201103389 六、發明說明： 【發明所屬之技術領域】 本發明係關於一種半導體發光元件燈組之製程設計’ 特別是關於一種表面黏著型發光元件燈組之製造方法。 【先前技術】 近年來’半導體發光元件逐漸取代一般傳統照明設備 。以發光二極體(Light Emitting Diode，LED)為例，其具有 體積小、反應快、壽命長、不易衰減、外表堅固、耐震動、 可全彩發光（含不可見光）、指向設計容易、低電壓、低電流 、轉換損失低、熱輻射小、量產容易、環保等優點。 LED之習知結構係由一燈泡狀封裝膠包覆一 led晶片 而成，自LED晶片延伸出有一對接腳，其穿出封裝膠作為電 性連接之用。在使用時，則需將LED之一對接腳分別焊接於 具有正電源之導線以及具有負電源之導線上’使LED晶片接 受電力而發亮。由於燈泡型LED的體積較大，之後為了因應 更小型封裝和工廠自動化，也出現了體積較小的表面黏著型 LED。 雖然LED具有種種優點，但由於其本身低電壓、低電 流的特性，故也有著發光亮度不足的缺點。因此，一般為了 提高LED的亮度’則會將多個LED組合或串接為燈組戍燈串 來使用。 【發明内容】 [S] 201103389 本發明所欲解決之技術問題 #车墓Γ以上所述’f知半導體發光元件係透過焊接方式 難以發光元件之接腳分別與導線相連。然而，焊接品質201103389 VI. Description of the Invention: [Technical Field] The present invention relates to a process design of a semiconductor light-emitting device lamp group, and more particularly to a method of manufacturing a surface-adhesive light-emitting device lamp group. [Prior Art] In recent years, semiconductor light-emitting elements have gradually replaced conventional light-emitting devices. Taking Light Emitting Diode (LED) as an example, it has small volume, fast response, long life, not easy to decay, strong appearance, vibration resistance, full color illumination (including invisible light), easy pointing design, low Low voltage, low current, low conversion loss, low heat radiation, easy mass production, and environmental protection. The conventional structure of the LED is formed by coating a led wafer with a bulb-like encapsulant. A pair of pins extend from the LED chip, and the package adhesive is used as an electrical connection. In use, one of the LED pins is soldered to a wire having a positive power supply and a wire having a negative power supply to cause the LED chip to receive power and illuminate. Due to the large size of the bulb-type LEDs, smaller surface-mount LEDs have emerged in response to smaller packages and factory automation. Although LEDs have various advantages, they have the disadvantage of insufficient luminance due to their low voltage and low current characteristics. Therefore, in general, in order to increase the brightness of the LED, a plurality of LEDs are combined or connected in series to be a lamp string. SUMMARY OF THE INVENTION [S] 201103389 Technical Problem to Be Solved by the Invention #车墓Γ The above-mentioned semiconductor light-emitting elements are transmitted through a soldering method. The pins of the light-emitting elements are respectively connected to the wires. However, welding quality
難以控制，道_ OA 發光元件與導線間連接的穩固程度受到焊 ，影響’使半導體發光元件有易受外力而損壞、脫落 …等問喊產生，可靠度較差。Difficult to control, the degree of stability of the connection between the _ OA illuminating element and the wire is affected by the soldering, which causes the semiconductor illuminating element to be damaged by external forces, and is detached, etc., resulting in poor reliability.
個半個铸體發光轉組合或串接時，需將多 繫藉困齡 件的—對麟—烊接於導線上，施工過程 難’當要組合的半導體發光元件❹，整體的生產效 f問題’且半導體發光元件在導線上難以定位準確，會 有間隔不一的問題，導致成品品質不佳。 ^此，本發明之主要目的即是提供—種表面黏著型發 =件燈組之製造方法’在組裝社上十分容易、以快速且 =地製造表面黏著型發光元件燈組，解決習知技術在生產 製造上的問題。When one half of the casting body is turned into a combination or a series connection, it is necessary to connect the multi-series of the dying element to the wire, and the construction process is difficult. When the semiconductor light-emitting element to be combined is used, the overall production efficiency is f. The problem 'and the semiconductor light-emitting elements are difficult to position accurately on the wires, and there are problems with different intervals, resulting in poor quality of the finished product. In view of the above, the main object of the present invention is to provide a method for manufacturing a surface-adhesive hair-lamp group, which is very easy to manufacture a surface-adhesive light-emitting device lamp set in an assembly society, and solves the conventional technology. Problems in manufacturing.
