to obtain the coordinate position of the positioning region 21 of fixing base 20, and 22 positioning method of positioning region of fixing base 20 can also Same mode is realized.
The host of processor such as computer in the host 63 of electronic device can store the coordinate position of fixing base 20, with When as each progress patch operation, difference can be quickly found out by the coordinate position of the positioning region 21,22 of 20 two sides of fixing base Respectively near fixing in two the first line segments and the second conducting wire 32 of two positioning regions 21,22 of fixing base 20 Two second line segments of two positioning regions 21,22 of seat 20.However, it should be understood that can also omit the positioning of fixing base 20 on implementing The positioning step in portion 21,22.
Further, please refer to fig. 5, it is the electronic device of the patch device of the LED chip of the embodiment of the present invention Input the schematic diagram for the LED chip coordinate amount to be sticked.As shown in figure 5, can be by window W1 as shown in Figure 4 by image capture Device 40 is moved to wherein one of the first conducting wire 31 near the positioning region of fixing base 20 21 from the positioning region of fixing base 20 21 A wherein second line segment for one line segment and the second conducting wire 32.At this point, graphical user interface 621 will be from the positioning region of fixing base 20 21 image 41 switchs to the image 42 that display has the first line segment and second line segment.
In addition, can be according to the grade line segments relative to the position of the spray gun 71 of chip mounter 70 and the LED chip 51 to be sticked Specification, manually or the processor of the host 63 of electronic device is automatically from multiple material by the input module 61 of electronic device It selects to wait the spray gun 71 of line matchs with each this in the menu of 71 specification option of rifle.
Finally, pressing the button in window to obtain the coordinate position of the grade line segments respectively.Then, the display of electronic device Screen 62 shows that graphical user interface 621 shows the XY coordinate position of the first label and the second label.The XY of first label Coordinate position represents LED chip 51 and is intended to be connected across wherein one first of the first conducting wire 31 near the positioning region of fixing base 20 21 The coordinate position of a wherein second line segment for line segment and the second conducting wire 32.The XY coordinate position of second label represents LED chip 51 are intended to be connected across another first line segment of the first conducting wire 31 near the positioning region of fixing base 20 22 and the second conducting wire 32 The coordinate position of another second line segment.
Optionally, be manually pressed by with the first marker recognition button or the second marker recognition button (or in practice by Processor in the host 63 of electronic device executes operations described below automatically), to pass through the processor in the host 63 of electronic device The image of positioning and the standard of the first line segment of the first conducting wire 31 in advance stored and the second line segment of the second conducting wire 32 are shone Piece compares, to judge whether the image of positioning is correct according to matching rate.For example, if matching rate is too low, in the image of positioning Object may not be the first conducting wire 31 and the second conducting wire 32, then aforesaid way can be followed to relocate.
After positioning, the controllable display screen 62 of the processor in the host 63 of electronic device is in graphical user interface 621 Segment area show two segments 6211 with the first color.The representative of segment 6211 on right side is intended to be connected across near fixing base A LED chip between first line segment of the first conducting wire 31 of 20 positioning region 21 and the second line segment of the second conducting wire 32 51.The segment 6211 in left side represent be intended to be connected across the first line segment of the first conducting wire 31 near the positioning region of fixing base 20 22 with And second conducting wire 32 second line segment between another LED chip 51.
Determine in the second line segment of the first line segment and second conducting wire 32 of completing the first conducting wire 31 of 20 two sides of fixing base After position, then LED chip can be inputted in the window W2 in graphical user interface 621 by the input module 61 of electronic device 51 coordinate amount, that is, the quantity for the LED chip 51 above each fixing base 20 that is intended to be sticked, include or practice on for not comprising having determined The quantity of the LED chip 51 of position.
Processor in the host 63 of electronic device can be based on the first line segment and second of oriented first conducting wire 31 Predetermined space between multiple line segments of the coordinate position of the second line segment of conducting wire 32, the first conducting wire 31 or the second conducting wire 32, with And it is more to analyze other according to the quantity of multiple LED chips 51 for the first preset distance between conducting wire 31 and the second conducting wire 32 First line segment and second conducting wire 32 of a LED chip 51 wait oriented first conducting wire 31 above fixing base 20 that is sticked Coordinate position between second line segment.
When the deviation correcting button of graphical user interface 621 is triggered, the processor in the host 63 of electronic device can The error of calibration coordinate position.In addition, can select to be intended to be sticked with what chip code indicated by the input module 61 of electronic device LED chip 51, the quantity according to each LED chip 51 chooses the spray gun that uses and selects the specification of each spray gun, and can The selection starting spray gun from multiple such as six spray guns, the LED that starting spray gun is for example represented for the segment 6211 in the left side that is sticked Be sticked mode and the sequence of LED chip 51 then may be selected in chip 51.
Further, referring to Figure 6 together, be the embodiment of the present invention LED chip patch device electronic device Display screen show that the representative in graphical user interface has been sticked or the segment for the LED chip that is not sticked.
After the quantity for inputting the LED chip 51 to be sticked by the input module 61 of electronic device, as shown in fig. 6, Processor in the host 63 of electronic device can control display screen 62 in the first segment area A1 of graphical user interface 621 accordingly Show have the first color multiple segments, respectively represent be not connected across it is multiple between the first conducting wire 31 and the second conducting wire 32 LED chip 51.
Between the adjacent second line segment of each of multiple first line segments of first conducting wire 31 and the second conducting wire 32 Bridge LED chip 51.Alternatively, only adjacent second of the first line segment of most first conducting wire 31 and the second conducting wire 32 LED chip 51 is set between line segment, and is then not provided with LED chip 51 between the first line segment and second line segment of rest part.
For example, installation respectively corresponds as shown in Figure 6 there are four fixing base 20 on workbench 10 as shown in Figure 2 A Graphical user interface 621 the first segment area A1 or four row segments in the second segment area A2.In the host 63 of electronic device Processor can be according to spray gun quantity such as six of chip mounter 70 as shown in Figure 2 A, with multiple figures to each fixing base 20 Block grouping, such as every six one group.The actuator 72 of chip mounter 70 may be actuated multiple such as six spray guns 71 and be respectively aligned to every group The corresponding coordinate position of first segment, then control spray gun 71 towards fixing base 20 direction vertically move, with sequentially or together When be sticked multiple such as six LED chips 51 bridge 20 top of each fixing base the first conducting wire 31 multiple first line segments and Between multiple second line segments between second conducting wire 32.
First segment area A1 of graphical user interface 621 shows the shape that is sticked of the LED chip 51 in first time patch process State.When as shown in fig. 6, the segment 6211 of the first segment area A1 in the graphical user interface 621 that display screen 62 is shown from the When one color such as white is changed into the second color such as black, it is meant that fill up 24 segments of the second color such as black 6211 24 LED chips 51 represented have been sticked completion, wherein each fixing base 20, which has been sticked, 6 LED chips 51.First When all segments 6211 in segment area A1 all fill up the second color, the operation that is sticked of 144 LED chips 51 is completed.
