JP6409928B2 - Light emitting device and manufacturing method thereof - Google Patents

Description

  The present invention relates to a light emitting device and a method for manufacturing the same.

  In recent years, light-emitting devices using light-emitting diodes such as LED lighting (see, for example, Non-Patent Document 1) have begun to spread.

“Explanation of lighting equipment with straight tube LED lamp”, [online], February 28, 2010, Panasonic Electric Works, [searched on August 5, 2012], Internet <URL: http: // www. hkd. meti. go. jp / hokne / h22enematch / 2data05. pdf>

  However, light-emitting devices using light-emitting diodes are still more expensive than conventional light-emitting devices such as incandescent bulbs and fluorescent lamps, and it is necessary to further reduce the price in order to increase their spread. .

  Therefore, an object of the present invention is to provide a light emitting device that uses a light emitting diode and is less expensive than the conventional one.

  According to the present invention, the above problem is solved by the following means. That is, the present invention is a light emitting device comprising a base, an electric wire fixed to the base, and a light emitting diode mounted on the electric wire.

1 is a schematic configuration diagram of a light emitting device according to a first embodiment of the present invention. It is a schematic block diagram of the light-emitting device which concerns on 2nd Embodiment of this invention. It is a schematic block diagram of the light-emitting device which concerns on 3rd Embodiment of this invention. It is a schematic plan view of the light-emitting device which concerns on 4th Embodiment of this invention. It is a schematic plan view of the light-emitting device which concerns on 5th Embodiment of this invention. It is a figure which shows schematic structure of the light-emitting device which concerns on 6th Embodiment of this invention. It is a figure which shows schematic structure of the light-emitting device which concerns on 7th Embodiment of this invention. It is a figure which shows schematic structure of the light-emitting device which concerns on 8th Embodiment of this invention. 3 is a schematic plan view showing an example (part 1) of forming an electrode on the electric wire 8. FIG. 6 is a schematic plan view showing an example (part 2) of a method of forming an electrode on the electric wire 8. FIG. It is a figure which shows an example (the 3) of the method of forming an electrode on the electric wire. It is a figure which shows an example (the 4) of the method of forming an electrode on the electric wire. It is the elements on larger scale of the light-emitting device which shows the manufacturing method of the light-emitting device which concerns on Example 6 of this invention. It is the elements on larger scale of the light-emitting device which shows the manufacturing method of the light-emitting device which concerns on Example 7 of this invention. It is the elements on larger scale of the light-emitting device which shows the manufacturing method of the light-emitting device which concerns on Example 8 of this invention.

  EMBODIMENT OF THE INVENTION Below, the form for implementing this invention is demonstrated, referring attached drawing.

[Light Emitting Device According to First Embodiment of the Present Invention]
FIG. 1 is a schematic configuration diagram of a light emitting device according to a first embodiment of the present invention, FIG. 1 (a) is a perspective view, and FIG. 1 (b) is a portion indicated by A in FIG. 1 (a). An enlarged partial enlarged view, FIG. 1C is a view partially showing a BB cross section in FIG.

  As shown in FIG. 1, the light emitting device according to the first embodiment of the present invention includes a base 4, a plurality of electric wires 8 fixed to the base 4 at a predetermined interval using an adhesive 12, and a plurality of electric wires 8. And a plurality of light emitting diodes 10 mounted on the electric wire 8 so that the electric wire 8 has a single linear shape. According to the light emitting device according to the first embodiment of the present invention, it is possible to provide a light emitting device in which a plurality of light emitting diodes 10 are connected in series with a simple configuration using the base 4 and the electric wires 8 at low cost. The fixing using the adhesive 12 is an example of a means for fixing the electric wire 8.

[Light Emitting Device According to Second Embodiment of the Present Invention]
FIG. 2 is a schematic configuration diagram of a light emitting device according to a second embodiment of the present invention, FIG. 2 (a) is a perspective view, and FIG. 2 (b) is a portion indicated by A in FIG. 2 (a). FIG. 2C is an enlarged partial enlarged view, and FIG. 2C is a view showing a BB cross section in FIG.

  As shown in FIG. 2, the light emitting device according to the second embodiment of the present invention includes a base 4, two electric wires 8 fixed to the base 4 using an adhesive 12, and two electric wires 8. A plurality of light emitting diodes 10 which are mounted with positive and negative electrodes joined to each other. According to the light emitting device according to the second embodiment of the present invention, a light emitting device in which a plurality of light emitting diodes 10 are connected in parallel can be provided at a low cost with a simple configuration using the base 4 and the electric wires 8. The fixing using the adhesive 12 is an example of a means for fixing the electric wire 8.

[Light Emitting Device According to Third Embodiment of the Present Invention]
FIG. 3 is a diagram showing a schematic configuration of a light emitting device according to a third embodiment of the present invention, in which FIG. 3 (a) is a perspective view, and FIG. 3 (b) is indicated by A in FIG. 3 (a). FIG. 3C is a partial enlarged view in which the portion is enlarged, and FIG. 3C is a view showing a BB cross section in FIG.

  As shown in FIG. 3, the light emitting device according to the third embodiment of the present invention includes a base body 4, one electric wire 8 fixed to the base body 4 by winding, and a plurality of electric wires mounted on the single electric wire 8. And a light emitting diode 10. According to the light emitting device according to the third embodiment of the present invention, it is possible to provide a light emitting device in which a plurality of light emitting diodes 10 are connected in series with a simple configuration using the base 4 and the electric wires 8 at low cost. Fixing by winding is an example of means for fixing the electric wire 8. In addition, the electric wire 8 may be bonded to the base 4 (insulating film 6) using the adhesive 12 after being fixed to the base 4 by winding.

[Light Emitting Device According to Fourth Embodiment of the Present Invention]
FIG. 4 is a schematic plan view of a light emitting device according to a fourth embodiment of the present invention.

  As shown in FIG. 4, the light emitting device according to the fourth embodiment of the present invention has two substrates 4 (the insulating film 6 described later is provided on the surface of the substrate 4, so that the substrate 4 appears in FIG. A plurality of electric wires 8 fixed to the base 4 using a fixing tape, a short-circuit electric wire 22 for short-circuiting the plurality of electric wires 8 so as to constitute a series-parallel circuit, and a plurality of electric wires 8 And a plurality of light emitting diodes 10 mounted on. According to the light emitting device according to the fourth embodiment of the present invention, a light emitting device in which a plurality of light emitting diodes 10 are connected in series and parallel can be provided at low cost by a simple configuration using the base 4 and the electric wires 8. . The fixing using the tape is an example of a means for fixing the electric wire 8.

[Light Emitting Device According to Fifth Embodiment of the Present Invention]
FIG. 5 is a schematic plan view of a light emitting device according to a fifth embodiment of the present invention.

  As shown in FIG. 5, in the light emitting device according to the fifth embodiment of the present invention, the base 4 (the base 4 is not shown in FIG. 5 because an insulating film 6 described later is provided on the surface of the base 4). .), A plurality of electric wires 8 fixed to the base 4 using an adhesive, a short-circuit electric wire 22 for short-circuiting the plurality of electric wires 8 so as to constitute a parallel series circuit, and a plurality of electric wires 8 A plurality of light emitting diodes 10. According to the light emitting device according to the fifth embodiment of the present invention, a light emitting device in which a plurality of light emitting diodes 10 are connected in parallel can be provided at a low cost by a simple configuration using the base 4 and the electric wires 8. . The fixing using the adhesive is an example of a means for fixing the electric wire 8.

  According to the light emitting devices according to the first to fifth embodiments of the present invention described above, relatively inexpensive members such as the base 4 and the electric wires 8 are used instead of relatively expensive members such as a printed board and a lead frame. Since the plurality of light emitting diodes 10 can be energized with the simple configuration used, a light emitting device that is cheaper than the conventional one using the light emitting diodes 10 can be provided.

[Light Emitting Device According to Sixth Embodiment of the Present Invention]
6A and 6B are diagrams showing a schematic configuration of a light emitting device according to a sixth embodiment of the present invention, in which FIG. 6A is a perspective view, and FIG. 6B is indicated by A in FIG. FIG. 6C is a partial enlarged view in which the portion is enlarged, and FIG. 6C is a view showing a BB cross section in FIG. 6B.

