JP6711381B2 - Light emitting device and manufacturing method thereof - Google Patents

Description

The present invention relates to a light emitting device and a method for manufacturing the same.

In recent years, a light emitting device using a light emitting diode such as an LED illumination (see Non-Patent Document 1) has begun to spread.

"Explanation of straight tube LED lamp-equipped luminaire", [online], February 28, 2010, Panasonic Electric Works, [search on August 5, 2012], Internet <URL: http://www. hkd. meti. go. jp/hokne/h22enematch/2data05. pdf>

However, the light emitting device using the light emitting diode is still more expensive than the conventional light emitting device such as an incandescent light bulb or a fluorescent lamp, and it is necessary to further reduce the price in order to expand its spread. ..

Therefore, an object of the present invention is to provide a light emitting device that uses a light emitting diode and is cheaper than the conventional one.

According to the present invention, the above problem is solved by the following means. That is, the present invention is a light emitting device including a base, an electric wire fixed to the base, and a light emitting diode mounted on the electric wire.

It is a schematic block diagram of the light-emitting device which concerns on 1st Embodiment of this invention. It is a schematic block diagram of the light-emitting device which concerns on 2nd Embodiment of this invention. It is a schematic block diagram of the light-emitting device which concerns on 3rd Embodiment of this invention. It is a schematic plan view of the light-emitting device which concerns on 4th Embodiment of this invention. It is a schematic plan view of the light-emitting device which concerns on 5th Embodiment of this invention. It is a figure which shows schematic structure of the light-emitting device which concerns on 6th Embodiment of this invention. It is a figure which shows schematic structure of the light-emitting device which concerns on 7th Embodiment of this invention. It is a figure which shows schematic structure of the light-emitting device which concerns on 8th Embodiment of this invention. It is a schematic plan view which shows an example (the 1) of the method of forming an electrode on the electric wire 8. It is a schematic plan view which shows an example (the 2) of the method of forming an electrode on the electric wire 8. It is a figure which shows an example (the 3) of the method of forming an electrode on the electric wire 8. It is a figure which shows an example (the 4) of the method of forming an electrode on the electric wire 8. It is a partially enlarged view of a light emitting device showing a method for manufacturing a light emitting device according to Example 6 of the present invention. It is a partially enlarged view of a light emitting device showing a method for manufacturing a light emitting device according to Example 7 of the present invention. It is a partially enlarged view of a light emitting device showing a method for manufacturing a light emitting device according to Example 8 of the present invention.

Hereinafter, embodiments for carrying out the present invention will be described with reference to the accompanying drawings.

[Light Emitting Device According to First Embodiment of the Present Invention]
1A and 1B are schematic configuration diagrams of a light emitting device according to a first embodiment of the present invention. FIG. 1A is a perspective view, and FIG. 1B is a portion indicated by A in FIG. 1A. An enlarged partial enlarged view, FIG. 1C is a view partially showing a BB cross section in FIG. 1B.

As shown in FIG. 1, the light emitting device according to the first embodiment of the present invention includes a substrate 4, a plurality of electric wires 8 fixed to the substrate 4 with an adhesive 12 at a predetermined interval, and a plurality of electric wires 8. The plurality of light emitting diodes 10 mounted on the electric wire 8 so that the electric wire 8 has one linear shape. According to the light emitting device of the first embodiment of the present invention, it is possible to inexpensively provide the light emitting device in which the plurality of light emitting diodes 10 are connected in series by the simple configuration using the base body 4 and the electric wire 8. Fixing using the adhesive 12 is an example of a means for fixing the electric wire 8.

[Light Emitting Device According to Second Embodiment of the Present Invention]
2A and 2B are schematic configuration diagrams of a light emitting device according to a second embodiment of the present invention. FIG. 2A is a perspective view, and FIG. 2B is a portion indicated by A in FIG. 2A. FIG. 2C is an enlarged partial enlarged view showing a BB cross section in FIG. 2B.

As shown in FIG. 2, the light emitting device according to the second embodiment of the present invention includes a base body 4, two electric wires 8 fixed to the base body 4 using an adhesive 12, and two electric wires 8 respectively. And a plurality of light emitting diodes 10 mounted by joining positive and negative electrodes. According to the light emitting device of the second embodiment of the present invention, it is possible to inexpensively provide the light emitting device in which the plurality of light emitting diodes 10 are connected in parallel by the simple configuration using the base body 4 and the electric wire 8. Fixing using the adhesive 12 is an example of a means for fixing the electric wire 8.

[Light Emitting Device According to Third Embodiment of the Present Invention]
3A and 3B are diagrams showing a schematic configuration of a light emitting device according to a third embodiment of the present invention, FIG. 3A is a perspective view, and FIG. 3B is shown by A in FIG. 3A. FIG. 3C is a partially enlarged view in which a part is enlarged, and FIG. 3C is a view showing a BB cross section in FIG. 3B.

As shown in FIG. 3, the light emitting device according to the third embodiment of the present invention includes a base body 4, one electric wire 8 fixed to the base body 4 by winding, and a plurality of electric wires mounted on the one electric wire 8. And a light emitting diode 10. According to the light emitting device of the third embodiment of the present invention, a light emitting device in which a plurality of light emitting diodes 10 are connected in series can be provided at low cost with a simple configuration using the base body 4 and the electric wires 8. Fixing by winding is an example of means for fixing the electric wire 8. Note that the electric wire 8 may be fixed to the base body 4 (insulating film 6) by using the adhesive 12 after being fixed to the base body 4 by winding.

[Light Emitting Device According to Fourth Embodiment of the Present Invention]
FIG. 4 is a schematic plan view of a light emitting device according to the fourth embodiment of the present invention.

As shown in FIG. 4, the light emitting device according to the fourth embodiment of the present invention has two bases 4 (an insulating film 6 described later is provided on the surface of the base 4 so that the base 4 appears in FIG. 4). ), a plurality of electric wires 8 fixed to the base body 4 using a fixing tape, a short-circuit electric wire 22 for short-circuiting the plurality of electric wires 8 so as to form a series-parallel circuit, and a plurality of electric wires 8 And a plurality of light emitting diodes 10 mounted on. According to the light emitting device of the fourth embodiment of the present invention, a light emitting device in which a plurality of light emitting diodes 10 are connected in series and parallel can be provided at low cost by a simple configuration using the base 4 and the electric wires 8. .. The fixing using the tape is an example of a means for fixing the electric wire 8.

[Light Emitting Device According to Fifth Embodiment of the Present Invention]
FIG. 5 is a schematic plan view of a light emitting device according to a fifth embodiment of the present invention.