Make in the first time patch process for multiple LED chips 51 that the multiple segments 6211 for completing the first segment area A1 represent After industry, the platform conveying device 12 of workbench 10 can will be equipped with the workbench 10 of multiple fixing bases 20, from chip mounter 70 70 outside of chip mounter is delivered to below interior 71 direction of multiple spray guns.It then, can be by multiple fixing bases 20 from workbench 10 It unloads, and by each lamp string being made of the first conducting wire 31, the second conducting wire 32 and multiple LED chips 51 from corresponding fixing base It is unloaded on 20.
There is single led chip by each LED light that lamp string is completed in above-mentioned operation.If the part of lamp string to be made is every A LED light has dual chip, then can rotate work by the actuator of workbench 10 before lamp string is unloaded from fixing base 20 Make platform 10, repeat above-mentioned patch operation using chip mounter, then be sticked a LED chip to lamp string each LED light.Often Double LED chips 51 of a LED light back-to-back can mutually be sticked together.
Second segment area A2 shows the state that is sticked of multiple LED chips 51 in second of patch process.When the second segment When all segments 6222 of area A2 also all fill up the second color, 288 LED chips 51 that are sticked are completed altogether.It should be understood that LED chip 51 patch quantity and corresponding patch operation can adjust according to actual demand, and invention is not limited thereto.
Referring to Fig. 7, it is the first pass figure of the pasting method of the LED chip of the embodiment of the present invention.As shown in fig. 7, The pasting method of the LED chip of the embodiment of the present invention comprises the steps of S701~S713, is applicable to above-mentioned LED chip Patch device.
Step S701: along the longitudinal direction of each fixing base of multiple fixing bases, the first conducting wire of winding at a predetermined interval Multiple first line segments, and multiple second line segments of the second conducting wire of winding are on each fixing base at a predetermined interval, wherein every 1 The preset distance that two line segments and adjacent every one first line segment are separated by depends on LED core chip size.
Step S703: multiple fixing bases are installed on workbench.
Step S705: by video capture device, capturing the image on workbench, includes multiple fixing bases, multiple first The image of conducting wire and multiple second conducting wires.
Step S707: utilizing electronic device, in the images of recording and displaying fixing base two sides, the first conducting wire respectively near Respectively near the two of each fixing base two sides in the coordinate position and the second conducting wire of two the first line segments of each fixing base two sides The coordinate position of a second line segment.
Step S709: the quantity of the LED chip that each fixing base to be sticked is inputted to electronic device.
Step S711: by electronic device, of the first line segment and the second conducting wire based on oriented first conducting wire Predetermined space and the first conducting wire between multiple line segments of the coordinate position of two line segments, the first conducting wire or the second conducting wire and Preset distance between second conducting wire analyzes other multiple LED chips and waits being connected across fixing according to the quantity of multiple LED chips The coordinate position between the first conducting wire and the second conducting wire on seat/be sticked position.
Step S713: by chip mounter, according to the coordinate position of multiple LED chips, the LED chip that is sticked is connected across first and leads Between the adjacent second line segment of the first line segment and the second conducting wire of line.
Single led chip is only arranged in each LED light of S701~S713 through the above steps, lamp string.If lamp string to be made Part or each LED light have dual chip, and the pasting method of the LED chip of the embodiment of the present invention, which comprises the steps of:, passes through work Make the actuator rotation work platform of platform, or the first conducting wire and the second conducting wire removed from fixing base and after turn-over further around If returning on fixing base；Above-mentioned steps S705~S713 is repeated using chip mounter, with the LED chip that is sticked again, two LED Chip can be adjacent to each other or back-to-back be mutually sticked together.
Referring to Fig. 8, it is the second flow chart of the pasting method of the LED chip of the embodiment of the present invention.As shown in figure 8, The pasting method of the LED chip of the embodiment of the present invention comprises the steps of S801~S809, can be with above-mentioned all or part of step Suddenly it is combined according to mode appropriate, the patch device suitable for above-mentioned LED chip.
Step S801: by video capture device, each fixing base, each first conducting wire and each second on workbench are captured The image of conducting wire.
Step S803: graphical user interface is shown by electronic device, the image area in graphical user interface shows shadow The image captured as acquisition device.
Step S805: by electronic device, multiple figures with the first color are shown in the segment area of graphical user interface Block respectively represents the multiple LED chips not being sticked between the first conducting wire and the second conducting wire on the surface of multiple fixing bases.
Step S807: by chip mounter, according to the coordinate position of multiple LED chips, the LED chip that is sticked is connected across first and leads Between the adjacent second line segment of the first line segment and the second conducting wire of line.
Step S809: electronic device changes first that shown segment Qu Zhong represents the segment for the LED chip being sticked Color is the second color, and multiple segments until representing all LED chips to be sticked all switch to the second color from the first color.
Referring to Fig. 9, it is the third flow chart of the pasting method of the LED chip of the embodiment of the present invention.As shown in figure 9, The pasting method of the LED chip of the embodiment of the present invention comprises the steps of S901~S911, can be with above-mentioned all or part of step Suddenly it is combined according to mode appropriate, the patch device suitable for above-mentioned LED chip.
Step S901: chip mounter is moved horizontally above multiple fixing bases of workbench by the actuator of chip mounter Multiple spray guns, each spray gun mouth is aligned between the first line segment and second line segment of LED chip to be sticked.
Step S903: by actuator, multiple spray guns are activated close to the first conducting wire and the second conducting wire, wait be sticked Dispensing on each first line segment of LED chip and each second line segment, and complete the multiple spray guns of actuating in dispensing and led far from first Line and the second conducting wire.
Step S905: by multiple conveying devices, respectively have towards the conveying of the direction of multiple spray guns of chip mounter respectively multiple Multiple bands of LED chip.
Step S907: by the actuator of chip mounter, activating multiple spray guns and being moved to respectively has the multiple of multiple LED chips Above band, to obtain multiple LED chips respectively by multiple spray guns.
Step S909: by actuator, activating multiple spray guns and move back to above the first conducting wire and the second conducting wire, will be each Spray gun mouth is aligned between the first line segment of the first conducting wire of LED chip to be sticked and the second line segment of the second conducting wire.
Step S911: by multiple spray guns, the first conducting wire that multiple LED chips that are sticked respectively are connected across on multiple fixing bases Multiple first line segments and the second conducting wire multiple second line segments between.
In conclusion the beneficial effects of the present invention are, the patch device and method of LED chip provided by the invention, Automation control chip mounter is used to realize patch operation, replaces the manpower operation for the LED chip that is sticked manually, to effectively improve patch If the position precision of LED chip and the efficiency of production, to reduce the processing time of each LED chip, mass production is realized The effect of the lamp string of high quality.
Must be explanatorily finally, in preceding description, although by the concept of the technology of the present invention with multiple exemplary implementations Example is specifically illustrated in and illustrates, however it will be understood by those skilled in the art that being defined without departing substantially from by following claims The technology of the present invention concept range under conditions of, the various change in form and details can be made to it.