  As shown in FIG. 6, the light emitting device according to the sixth embodiment of the present invention includes a base 4 having a plurality of through holes 42, an electric wire 8 provided on the back side of the base 4, and a plurality of light emitting diodes 10. And a light emitting device.

  Here, the electric wire 8 is composed of a pair of an anode electric wire 8a and a cathode electric wire 8b. Further, in the anode electric wire 8a and the cathode electric wire 8b, each portion where the plurality of light emitting diodes 10 are mounted once protrudes from the back surface side of the substrate 4 through the through hole 42 to the surface side of the substrate 4. After that, it is bent so as to return to the back side of the substrate 4 through the through hole 42 again. The plurality of light emitting diodes 10 are provided on the surface side of the base 4, and the positive and negative electrodes thereof are connected to the anode electric wire 8 a and the cathode electric wire 8 b, respectively.

  Therefore, according to the light emitting device according to the sixth embodiment of the present invention, the electric wire 8 provided on the back surface side of the base body 4 has a plurality of portions at the surface of the base body 4 in the plurality of through holes 42 of the base body 4. To the side. Then, the plurality of light emitting diodes 10 provided on the surface side of the base body 4 are respectively mounted on each portion of the electric wire 8 that communicates with the surface side of the base body 4.

  According to the light emitting device of the sixth embodiment of the present invention, the plurality of light emitting diodes 10 are energized without using a printed wiring board or a lead frame, which is one of the causes of the conventional light emitting device being expensive. Therefore, it is possible to provide a light emitting device that uses the light emitting diode 10 and is less expensive than the conventional one. Therefore, it becomes possible to make various illuminations including a general lighting fixture inexpensive and highly efficient.

  Further, according to the light emitting device according to the sixth embodiment of the present invention, since the electric wire 8 is provided on the back side of the base body 4, the degree of freedom of wiring and arrangement is increased. Therefore, it becomes possible to easily form a complicated circuit for individually driving a plurality of light emitting diodes 10 or driving them in an arbitrary group, and to realize high functionality of the light emitting device at low cost. Is possible.

[Light Emitting Device According to Seventh Embodiment of the Present Invention]
FIG. 7 is a diagram showing a schematic configuration of a light emitting device according to a seventh embodiment of the present invention, FIG. 7A is a perspective view, and FIG. 7B is indicated by A in FIG. 7A. FIG. 7C is a partial enlarged view in which the portion is enlarged, and FIG. 7C is a view showing a BB cross section in FIG. 7B.

  As shown in FIG. 7, in the light emitting device according to the seventh embodiment of the present invention, the electric wires 8 are composed of a plurality of wires (electric wires 8 a, 8 b, 8 c, 8 d...). Each electric wire 8 (electric wire 8a, electric wire 8b, electric wire 8c, electric wire 8d...) Has one end and the other end protruding from the back surface side of the substrate 4 through the through hole 42 to the surface side of the substrate 4 and then the substrate. 4 is folded toward the surface. The plurality of light emitting diodes 10 are provided on the surface side of the base 4, and the positive and negative electrodes thereof are one end of one of the plurality of wires 8 (for example, the wire 8 a) and the other wire (for example, the wire 8 b). Connected to the end respectively.

  Even in the light emitting device according to the seventh embodiment of the present invention, as in the case of the light emitting device according to the sixth embodiment of the present invention, the electric wire 8 provided on the back surface side of the base 4 has a plurality of portions thereof. The plurality of light-emitting diodes 10 provided on the surface side of the base body 4 through the plurality of through holes 42 of the base body 4 and provided on the surface side of the base body 4 are respectively connected to the respective portions of the electric wires 8 leading to the surface side of the base body 4. Implemented.

  According to the light emitting device according to the sixth embodiment of the present invention, a plurality of light emitting diodes 10 can be connected in parallel, whereas according to the light emitting device according to the seventh embodiment of the present invention, a plurality of light emitting diodes 10 can be connected. The light emitting diodes 10 can be connected in series. Furthermore, when the light emitting devices according to the sixth and seventh embodiments of the present invention are combined, the plurality of light emitting diodes 10 can be connected in series-parallel or parallel-series.

[Light Emitting Device According to Eighth Embodiment of the Present Invention]
FIG. 8 is a diagram showing a schematic configuration of a light emitting device according to an eighth embodiment of the present invention. FIG. 8A is a perspective view, and FIG. 8B is indicated by A in FIG. FIG. 8C is a partial enlarged view in which the portion is enlarged, and FIG. 8C is a view showing a BB cross section in FIG. 8B.

  As shown in FIG. 8, in the light emitting device according to the eighth embodiment of the present invention, the electric wire 8 is composed of a pair of an anode electric wire 8a and a cathode electric wire 8b. The anode electric wire 8 a and the cathode electric wire 8 b cross the opening surface of the through hole 42 on the back surface side of the base 4. The plurality of light emitting diodes 10 are provided in the through hole 42, and the positive and negative electrodes thereof are connected to the anode electric wire 8a and the cathode electric wire 8b, respectively.

  As with the light emitting device according to the sixth embodiment of the present invention, the light emitting device according to the eighth embodiment of the present invention has the plurality of portions of the electric wire 8 provided on the back surface side of the base body 4. The plurality of through holes 42 of the base body 4 lead to the surface side of the base body 4. Then, the plurality of light emitting diodes 10 provided on the surface side of the base body 4 are respectively mounted on each portion of the electric wire 8 that communicates with the surface side of the base body 4.

  As mentioned above, although the light-emitting device which concerns on 6th-8th embodiment of this invention was demonstrated, according to the light-emitting device which concerns on these embodiment, the resist required when manufacturing a printed wiring board, an etching material, Since the resist stripping material, plating solution, and their collection device (see additive method and subtractive method) are not required, and the tie bar part required for the light emitting device using the lead frame is also unnecessary, Waste generated when manufacturing the light-emitting device can be reduced, and an environment-friendly light-emitting device can be provided.

  In the light emitting devices according to the sixth to eighth embodiments of the present invention, a protective element such as the light emitting diode 10 or a Zener diode, a connection connector, or the like can be mounted on the electric wire 8 on the back surface side of the base 4. In this way, since the unevenness on the surface side of the substrate 4 is reduced, the insulating film 6 can be made thinner, the cost of the insulating film 6 can be reduced, and a wide light distribution angle can be achieved.

  Hereinafter, each member will be described.

[Substrate 4]
For the substrate 4, for example, aluminum, copper, iron, alloys thereof, plates, sheets (tapes, films), rods, pipes, wires using other materials (glass, wood, plastics, etc.) A member such as a shape can be used. Examples of the shape of the substrate 4 in plan view include a strip shape, a rectangle shape, a polygon shape, a circle shape, a fan shape, and a donut shape.

  As described above, according to the embodiment of the present invention, it is not necessary to use a printed circuit board as the base 4, so that a light emitting device that uses the light emitting diode 10 and is less expensive than the conventional one can be provided.

  Note that a printed circuit board having a curved line such as a circle is manufactured by cutting out from a printed circuit board having a quadrangular shape, for example, and therefore, many parts are discarded at the time of cutting, and is more expensive than a printed circuit board having a square shape. However, according to the embodiment of the present invention, an inexpensive member such as aluminum, copper, iron, alloys thereof, or other materials (glass, wood, plastic, etc.) can be used as the substrate 4. Even if has a curved line such as a circle, an inexpensive light emitting device can be provided.

  The size of the substrate 4 is not particularly limited because it can be varied depending on the application in which the light emitting device is used. As an example, when a light emitting device is used as a light source of an illuminating device that replaces a straight tube fluorescent lamp, the base 4 is, for example, a rectangular shape with a short side direction of 30 mm to 50 mm and a long side direction of 300 mm to 1200 mm. A member can be used.

  For the substrate 4, it is preferable to use a flexible member (for example, a member such as a film or a sheet). In this way, since the light emitting device can be manufactured by roll-to-roll, a cheaper light emitting device can be provided. Further, by bending the substrate 4, it can be used for a round fluorescent lamp or the like.