As shown in FIG. 5, in the light emitting device according to the fifth embodiment of the present invention, the base body 4 (the base body 4 does not appear in FIG. 5 because the insulating film 6 described later is provided on the surface of the base body 4). .), a plurality of electric wires 8 fixed to the base body 4 with an adhesive, a short-circuit electric wire 22 for short-circuiting the plurality of electric wires 8 to form a parallel series circuit, and a plurality of electric wires 8 mounted on the plurality of electric wires 8. And a plurality of light emitting diodes 10. According to the light emitting device of the fifth embodiment of the present invention, it is possible to inexpensively provide a light emitting device in which a plurality of light emitting diodes 10 are connected in parallel in series by a simple configuration using the base body 4 and the electric wires 8. .. Note that fixing using an adhesive is an example of means for fixing the electric wire 8.

According to the light emitting devices according to the first to fifth embodiments of the present invention described above, relatively inexpensive members such as the base 4 and the electric wire 8 are used instead of relatively expensive members such as the printed circuit board and the lead frame. Since the plurality of light emitting diodes 10 can be energized with the simple configuration used, it is possible to provide a light emitting device that uses the light emitting diodes 10 and is cheaper than the conventional light emitting device.

[Light Emitting Device According to Sixth Embodiment of the Present Invention]
6A and 6B are diagrams showing a schematic configuration of a light emitting device according to a sixth embodiment of the present invention. FIG. 6A is a perspective view, and FIG. 6B is shown by A in FIG. 6A. FIG. 6C is a partially enlarged view in which a part is enlarged, and FIG. 6C is a view showing a BB cross section in FIG. 6B.

As shown in FIG. 6, the light emitting device according to the sixth embodiment of the present invention includes a base 4 having a plurality of through holes 42, an electric wire 8 provided on the back side of the base 4, and a plurality of light emitting diodes 10. And a light emitting device.

Here, the electric wire 8 is composed of a pair of an electric wire 8a for an anode and an electric wire 8b for a cathode. Further, in the electric wire 8a for the anode and the electric wire 8b for the cathode, respective portions where the plurality of light emitting diodes 10 are mounted are once projected from the rear surface side of the base body 4 through the through holes 42 to the front surface side of the base body 4. After that, it is bent so as to pass through the through hole 42 again and return to the back surface side of the substrate 4. The plurality of light emitting diodes 10 are provided on the front surface side of the base body 4, and positive and negative electrodes thereof are connected to the anode electric wire 8a and the cathode electric wire 8b, respectively.

Therefore, according to the light emitting device of the sixth embodiment of the present invention, the electric wire 8 provided on the back surface side of the base body 4 has a plurality of locations on the front surface of the base body 4 in the plurality of through holes 42 included in the base body 4. Lead to the side. Then, the plurality of light emitting diodes 10 provided on the front surface side of the base body 4 are mounted on respective portions of the electric wire 8 communicating with the front surface side of the base body 4.

According to the light emitting device of the sixth embodiment of the present invention, it is possible to energize a plurality of light emitting diodes 10 without using a printed wiring board or a lead frame, which is one of the causes that the conventional light emitting device is expensive. Therefore, it is possible to provide a light emitting device that uses the light emitting diode 10 and is cheaper than the conventional light emitting device. Therefore, it becomes possible to make various lights including general lighting fixtures inexpensive and highly efficient.

Further, according to the light emitting device of the sixth embodiment of the present invention, since the electric wire 8 is provided on the back surface side of the base body 4, the degree of freedom in wiring and arrangement is increased. Therefore, it becomes possible to easily form a complicated circuit for individually driving the plurality of light emitting diodes 10 or for driving the plurality of light emitting diodes 10 in an arbitrary group, and to realize the high performance of the light emitting device at low cost. Is possible.

[Light Emitting Device According to Seventh Embodiment of the Present Invention]
7A and 7B are diagrams showing a schematic configuration of a light emitting device according to a seventh embodiment of the present invention. FIG. 7A is a perspective view and FIG. 7B is shown by A in FIG. 7A. FIG. 7C is a partially enlarged view in which a part is enlarged, and FIG. 7C is a view showing a cross section taken along line BB in FIG. 7B.

As shown in FIG. 7, in the light emitting device according to the seventh embodiment of the present invention, the electric wire 8 is composed of a plurality of electric wires (electric wire 8a, electric wire 8b, electric wire 8c, electric wire 8d... ). Each electric wire 8 (electric wire 8a, electric wire 8b, electric wire 8c, electric wire 8d,...) Has one end and the other end protruding from the back surface side of the base body 4 through the through hole 42 to the front surface side of the base body 4, and then the base body. It is folded toward the surface of No. 4. The plurality of light emitting diodes 10 are provided on the front surface side of the base body 4, and the positive and negative electrodes thereof have one end of one of the plurality of electric wires 8 (for example, the electric wire 8a) and another electric wire (for example, the electric wire 8b). Connected to the ends and respectively.

Also in the light emitting device according to the seventh embodiment of the present invention, as in the case of the light emitting device according to the sixth embodiment of the present invention, the electric wire 8 provided on the back surface side of the base body 4 has a plurality of positions, The plurality of light emitting diodes 10 provided on the front surface side of the base body 4 and communicating with the front surface side of the base body 4 through the plurality of through-holes 42 of the base body 4 are respectively provided at respective positions of the electric wire 8 communicating with the front surface side of the base body 4. To be implemented.

In addition, according to the light emitting device according to the sixth embodiment of the present invention, a plurality of light emitting diodes 10 can be connected in parallel, whereas according to the light emitting device according to the seventh embodiment of the present invention, a plurality of light emitting diodes are provided. The light emitting diodes 10 can be connected in series. Further, by combining the light emitting devices according to the sixth and seventh embodiments of the present invention, a plurality of light emitting diodes 10 can be connected in series/parallel or parallel series.

[Light Emitting Device According to Eighth Embodiment of the Present Invention]
8A and 8B are diagrams showing a schematic configuration of a light emitting device according to an eighth embodiment of the present invention. FIG. 8A is a perspective view and FIG. 8B is shown by A in FIG. 8A. FIG. 8C is a partially enlarged view in which a part is enlarged, and FIG. 8C is a view showing a BB cross section in FIG. 8B.

As shown in FIG. 8, in the light emitting device according to the eighth embodiment of the present invention, the electric wire 8 includes a pair of an electric wire 8a for an anode and an electric wire 8b for a cathode. The electric wire 8a for the anode and the electric wire 8b for the cathode cross the opening surface of the through hole 42 on the back surface side of the base body 4. The plurality of light emitting diodes 10 are provided in the through hole 42, and the positive and negative electrodes thereof are connected to the electric wire 8a for anode and the electric wire 8b for cathode, respectively.

Also in the light emitting device according to the eighth embodiment of the present invention, as in the case of the light emitting device according to the sixth embodiment of the present invention, the electric wire 8 provided on the back surface side of the base body 4 has a plurality of positions, The plurality of through holes 42 included in the base body 4 communicate with the front surface side of the base body 4. Then, the plurality of light emitting diodes 10 provided on the front surface side of the base body 4 are mounted on respective portions of the electric wire 8 communicating with the front surface side of the base body 4.