Claims (14)

1. a kind of patch device of LED chip, which is characterized in that the patch device of the LED chip includes:
Workbench；
Multiple fixing bases, installation is on the working platform；
Multiple conducting wires include multiple first conducting wires and multiple second conducting wires, multiple first line segments edge of each first conducting wire The longitudinal direction of each fixing base is wound around at a predetermined interval on each fixing base, and multiple the second of each second conducting wire Line segment is wound around on each fixing base along the longitudinal direction of each fixing base with the predetermined space；
Video capture device, setting is square on the working platform, and configuration is to capture an image towards the workbench；
Multiple LED chips, each LED chip are sticked first conducting wire and described on the corresponding fixing base Between two conducting wires, wherein the preset distance between second conducting wire and first conducting wire depends on each LED chip ruler It is very little；
Electronic device, connects the video capture device, configuration with provide first conducting wire inputted on each fixing base and The quantity for the multiple LED chip to be sticked between second conducting wire shows the image and based on the image capture Device captures the position analysis of the image, record and shows respectively in first conducting wire of each fixing base two sides Described two first line segments and described two second line segments in second conducting wire multiple coordinate positions, according to described in Multiple coordinate positions, the predetermined space, the preset distance and the quantity analyze other the multiple LED chips and are intended to paste If other multiple coordinate positions；And
One chip mounter, connects the electronic device, and configuration according to other the multiple coordinate positions to be sticked each LED chip Between first conducting wire and second conducting wire.
2. the patch device of LED chip according to claim 1, which is characterized in that the display screen of the electronic device To show graphical user interface, the image area in the graphical user interface shows what the video capture device was captured for configuration Image；
The display screen configuration shows multiple segments with the first color with the segment area in the graphical user interface, point It does not represent the multiple between first conducting wire and second conducting wire not being sticked above the multiple fixing base LED chip.
3. the patch device of LED chip according to claim 2, which is characterized in that a processor of the electronic device Configuration in each LED chip to be sticked between first conducting wire and second conducting wire above the fixing base When, the segment Qu Zhong that the control display screen changes display represents the described of each segment of each LED chip First color is the second color；
Wherein second color is different from first color.
4. the patch device of LED chip according to claim 1, which is characterized in that the patch device of the LED chip is also Comprising platform conveying device, the workbench is connected, the platform conveying device configuration is arranged with described the will install The workbench of one conducting wire and second conducting wire but the multiple fixing base for the multiple LED chip that is not sticked, It is delivered to below multiple spray gun directions in the chip mounter from an outside of the chip mounter；
The platform conveying device configuration has been sticked described in the multiple fixing base of the multiple LED chip with that will be equipped with Workbench is delivered to another outside of the chip mounter below the multiple spray gun direction in the chip mounter.
5. the patch device of LED chip according to claim 1, which is characterized in that the chip mounter also includes actuator, Multiple spray guns are connected, each spray gun mouth is aligned the multiple wait be sticked by the actuator configuration with the multiple spray guns of movement Between first conducting wire and second conducting wire of LED chip；
Actuator configuration with by the multiple spray gun of the actuator activation close to first conducting wire and described the Two conducting wires, with the dispensing on each first conducting wire and each second conducting wire wait the multiple LED chip that is sticked, and Complete to activate the multiple spray gun far from first conducting wire and second conducting wire in dispensing.
6. the patch device of LED chip according to claim 1, which is characterized in that the chip mounter also includes multiple cores Piece conveying device and actuator, the multiple chip conveying device is adjacent with the chip mounter, described in the actuator connection Multiple spray guns of chip mounter, the multiple chip conveying device are respectively configured with towards the side of the multiple spray gun of the chip mounter To conveying respectively with multiple bands of the multiple LED chip；
The actuator is configured such that moving the multiple spray gun is moved to the multiple band respectively with the multiple LED chip Top, the multiple spray gun obtain the multiple LED chip respectively, and the actuator then activates the multiple spray gun and moves back to Above first conducting wire and second conducting wire；
The actuator, which is configured such that, moves the multiple spray gun, and each spray gun mouth is aligned wait the LED chip that is sticked Between first conducting wire and second conducting wire, each spray gun is sticked each LED chip in the fixing base respectively On first conducting wire and second conducting wire between.
7. the patch device of LED chip according to claim 6, which is characterized in that be placed on each item take it is each The anode of the LED chip and the configuration direction of cathode depend on being intended to be sticked first conducting wire and second conducting wire it Between each LED chip anode and cathode configuration direction.