本發明解決問題之技術手段 本發明為解決習知技術之問題所採用之技術手段係先 製備-具有預定長度的桿體及具有對應旋轉驅動軸之繞線 制架’再將桿體結合於繞線触之旋轉驅動軸，旋轉驅動轴 由-繞線設備W減轉。然後，將至少二條具有外覆絶 緣層的導線以-預定繞設間距，於椁體受到繞線制架之旋轉 驅動軸之驅減轉時，鴻繞料桿體之表面，繞設間距係 對應於-狀之表面黏著型發光元件之接腳間距，再沿桿體 [S1 -4 - 201103389 ΐ轴打磨各導線之絕緣層至裸露出各導線之導電 邠Λ在各導線上形成相對應位置之接觸墊區。 =Γ導電膠’且在相鄰導線的接觸塾區間跨置表面 黏者t發光元件，表面黏著型發光元件之各接腳係分別對應 相鄰導線的接觸㈣，並㈣導電膠紐連接於相鄰導線的 導電部。Technical Solution for Solving the Problems of the Invention The technical means adopted by the present invention to solve the problems of the prior art is to first prepare a rod body having a predetermined length and a winding frame having a corresponding rotating drive shaft, and then combining the rod body The line touches the rotary drive shaft, and the rotary drive shaft is rotated by the winding device W. Then, at least two wires having an outer insulating layer are arranged at a predetermined pitch, and when the carcass is driven by the rotating drive shaft of the winding frame, the surface of the material rod body is wound and the pitch is matched. On the surface of the surface-bonded light-emitting element, the distance between the pins of the surface-shaped light-emitting element is further polished along the rod body [S1 -4 - 201103389 ΐ axis to polish the conductive layer of each wire to expose the conductive 邠Λ of each wire to form a corresponding position on each wire Contact the pad area. =Γ conductive paste' and the surface of the adjacent wire is in contact with the surface of the t-light emitting element, the pins of the surface-adhesive light-emitting element respectively correspond to the contact of the adjacent wires (4), and (4) the conductive adhesive is connected to the phase The conductive portion of the adjacent wire.
Μ在本發明之較佳實施例中，導線更以一預定繞設節距 繞設在桿體之表面。且在跨置表面黏著型發光元件後，更包 括對表面黏著型發光元件及導線進行電導通測試，測試成功 後再烘乾導電膠，使表面黏著型發光元件固定結合於導線。 再者’相鄰導線的接觸墊區及表面黏著型發光元件更以封膠 包覆’並烘乾固化。在元件的選用上，桿體之形狀為圓枉形， 其表面更形成有至少二螺旋凹槽，以供導線繞設。導線選用 漆包線，導電膠選用銀膠，表面黏著型發光元件則選用表面 黏著型LED。 本發明對照先前技術之功效 經由本發明所採用之技術手段，透過將導線繞設於制 架後一併打磨，除了節省工時、增加效率外，更能透過調整 繞設節距，使得在導線上加工裸露出導電部的位置受到控 制，讓最後成品的導線上各個表面黏著型發光元件的間隔一 致，達到精確定位。 再者，由於不需要對表面黏著型發光元件的接腳一一 進行焊接，而是直接將其跨置於相對應之接觸墊區’藉由導 201103389 電膠電性電性連接於導線之導電部，組裝過程簡單、方便， 有效提升生產效率® 此外，因接觸墊區提供定位表面黏著型發光元件之作 用，讓表面黏著型發光元件與導線間之接觸面積較大，表面 更包覆有封膠，整體結構穩固，不易受外力而損壞、脫落， 可靠度較佳。 本創作所採用的具體實施例，將藉由以下之實施例及 附呈圖式作進一步之說明。 【實施方式】 參閱第1圖所示，其係顯示本發明較佳實施例之步驟 流程圖，並同時配合第2圖至第12圖對本發明較佳實施例 作一說明如下。 參閱第2圖、第3圖及第4圖，首先製備一具有預定 長度L的桿體S及一具有對應旋轉驅動轴ΤΙ、T2之繞線制 架Τ(步驟101)。再將桿體S結合於繞線制架Τ之旋轉驅動 軸ΤΙ、Τ2，旋轉驅動軸Ή、Τ2由一繞線設備Ε予以驅動 旋轉（步驟102)。 參閱第5圖，將至少二條具有外覆絶緣層11、21的導 線1、2以一預定繞設間距D，於桿體S受到繞線制架Τ之 旋轉驅動軸Τ卜Τ2沿一旋轉方向R驅動旋轉時，相鄰繞設 在桿體S之表面S1，繞設間距D係對應於一選定之表面黏 著型發光元件之接腳間距（步驟103)。 在本實施例中，桿體S之形狀為圓柱形，亦可以是其 201103389 匕形狀(如.橢圓形）’具有一軸向方向s〇,且在桿體s之表 面S1更形成有至少二螺旋凹槽S21、S2卜供導線卜2繞 設，以便於使導線丨、2繞設於桿體s之表面S1時，維持 其繞設間距D —致。 參閱第6圖及第7圖，在將導線卜2繞設於桿體s後， 沿桿體S之軸向方向S0打磨各導線1>2之絕緣層ιΐ 2ι 至裸露出各導線1、2之導電部12、22，以在各導線】、2 上形成相對應位置之接觸塾區13、23(步驟1〇4)。 導線1、2在本實施例為漆包線，其導電部12、22為 銅線’而絕緣| 1卜21貝ij為包覆於銅線外之絕緣漆。當然， 導線1、2不限於是漆包線，也可以是其他種線村，像是 電子線PE電線、電規線等，也可以是多條導線一併封 裝的電源線。