Although the light emitting devices according to the sixth to eighth embodiments of the present invention have been described above, according to the light emitting devices according to these embodiments, a resist, an etching material, and the like required when manufacturing a printed wiring board, Resist stripping material, plating solution, and their recovery device (see additive method or subtractive method) are not required, and further, the tie bar and the like required for a light emitting device using a lead frame are not required. It is possible to reduce the waste generated when manufacturing the light emitting device and to provide an environment-friendly light emitting device.

In addition, in the light emitting devices according to the sixth to eighth embodiments of the present invention, a protective element such as the light emitting diode 10 or a Zener diode, a connection connector, or the like can be mounted on the electric wire 8 on the back surface side of the substrate 4. By doing so, the unevenness on the surface side of the substrate 4 is reduced, so that the insulating film 6 can be thinned, the cost of the insulating film 6 can be reduced, and a wide light distribution angle can be obtained.

Hereinafter, each member will be described.

[Base 4]
The substrate 4 is made of, for example, aluminum, copper, iron, their alloys, or other materials (glass, wood, plastic, etc.) in the form of plates, sheets (tapes, films), rods, pipes, wires. A member such as a shape can be used. Examples of the shape of the substrate 4 in plan view include a strip shape, a rectangle, a polygon, a circle, a fan shape, and a donut shape.

As described above, according to the embodiment of the present invention, since it is not necessary to use the printed board as the base body 4, it is possible to provide a light emitting device that uses the light emitting diode 10 and is cheaper than the conventional light emitting device.

Note that a printed circuit board having a curved line such as a circle is manufactured by being cut out from a printed circuit board having, for example, a quadrangular shape. However, according to the embodiment of the present invention, since an inexpensive member such as aluminum, copper, iron, alloys thereof, or other materials (glass, wood, plastic, etc.) can be used as the base body 4, the base body 4 can be used. Even if has a curve such as a circle, an inexpensive light emitting device can be provided.

The size of the base 4 can be various depending on the application in which the light emitting device is used, and is not particularly limited. As an example, when a light emitting device is used as a light source of a lighting device that replaces a straight tube fluorescent lamp, the base 4 is, for example, a rectangular shape having a lateral direction of 30 mm to 50 mm and a longitudinal direction of 300 mm to 1200 mm. Members can be used.

It is preferable to use a flexible member (for example, a member having a film or sheet shape) for the base 4. By doing so, the light emitting device can be manufactured in a roll-to-roll manner, and thus a more inexpensive light emitting device can be provided. Further, by bending the base 4, it can be used for a round fluorescent lamp or the like.

For the flexible member, for example, an insulating film having a thickness of 10 μm to 300 μm can be used. Examples of the material of this insulating film include resins such as polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyetherimide (PEI), polyphenylene sulfide (PPS), liquid crystal polymer (LCP), and polyimide (PI). A film can be mentioned as an example. Among them, a cheaper light emitting device can be provided by using low cost PET or PEN. Further, when PI having high heat resistance is used as the material of the insulating film, the light emitting diode 10 can be mounted on the base body 4 by using a solder material or the like, so that a more inexpensive light emitting device can be provided.

Further, the resin film may be transparent or colored, but a resin film containing a light-reflecting material, a finely foamed product, or the like having an improved light reflectance with respect to visible light is used. preferable.

The conductivity, flexibility, transparency, etc. of the substrate 4 are not particularly limited, but it is preferable that the substrate 4 has little or no elasticity. With this configuration, after the electric wire 8 is provided on the base body 4, the adhesion between the base body 4 and the electric wire 8 can be secured, and the occurrence of warpage in the base body 4 can be suppressed. Further, it is possible to prevent stress due to expansion and contraction of the base body 4 from being applied to the portion of the electric wire 8 to which the light emitting diode 10 is connected.

An example of a case where the base body 4 has a low elasticity is, for example, a case where the base material 4 and the electric wire 8 have substantially the same elasticity. For example, when a copper thin plate is used for the base body 4 and a copper wire is used for the electric wire 8 or when an aluminum plate is used for the base body 4 and a copper clad aluminum wire is used for the electric wire 8, expansion and contraction of the base body 4 and the electric wire 8 is performed. This is an example where the sexes are almost equal.

It is preferable that a part of the surface of the substrate 4 is coated with a metal such as Ag or Al having a high light reflectance or a white resist in which titanium oxide is contained in a silicone resin or a metal-oxide composite film. .. By doing so, the luminous efficiency of the light emitting device can be improved.

It should be noted that the groove 18 may be provided in the base body 4, the insulating film 6 described later, and the like. In this way, the electric wire 8 can be hooked in the groove 18 and held. Therefore, the electric wire 8 can be fixed so as to be embedded in the base body 4, so that the manufacturing is facilitated and a cheaper light emitting device can be provided.

[Insulation film 6]
When the substrate 4 has conductivity, the insulating film 6 is preferably provided on the surface on which the electric wire 8 is provided. The insulating film 6 may be of any type as long as it can be insulated, but preferably has a high light reflectance. Thereby, the light emitted from the light emitting diode 10 can be efficiently reflected on the surface of the base 4. As the insulating film 6 having such a high light reflectance, for example, an insulating film 6 containing a white filler or a white powder can be used, but more specifically, a silicone containing TiO _2. In addition to resins and resists, white resists containing titanium oxide in a silicone resin, metal-oxide composite films such as alumite, and the like can be used. Further, it is preferable to use the insulating film 6 having high heat resistance and light resistance. The insulating film 6 may be made of a material other than a film.

The insulating film 6 can be provided almost all over the substrate 4, or can be provided only in the region surrounding the through hole 42.

[Electric wire 8]
Although various members having conductivity can be used for the electric wire 8, it is particularly preferable to use members having excellent conductivity. For example, a metal wire having a low electric resistivity such as Cu, Au, Al or Ag or a composite material thereof (copper clad aluminum wire, alloy wire, etc.) can be preferably used. Further, those that are easily bendable are preferable, and those that are less likely to be damaged even when bent (hard to fatigue) are particularly preferable. The electric wire 8 may be plated with a noble metal such as Pd, Pt, Ag, or tin-based plating. In particular, Ag plating is preferable because it has a high light reflectance and can improve the brightness of the light emitting device. Further, as the plating, it is preferable to use one having good compatibility with the connecting member for connecting the positive and negative electrodes of the light emitting diode 10 and the electric wire 8. Specifically, for example, when a solder material is used for the connection member, it is preferable to use, as the electric wire 8, a material plated with noble metal or tin-based plating.