  For the flexible member, for example, an insulating film having a thickness of 10 to 300 μm can be used. Examples of the material for the insulating film include resins such as polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyetherimide (PEI), polyphenylene sulfide (PPS), liquid crystal polymer (LCP), and polyimide (PI). A film can be mentioned as an example. Among them, a cheaper light emitting device can be provided by using PET, PEN, etc., which are inexpensive. Further, if PI having high heat resistance is used as the material of the insulating film, the light emitting diode 10 can be mounted on the base 4 using a solder material or the like, so that a cheaper light emitting device can be provided.

  In addition, the resin film may be transparent or colored, but has a light reflectivity enhanced with respect to visible light, such as a light-reflecting material blended or a fine foamed one. preferable.

  The conductivity, flexibility (flexibility), transparency and the like of the substrate 4 are not particularly limited, but it is preferable that the substrate 4 has little or no stretchability. In this way, after the electric wire 8 is provided on the base body 4, the adhesion between the base body 4 and the electric wire 8 can be secured and the occurrence of warpage in the base body 4 can be suppressed. In addition, it is possible to prevent stress due to expansion and contraction of the base body 4 from being applied to the portion of the electric wire 8 to which the light emitting diode 10 is connected.

  An example of the case where the base 4 has low stretchability is, for example, the case where the base 4 and the wire 8 have substantially the same stretchability. For example, when a copper thin plate is used for the substrate 4 and a copper wire is used for the electric wire 8, or when an aluminum plate is used for the substrate 4 and a copper clad aluminum wire is used for the electric wire 8, the expansion and contraction of the substrate 4 and the electric wire 8 is performed. This is an example in which the sex is almost equal.

  It is preferable that a part of the surface of the substrate 4 is coated with a high light reflectance metal such as Ag or Al, a white resist in which titanium oxide is contained in a silicone resin, or a metal-oxide composite film. . In this way, the light emission efficiency of the light emitting device can be increased.

  A groove 18 can be provided in the substrate 4 or an insulating film 6 described later. In this way, the electric wire 8 can be hooked and held in the groove 18. Therefore, since the electric wire 8 can be fixed so as to be embedded in the base body 4, manufacturing is facilitated and a cheaper light emitting device can be provided.

[Insulating film 6]
In the case where the substrate 4 has conductivity, it is preferable that the insulating film 6 is provided on the surface on which the electric wires 8 are provided. The insulating film 6 may be anything as long as it can be insulated, but preferably has a high light reflectance. Thereby, the light emitted from the light emitting diode 10 can be efficiently reflected on the surface of the substrate 4. As the insulating film 6 having such a high light reflectance, for example, the insulating film 6 containing a white filler or white powder can be used. More specifically, a silicone containing TiO ₂ is used. In addition to resins and resists, white resists containing titanium oxide in a silicone resin, metal-oxide composite films such as alumite, and the like can be used. Furthermore, it is preferable to use an insulating film 6 having high heat resistance and light resistance. For the insulating film 6, a member other than a film can be used.

  The insulating film 6 can be provided over almost the entire area of the substrate 4, or can be provided only in a region surrounding the through hole 42.

[Wire 8]
Although various members having conductivity can be used for the electric wire 8, it is particularly preferable to use a member having excellent conductivity. For example, a metal wire having a low electrical resistivity such as Cu, Au, Al, Ag, or a composite material thereof (copper clad aluminum wire, alloy wire, etc.) can be preferably used. Moreover, the thing which is easy to bend is preferable, and the thing which is hard to be damaged even if it bends (it is hard to be fatigued) is especially preferable. The electric wire 8 may be subjected to noble metal plating such as Pd, Pt, Ag, or tin-based plating. In particular, Ag plating is preferable because it has high light reflectivity and can improve the brightness of the light emitting device. Moreover, as these plating, it is preferable to use what has good compatibility with the connection member which connects the positive / negative electrode which the light emitting diode 10 has, and the electric wire 8. FIG. Specifically, for example, when a solder material is used for the connection member, it is preferable to use the wire 8 that has been subjected to noble metal plating or tin plating.

  As the electric wire 8, a covered electric wire in which a metal wire is covered with an insulating member may be used. In this case, the insulation coating of the electric wire with the insulation coating exposed to the surface side of the substrate 4 (or leading to the surface side) is removed by polishing, heat of air heater, solder, light, etc. The core wire of the attached electric wire is exposed, and the light emitting diode 10 is mounted on the exposed core wire. If a covered electric wire is used, a plurality of electric wires 8 can be brought into contact with each other, so that various circuits can be assembled. Also, for example, a coated electric wire using an epoxy-based transparent resin containing a white resist or a white filler as an insulating coating material can be preferably used as the electric wire 8 because the coating material has a high reflectance. As the coated electric wire, for example, a magnet wire (enameled wire, flat copper wire, ribbon wire, parallel wire, copper clad aluminum wire, horizontal winding) or the like can be used.

  The electric wire 8 may be a member in which the surface of the insulator thread is coated with a conductor and further covered with the insulator. By using such a member as the electric wire 8, a plurality of electric wires 8 can be brought into contact as in the case of using a covered electric wire, so that various circuits can be assembled and lightweight light emission is achieved. It can be a device.

  For the electric wire 8, for example, a rectangular wire (a line whose cross section is close to a rectangle) or a round line (a line whose cross section is close to a circle) can be used. If a flat wire is used, a wide bonding area between the base 4 and the light emitting diode 10 can be secured. Moreover, when using a round wire, the area of the site | part on the electric wire 8 connected to the light emitting diode 10 is large by crushing each part in the electric wire 8 in which the light emitting diode 10 is mounted partially flat with a press or a roll. Therefore, the light emitting diode 10 can be easily mounted on the electric wire 8. Moreover, the electric wire 8 may be an aggregate of a plurality of wire rods such as twisted wires.

  In the case of using a round wire, the light emitting diode 10 can be easily mounted on the electric wire 8 by using a plurality of thin round wires as a set (using it as a single electric wire).

  If three or more electric wires 8 (especially round wires) are used as a set of electrodes having one polarity (that is, if they are regarded as one electric wire 8), the light emitting diode 10 mounted on the electric wire 8 is used. Therefore, the light emitting diode 10 can be mounted on the electric wire 8 with good stability. Specifically, the plurality of electric wires 8 can be arranged on the base 4 in parallel so as to be in contact with or shorter than the width of the electrode of the light emitting diode 10 and can be used as one polarity electrode. .

  The three or more electric wires 8 used as one set may include those that are not electrically connected to the light emitting diode 10. For example, when three electric wires 8 are used as one set, two of the three wires 8 are electrically connected to the light emitting diode 10 and the remaining one is not electrically connected to the light emitting diode 10. It can be used exclusively to improve the installation of the light emitting diode 10.

  The shape and dimensions of the electric wire 8 are not particularly limited. For example, the thickness or width of the electric wire 8 is set to 0. 0 in view of characteristics required for the light emitting device, the size of the light emitting diode 10 to be mounted, and the like. The thing of several mm-several mm, for example, the thickness of 0.1 mm-2 mm, and the length of 1 mm-5 m, etc. can be used. However, since enameled wire has a low reflectance, it is generally used as a light absorption source in the light emitting device. Therefore, when using these as the electric wire 8, it is preferable that the diameter of the electric wire 8 is thinner than the light emitting diode 10 (preferably the positive electrode or the negative electrode of the light emitting diode 10). In this way, the efficiency of the light emitting device can be increased and the weight of the light emitting device can be reduced. In addition, the material cost of the light emitting device can be reduced.

  When the light emitting diode 10 is mounted on the electric wire 8, the electrode of the light emitting diode 10 is connected to the electrode on the electric wire 8 provided on the electric wire 8, and the electrode on the electric wire 8 can be formed by the following method, for example. it can.

(Example of electrode formation <part 1>)
FIG. 9 is a schematic plan view showing an example (No. 1) of a method of forming an electrode on the electric wire 8.