8. a kind of pasting method of LED chip, which is characterized in that the pasting method of the LED chip comprises the steps of:
Along the longitudinal direction of each fixing base of multiple fixing bases, multiple First Lines of the first conducting wire of winding at a predetermined interval Section, and with multiple second line segments of second conducting wire of predetermined space winding on each fixing base, wherein each described The preset distance that second line segment and adjacent each first line segment are separated by depends on LED core chip size；
The multiple fixing base is installed on workbench；
By video capture device, towards the workbench pick-up image；
Using electronic device, respectively near each institute in the image of the multiple fixing base of recording and displaying, first conducting wire It states in the coordinate position and second conducting wire of described two first line segments of fixing base two sides respectively near each described solid Hold the coordinate position of described two second line segments of a two sides；
Quantity to the electronics that each fixing base is inputted in face of the multiple LED chip to be sticked above chip mounter fills It sets；
By the electronic device, based near described two first line segments of the two sides of each fixing base and described two The coordinate position of a second line segment, the predetermined space and the preset distance, according to the quantity of the multiple LED chip, Analyze other the multiple LED chips be intended to be sticked first conducting wire on each fixing base and second conducting wire it Between coordinate position；And
By the chip mounter, according to the coordinate position of the multiple LED chip, each LED chip that is sticked is described first Between conducting wire and second conducting wire.
9. the pasting method of LED chip according to claim 8, which is characterized in that the pasting method of the LED chip is also It comprises the steps of:
Graphical user interface is shown by the electronic device, and the image area in the graphical user interface shows the shadow The image captured as acquisition device；
By the electronic device, multiple segments with the first color are shown in the segment area of the graphical user interface, point It does not represent the multiple between first conducting wire and second conducting wire not being sticked above the multiple fixing base LED chip.
10. the pasting method of LED chip according to claim 8, which is characterized in that the pasting method of the LED chip Also comprise the steps of:
When the LED chip has been sticked between first conducting wire and second conducting wire above the fixing base, The electronic device changes first face that the shown segment Qu Zhong represents each segment of each LED chip Color is the second color；
Wherein second color is different from first color.
11. the pasting method of LED chip according to claim 8, which is characterized in that the pasting method of the LED chip Also comprise the steps of:
By platform conveying device, it will install and be arranged with first conducting wire and second conducting wire but be not sticked described more The workbench of the multiple fixing base of a LED chip is delivered to the chip mounter from an outside of the chip mounter Below interior multiple spray gun directions；And
By the platform conveying device, it has been sticked being equipped with described in the multiple fixing base of the multiple LED chip Workbench is delivered to another outside of the chip mounter below the multiple spray gun direction in the chip mounter.
12. the pasting method of LED chip according to claim 8, which is characterized in that the pasting method of the LED chip Also comprise the steps of:
By the actuator of the chip mounter, each spray gun mouth is aligned wait paste by multiple spray guns of the mobile chip mounter If between first line segment of the LED chip and the second line segment；And
By the actuator, the multiple spray gun is activated close to first conducting wire and second conducting wire, wait paste If dispensing on each first conducting wire and each second conducting wire of the LED chip, and completed described in actuating in dispensing Multiple spray guns are far from first conducting wire and second conducting wire.
13. the pasting method of LED chip according to claim 8, which is characterized in that the pasting method of the LED chip Also comprise the steps of:
By multiple chip conveying devices, respectively there are multiple LED cores towards the conveying of the direction of multiple spray guns of the chip mounter respectively Multiple bands of piece；
By the actuator of the chip mounter, activates the multiple spray gun and be moved to multiple bands respectively with multiple LED chips Top, to obtain multiple LED chips respectively by the multiple spray gun；
By the actuator of the chip mounter, activates the multiple spray gun and move back to first conducting wire and second conducting wire Each spray gun mouth is aligned between first conducting wire and second conducting wire wait the LED chip that is sticked by top； And
By the multiple spray gun, the multiple LED chip is sticked described first on the multiple fixing base leads respectively Between line and second conducting wire.
14. the pasting method of LED chip according to claim 13, which is characterized in that the pasting method of the LED chip Also comprise the steps of:
Through each chip conveying device, described in being intended to be sticked between first conducting wire and second conducting wire The anode of LED chip and the configuration direction of cathode determine the anode and cathode that are placed on each LED chip that the item takes Configuration direction.
CN201811081651.2A 2017-09-29 2018-09-17 The patch device and method of LED chip Pending CN109585627A (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US201762565327P 2017-09-29 2017-09-29
US62/565,327 2017-09-29
US201762584619P 2017-11-10 2017-11-10
US62/584,619 2017-11-10