導線1、2係以一預定繞設節距p繞設在桿體 之表面S1 ’繞设距p會影響同一導線上接觸墊區間的 距離，當繞設節距P固定時，所加工出的接觸塾區間的間隔 則會-致’在本實施例中則為環繞桿體s—周的距離。 參閱第8圖及第9圖，於導線卜2上打磨出接觸塾區 13、23後，在各接觸墊區13、幻塗佈導電膠％步驟1仍）。 然後在相鄰導線卜2的接觸墊區間跨置—表面黏著 1光元件4’表面黏著型發光元件4之各接腳係 另J對應相鄰導線！、2的接觸塾區Η、η，並經由導電膠 /電f生連接於相鄰導線卜2的導電部12、22(步驟1〇6)。之 Ή表面黏著型發光元件4及導線卜2進行電導通測試(步 ，)以檢測表面黏著型發光元件4與導線1、2是否確 201103389In a preferred embodiment of the invention, the wires are wound around the surface of the rod at a predetermined pitch. After the surface-mounting type light-emitting element is straddle-mounted, the surface conduction type light-emitting element and the wire are electrically tested. After the test is successful, the conductive glue is dried to fix the surface-adhesive light-emitting element to the wire. Further, the contact pad region of the adjacent wires and the surface-adhesive light-emitting device are further encapsulated by a sealer and dried and solidified. In the selection of the components, the shape of the rod body is a round shape, and the surface thereof is further formed with at least two spiral grooves for winding the wires. The wire is made of enameled wire, the conductive glue is made of silver glue, and the surface-adhesive type of light-emitting element is made of surface-adhesive LED. Compared with the technical means adopted by the present invention, the present invention can be used to anneal the wire after being placed on the frame, and save the working time and increase the efficiency, and can adjust the pitch by adjusting the pitch. The position of the bare conductive portion on the wire is controlled so that the spacing of the surface-emissive light-emitting elements on the final finished wire is uniform to achieve precise positioning. Furthermore, since it is not necessary to solder the pins of the surface-adhesive light-emitting element one by one, but directly straddle the corresponding contact pad area, the electrical conductivity of the conductive wire is electrically connected to the wire by the guide 201103389 The assembly process is simple and convenient, and the production efficiency is effectively improved. In addition, since the contact pad area provides the positioning surface-adhesive type of light-emitting element, the contact area between the surface-adhesive light-emitting element and the wire is large, and the surface is covered with a seal. Glue, the overall structure is stable, not easily damaged or detached by external force, and the reliability is better. The specific embodiments used in the present application will be further illustrated by the following examples and accompanying drawings. [Embodiment] Referring to Figure 1, there is shown a flow chart showing the steps of a preferred embodiment of the present invention, and a preferred embodiment of the present invention will be described below in conjunction with Figures 2 through 12. Referring to Figures 2, 3 and 4, a rod S having a predetermined length L and a winding frame