  As shown in FIG. 9, this example is an example in the case where a coated electric wire (round wire) is used as the electric wire 8. When the covered electric wire (round wire) is used as the electric wire 8, for example, the covering 81 is removed by half cutting with a cutting tool (for example, a dicer, a leuter, etc.) (region indicated by X in FIG. 9), The part from which the coating 81 has been removed is cut by the full cut (region indicated by Y in FIG. 9). A portion from which the coating 81 remaining after cutting is removed (that is, the core wire 82) becomes an electrode on the electric wire 8 connected to the electrode of the light emitting diode 10.

(Example of electrode formation <2>)
FIG. 10 is a schematic plan view showing an example (No. 2) of a method of forming an electrode on the electric wire 8.

  As shown in FIG. 10, this example is also an example in which a covered electric wire (round wire) is used as the electric wire 8 as in the above example. However, in this example, the portion from which the coating remaining after cutting is removed (that is, the core wire 82) is bent, and this bent portion becomes an electrode on the electric wire 8 connected to the electrode of the light emitting diode 10. . If the electric wire 8 is bent in this way, the area of the electrode on the electric wire 8 connected to the electrode of the light emitting diode 10 (the core wire 82 from which the coating 81 shown in FIGS. 9 and 10 is removed) increases. When the electric wire 8 is thin, it is easy to ensure electrical contact between the light emitting diode 10 and the electric wire 8.

  In one example (part 1) and (part 2) of forming the electrode on the electric wire 8 described above, the method for cutting the electric wire 8 includes a method such as laser processing or punching in addition to a method using a dicer. Can be used. Further, the base 4 is damaged by inserting a metal plate or the like to be removed after processing between the electric wire 8 and the base 4 or by transferring the electric wire 8 to the base 4 after being cut by a processing stage. The electric wire 8 can be cut without.

(Example of electrode formation <3>)
FIG. 11 is a diagram illustrating an example (No. 3) of a method of forming an electrode using the electric wire 8.

  As shown in FIG. 11, this example is an example in the case where a covered electric wire (flat wire) is used as the electric wire 8. When the covered electric wire (flat wire) is used as the electric wire 8, for example, the end thereof is folded (FIG. 11A). The base 4 is provided with an insulating film 6 such as a white reflective material so that the folded portion is exposed (FIG. 11B). The folded part (the part exposed from the insulating film 6) becomes an electrode on the electric wire 8 connected to the electrode of the light emitting diode 10 (FIG. 11C).

  That is, the electric wire 8 is folded (an example of bending), a high portion (eg, a folded portion) and a low portion (eg, an unfolded portion) are formed to provide a height difference, and a high portion (eg, folded) is formed. An insulating film 6 such as a white reflecting material is provided so that the exposed portion is exposed, and a high portion (eg, a folded portion) is used as an electrode on the electric wire 8 connected to the electrode of the light emitting diode 10.

  According to this example, the area of the electric wire 8 connected to the electrode of the light emitting diode 10 can be easily adjusted by adjusting how much the electric wire 8 is folded. It is easy to ensure electrical contact.

(Example of electrode formation <4>)
FIG. 12 is a diagram illustrating an example (part 4) of a method of forming an electrode on the electric wire 8.

  As shown in FIG. 12, in this example, a part of the base body 4 is raised, and a part on the electric wire 8 fixed to the raised part is used as an electrode, and the light emitting diode 10 is used for this. Implemented. If it does in this way, since it can prevent that the side surface of the light emitting diode 10 is covered with the connection member 20 etc. which connect the electrode of the light emitting diode 10 and the electric wire 8, the light emitting device can be made to shine brightly.

  Even in the case where the through hole 42 is provided in the base body 4, it is preferable that each portion of the electric wire 8 where the light emitting diode 10 is mounted be bent (see FIG. 6). By doing so, the area of the electric wire 8 joined to the light emitting diode is widened, so that the light emitting diode can be easily mounted on the electric wire 8.

[Short-circuit wire 22]
The short-circuited wire 22 is used to short-circuit different wires 8. For example, when a power source is provided on the substrate 4, the electric wire 8 connected to the positive electrode of the power source and the electric wire 8 connected to the positive electrode of the light emitting diode 10 are short-circuited, or It is used for short-circuiting the electric wires 8 connected to the electrodes, short-circuiting the electric wires 8 connected to the positive electrodes on different substrates 4, or the electric wires 8 connected to the negative electrodes. When the short-circuited wire 22 is used, a series-parallel circuit (see FIG. 4) including a plurality of light-emitting diodes 10 in which each branch of a plurality of parallel circuits is connected in series or a plurality of parallel circuits in which a plurality of light-emitting diodes 10 are connected in parallel. A complicated circuit such as a parallel series circuit (see FIG. 5) connected in series can be easily configured, and a desired light emitting device in which the light emitting diodes 10 are connected in various modes can be provided at low cost.

  For the short-circuited wire 22, the same material and shape as the wire 8 can be used. For example, a U-shaped pin can be used as the shape. Further, the connection of the short-circuited wire 22 to the wire 8 can be performed by a method using a connecting member such as a solder material or fusing.

[Light emitting diode 10]
For the light emitting diode 10, for example, various elements such as a surface mount LED, a bullet type LED, an LED chip, and a chip size package LED can be used. Further, an LED chip or the like in which a GaN-based semiconductor that emits blue light is stacked on a light-transmitting substrate such as a sapphire substrate is used as a light emitting diode 10 by combining it with a wavelength conversion member such as a phosphor. It can be particularly preferably used for a light emitting device. By using an unpackaged LED chip as the light emitting diode 10, an inexpensive light emitting device can be obtained.

  The light emitting diode 10 can be mounted on the electric wire 8 by various modes (for example, flip-chip mounting, wire bonding mounting, or a combination of die bonding and wire bonding). In particular, according to the flip chip mounting, the light emitting diode 10 can be placed on the substrate 4 and the light emitting diode 10 and the electric wire 8 can be electrically connected at the same time, so that mass productivity can be improved.

  Note that the light emitting diode 10 can be provided not only on the front surface side of the base body 4 or in the through hole 42 of the base body 4 but also on the back surface side of the base body 4.

[Adhesive 12]
The substrate 4 and the electric wire 8 may be bonded by an adhesive 12. With the adhesive 12, the electric wire 8 and the light emitting diode 10 can be bonded together to the base 4.

  The adhesive 12 preferably has high transparency and high heat resistance and light resistance, and preferably has insulating properties. Specifically, for example, transparent adhesives such as epoxy, silicone, acrylic, modified silicone, and urethane can be used. Further, a thermosetting or ultraviolet curable adhesive can be used. In particular, an acrylic ultraviolet curable adhesive is preferable because it is excellent in heat resistance and light resistance, has a high curing speed, and can simplify the production line. When a flexible member is used for the substrate 4, it is preferable to use a flexible member (for example, resin) for the adhesive 12. Thereby, when the base | substrate 4 bends, the stress concerning the light emitting diode 10 or the electric wire 8 can be reduced.

  The adhesive 12 may be a combination of a plurality of types of adhesives such that the periphery of the through hole 42 is a thermosetting type and the other is a thermoplastic type.

The adhesive 12 preferably contains a filler in order to adjust the light reflectance and viscosity. By including a white filler such as TiO ₂ or SiO ₂ or a reflective material such as white powder, the light emitted from the light emitting diode 10 can be efficiently reflected on the substrate 4. As such a filler, other compounds such as Mg, Ca, Ba, Si, Al, Ti, Zr, rare earth elements, and oxides and carbonates of mixtures thereof can be used. According to the filler, high efficiency and shape control of the light emitting device can be preferably performed.

  The adhesive 12 may be provided at a part of the joint between the base body 4 and the electric wire 8 or may be provided throughout. By providing in part, even if an expensive material (for example, silicone resin) is used as the adhesive 12, an inexpensive light emitting device can be obtained.

  The adhesive 12 can be provided by a method such as dispensing or screen printing. When manufacturing by roll-to-roll, it is preferable to provide by printing.

  The adhesive 12 may be a tape. Examples of the tape used as the adhesive 12 include an epoxy film tape, a polyimide film tape, a PTFE film tape, a polyester film tape, an acetate cloth tape, a cotton cloth tape, and a vinyl tape.

[Sealing member 14]
The light emitting diode 10 is sealed by a sealing member 14.