Publications (1)

Publication Number Publication Date
CN109585627A true CN109585627A (en) 2019-04-05

Family

ID=65034629

Family Applications (7)

Application Number Title Priority Date Filing Date
CN201810312753.4A Active CN109587898B (en) 2017-09-29 2018-04-09 Lamp circuit with time control function
CN201810312731.8A Active CN109586141B (en) 2017-09-29 2018-04-09 Wire, wire stripping method and lamp
CN201810311959.5A Pending CN109611711A (en) 2017-09-29 2018-04-09 Lamp bar manufacturing method and bobbin winder bracket for manufacturing lamp bar
CN201810415874.1A Active CN109587870B (en) 2017-09-29 2018-05-03 Single-point control lamp string circuit and method thereof
CN201811008510.8A Pending CN109586352A (en) 2017-09-29 2018-08-31 Power supply device
CN201811044271.1A Pending CN109570997A (en) 2017-09-29 2018-09-07 Lamp string and its automatic assembly equipment and method
CN201811081651.2A Pending CN109585627A (en) 2017-09-29 2018-09-17 The patch device and method of LED chip

Family Applications Before (6)

Application Number Title Priority Date Filing Date
CN201810312753.4A Active CN109587898B (en) 2017-09-29 2018-04-09 Lamp circuit with time control function
CN201810312731.8A Active CN109586141B (en) 2017-09-29 2018-04-09 Wire, wire stripping method and lamp
CN201810311959.5A Pending CN109611711A (en) 2017-09-29 2018-04-09 Lamp bar manufacturing method and bobbin winder bracket for manufacturing lamp bar
CN201810415874.1A Active CN109587870B (en) 2017-09-29 2018-05-03 Single-point control lamp string circuit and method thereof
CN201811008510.8A Pending CN109586352A (en) 2017-09-29 2018-08-31 Power supply device
CN201811044271.1A Pending CN109570997A (en) 2017-09-29 2018-09-07 Lamp string and its automatic assembly equipment and method

Country Status (4)

Country Link
US (7) US20190101254A1 (en)
CN (7) CN109587898B (en)
CA (7) CA3013375A1 (en)
TW (7) TW201914717A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111933555A (en) * 2020-09-16 2020-11-13 深圳平晨半导体科技有限公司 Efficient multi-station synchronous die bonding device and method

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10845012B1 (en) * 2019-06-14 2020-11-24 Fourstar Group Inc. Decorative light string
CN110726081B (en) 2019-09-06 2024-02-27 珠海博杰电子股份有限公司 LED lamp string, production method and production equipment thereof
CN110617414A (en) 2019-09-06 2019-12-27 珠海博杰电子股份有限公司 LED net lamp and production method thereof
CN110736034B (en) 2019-09-06 2024-05-28 珠海博杰电子股份有限公司 LED hose lamp, production method and production equipment thereof
CN110645494A (en) * 2019-09-06 2020-01-03 珠海博杰电子股份有限公司 Electrodeless side-mounted LED lamp string, production method and production equipment thereof
CN110630923A (en) 2019-09-06 2019-12-31 珠海博杰电子股份有限公司 Electrodeless flat-pasted LED lamp string, production method and production equipment thereof
US11603983B2 (en) 2019-09-06 2023-03-14 Zhuhai Bojay Electronics Co. Ltd. LED light string ornament and method for manufacturing the same
CN110994329B (en) * 2019-12-06 2021-02-26 广州市亿源机电有限公司 Wire harness automatic jack identification device and method
CN111168377B (en) * 2020-01-13 2021-06-11 浙江阳光照明电器集团股份有限公司 Automatic assembling device for LED bulb lamp
CN113365387A (en) * 2020-03-02 2021-09-07 科斯莫灯饰公司 Light-emitting controller with multiple light-emitting modes for lamp string, control method and lamp string assembly
US11359775B2 (en) * 2020-06-10 2022-06-14 Ledup Manufacturing Group Limited Series connected parallel array of LEDs
TWI724917B (en) * 2020-06-10 2021-04-11 矽誠科技股份有限公司 Light-emitting diode module and light-emitting diode lamp string with sleep mode
TWI748724B (en) * 2020-11-03 2021-12-01 電威電機工廠股份有限公司 Control system and control method of garden lamp
CN113147464B (en) * 2021-04-30 2022-09-30 重庆工业职业技术学院 Multi-functional new energy automobile fills electric pile
CN115405878A (en) 2021-05-26 2022-11-29 珠海博杰电子股份有限公司 LED lamp string with single wire and lighting device
JP7302627B2 (en) * 2021-06-11 2023-07-04 株式会社プロテリアル Wire connection structure, wire connection method, medical device, and method for manufacturing medical device
EP4130552A1 (en) * 2021-08-04 2023-02-08 Chongyi Jingyi Lighting Products Co., Ltd. Led lamp module
US11777334B2 (en) * 2021-11-11 2023-10-03 Beta Air, Llc System for charging multiple power sources and monitoring diode currents for faults
TWI792840B (en) * 2022-01-07 2023-02-11 瑞昱半導體股份有限公司 Usb chip and operation method thereof
CN114554645A (en) * 2022-03-11 2022-05-27 厦门普为光电科技有限公司 Illumination device with illumination compensation function and illumination compensation method of illumination device