having a corresponding rotational drive shaft ΤΙ, T2 are first prepared (step 101). The rod body S is then coupled to the rotary drive shafts Τ 2 of the winding frame ,, and the rotary drive shafts Τ 2 are driven to rotate by a winding device 步骤 (step 102). Referring to FIG. 5, at least two wires 1 and 2 having overlying insulating layers 11, 21 are arranged at a predetermined pitch D, and the rotating shaft of the rotating body of the rod S is wound in a rotating direction. When the R drive is rotated, adjacent to the surface S1 of the rod S, the winding pitch D corresponds to the pitch of the selected surface-adhesive light-emitting element (step 103). In the present embodiment, the shape of the rod S is cylindrical, or it may be such that its 201103389 匕 shape (eg, elliptical shape) has an axial direction s〇, and at least two surfaces S1 are formed on the surface S1 of the rod s. The spiral grooves S21 and S2 are wound around the wire 2 so as to maintain the winding pitch D when the wire turns 2 are wound around the surface S1 of the rod s. Referring to Figures 6 and 7, after the wire 2 is wound around the rod s, the insulating layer ι 2 2 of each wire 1 > 2 is polished in the axial direction S0 of the rod S to barely expose the wires 1, 2 The conductive portions 12, 22 form contact regions 13, 23 at corresponding positions on the respective wires [2, 2] (step 1〇4). In the present embodiment, the wires 1, 2 are enameled wires, and the conductive portions 12, 22 are copper wires' and the insulation is 1 Å 21 ij is an insulating varnish coated on the outside of the copper wire. Of course, the wires 1 and 2 are not limited to enameled wires, and may be other types of wire villages, such as electronic wire PE wires, electric gauge wires, etc., or may be power cables with a plurality of wires sealed together. The wires 1 and 2 are wound around the surface S1 of the rod body at a predetermined pitch p. The distance p is affected to affect the distance between the contact pads on the same wire. When the pitch P is fixed, the wire is processed. The interval of the contact 塾 interval will be such that, in this embodiment, it is the distance around the s-week. Referring to Fig. 8 and Fig. 9, after the contact regions 13 and 23 are polished on the wire 2, in each of the contact pad regions 13, the conductive paste is applied in step 1 (still). Then, in the contact pad section of the adjacent wire 2, the surface is adhered to the surface of the light element 4', and the respective pins of the surface of the light-emitting element 4 are attached to each other. The contact regions Η, η of 2 are connected to the conductive portions 12, 22 of the adjacent wires 2 via conductive paste/electricity (step 1〇6). The surface-adhesive light-emitting element 4 and the wire 2 are electrically tested (steps) to detect whether the surface-adhesive light-emitting element 4 and the wires 1, 2 are accurate.