  Various materials can be used for the sealing member 14 according to the type of the light-emitting diode 10 and the like, but those having insulating properties, high translucency, and high heat resistance and light resistance are preferable. For example, epoxy resins, silicone resins, fluorine resins, and the like, and mixed resins thereof can be used, and silicone resins are preferably used. The sealing member 14 can be provided by various methods such as potting, printing, and sheeting.

  The shape of the sealing member 14 is not particularly limited. In addition, if the viscosity and thixotropy of the sealing member 14 are controlled, the sealing member 14 can be provided in a desired shape. In particular, the light extraction efficiency of the light emitting device can be increased by providing the sealing member 14 in a dome shape.

  The sealing member 14 can contain a wavelength conversion member such as a phosphor. In this way, various color tones and emission spectra can be provided, which can be applied to market demands such as for general illumination and liquid crystal TV (liquid crystal backlight). The sealing member 14 can contain various fillers.

  Specifically, when the light emitting diode 10 emits blue light, a YAG phosphor that emits yellow light, a LAG phosphor that emits green light, a SiAlON phosphor, a CASN phosphor that emits red light, a SCASN phosphor, etc. Can be cited as an example of a phosphor. If these phosphors are contained in the sealing member 14, since the green light emitting diode 10 can be combined with the green light emitting SiAlON phosphor and the red light emitting CASN phosphor, the color reproducibility is high. Thus, a light emitting device suitable for a light source for a backlight can be obtained. In addition, when a combination of green to yellow light emitting LAG, YAG phosphor, and red light emitting phosphor is included in the sealing member 14, the color rendering (Ra) is higher than when one kind of phosphor is used. A light emitting device that emits white / bulb light that is high and suitable for a light source for illumination can be obtained.

The sealing member 14 may contain a light diffusing member that scatters light. Thereby, a desired light distribution can be obtained, or color unevenness can be prevented. Examples of the material of the light diffusing member include TiO ₂ , SiO ₂ , Al ₂ O ₃ , MgO, MgCO ₃ , CaCO ₃ , Mg (OH) ₂ , and Ca (OH) ₂ .

  The sealing member 14 can contain a filler. In this way, it is possible to prevent uneven color in the light emitting device and control the shape of the sealing member. Examples of the filler include inorganic fillers such as compounds such as Mg, Ca, Ba, Si, Al, Ti, Zr, rare earth elements, and oxides and carbonates of mixtures thereof.

  The method for providing the sealing member 14 is not particularly limited. As an example, it can be performed by various methods such as molding using a casting case, potting on the light emitting diode 10, printing, transfer molding, compression molding, injection molding, and the like. Further, the sealing by the sealing member 14 can be performed individually for each light emitting diode 10 (see FIGS. 1 to 8), or a plurality of light emitting diodes 10 can be performed collectively.

[Bank part 16]
The sealing member 14 may be surrounded by the bank portion 16. According to the bank portion 16, the sealing member 14 can be easily formed by preventing the sealing member 14 from flowing out when the light emitting diode 10 is sealed with the sealing member 14.

For example, the bank portion 16 is preferably made of a highly reflective member. More specifically, for example if the resin can be preferably used TiO _2, white filler is contained heat and light resistance is high white resin such as SiO ₂ as a bank portion 16. For other ceramics, a frame such as Al ₂ O ₃ or TiO ₂ or a glass frame on which Al or Ag is deposited can be preferably used as the bank portion 16.

  The bank portion 16 is preferably a member having a large contact angle with the sealing member 14. If it does in this way, when forming sealing member 14, the height can be adjusted and it becomes possible to control light distribution of a light-emitting device.

[Connection member 20]
The connection member 20 that connects the light emitting diode 10 and the electric wire 8 includes, for example, solder such as Au—Sn, Sn—Cu—Ag, Sn—Cu, Sn—Bi, and Sn—Zn, and anisotropic conductive paste. A conductive bonding material such as a silver paste, a copper paste, or a carbon paste can be used.

  However, when the light emitting diode 10 and the electric wire 8 are connected by flip-chip mounting as in the illustrated example, bumps can be used as connection members in addition to the above-described members. As such a bump, Au and its alloy can be preferably used.

  Further, unlike the illustrated example, when the light emitting diode 10 and the electric wire 8 are connected by wire bonding, a wire can be used as a connecting member. As such a wire, a fine wire of a metal such as Au, Ag, Al, or Cu, an alloy thereof, or a plated alloy can be suitably used. In addition, when connecting the light emitting diode 10 and the electric wire 8 by wire bonding, the place in which the light emitting diode 10 is mounted is not ask | required. In this case, the light emitting diode 10 can be placed on the base 4 such as a place away from the electric wires 8 or between the electric wires 8.

  In addition, the electrode of the light emitting diode 10 and the electric wire 8 can also be directly connected, without using a connection member like the ultrasonic welding and the fusing method, for example.

  In addition, when the light emitting diode 10 is bonded or bonded to the electric wire 8 without being electrically connected, a thermosetting resin such as an insulating epoxy resin or silicone resin can be used.

[Others]
In addition, the electric wire 8 fixed on the base 4 can be provided with a power feeding connector or a protective element (eg, Zener diode).

  Further, the position of the power feeding connector and the routing method of the electric wires 8 can be appropriately changed depending on the intended use of the light emitting device. For example, when it is used as a light source of a lighting device for replacement of a straight tube fluorescent lamp, it is necessary to provide a power supply terminal on one end side. It is preferable to provide positive and negative power feeding connectors.

  As a Zener diode, a packaged Zener diode or the like can be used in addition to a Zener diode chip.

  Next, examples of the present invention will be described.

  First, an example of a method for manufacturing the light emitting device shown in FIG. 1 will be described.

  First, an aluminum plate (thickness 1 mm, width 16 mm, length 706 mm) is prepared as the base 4.

  Next, an insulating PI film (thickness: 38 μm) is pasted as an insulating film 6 on the entire surface of one side of the substrate 4 or on the part where the electric wires 8 are fixed.

  Next, a copper clad aluminum wire (φ 50 μm) treated with one insulating film is arranged on the insulating film 6 in a straight line so as to be parallel to the longitudinal direction of the substrate 4 as the electric wire 8. At this time, the electric wire 8 is hooked in the groove 18 and half embedded in the insulating film 6.

Next, adhesion of a silicone resin containing TiO _{2 at} 12 locations on the wire 8 and on the substrate 4 (more specifically, the insulating film 6) so that the substrate 4 and the wire 8 are bonded. Agent 12 is applied.

  The adhesive 12 applied on the substrate 4 has a circular shape with a diameter of 10 mm centered on the electric wire 8. The distance between the centers of the circles is 58 mm. Since the light emitted from the light emitting diode 10 spreads in a circular shape, the adhesive 12 is applied in accordance with this shape so that the adhesive 12 is not applied wastefully, and the light use efficiency is improved. Can be provided at low cost.

Next, a silicone resin (white resin frame) containing a ring-shaped TiO ₂ having a circular shape with a diameter of 3 mm is formed as a bank portion 16 in the region where the adhesive 12 is applied by a dispensing method. The circular area where the adhesive 12 is applied and the bank 16 are concentric.

  Next, the adhesive 12 and the bank 16 are thermally cured.

  Next, the adhesive 12 is partially removed near the center of the circular area where the adhesive 12 is applied, and the electric wire 8 is half-cut with a dicer (cut width 1 mm, depth reaching the center of the electric wire 8). Then, the insulating coating on the surface of the electric wire 8 is removed.

  Next, the blade of the dicer is changed, and the electric wire 8 from which the insulating film is removed and the core material is exposed is fully cut (cut width 0.1 mm, cut depth 0.06 mm).

  Next, a solder paste is dispensed as a connecting member 20 on the portion of the electric wire 8 from which the insulating film is removed and the core material is exposed.

  Next, an LED chip (size of 1200 μm in a plan view) is mounted on the center of the area where the adhesive 12 is applied as a light emitting diode 10 with a mounter, and light is emitted to the part where the connecting member 20 is dispensed. The electrode of the diode 10 is disposed so as to face the electric wire 8. A Zener diode and a connector are mounted on the electric wire 8.