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6173517B1 (en) * 1997-03-27 2001-01-16 Osa Elektronik Gmbh Luminous display element with a light coupled into a light conducting housing
CN201274636Y (en) * 2008-07-11 2009-07-15 上海现代科技发展有限公司 Visual full-automatic chip mounter capable of image recognition
TW201103389A (en) * 2009-07-14 2011-01-16 nai-cheng Cai Method for manufacturing light set with surface mounted light emitting components
CN202302947U (en) * 2011-10-14 2012-07-04 廖国荣 Patch-typed LED (Light Emitting Diode) copper wire lamp string
CN105353721A (en) * 2015-11-10 2016-02-24 中国科学院合肥物质科学研究院 Fully automatic LED mounting machine control system
CN105407654A (en) * 2015-11-09 2016-03-16 东莞市浩远电子有限公司 Surface mounting machine and surface mounting method thereof

Family Cites Families (68)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3794522A (en) * 1972-01-24 1974-02-26 Burroughs Corp Stripping insulated wire
JP2683926B2 (en) * 1988-01-25 1997-12-03 三菱電機株式会社 Insulation-coated wire stripping method and device
JP2928634B2 (en) * 1990-11-30 1999-08-03 トキコーポレーション株式会社 Wire exposure hole processing tool and processing method for strip-shaped electric wire
US5608290A (en) * 1995-01-26 1997-03-04 Dominion Automotive Group, Inc. LED flashing lantern
US5800500A (en) * 1995-08-18 1998-09-01 Pi Medical Corporation Cochlear implant with shape memory material and method for implanting the same
US5935465A (en) * 1996-11-05 1999-08-10 Intermedics Inc. Method of making implantable lead including laser wire stripping
US6027952A (en) * 1997-01-21 2000-02-22 Liu; Ming-Hsun Method of manufacturing a string of electrically connected light emitting diodes
US6374143B1 (en) * 1999-08-18 2002-04-16 Epic Biosonics, Inc. Modiolar hugging electrode array
CN100343573C (en) * 2000-11-29 2007-10-17 吴政雄 Bendable lamp unit and its manufacture method
DE10106961A1 (en) * 2001-02-15 2002-08-29 Happich Fahrzeug & Ind Teile Bleuchtungseinrichtung
TW470136U (en) * 2001-03-30 2001-12-21 Tsuei-Duan Weng Strand structure of decoration lights
JP3796159B2 (en) * 2001-10-24 2006-07-12 矢崎総業株式会社 Wire covering material removing method and covering material removing apparatus
US7178971B2 (en) * 2001-12-14 2007-02-20 The University Of Hong Kong High efficiency driver for color light emitting diodes (LED)
CN1514497A (en) * 2002-12-12 2004-07-21 林锡煌 Luminuous crystal grain series packaging method
CN2612082Y (en) * 2003-04-04 2004-04-14 京东方科技集团股份有限公司 Rechargeable battery pack
US6860007B1 (en) * 2003-08-26 2005-03-01 Li-Wen Liu Method of producing an LED rope light
JP4262565B2 (en) * 2003-10-15 2009-05-13 株式会社松村電機製作所 Lighting device
US6935762B2 (en) * 2003-11-26 2005-08-30 Vickie Jean's Creations, Inc. Light string assembly
WO2011143510A1 (en) * 2010-05-12 2011-11-17 Lynk Labs, Inc. Led lighting system
US7221110B2 (en) * 2004-12-17 2007-05-22 Bruce Industries, Inc. Lighting control system and method
US7235815B2 (en) * 2005-02-14 2007-06-26 Hsien-Ta Shen LED light set
CN2830875Y (en) * 2005-09-29 2006-10-25 陈铭培 Pouring-shaped festival string lamps
CN2872072Y (en) * 2006-01-06 2007-02-21 林书弘 Light-emitting diodes light string device with anti-blocking mechanism
JP2007290013A (en) * 2006-04-26 2007-11-08 Phoeton Corp Cutting method for shielded conductor layer, and laser beam machining apparatus
US7670023B1 (en) * 2006-05-15 2010-03-02 Peterson Terry J Flashlight with photovoltaic power source
US7947921B2 (en) * 2006-10-30 2011-05-24 Delphi Technologies, Inc. Electric wire insulation center stripping method and device
TW200831818A (en) * 2007-01-25 2008-08-01 nai-cheng Cai Manufacturing method of an LED lamp string
JP2008188661A (en) 2007-02-07 2008-08-21 Sumitomo Electric Ind Ltd Laser beam machining method
CN101255961A (en) * 2007-03-01 2008-09-03 蔡乃成 Method for manufacturing LED lamp string
TWM343822U (en) * 2008-03-21 2008-11-01 Mosdesign Semiconductor Corp Simultaneous LED cascade circuit of two-cord AC power
EP2216866A3 (en) * 2009-02-06 2011-07-13 HID Global GmbH Method to strip a portion of an insulated wire
TWM368010U (en) * 2009-06-19 2009-11-01 Semisilicon Technology Corp LED (light emitting diode) lamp string and net lamp thereof