As the electric wire 8, a covered electric wire in which the metal wire is covered with an insulating member may be used. In this case, the insulation coating of the electric wire with the insulation coating exposed on the front surface side of the substrate 4 (or communicating with the front surface side) due to polishing, heat from an air heater, solder, light, or the like is removed to remove the insulation coating. The core wire of the attached electric wire is exposed, and the light emitting diode 10 is mounted on the exposed core wire. If a covered electric wire is used, a plurality of electric wires 8 can be brought into contact with each other, so that various circuits can be assembled. A coated electric wire using an epoxy transparent resin containing a white resist or a white filler as the insulating coating material can be preferably used as the electric wire 8 because the coating material has a high reflectance. As the covered electric wire, for example, a magnet wire (enameled wire, rectangular copper wire, ribbon wire, parallel electric wire, copper clad aluminum wire, horizontal winding) or the like can be used.

For the electric wire 8, a member in which the surface of a thread of an insulator is coated with a conductor and further this is coated with an insulator can also be used. By using such a member as the electric wire 8, a plurality of electric wires 8 can be brought into contact with each other, as in the case of using the covered electric wire, so that various circuits can be assembled and the light emission is light. It can be a device.

For the electric wire 8, for example, a rectangular wire (a wire whose cross section is close to a rectangle) or a round wire (a wire whose cross section is close to a circle) can be used. If a rectangular wire is used, it is possible to secure a wide bonding area between the base body 4 and the light emitting diode 10. When a round wire is used, each area of the electric wire 8 on which the light emitting diode 10 is mounted is partially flattened with a press or a roll so that the area of the electric wire 8 connected to the light emitting diode 10 is wide. Therefore, the light emitting diode 10 can be easily mounted on the electric wire 8. Further, the electric wire 8 may be an assembly of a plurality of wire materials such as a twisted wire.

When the round wire is used, the light emitting diode 10 can be easily mounted on the wire 8 by using a plurality of thin round wires as a set (by considering it as one wire).

If three or more electric wires 8 (especially, round wires) are grouped and used as electrodes of one polarity (that is, regarded as one electric wire 8), the light emitting diode 10 mounted on the electric wire 8 will be described. Therefore, the light emitting diode 10 can be mounted on the electric wire 8 with good stability. Specifically, a plurality of electric wires 8 are arranged on the base 4 in parallel so as to be spaced apart from or in contact with the width of the electrodes of the light emitting diode 10, and this can be used as an electrode of one polarity. ..

The three or more electric wires 8 used as one set may include one that is not electrically connected to the light emitting diode 10. For example, when three electric wires 8 are used as one set, two of the three wires are electrically connected to the light emitting diode 10 and the remaining one is not electrically connected to the light emitting diode 10. In particular, it can be used to improve the installation of the light emitting diode 10.

The shape and size of the electric wire 8 are not particularly limited. To give an example, the thickness or width of the electric wire 8 is 0. A material having a thickness of several mm to several mm, for example, a material having a thickness of 0.1 mm to 2 mm and a length of 1 mm to 5 m can be used. However, since the enameled wire or the like has a low reflectance, it generally serves as an absorption source of light in the light emitting device. Therefore, when these are used as the electric wire 8, the diameter of the electric wire 8 is preferably smaller than that of the light emitting diode 10 (preferably the positive electrode or the negative electrode of the light emitting diode 10). With this configuration, the efficiency of the light emitting device can be increased and the weight of the light emitting device can be reduced. Further, the material cost of the light emitting device can be reduced.

When mounting the light emitting diode 10 on the electric wire 8, the electrode of the light emitting diode 10 is connected to the electrode on the electric wire 8 provided on the electric wire 8. The electrode on the electric wire 8 may be formed by, for example, the following method. it can.

(Example of forming electrode <1>)
FIG. 9 is a schematic plan view showing an example (No. 1) of a method of forming an electrode on the electric wire 8.

As shown in FIG. 9, this example is an example in which a covered electric wire (round wire) is used as the electric wire 8. When the coated electric wire (round wire) is used as the electric wire 8, for example, the coating 81 is removed by a half cut with a cutting tool (for example, a dicer or a router) (a region indicated by X in FIG. 9), The portion from which the coating 81 has been removed is cut by full cutting (area indicated by Y in FIG. 9). The portion where the coating 81 remaining after the cutting is removed (that is, the core wire 82) becomes an electrode on the electric wire 8 connected to the electrode of the light emitting diode 10.

(Example of electrode formation <Part 2>)
FIG. 10 is a schematic plan view showing an example (No. 2) of a method of forming an electrode on the electric wire 8.

As shown in FIG. 10, this example is also an example of using a coated electric wire (round wire) as the electric wire 8 as in the above example. However, in this example, the portion where the coating remaining after the cutting is removed (that is, the core wire 82) is bent, and this bent portion becomes the electrode on the electric wire 8 connected to the electrode of the light emitting diode 10. .. If the electric wire 8 is bent in this way, the area of the electrode (core wire 82 from which the coating 81 shown in FIGS. 9 and 10 is removed) on the electric wire 8 connected to the electrode of the light emitting diode 10 increases. When the electric wire 8 is thin, it is easy to ensure the electrical contact between the light emitting diode 10 and the electric wire 8.

In addition, in the examples (1) and (2) of the method for forming the electrode on the electric wire 8 described above, the method of cutting the electric wire 8 includes a method using a dicer, a method such as laser processing or punching. Can be used. In addition, damage to the base body 4 may be caused by inserting a metal plate or the like to be removed after processing between the electric wire 8 and the base body 4, or transferring the electric wire 8 to the base body 4 after cutting processing by a processing stage. The electric wire 8 can be cut without a wire.

(Example of electrode formation <Part 3>)
FIG. 11: is a figure which shows an example (the 3) of the method of forming an electrode using the electric wire 8. As shown in FIG.

As shown in FIG. 11, this example is an example in which a covered electric wire (rectangular wire) is used as the electric wire 8. When the coated electric wire (rectangular wire) is used as the electric wire 8, for example, its end portion is folded (FIG. 11A). Then, the base 4 is provided with an insulating film 6 such as a white reflecting material so that the folded portion is exposed (FIG. 11B). The folded portion (the portion exposed from the insulating film 6) becomes the electrode on the electric wire 8 connected to the electrode of the light emitting diode 10 (FIG. 11C).

That is, the electric wire 8 is folded (an example of bending), and a high portion (eg, folded portion) and a low portion (eg, unfolded portion) are formed to provide a height difference, and a high portion (eg, folded portion). The insulating film 6 such as a white reflecting material is provided so that the exposed portion) is exposed, and the high portion (eg, the folded portion) is used as an electrode on the electric wire 8 that connects to the electrode of the light emitting diode 10.

According to this example, the area of the electric wire 8 connected to the electrode of the light emitting diode 10 can be easily adjusted by adjusting the degree to which the electric wire 8 is folded. It becomes easier to secure electrical contact.