  Next, the connection member 20 is melted in a reflow furnace, and the light emitting diode 10, the Zener diode, and the connector are electrically joined to the electric wire 8.

  Next, the flux residue of the connecting member 20 is washed and removed.

  Next, a transparent silicone resin having low viscosity and light resistance is provided under the light emitting diode 10 as an underfill.

  Next, a transparent silicone resin sealing member 14 containing a YAG phosphor is potted on the inside of the bank portion 16 on the light emitting diode 10. The sealing member 14 is also potted on the Zener diode chip.

  Then, the sealing member 14 is cured.

  According to the manufacturing method according to Example 1 of the present invention, the light-emitting device shown in FIG. 1 can be manufactured at low cost.

  Next, an example of a method for manufacturing the light emitting device shown in FIG. 2 will be described.

  First, a copper thin plate (thickness 0.3 mm, width 16 mm, length 300 mm) is prepared as the base 4. Since the copper thin plate is used, the base 4 according to Example 2 is excellent in heat dissipation.

Next, a white resist (thickness 38 μm) containing TiO _{2 in} a silicone resin is printed as an insulating film 6 on the entire surface of one side of the substrate 4.

  Next, two copper wires (φ200 μm) are linearly arranged on the insulating film 6 so as to be parallel to each other as the electric wires 8. At this time, the electric wire 8 is hooked in the groove 18 and half embedded in the insulating film 6. In addition, the space | interval of the two electric wires 8 shall be 0.2 mm.

  Next, a silicone resin adhesive 12 containing a white filler is applied onto the electric wires 8 and the substrate 4 (more specifically, the insulating film 6). The adhesive 12 applied on the substrate 4 has a circular shape with a diameter of 5 mm with the center between the two electric wires 8. The distance of this circle is 12 mm. As described above, since the light emitted from the light emitting diode 10 spreads in a circular shape, the adhesive 12 is applied in accordance with this shape so that the adhesive 12 is not applied wastefully, and the light use efficiency is increased. The light emitting device obtained can be provided at low cost.

  Next, a ring-shaped white frame having a circular shape with a diameter of 3 mm is formed as the bank portion 16 by a method such as printing or dispensing.

  Next, the adhesive 12 and the bank portion 16 are cured.

  Next, the adhesive 12 is partially removed, and the electric wire 8 is half cut with a dicer (cut width: 1 mm, depth reaching the center of the electric wire 8) to remove the insulating coating of the electric wire 8.

  Next, a solder paste is dispensed as a connecting member 20 on the portion of the electric wire 8 from which the insulating film is removed and the core material is exposed.

  Next, the LED chip is mounted on the central portion of the region where the adhesive 12 is applied as a light emitting diode 10 with a mounter, and the electrode of the light emitting diode 10 is connected to the portion where the connecting member 20 is dispensed via the connecting member 20. And arranged so as to face the electric wire 8. A Zener diode and a connector are mounted on the electric wire 8.

  Next, the connection member 20 is melted in a reflow furnace, and the light emitting diode 10, the Zener diode, and the connector are electrically joined to the electric wire 8.

  Next, the flux residue of the connecting member 20 is washed and removed.

  Next, the sealing member 14 containing a phosphor is potted on the light emitting diode 10.

  Then, the sealing member 14 is cured.

  According to the manufacturing method according to Example 2 of the present invention, the light-emitting device shown in FIG. 2 can be manufactured at low cost.

  Next, an example of a method for manufacturing the light emitting device shown in FIG. 3 will be described.

  First, an electrogalvanized steel sheet (thickness 1 mm, width 16 mm, length 300 mm) is prepared as the base 4.

  Next, a PET film (thickness: 38 μm) is attached as an insulating film 6 to the entire surface of one side of the substrate 4.

  Next, an enameled wire with a fusion layer (for example, magnet wire: 0 type size 0.1 mm) is used as the electric wire 8 on the base 4 so that a plurality of parts parallel to each other appear on the side surface of the base 4 in the short direction. 8 is wound around the surface of the substrate 4 in a single layer from one end to the other end of the substrate 4. At this time, the electric wire 8 is hooked in the groove 18 provided on the side surface of the base 4. The distance between the electric wires 8 is 29.33 mm.

  Next, in order to fix the base body 4 and the electric wire 8, the base body 4 around which the electric wire 8 is wound is heated at about 120 to 220 degrees. The heating is preferably performed by applying pressure so that the electric wires 8 do not float from the base 4.

  Next, a silicone resin adhesive 12 containing a white filler is applied onto the electric wires 8 and the substrate 4 (more specifically, the insulating film 6). The adhesive 12 applied on the substrate 4 is first applied so as to cover the electric wires 8 in the short direction of the substrate 4, and then forms a circle having a center in the center in the short direction of the substrate 4. Applied. As described above, since the light emitted from the light emitting diode 10 spreads in a circular shape, the adhesive 12 is applied in accordance with this shape so that the adhesive 12 is not applied wastefully, and the light use efficiency is increased. The light emitting device obtained can be provided at low cost.

  Next, the ring-shaped bank portion 16 is formed.

  Next, the adhesive 12 and the bank portion 16 are cured.

  Next, the adhesive 12 is partially removed at the center of the bank 16, and the electric wire 8 is half-cut with a dicer (cut width: 1 mm, depth reaching the center of the electric wire 8). Remove. In addition, the winding start part and winding end part of the electric wire 8 at the end of the base 4 are also half-cut with a dicer.

  Next, the blade of the dicer is changed, and the electric wire 8 from which the insulating film is removed and the core material is exposed is fully cut (cut width 0.1 mm, cut depth 0.11 mm).

  Next, a solder paste is dispensed as a connecting member 20 on the portion of the electric wire 8 from which the insulating film is removed and the core material is exposed.

  Next, an LED chip (one side of 1200 μm) is mounted as a light emitting diode 10 on the center portion of the bank 16 with a mounter, and the electrode of the light emitting diode 10 is connected to the portion where the connecting member 20 is dispensed via the connecting member 20. The light emitting diode 10 is disposed in a flip chip state so as to face the electric wire 8. In addition, the electric wire 8 parallel to the winding start part and the winding end part of the electric wire 8 is provided at the end of the base 4, and a Zener diode and a connector are mounted on the electric wire 8.

  Next, the connection member is melted in a reflow furnace, and the light emitting diode 10, the Zener diode, and the connector are electrically joined to the electric wire 8.

  Next, the flux residue of the connecting member 20 is washed and removed.

  Next, the sealing member 14 containing a phosphor is potted on the light emitting diode 10. Further, the sealing member 14 is potted on the Zener diode.

  Then, the sealing member 14 is cured.

  According to the manufacturing method according to Example 3 of the present invention, the light-emitting device shown in FIG. 3 can be manufactured at low cost.

  Next, an example of a manufacturing method of the light emitting device shown in FIG. 4 will be described.

  First, a PI film (thickness 0.38 mm, width 16 mm, length 706 mm) is prepared as the substrate 4. As described above, since the insulating film 6 is provided on the surface of the base body 4, the base body 4 does not appear in FIG.

Next, a white resist of silicone resin containing TiO ₂ is printed as an insulating film 6 on substantially the entire surface of one side of the substrate 4.

  Next, three enamel wires (φ50 μm) are linearly provided on the insulating film 6 so as to be parallel to each other as the electric wires 8. Moreover, the electric wire 8 is fixed on the base 4 with an insulating tape. The interval between the three electric wires 8 is 1 mm.

  Next, a ring-shaped white frame in the shape of a circle having a diameter of 3 mm is formed on the three electric wires 8 as the bank portion 16 by printing. At this time, the bank 16 is formed so that the center of the circle is positioned on the middle electric wire 8 among the three electric wires 8.

  Next, the bank portion 16 is cured.

  Next, the electric wire 8 is half-cut with a dicer (cut width: 1 mm, depth reaching the center of the electric wire 8), and the insulating coating of the electric wire 8 is removed. The parallel electric wires 8 formed at the end of the base 4 are also half-cut with a dicer.

  Next, the blade of the dicer is changed, and the electric wire 8 from which the insulating film is removed and the core material is exposed is fully cut (cut width 0.1 mm, cut depth 0.06 mm).