US8397381B2 (en) * 2009-08-06 2013-03-19 Allied Bright Technology Limited Method for manufacturing light set with surface mounted light emitting components
CN201487798U (en) * 2009-08-18 2010-05-26 普信科技股份有限公司 Safety and energy-saving decorative lamp
CN201611025U (en) * 2009-08-20 2010-10-20 杭州佑国光电科技有限公司 LED lamp with adjustable light
US8299724B2 (en) * 2010-03-19 2012-10-30 Active-Semi, Inc. AC LED lamp involving an LED string having separately shortable sections
US8454186B2 (en) * 2010-09-23 2013-06-04 Willis Electric Co., Ltd. Modular lighted tree with trunk electical connectors
JP6182074B2 (en) * 2011-03-07 2017-08-16 オスラム・シルバニア・インコーポレイテッド High efficiency low energy storage drive circuit for solid state light source
TWI431218B (en) * 2011-03-11 2014-03-21 Lingsen Precision Ind Ltd The manufacturing method and structure of LED light bar
CN102833995A (en) * 2011-06-17 2012-12-19 王协峰 Full-automatic high-speed LED (light-emitting diode) plug-in chip mounter
CN105828473B (en) * 2011-07-14 2018-02-09 陈家德 Two stepwise light emitting diode security monitoring lighting devices
TW201307728A (en) * 2011-08-09 2013-02-16 Foxsemicon Integrated Tech Inc LED lamp
CN102322589B (en) * 2011-08-31 2013-07-10 浙江恒森光电科技有限公司 Full-automatic LED (light-emmiting diode) light bar processing device
CN202201584U (en) * 2011-08-31 2012-04-25 浙江恒森光电科技有限公司 Rotary winding table of full-automatic LED lamp bar processing equipment
TWI448200B (en) * 2011-09-06 2014-08-01 Univ Nat Taipei Technology AC-driven light-emitting diode devices
TW201320384A (en) * 2011-11-08 2013-05-16 Ind Tech Res Inst Ceiling fixture
CN102548240B (en) * 2012-01-12 2015-02-11 广东木几智能装备有限公司 Double-arm multi-head chip mounting system for light-emitting diode (LED) chip mounter
TWI528018B (en) * 2012-03-07 2016-04-01 鴻海精密工業股份有限公司 Examination device of mounting machine
CN103369776A (en) * 2012-04-10 2013-10-23 深圳中科光华科技有限公司 Driving device with a plurality of serially-connected LED circuits connected in parallel and with real-time detection function and constant-current driving method
FR2992784B1 (en) 2012-06-29 2015-08-07 Laselec DEVICE FOR STRIPPING ELECTRIC CABLES USING VIOLET OR BLUE LASER DIODES
TWI556539B (en) * 2012-09-21 2016-11-01 Battery pack series and parallel matrix connection application module
WO2014153034A1 (en) * 2013-03-14 2014-09-25 Milwaukee Electric Tool Corporation Power tool having multiple battery packs
CN104185384B (en) * 2013-05-22 2017-07-25 松下知识产权经营株式会社 The installation method and erecting device of installing component
CN103915870B (en) * 2014-03-28 2017-04-12 小米科技有限责任公司 Power source and terminal
TWM493218U (en) * 2014-05-20 2015-01-01 Maintech Semiconductor Inc Two-wire type LED lamp circuit with independent control
CN204026263U (en) * 2014-08-13 2014-12-17 乐清市新明丽灯饰有限公司 Detachable meshwork lamp
US9806551B2 (en) * 2014-08-25 2017-10-31 Master Lock Company Llc Circuits and methods for using parallel separate battery cells
TWI536866B (en) * 2014-08-29 2016-06-01 矽誠科技股份有限公司 Light emitting diode lamp with burnable function and lamp string and system for the same
TWI556547B (en) * 2014-09-16 2016-11-01 盧昭正 Diffusion potential diode application circuits
CN204481496U (en) * 2014-12-26 2015-07-15 成都建中锂电池有限公司 With the primary lithium battery pack of safety system
TWM503521U (en) * 2015-02-03 2015-06-21 King Yang Internat Technology Co Ltd LED lamp decoration carrier
CN107924736B (en) * 2015-06-01 2019-11-05 奥托诺米克斯医药有限公司 Slender conductor and its making and use method
CN204836690U (en) * 2015-07-29 2015-12-02 东莞市纳川盈海照明有限公司 LED lamps and lanterns through two return circuit mixing of colors temperature of two lines
TWM516227U (en) * 2015-11-12 2016-01-21 Tian-Yu Chen Surface attachment type LED module molding structure
CN205546029U (en) * 2016-01-11 2016-08-31 武汉金东方智能景观股份有限公司 Led lamp lighting circuit
CN205489597U (en) * 2016-01-12 2016-08-17 吉安精程仪表科技有限公司 Many batteries instrument supply circuit
US10239159B2 (en) * 2016-06-30 2019-03-26 The Boeing Company Laser wire processing device
CN106532150B (en) * 2016-12-02 2019-05-03 中国船舶重工集团公司第七一九研究所 A kind of modular controllable topological structure of high-voltage large-capacity lithium battery group