(Example of forming electrode <Part 4>)
FIG. 12 is a diagram showing an example (No. 4) of a method of forming an electrode on the electric wire 8.

As shown in FIG. 12, in this example, a part of the base body 4 is raised, and the portion on the electric wire 8 fixed to the raised portion is used as an electrode, and the light emitting diode 10 is attached to this portion. To be implemented. With this configuration, it is possible to prevent the side surface of the light emitting diode 10 from being covered by the connecting member 20 that connects the electrode of the light emitting diode 10 and the electric wire 8, so that the light emitting device can shine brightly.

Even when the through hole 42 is provided in the base body 4, it is preferable that the electric wire 8 is bent at each position where the light emitting diode 10 is mounted (see FIG. 6 ). By doing so, the area of the electric wire 8 joined to the light emitting diode becomes large, so that the light emitting diode can be easily mounted on the electric wire 8.

[Short-circuit wire 22]
The short-circuit electric wire 22 is used to short-circuit different electric wires 8. For example, when a power source is provided on the base 4, the wire 8 connected to the positive electrode of the power source and the wire 8 connected to the positive electrode of the light emitting diode 10 are short-circuited, or the wire 8 connected to the negative electrode of the power source and the negative electrode of the light emitting diode 10 are shorted. It is used to short-circuit the electric wires 8 connected to the electrodes, short-circuit the electric wires 8 connected to the positive electrodes on different bases 4, or the electric wires 8 connected to the negative electrodes. If the short-circuit wire 22 is used, a series-parallel circuit (see FIG. 4) including a plurality of light-emitting diodes 10 in which each branch of a plurality of parallel circuits is connected in series or a plurality of parallel circuits in which a plurality of light-emitting diodes 10 are connected in parallel can be used. A complicated circuit such as a parallel series circuit (see FIG. 5) formed by connecting in series can be easily configured, and a desired light emitting device in which the light emitting diodes 10 are connected in various modes can be provided at low cost.

For the short-circuit electric wire 22, the same material and shape as the electric wire 8 can be used. As the shape, for example, a U-shaped pin can be used. Further, the short-circuited electric wire 22 can be connected to the electric wire 8 by a method using a connecting member such as a solder material or fusing.

[Light emitting diode 10]
For the light emitting diode 10, various elements such as a surface mount LED, a bullet LED, an LED chip, and a chip size package LED can be used. An LED chip in which a GaN-based semiconductor that emits blue light is stacked on a translucent substrate such as a sapphire substrate is used as a lighting device by combining the LED chip 10 with a wavelength conversion member such as a phosphor. It can be used particularly preferably in a light emitting device. By using an unpackaged LED chip as the light emitting diode 10, an inexpensive light emitting device can be obtained.

The light emitting diode 10 can be mounted on the electric wire 8 by various modes (eg, flip-chip mounting, wire bonding mounting, mounting in which die bonding and wire bonding are combined). In particular, by flip-chip mounting, the mounting of the light emitting diode 10 on the base body 4 and the electrical connection between the light emitting diode 10 and the electric wire 8 can be performed at the same time, so that mass productivity can be improved.

The light emitting diode 10 can be provided not only on the front surface side of the base body 4 or in the through hole 42 of the base body 4 but also on the back surface side of the base body 4.

[Adhesive 12]
The base 4 and the electric wire 8 may be adhered to each other with an adhesive 12. The electric wire 8 and the light emitting diode 10 can be bonded together to the base 4 by the adhesive 12.

The adhesive 12 preferably has high transparency and high heat resistance and light resistance, and preferably has an insulating property. Specifically, for example, a transparent adhesive such as an epoxy type, a silicone type, an acrylic type, a modified silicone type, or a urethane type can be used. Further, a thermosetting or ultraviolet curable adhesive can be used. In particular, acrylic UV-curable adhesives and the like are preferable because they are excellent in heat resistance and light resistance, have a high curing speed, and can simplify the production line. When a flexible member is used for the base body 4, it is preferable to use a flexible member (for example, resin) also for the adhesive 12. Thereby, when the substrate 4 is bent, the stress applied to the light emitting diode 10 or the electric wire 8 can be reduced.

Further, the adhesive 12 may be a combination of a plurality of types of adhesives, such as a thermosetting type around the through-hole 42 and a thermoplastic type other than that.

The adhesive 12 preferably contains a filler in order to adjust the light reflectance and the viscosity. By including a white filler such as TiO ₂ or SiO ₂ or a reflective material such as white powder, the light emitted from the light emitting diode 10 can be efficiently reflected on the substrate 4. As such a filler, compounds such as oxides and carbonates of Mg, Ca, Ba, Si, Al, Ti, Zr, rare earth elements, and mixtures thereof can be used. By using the filler, it is possible to preferably perform high efficiency and shape control of the light emitting device.

The adhesive 12 may be provided on a part of the joint between the base body 4 and the electric wire 8 or may be provided on the whole. By providing the adhesive 12 partially, an inexpensive light emitting device can be obtained even if an expensive material (for example, silicone resin) is used as the adhesive 12.

The adhesive 12 can be provided by a method such as dispensing or screen printing. In the case of roll-to-roll manufacturing, it is preferable to provide by printing.

The adhesive 12 may be a tape. Examples of tapes used as the adhesive 12 include epoxy film tapes, polyimide film tapes, PTFE film tapes, polyester film tapes, acetate cloth tapes, cotton cloth tapes, and vinyl tapes.

[Sealing member 14]
The light emitting diode 10 is sealed by a sealing member 14.

Although various materials can be used for the sealing member 14 depending on the type of the light emitting diode 10 and the like, it is preferable that the sealing member 14 has insulating properties, high translucency, and high heat resistance and light resistance. For example, an epoxy resin, a silicone resin, a fluorine resin, or a mixed resin thereof can be used, but a silicone resin is preferably used. The sealing member 14 can be provided by various construction methods such as potting, printing and sheeting.

The shape of the sealing member 14 is not particularly limited. The sealing member 14 can be provided in a desired shape by controlling the viscosity and thixotropy of the sealing member 14. In particular, by providing the sealing member 14 in a dome shape, the light extraction efficiency of the light emitting device can be improved.

The sealing member 14 can contain a wavelength conversion member such as a phosphor. By doing so, various color tones and emission spectra can be provided, and it can be applied to the demands of the market such as for general lighting and for liquid crystal TV (liquid crystal backlight). Further, the sealing member 14 can contain various fillers.