  Next, a solder paste is dispensed as a connecting member to the portion of the electric wire 8 where the insulating coating is removed and the core material is exposed.

  Next, the LED chip is mounted as a light emitting diode 10 on the center portion of the bank portion 16 with a mounter. Specifically, the light emitting diode 10 is disposed at a portion where the connection member is dispensed. Further, a Zener diode and a connector are mounted on the electric wire 8. Then, the short-circuited wire 22 is mounted on the wire 8 to form a series-parallel circuit composed of six light-emitting diodes 10 in which each branch of the parallel circuit is connected in series.

  Next, the connection member is melted in a reflow furnace, and the light emitting diode 10, the Zener diode, the connector, and the short-circuited wire 22 are electrically connected to the wire 8.

  Next, the flux residue of the connecting member is washed and removed.

  Next, the sealing member 14 containing a phosphor is potted on the light emitting diode 10. Further, the sealing member 14 is potted on the Zener diode.

  Then, the sealing member 14 is cured.

  According to the manufacturing method according to Example 4 of the present invention, the light-emitting device shown in FIG. 4 can be manufactured at low cost. In particular, according to the manufacturing method according to Example 4 of the present invention, the plurality of light emitting diodes 10 can be connected in series and at low cost by the short-circuited wires 22, and a light emitting device having a complicated circuit configuration can be formed at low cost. Can do.

  Next, an example of a method for manufacturing the light emitting device shown in FIG. 5 will be described.

  First, an aluminum foil (thickness 0.1 mm, width 30 mm, length 1200 mm) is prepared as the substrate 4. As described above, since the insulating film 6 is provided on the surface of the base body 4, the base body 4 does not appear in FIG.

  Next, an insulating film 6 (thickness 20 μm) is formed on the entire surface of one side of the substrate 4 by alumite treatment and sealing treatment.

  Next, after applying an adhesive on the surface of three tin-plated aluminum wires (φ100 μm), each tin-plated aluminum wire is made into a linear shape so as to be parallel to the longitudinal direction of the substrate 4 as an electric wire 8. And provided on the insulating film 6. The interval between the three wires 8 is 1 mm.

  Next, an adhesive containing white filler is applied to the insulating film 6 on the substrate 4. The applied adhesive is in the shape of a circle having a diameter of 10 mm centered on the electric wire 8. The distance between the centers of the circles is 58 mm. As described above, since the light emitted from the light emitting diode 10 spreads in a circular shape, the adhesive is applied in accordance with this shape so that the adhesive is not applied unnecessarily, and the light utilization efficiency is increased. The light emitting device obtained can be provided at low cost.

  Next, a ring-shaped white frame in the shape of a circle having a diameter of 3 mm is formed as a bank portion 16 in the region where the adhesive is applied by a method such as printing or dispensing. The circular area where the adhesive is applied and the bank 16 are concentric.

  Next, the adhesive and the bank portion 16 are cured.

  Next, the adhesive is partially removed at the central portion of the region where the adhesive is applied, and the electric wires 8 are exposed. Note that the parallel electric wires 8 formed at the ends of the substrate 4 also remove the adhesive to expose the electric wires 8.

  Next, the wire 8 exposed by removing the insulating coating is fully cut with a dicer (cut width 0.1 mm, cut depth 0.11 mm). Subsequently, a predetermined portion of the three inner wires 8 is fully cut (cut width: 1 mm, cut depth: 0.11 mm).

  Next, a solder paste is dispensed as a connecting member onto the exposed portion of the electric wire 8 from which the insulating coating has been removed.

  Next, an LED chip (1200 × 500 μm) is mounted as a light-emitting diode 10 at the center of the area where the adhesive is applied with a mounter, and the electrodes and wires of the light-emitting diode 10 are connected to the part where the connecting member is dispensed. It arrange | positions so that 8 may oppose. Further, a Zener diode and a connector are mounted on the electric wire 8. Further, the short-circuited wire 22 is mounted on the wire 8 to form a parallel series circuit formed by serially connecting parallel circuits in which four light emitting diodes 10 are connected in parallel.

  Next, the connection member is melted in a reflow furnace, and the light emitting diode 10, the Zener diode, the connector, and the short-circuited wire 22 are connected to the wire 8.

  Next, the flux residue of the connecting member is removed by washing.

  Next, the sealing member 14 containing a phosphor is potted on the light emitting diode 10. Further, the sealing member 14 is potted on the Zener diode.

  Then, the sealing member 14 is cured.

  According to the manufacturing method according to Example 5 of the present invention, the light-emitting device shown in FIG. 5 can be manufactured at low cost. In particular, according to the manufacturing method according to the fifth embodiment of the present invention, a plurality of light emitting diodes 10 can be connected in series at low cost by the short-circuited wire 22, and a light emitting device having a complicated circuit configuration can be formed at low cost. Can do.

  Next, an example of a method for manufacturing the light emitting device shown in FIG. 6 will be described with reference to FIG. FIG. 13 is a partially enlarged view of the light emitting device showing the method for manufacturing the light emitting device according to Example 6 of the present invention. As shown in FIG. 13, the manufacturing method of the light-emitting device according to Example 6 of the present invention includes the following steps.

(First step)
First, as shown in FIG. 13A, a base 4 having a plurality of through holes 42 is prepared. As the substrate 4, a SUS304 thin plate having a thickness of 0.1 mm, a width of 16 mm, and a length of 300 mm is used. In addition, long holes (length: 1 mm, width: 0.4 mm) are formed at intervals of 12.5 mm at 24 locations on the center line of the substrate 4 to form through holes 42.

(Second step)
Next, as shown in FIG. 13 (b), a wire 8 consisting of a pair of an anode wire 8 a and a cathode wire 8 b is provided on the back side of the base 4. At this time, the anode electric wire 8a and the cathode electric wire 8b are such that each portion where the plurality of light emitting diodes 10 are mounted temporarily protrudes from the back surface side of the substrate 4 to the surface side of the substrate 42 through the through hole 42. After that, it is bent so as to return to the back side of the substrate 4 through the through hole 42 again.

  More specifically, on the back side of the base 4, two enamel wires (flat wire, thickness 0.15 mm, width 0.5 mm) sandwiching the center line of the base 4 are used as a pair of electric wires 8. Then, it protrudes through the through hole 42 to the surface of the substrate 4 by 0.15 mm. Then, an epoxy adhesive is applied as an adhesive to a region surrounding the through hole 42 of the base 4, and the two electric wires 8 are fixed to the base 4.

(Third step)
Next, as shown in FIG. 13C, a silicone white resist is provided on the surface of the substrate 4 as an insulating film 6 with a thickness of 10 to 20 μm. As a coating method, various methods such as screen printing and spray coating can be used.

  After that, the insulating coating (white resist and enamel) on a part of the pair of electric wires 8 protruding from the through hole 42 (width 0.5 mm, length about 0.3 mm) is removed with a router, for example. In Example 6 of the present invention, since the coating thickness is thinner than the protruding amount of the electric wire 8, the portion where the insulating film is removed can be easily determined even after the insulating film 6 is provided.

(4th process)
Next, as shown in FIG. 13 (d), a solder paste is dispensed as a connecting member (48 locations) where the insulating coating has been removed, and 24 LED chips for mounting a flip chip (length 0.8 mm, A light emitting diode 10 having a width of 0.3 mm) is mounted in a predetermined direction (direction in which positive and negative electrodes are connected to one and the other of the pair of electric wires 8) at a place where the connection member is dispensed. Then, the connection member is melted using a reflow furnace, and the light emitting diode 10 and the electric wire 8 are connected.

  The electric wire 8 on the back side of the base 4 is provided with a protective element such as a Zener diode, a connection connector, and the like.

(5th process)
Next, as shown in FIG. 13E, the flux is washed, the bank 16 is formed of an epoxy transparent resin containing a white filler, and a silicone resin mixed with a YAG phosphor is used as the sealing member 14. Potting and curing as.

  Next, an example of a method for manufacturing the light emitting device shown in FIG. 7 will be described with reference to FIG. FIG. 14 is a partially enlarged view of the light emitting device showing the method for manufacturing the light emitting device according to Example 7 of the present invention. As shown in FIG. 14, the manufacturing method of the light-emitting device according to Example 7 of the present invention includes the following steps.