I I 實電性連接。 在本實施例中’表面黏著型發光元件4為一表面黏著 型LED，包括有一對接腳41、42，接腳41、42間具有一預 定之接腳間距W，接腳間距w與導線丨、2的繞設間距D 相等。在電導通測試時，則將導線丨、2分別連接於玉、負 電源’依據表面黏著型發光元件4是否發亮來判斷是否電性 連接。當然’表面黏著型發光元件之規格種類繁多，亦有三 • 接腳或多接腳之設計’在實施上，導線的數量需配合接腳數 調整、導_繞設間關對應接腳間距調整，以使表面黏著 型發光元件跨置於導線上時，其接腳分別對應接觸整區，與 導線成為電性連接狀態。 導電膠3在本實施例中採用銀膠，需經由烤箱高溫烘 乾導電膠3，使表面黏著型發光元件4固定結合於導線1、 2(步驟108)，讓表面黏著型發光元件4與導線丨、2之導電 部12、22’藉由導電膠3的導電特性，完成接觸及電導通， φ 烘烤時間約需150°C/1.5Hrs。導電膠3除用以幫助導電外， 更提升表面黏著型發光元件4與導線1、2間的結合強度， 使表面黏著型發光元件4可穩定地跨置固定在導線1、2之 接觸墊區13、23。且由於不需要做接腳的焊接，故整體組 裝過程簡單、方便，不造成生產上的困難。 參閱第10圖及第11圖，於表面黏著型發光元件4跨 置後，將相鄰導線1、2的接觸墊區13、23及表面黏著型發 光元件4以封膠5包覆（步驟109)。封膠5採用AB膠，以 封膠5包覆後的導線1、2，需放入烤箱烘烤i5〇°C/2Hrs， rsi 201103389 以烘乾固化封膠5(步驟no)。 用 發光元件4與導線〗、2，避免以保護表面黏著型 :整體結構之可靠度。並藉由其對電的絕緣特性：導ί =隔外界落塵，維持導線卜2原本的絕緣特性，避免因 ^的1塵、微粒飛人而造成故障。另_方面，亦可以透過 =膠5來調節表面黏著型發光元件4所發^線的發散角 度，提供使用者所需之效果。 參閲第12圖’最後，從桿體S取下導線卜2,即獲得 表面黏著型發光元件燈組6。於實際應用時，由於導線广2 係可隨意彎曲、環繞，可藉以纏置於各式物品上，如··聖誕 樹、門、窗…等，作為裝飾之用。 由以上之實施例可知，本發明所提供之表面黏著型發 光元件燈組之製造方法_具產業上之利用價值，故本發明業 已符合於專利之要件，以上之敘述僅為本發明之較佳實施 例說明，凡精於此項技藝者當可依據上述之說明而作其它種 種之改良，惟這些改變仍屬於本發明之發明精神及以下所界 定之專利範圍中。 【圖式簡單說明】 第1圖係顯示本發明較佳實施例之步驟流程圖； 第2圖係顯示桿體、繞線制架及繞線設備之側視示意圖； 第3圖係顯示桿體及具有對應旋轉驅動軸之繞線制架之立 體圖； 第4圖係顯示桿體結合於繞線制架之旋轉驅動軸之立體圖； 201103389 第5圖係顯示導線繞設在桿體之表面之立體圖； 第6圖係顯示導線打磨後之立體圖； 第7圖係顯示第6圖中C區域之局部放大視圖； 第8圖係顯示表面黏著型發光元件之接腳對應塗佈有導電 膠之接觸墊區之局部放大視圖； 第9圖係顯示表面黏著型發光元件跨置於導線之局部放大 視圖； 第10圖係顯示表面黏著型發光元件及接觸墊區以封膠包覆 之局部放大視圖， 第11圖係顯示表面黏著型發光元件及接觸墊區以封膠包覆 之剖視圖； 第12圖係顯示表面黏著型發光元件燈組之立體圖。 【主要元件符號說明】 1 導線 11 絕緣層 12 導電部 13 接觸塾區 2 導線 21 絕緣層 22 導電部 23 接觸墊區 3 導電膠 4 表面黏著型發光元件 201103389 41、42 接腳 5 封膠 6 表面黏著型發光元件燈組 D 繞設間距 E 繞線設備 P 繞設節距 R 旋轉方向 S 桿體 SO 轴向方向 SI 表面 S21 > S21 螺旋凹槽 T 繞線制架 ΤΙ、T2 旋轉驅動轴 W 接腳間距I I is a real connection. In the present embodiment, the surface-adhesive light-emitting element 4 is a surface-adhesive LED including a pair of pins 41 and 42 having a predetermined pitch W between the pins 41 and 42 and a pitch w and a lead. The winding pitch D of 2 is equal. In the electrical continuity test, the wires 丨 and 2 are respectively connected to the jade and the negative power source. Depending on whether or not the surface-adhesive light-emitting element 4 is lit, it is judged whether or not the electrical connection is made. Of course, there are many kinds of specifications for surface-adhesive light-emitting components, and there are also three designs of pins or multiple pins. In implementation, the number of wires needs to be adjusted according to the number of pins, and the spacing between the leads and the turns is adjusted. When the surface-adhesive light-emitting element is placed on the wire, the pins are respectively in contact with the entire area, and are electrically connected to the wire. In the present embodiment, the conductive paste 3 is made of silver glue, and the conductive adhesive 3 is dried at a high temperature through the oven, so that the surface-adhesive light-emitting element 4 is fixedly bonded to the wires 1 and 2 (step 108), and the surface-adhesive light-emitting element 4 and the wire are allowed. The conductive portions 12, 22' of 丨 and 2 complete contact and electrical conduction by the conductive characteristics of the conductive paste 3, and the baking time of φ is about 150 ° C / 1.5 Hrs. In addition to helping to conduct electricity, the conductive adhesive 3 further enhances the bonding strength between the surface-adhesive light-emitting element 4 and the wires 1, 2, so that the surface-adhesive light-emitting element 4 can be stably supported across the contact pads of the wires 1, 2. 