Specifically, when the light emitting diode 10 emits blue light, YAG-based phosphor that emits yellow light, LAG-based phosphor that emits green light, SiAlON-based phosphor, CASN phosphor that emits red light, SCASN phosphor, etc. Can be mentioned as an example of the phosphor. If these phosphors are contained in the sealing member 14, the blue light emitting diode 10 can be combined with the green light emitting SiAlON-based phosphor and the red light emitting CASN phosphor, resulting in high color reproducibility. The light emitting device can be a light source suitable for a backlight. In addition, if the sealing member 14 contains a combination of a green to yellow light emitting LAG or YAG phosphor, a red light emitting phosphor, or the like, the color rendering property (Ra) is higher than that when one type of phosphor is used. A light emitting device that emits white/bulb-colored light that is expensive and suitable for a light source for illumination can be provided.

The sealing member 14 may contain a light diffusing member that scatters light. As a result, a desired light distribution can be obtained, or uneven color can be prevented. Examples of the material of the light diffusion member include TiO ₂ , SiO ₂ , Al ₂ O ₃ , MgO, MgCO ₃ , CaCO ₃ , Mg(OH) ₂ and Ca(OH) ₂ .

The sealing member 14 can contain a filler. By doing so, it is possible to prevent color unevenness of the light emitting device and control the shape of the sealing member. Examples of the filler include inorganic fillers such as Mg, Ca, Ba, Si, Al, Ti, Zr, rare earth elements, and compounds such as oxides and carbonates of a mixture thereof.

The method of providing the sealing member 14 is not particularly limited. As an example, various methods such as molding using a casting case, potting on the light emitting diode 10, printing, transfer molding, compression molding, and injection molding can be performed. Moreover, the sealing by the sealing member 14 can be performed individually for each light emitting diode 10 (see FIGS. 1 to 8) or collectively for a plurality of light emitting diodes 10.

[Bank portion 16]
The sealing member 14 may be surrounded by the bank portion 16. According to the bank portion 16, it is possible to prevent the sealing member 14 from flowing out when the light emitting diode 10 is sealed with the sealing member 14, and to easily form the sealing member 14.

For the bank portion 16, for example, it is preferable to use a member having a high reflectance. More specifically, for example, if it is a resin, a white resin containing a white filler such as TiO ₂ or SiO ₂ and having high heat resistance and light resistance can be preferably used as the bank portion 16. In addition, if ceramics are used, a frame such as Al ₂ O ₃ or TiO ₂ or a glass frame on which Al or Ag is deposited can be preferably used as the bank portion 16.

Further, it is preferable to use a member having a large contact angle with the sealing member 14 for the bank portion 16. With this configuration, the height of the sealing member 14 can be adjusted when the sealing member 14 is formed, and the light distribution of the light emitting device can be controlled.

[Connecting member 20]
The connecting member 20 for connecting the light emitting diode 10 and the electric wire 8 includes, for example, solder and anisotropic conductive paste such as Au-Sn, Sn-Cu-Ag, Sn-Cu, Sn-Bi, and Sn-Zn. Conductive bonding materials such as silver paste, copper paste, and carbon paste can be used.

However, when the light emitting diode 10 and the electric wire 8 are connected by flip chip mounting as in the illustrated example, bumps can be used as the connecting member in addition to the members described above. For such bumps, Au and its alloy can be preferably used.

Further, unlike the illustrated example, when the light emitting diode 10 and the electric wire 8 are connected by wire bonding, a wire can be used as a connecting member. As such a wire, a fine wire of a metal such as Au, Ag, Al, or Cu, an alloy thereof, or a plated alloy can be preferably used. When the light emitting diode 10 and the electric wire 8 are connected by wire bonding, the place where the light emitting diode 10 is mounted does not matter. In this case, the light emitting diode 10 can be mounted on the base 4 such as a place away from the electric wire 8 or between the electric wires 8.

Note that the electrode of the light emitting diode 10 and the electric wire 8 can be directly connected without using a connecting member as in the case of ultrasonic welding or fusing method.

When the light emitting diode 10 is joined or adhered to the electric wire 8 without being electrically connected, a thermosetting resin such as an insulating epoxy resin or a silicone resin can be used.

[Other]
In addition, the electric wire 8 fixed on the base body 4 may be provided with a power feeding connector or a protective element (eg, Zener diode).

Further, the position of the power supply connector and the method of routing the electric wire 8 can be appropriately changed depending on the intended use of the light emitting device. For example, when it is used as a light source of a lighting device for replacing a straight tube fluorescent lamp, it is necessary to provide a power supply terminal on one end side. It is preferable to provide positive and negative power supply connectors.

In addition to the Zener diode chip, a packaged Zener diode or the like can be used as the Zener diode.

Next, examples of the present invention will be described.

First, an example of a method for manufacturing the light emitting device shown in FIG. 1 will be described.

First, an aluminum plate (thickness 1 mm, width 16 mm, length 706 mm) is prepared as the base 4.

Next, an insulating PI film (thickness: 38 μm) is attached as an insulating film 6 to the entire surface of one side of the base body 4 or the portion where the electric wire 8 is fixed on the one side.

Next, a single copper-clad aluminum wire (φ50 μm) that has been treated with an insulating coating is linearly arranged as an electric wire 8 on the insulating film 6 so as to be parallel to the longitudinal direction of the substrate 4. At this time, the electric wire 8 is hooked in the groove 18 and half-embedded in the insulating film 6.

Next, in order to bond the base 4 and the electric wire 8 to each other, adhesion of a silicone resin containing TiO ₂ to the electric wire 8 and the 12 positions on the base 4 (more specifically, the insulating film 6) are adhered. The agent 12 is applied.

The adhesive 12 applied on the base 4 is in the shape of a circle having a diameter of 10 mm and centered on the electric wire 8. The distance between the centers of the circles is 58 mm. Since the light emitted from the light emitting diode 10 spreads in a circular shape, the adhesive 12 is applied in conformity with this shape so that the adhesive 12 is not unnecessarily applied, and the light utilization efficiency is improved. Can be provided at low cost.

Next, a silicone resin (white resin frame) containing circular TiO ₂ in the shape of a circle having a diameter of 3 mm is formed as a bank portion 16 in the area to which the adhesive 12 is applied by a dispensing method. The circular area to which the adhesive 12 is applied and the bank portion 16 are concentric.

Next, the adhesive 12 and the bank portion 16 are thermoset.

Next, the adhesive 12 is partially removed near the center of the circular area to which the adhesive 12 is applied, and the electric wire 8 is half-cut with a dicer (cut width 1 mm, a depth reaching the center of the electric wire 8). Then, the insulating coating on the surface of the electric wire 8 is removed.

Next, the blade of the dicer is changed, and the electric wire 8 from which the insulating coating is removed and the core material is exposed is fully cut (cut width 0.1 mm, cut depth 0.06 mm).

Next, solder paste is dispensed as the connecting member 20 on the portion of the electric wire 8 where the insulating coating is removed and the core material is exposed.

Next, an LED chip (the size of which is 1200 μm on a side in plan view) is mounted as a light emitting diode 10 on the central portion of the area where the adhesive 12 is applied by a mounter, and light is emitted to the portion where the connection member 20 is dispensed. The electrode of the diode 10 is arranged so as to face the electric wire 8. Further, the Zener diode and the connector are mounted on the electric wire 8.