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6173517B1 (en) * 1997-03-27 2001-01-16 Osa Elektronik Gmbh Luminous display element with a light coupled into a light conducting housing
CN201274636Y (en) * 2008-07-11 2009-07-15 上海现代科技发展有限公司 Visual full-automatic chip mounter capable of image recognition
TW201103389A (en) * 2009-07-14 2011-01-16 nai-cheng Cai Method for manufacturing light set with surface mounted light emitting components
CN202302947U (en) * 2011-10-14 2012-07-04 廖国荣 Patch-typed LED (Light Emitting Diode) copper wire lamp string
CN105407654A (en) * 2015-11-09 2016-03-16 东莞市浩远电子有限公司 Surface mounting machine and surface mounting method thereof
CN105353721A (en) * 2015-11-10 2016-02-24 中国科学院合肥物质科学研究院 Fully automatic LED mounting machine control system

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111933555A (en) * 2020-09-16 2020-11-13 深圳平晨半导体科技有限公司 Efficient multi-station synchronous die bonding device and method

Also Published As

Publication number Publication date
CA3014180A1 (en) 2019-03-29
US20190104576A1 (en) 2019-04-04
US10631388B2 (en) 2020-04-21
CN109586141B (en) 2020-12-22
US20190101253A1 (en) 2019-04-04
CA3014180C (en) 2020-10-13
CA3013375A1 (en) 2019-03-29
US10993304B2 (en) 2021-04-27
TW201914717A (en) 2019-04-16
US20190103505A1 (en) 2019-04-04
TWI666972B (en) 2019-07-21
US20190103592A1 (en) 2019-04-04
TWI718406B (en) 2021-02-11
TW201916528A (en) 2019-04-16
TWI681697B (en) 2020-01-01
CN109586141A (en) 2019-04-05
CN109586352A (en) 2019-04-05
CN109570997A (en) 2019-04-05
TW201915384A (en) 2019-04-16
TW201914727A (en) 2019-04-16
US20190104578A1 (en) 2019-04-04
TW201916747A (en) 2019-04-16
US10299329B2 (en) 2019-05-21
CN109587898B (en) 2020-12-22
CN109587870B (en) 2021-07-13
US10264631B1 (en) 2019-04-16
CN109587898A (en) 2019-04-05
US20190101254A1 (en) 2019-04-04
US20190103736A1 (en) 2019-04-04
CA3019044A1 (en) 2019-03-29
TWI699254B (en) 2020-07-21
CN109611711A (en) 2019-04-12
TW201916739A (en) 2019-04-16
TW201916791A (en) 2019-04-16
CN109587870A (en) 2019-04-05
CA3014183A1 (en) 2019-03-29
US10609800B2 (en) 2020-03-31
TWI641780B (en) 2018-11-21
CA3019057A1 (en) 2019-03-29
CA3014179A1 (en) 2019-03-29
CA3019082A1 (en) 2019-03-29
TWI661745B (en) 2019-06-01

Similar Documents

Publication Publication Date Title
CN109585627A (en) The patch device and method of LED chip
CN108022279B (en) Video special effect adding method and device and intelligent mobile terminal
CN103206925B (en) Soldering inspection is with checking reference enrollment method and the base board checking device by the method
CN105022498B (en) Electronic device and its method
CN109785420B (en) 3D scene color picking method and system based on Unity engine
CN102801924A (en) Television program host interaction system based on Kinect
CN106973220A (en) Object method for tracing
CN102184007B (en) Interactive intelligent conference system based on pattern recognition and using method thereof
CN102436327A (en) Screen input system and implementation method thereof
CN105491293A (en) Shooting control method, device, mobile terminal, selfie stick and shooting control system
CN105773117A (en) Automatic pressing-in device for wire pressing-in terminal
CN104506765A (en) Mobile terminal and focusing method based on touch gesture of mobile terminal
CN104536181A (en) FOG process alignment method and system
CN104281335A (en) Multi-point touch control interactive large screen system and control method of multi-point touch control interactive large screen system
CN206731440U (en) A kind of glue applying mechanism with vision inspection apparatus
CN107764210B (en) Pitch ear auricle assembly pin hole method for measuring coaxiality
CN203281518U (en) Crystal grain selecting equipment
CN101730461B (en) Aligning method used for welding BGA chip
CN104932077A (en) Shooting module assembling device and shooting module assembling method
CN107346641B (en) Manufacturing method of large display screen photoelectric glass
CN204855735U (en) Circuit board automated inspection equipment
US20190267340A1 (en) Micro-device panel and manufacturing process thereof
CN102680765A (en) Method for testing current of camera connecting plate and clamp thereof
CN105163013B (en) A kind of camera module normal component and its assemble method
CN109219339A (en) Apparatus for mounting part and storage medium

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20190405

WD01 Invention patent application deemed withdrawn after publication