13,23. Moreover, since the welding of the pins is not required, the overall assembly process is simple and convenient, and does not cause production difficulties. Referring to FIG. 10 and FIG. 11 , after the surface-adhesive light-emitting element 4 is straddle, the contact pad regions 13 and 23 of the adjacent wires 1 and 2 and the surface-adhesive light-emitting element 4 are covered with a seal 5 (step 109). ). The sealant 5 is made of AB glue, and the wires 1 and 2 covered with the sealant 5 are placed in an oven to bake i5〇°C/2Hrs, rsi 201103389 to dry and cure the sealant 5 (step no). Use the light-emitting element 4 and the wire, 2, to avoid the surface adhesion type: the reliability of the overall structure. And through its electrical insulation characteristics: ί 隔 隔 隔 隔 隔 隔 隔 隔 隔 隔 隔 隔 隔 维持 维持 维持 维持 维持 维持 维持 维持 维持 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 On the other hand, it is also possible to adjust the divergence angle of the surface of the surface-adhesive light-emitting element 4 through the glue 5 to provide the user with the desired effect. Referring to Fig. 12', finally, the wire 2 is removed from the rod S, and the surface-adhesive light-emitting element lamp group 6 is obtained. In practical applications, because the wire 2 can be bent and wrapped at will, it can be wrapped around various items, such as Christmas trees, doors, windows, etc., for decoration. It can be seen from the above embodiments that the method for manufacturing the surface-adhesive light-emitting device lamp set provided by the present invention has industrial value, so the present invention has been in compliance with the requirements of the patent, and the above description is only preferred of the present invention. It is to be understood that those skilled in the art can make various other modifications in light of the above description, but these modifications are still within the scope of the invention and the scope of the invention as defined below. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a flow chart showing the steps of a preferred embodiment of the present invention; Fig. 2 is a side view showing a rod body, a winding frame and a winding device; And a perspective view of a winding frame having a corresponding rotating drive shaft; Fig. 4 is a perspective view showing a rotating body of the rod body coupled to the winding frame; 201103389 Fig. 5 is a perspective view showing the wire wound around the surface of the rod body Figure 6 shows a perspective view of the wire after grinding; Figure 7 shows a partial enlarged view of the C area in Figure 6; Figure 8 shows the contact pad of the surface-adhesive light-emitting element corresponding to the contact pad coated with conductive adhesive; Partially enlarged view of the area; Figure 9 shows a partial enlarged view of the surface-adhesive light-emitting element spanning the wire; Figure 10 shows a partial enlarged view of the surface-adhesive light-emitting element and the contact pad area coated with the sealant, Figure 11 shows a cross-sectional view of the surface-adhesive light-emitting element and the contact pad area covered with a sealant; Figure 12 shows a perspective view of the surface-adhesive light-emitting element lamp set. [Main component symbol description] 1 Conductor 11 Insulation layer 12 Conductive part 13 Contact area 2 Conductor 21 Insulation layer 22 Conductive part 23 Contact pad area 3 Conductive adhesive 4 Surface-adhesive light-emitting element 201103389 41, 42 Pin 5 Sealing 6 Surface Adhesive type light-emitting element lamp group D Winding distance E Winding device P Winding pitch R Direction of rotation S Rod body SO Axis direction SI Surface S21 > S21 Spiral groove T Winding frame ΤΙ, T2 Rotary drive shaft W Pin spacing
[S3 -11 -[S3 -11 -