Next, the connection member 20 is melted in a reflow furnace, and the light emitting diode 10, the Zener diode, and the connector are electrically joined to the electric wire 8.

Next, the flux residue of the connecting member 20 is washed and removed.

Next, a transparent silicone resin having low viscosity and light resistance is provided below the light emitting diode 10 as an underfill.

Next, a translucent silicone resin sealing member 14 containing a YAG phosphor is potted on the light emitting diode 10 and inside the bank portion 16. Further, the sealing member 14 is also potted on the Zener diode chip.

Then, the sealing member 14 is cured.

According to the manufacturing method of the first embodiment of the present invention, the light emitting device shown in FIG. 1 can be manufactured at low cost.

Next, an example of a method for manufacturing the light emitting device shown in FIG. 2 will be described.

First, a copper thin plate (thickness 0.3 mm, width 16 mm, length 300 mm) is prepared as the base 4. Since the copper thin plate is used, the substrate 4 according to the second embodiment has excellent heat dissipation.

Then, a white resist (thickness: 38 μm) containing TiO _{2 in} a silicone resin is printed as an insulating film 6 on one entire surface of the substrate 4.

Next, two copper wires (φ200 μm) are linearly arranged as the electric wires 8 on the insulating film 6 so as to be parallel to each other. At this time, the electric wire 8 is hooked in the groove 18 and half-embedded in the insulating film 6. The distance between the two electric wires 8 is 0.2 mm.

Next, the adhesive 12 made of a silicone resin containing a white filler is applied on the electric wire 8 and the substrate 4 (more specifically, the insulating film 6). The adhesive 12 applied on the base body 4 is in the shape of a circle having a diameter of 5 mm with the center between the two electric wires 8. The distance of this circle is 12 mm. As described above, since the light emitted from the light emitting diode 10 spreads in the shape of a circle, the adhesive 12 is applied in conformity with this shape so that the adhesive 12 is not unnecessarily applied and the light utilization efficiency is improved. The light emitting device can be provided at low cost.

Next, a ring-shaped white frame in the shape of a circle having a diameter of 3 mm is formed as the bank portion 16 by a method such as printing or dispensing.

Next, the adhesive 12 and the bank portion 16 are cured.

Next, the adhesive 12 is partially removed, and the electric wire 8 is half-cut (cut width 1 mm, the depth reaching the center of the electric wire 8) with a dicer to remove the insulating coating of the electric wire 8.

Next, solder paste is dispensed as the connecting member 20 on the portion of the electric wire 8 where the insulating coating is removed and the core material is exposed.

Next, the LED chip is mounted as the light emitting diode 10 on the central portion of the region where the adhesive 12 is applied by a mounter, and the electrode of the light emitting diode 10 is inserted through the connecting member 20 at the portion where the connecting member 20 is dispensed. Are arranged so as to face the electric wire 8. Further, the Zener diode and the connector are mounted on the electric wire 8.

Next, the connection member 20 is melted in a reflow furnace, and the light emitting diode 10, the Zener diode, and the connector are electrically joined to the electric wire 8.

Next, the flux residue of the connecting member 20 is washed and removed.

Next, the sealing member 14 containing the phosphor is potted on the light emitting diode 10.

Then, the sealing member 14 is cured.

According to the manufacturing method of the second embodiment of the present invention, the light emitting device shown in FIG. 2 can be manufactured at low cost.

Next, an example of a method of manufacturing the light emitting device shown in FIG. 3 will be described.

First, an electrogalvanized steel sheet (thickness 1 mm, width 16 mm, length 300 mm) is prepared as the base 4.

Next, a PET film (thickness: 38 μm) is attached as an insulating film 6 to the entire one surface of the substrate 4.

Next, an enameled wire with a fusion layer (for example, a magnet wire: type 0 size 0.1 mm) is used as the electric wire 8 on the base body 4 so that a plurality of parts parallel to each other appear on the lateral sides of the base body 4. 8 is wound from the one end to the other end of the substrate 4 on the surface of the substrate 4 in a single layer. At this time, the electric wire 8 is hooked in the groove 18 provided on the side surface of the base 4. The distance between the electric wires 8 is 29.33 mm.

Next, in order to fix the base 4 and the electric wire 8, the base 4 around which the electric wire 8 is wound is heated at about 120 to 220 degrees. The heating is preferably performed by applying pressure so that the electric wire 8 does not float from the base 4.

Next, the adhesive 12 made of a silicone resin containing a white filler is applied on the electric wire 8 and the substrate 4 (more specifically, the insulating film 6). The adhesive 12 applied on the substrate 4 is first applied so as to cover the electric wires 8 in the lateral direction of the substrate 4, and then forms a circle having a center at the center of the substrate 4 in the lateral direction. Is applied. As described above, since the light emitted from the light emitting diode 10 spreads in the shape of a circle, the adhesive 12 is applied in conformity with this shape so that the adhesive 12 is not unnecessarily applied and the light utilization efficiency is improved. The light emitting device can be provided at low cost.

Next, the ring-shaped bank portion 16 is formed.

Next, the adhesive 12 and the bank portion 16 are cured.

Next, the adhesive 12 is partially removed at the center of the bank portion 16, and the electric wire 8 is half-cut with a dicer (cut width 1 mm, a depth reaching the center of the electric wire 8) to obtain an insulating coating of the electric wire 8. To remove. The winding start portion and winding end portion of the electric wire 8 at the end of the base body 4 are also half-cut with a dicer.

Next, the blade of the dicer is changed, and the electric wire 8 from which the insulating coating is removed and the core material is exposed is subjected to full cutting (cut width 0.1 mm, cut depth 0.11 mm).

Next, solder paste is dispensed as the connecting member 20 on the portion of the electric wire 8 where the insulating coating is removed and the core material is exposed.

Next, an LED chip (one side is 1200 μm) is mounted on the central portion of the bank 16 as a light emitting diode 10 with a mounter, and the electrode of the light emitting diode 10 is connected to the portion where the connecting member 20 is dispensed through the connecting member 20. The light emitting diode 10 is arranged in a flip chip state so as to face the electric wire 8. An electric wire 8 is provided at the end of the base body 4 in parallel with the winding start portion and the winding end portion of the electric wire 8, and the Zener diode and the connector are mounted on the electric wire 8.

Next, the connection member is melted in a reflow furnace, and the light emitting diode 10, the Zener diode, and the connector are electrically joined to the electric wire 8.

Next, the flux residue of the connecting member 20 is washed and removed.

Next, the sealing member 14 containing the phosphor is potted on the light emitting diode 10. Further, the sealing member 14 is also potted on the Zener diode.

Then, the sealing member 14 is cured.