(First step)
First, as shown in FIG. 14A, a base 4 having a plurality of through holes 42 is prepared. As the substrate 4, a SUS304 thin plate having a thickness of 0.1 mm, a width of 16 mm, and a length of 300 mm is used. In addition, long holes (length: 1 mm, width: 0.4 mm) are formed at intervals of 12.5 mm at 24 locations on the center line of the substrate 4 to form through holes 42.

(Second step)
Next, as shown in FIG. 14B, on the back side of the base body 4, one enamel wire (flat wire, thickness 0.15 mm, width 0.5 mm) is put on the center line of the base body 4. Through the through hole 42, the surface of the substrate 4 protrudes 0.15 mm, and the protruding portion is cut. As a result, one enameled wire is separated into a plurality of electric wires 8 (electric wires 8a, 8b, 8c, 8d...), And each electric wire 8 (electric wires 8a, 8b, 8c, 8d,. (1) One end and the other end of the base 4 protrude from the back surface side of the base 4 through the through hole 42 to the front side of the base 4.

  Then, one end and the other end of each protruding electric wire 8 (the electric wire 8a, the electric wire 8b, the electric wire 8c, the electric wire 8d...) Are folded toward the surface of the base 4, and the epoxy adhesive is passed through the through hole 42 of the base 4. Is applied as an adhesive 12 to fix the one end and the other end of each wire 8 (wire 8a, wire 8b, wire 8c, wire 8d...) To the base 4.

(Third step)
Next, as shown in FIG. 14C, a silicone white resist is applied to the surface of the substrate 4 as an insulating film 6 with a thickness of 10 to 20 μm and cured.

  Thereafter, an insulating coating on a portion (width 0.5 mm, length 0.3 mm) of one end and the other end of each wire 8 (wire 8a, wire 8b, wire 8c, wire 8d...) Protruding from the through hole 42. (White resist and enamel) are removed with a blade such as a leuter. In Example 7 of the present invention, as in Example 6 of the present invention, since the coating thickness is thinner than the protruding amount of the electric wire 8, the location where the insulating film is removed can be easily determined even after coating.

(4th process)
Next, as shown in FIG. 14 (d), a solder paste is dispensed as a connecting member (48 locations) at locations where the insulating coating has been removed, and 24 LED chips for flip chip mounting (length 0.8 mm, A predetermined direction (one end of the electric wire 8 (for example, the electric wire 8a) having one positive and negative electrode) and the other end of the other electric wire 8 (for example, the electric wire 8b) to the portion where the connection member is dispensed with the light emitting diode 10 as a width 0.3mm) And mount in the direction that is connected to each). Then, the connection member is melted using a reflow furnace, and the light emitting diode 10 and the electric wire 8 are electrically connected.

  The electric wire 8 on the back side of the base 4 is provided with a protective element such as a Zener diode, a connector, or the like.

(5th process)
Next, as shown in FIG. 14 (e), the flux is washed, and a circular bank portion 16 that surrounds the light emitting diode 10 in plan view is formed of an epoxy-based transparent resin containing a white filler. A silicone resin mixed with YAG phosphor inside 16 is potted as a sealing member 14 and cured.

  Next, an example of a method for manufacturing the light emitting device shown in FIG. 8 will be described with reference to FIG. FIG. 15 is a partially enlarged view of the light emitting device showing the method for manufacturing the light emitting device according to Example 8 of the present invention. As shown in FIG. 15, the manufacturing method of the light-emitting device according to Example 8 of the present invention includes the following steps.

(First step)
First, as shown in FIG. 15A, a base 4 having a plurality of through holes 42 is prepared. As the substrate 4, a white polyphthalamide (PPA) plate having a thickness of 2 mm, a width of 16 mm, and a length of 300 mm is used. Further, holes (circular in top view having a diameter of 3 mm and bottom surface having a diameter of 1.4 mm) are formed at 24 locations on the center line of the substrate 4 at intervals of 12.5 mm to form through holes 42.

(Second step)
Next, as shown in FIG. 15 (b), an electric wire 8 composed of a pair of an anode electric wire 8 a and a cathode electric wire 8 b is provided on the back side of the substrate 4. At this time, the anode electric wire 8 a and the cathode electric wire 8 b are provided so as to cross the opening surface of the through hole 42 on the back surface side of the base 4.

  More specifically, two enameled wires (flat wire, thickness 0.15 mm, width 0.5 mm) are penetrated as a pair of electric wires 8 across the center line of the substrate 4 on the back side of the substrate 4. Rise across the opening face of the hole 42. Then, an epoxy adhesive is applied to the substrate 4 as an adhesive, and the two electric wires 8 are fixed to the substrate 4.

(Third step)
Next, as shown in FIG. 15C, an insulating film (enamel) on a part (width 0.5 mm, length about 0.3 mm) of the pair of electric wires 8 on the opening surface of the through hole 42 is, for example, a leuter. As shown in FIG. 15 (c), an LED chip (length: 0.8 mm) in which positive and negative electrodes are formed on one main surface is dispensed with solder paste as a connecting member at a location where the insulating film has been removed. , Width 0.3 mm) as a light emitting diode 10 and mounted in a predetermined direction (direction in which the positive and negative electrodes are connected to one and the other of the pair of electric wires 8) at the place where the connection member is dispensed. Then, the connection member is melted using a reflow furnace, and the light emitting diode 10 and the electric wire 8 are connected.

  The electric wire 8 on the back side of the base 4 is provided with a protective element such as a Zener diode, a connector, or the like.

(4th process)
Next, as shown in FIG. 15D, after the flux is washed, a silicone resin mixed with a YAG phosphor is potted as a sealing member 14 and cured.

  In Examples 6, 7, and 8 described above, a flat wire is used as the electric wire 8, but a round wire can also be used. In this case, by applying the sewing of the sewing machine using the upper thread and the lower thread, passing the electric wire 8 through the through hole of the base 4 and adjusting the tension and thickness of the upper thread and the lower thread (enameled wire), The electric wire 8 can also be taken out from the through-hole 42 of the base | substrate 4 with a desired dimension. Specifically, the tension of the upper thread is made higher than that of the lower thread so that the lower thread electric wire 8 protrudes from the base 4. At this time, by selecting the thickness and tension of the upper thread, it is possible to adjust the length at which the lower thread protrudes from the base body 4.

  As mentioned above, although embodiment and the Example of this invention were described, these description is related to an example of this invention, and this invention is not limited at all by these description.

4 Substrate 6 Insulating film 8 Electric wire 81 Cover 82 Core wire 10 Light emitting diode 12 Adhesive 14 Sealing member 16 Bank portion 18 Groove 20 Connection member 22 Short-circuit electric wire 42 Through hole

Claims (5)

A substrate having a plurality of through holes;
An electric wire provided on the back side of the substrate;
A plurality of light emitting diodes provided on the surface side of the substrate,
The electric wire consists of a pair of an anode electric wire and a cathode electric wire,
The anode electric wire and the cathode electric wire once protrude from the back surface side of the substrate through the one through hole to the front surface side of the substrate, and then pass through the one through hole again. After being bent back to the back side and returning to the back side of the base, the base is stretched along the back side of the base, and once passes from the back side of the base through the other through holes to the front side of the base. After protruding, it is bent so as to return to the back side of the substrate through another through hole,
In the plurality of light emitting diodes, positive and negative electrodes protrude to the surface side of the substrate through the one through hole and the other through hole in the anode electric wire and the cathode electric wire, respectively. Light emitting device connected to each location. The light-emitting device according to claim 1, wherein a light-emitting diode and / or a protection element is mounted on the electric wire on the back surface side of the base. The light emitting device according to claim 1, wherein the electric wire has a rectangular cross section. The wire is
A core wire and an insulating member covering the core wire;
A plurality of exposed portions where the core wire is exposed from the insulating member on the surface side of the base;
The plurality of light emitting diodes are mounted on the exposed core wire,
The light-emitting device according to claim 1. The light emitting device according to claim 1, wherein the substrate is a resin film.

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