According to the manufacturing method of the third embodiment of the present invention, the light emitting device shown in FIG. 3 can be manufactured at low cost.

Next, an example of a method of manufacturing the light emitting device shown in FIG. 4 will be described.

First, a PI film (thickness 0.38 mm, width 16 mm, length 706 mm) is prepared as the substrate 4. Since the insulating film 6 is provided on the surface of the base 4 as described above, the base 4 does not appear in FIG.

Next, a white resist of silicone resin containing TiO ₂ is printed as an insulating film 6 on substantially the entire one surface of the substrate 4.

Next, three enameled wires (φ50 μm) are provided as the electric wires 8 on the insulating film 6 in a straight line so as to be parallel to each other. Further, the electric wire 8 is fixed on the base body 4 with an insulating tape. The distance between the three electric wires 8 is 1 mm.

Next, a ring-shaped white frame having a circular shape with a diameter of 3 mm is formed as a bank portion 16 on the three electric wires 8 by printing. At this time, the bank portion 16 is formed so that the center of the circle is located above the middle electric wire 8 among the three electric wires 8.

Next, the bank portion 16 is hardened.

Next, the electric wire 8 is half-cut with a dicer (cut width 1 mm, depth reaching the center of the electric wire 8) to remove the insulating coating of the electric wire 8. The parallel electric wires 8 formed at the ends of the base body 4 are also half-cut with a dicer.

Next, the blade of the dicer is changed, and the electric wire 8 from which the insulating coating is removed and the core material is exposed is fully cut (cut width 0.1 mm, cut depth 0.06 mm).

Next, solder paste is dispensed as a connecting member on the portion of the electric wire 8 where the insulating coating is removed and the core material is exposed.

Next, the LED chip is mounted on the central portion of the bank portion 16 as the light emitting diode 10 with a mounter. Specifically, the light emitting diode 10 is arranged at the portion where the connection member is dispensed. Further, the Zener diode and the connector are mounted on the electric wire 8. Then, the short-circuited electric wire 22 is mounted on the electric wire 8 to form a series-parallel circuit in which each branch of the parallel circuit is composed of six light-emitting diodes 10 connected in series.

Next, the connection member is melted in a reflow furnace, and the light emitting diode 10, the Zener diode, the connector, and the short-circuit electric wire 22 are electrically connected to the electric wire 8.

Next, the flux residue on the connecting member is washed and removed.

Next, the sealing member 14 containing the phosphor is potted on the light emitting diode 10. Further, the sealing member 14 is also potted on the Zener diode.

Then, the sealing member 14 is cured.

According to the manufacturing method of the fourth embodiment of the present invention, the light emitting device shown in FIG. 4 can be manufactured at low cost. Particularly, according to the manufacturing method according to the fourth embodiment of the present invention, the plurality of light emitting diodes 10 can be inexpensively connected in series and parallel by the short-circuit wire 22, and the light emitting device having a complicated circuit configuration can be inexpensively formed. You can

Next, an example of a method of manufacturing the light emitting device shown in FIG. 5 will be described.

First, an aluminum foil (thickness 0.1 mm, width 30 mm, length 1200 mm) is prepared as the base 4. Since the insulating film 6 is provided on the surface of the substrate 4 as described above, the substrate 4 does not appear in FIG.

Next, the insulating film 6 (thickness 20 μm) is formed on the entire one surface of the substrate 4 by anodizing and sealing.

Next, an adhesive is applied to the surfaces of the three tin-based plated aluminum wires (φ100 μm), and then each tin-based plated aluminum wire is used as an electric wire 8 and linearized so as to be parallel to the longitudinal direction of the substrate 4. Provided on the insulating film 6. The distance between the three electric wires 8 is 1 mm.

Next, an adhesive containing a white filler is applied to the insulating film 6 on the substrate 4. The applied adhesive is in the shape of a circle having a diameter of 10 mm and having a center on the electric wire 8. The distance between the centers of the circles is 58 mm. As described above, the light emitted from the light emitting diode 10 spreads in the shape of a circle. Therefore, by applying the adhesive in conformity with this shape, the adhesive is prevented from being unnecessarily applied, and the light utilization efficiency is improved. The light emitting device can be provided at low cost.

Next, a ring-shaped white frame in the shape of a circle having a diameter of 3 mm is formed as the bank portion 16 in the area where the adhesive is applied by a method such as printing or dispensing. The circular area coated with the adhesive and the bank portion 16 are concentric.

Next, the adhesive and the bank portion 16 are cured.

Next, the adhesive is partially removed at the central portion of the area where the adhesive is applied to expose the electric wire 8. The adhesive is also removed from the parallel electric wires 8 formed on the ends of the base 4 to expose the electric wires 8.

Next, the electric wire 8 from which the insulating coating is removed and which is exposed is fully cut (cut width 0.1 mm, cut depth 0.11 mm) with a dicer. Subsequently, a predetermined portion of the electric wire 8 at the center of the three is fully cut (cut width 1 mm, cut depth 0.11 mm).

Next, the solder paste is dispensed as a connecting member to the exposed portion of the electric wire 8 where the insulating coating is removed.

Next, mount the LED chip (1200×500 μm) as the light emitting diode 10 on the central portion of the area where the adhesive is applied by a mounter, and the electrode and the electric wire of the light emitting diode 10 are attached to the portion where the connection member is dispensed. 8 are arranged so as to face each other. Further, the Zener diode and the connector are mounted on the electric wire 8. Further, the short-circuit electric wire 22 is mounted on the electric wire 8 to form a parallel series circuit in which four parallel circuits in which four light emitting diodes 10 are connected in parallel are connected in series.

Next, the connection member is melted in a reflow furnace, and the light emitting diode 10, the Zener diode, the connector, and the short-circuit electric wire 22 are connected to the electric wire 8.

Next, the flux residue on the connecting member is removed by washing.

Next, the sealing member 14 containing the phosphor is potted on the light emitting diode 10. Further, the sealing member 14 is also potted on the Zener diode.

Then, the sealing member 14 is cured.

According to the manufacturing method of the fifth embodiment of the present invention, the light emitting device shown in FIG. 5 can be manufactured at low cost. In particular, according to the manufacturing method of the fifth embodiment of the present invention, the plurality of light emitting diodes 10 can be connected in parallel at low cost by the short-circuit wire 22, and the light emitting device having a complicated circuit configuration can be formed at low cost. You can

Next, an example of a method for manufacturing the light emitting device shown in FIG. 6 will be described with reference to FIG. FIG. 13 is a partially enlarged view of the light emitting device showing the method for manufacturing the light emitting device according to the sixth embodiment of the invention. As shown in FIG. 13, the method for manufacturing the light emitting device according to Example 6 of the invention includes the following steps.

(First step)
First, as shown in FIG. 13A, a base 4 having a plurality of through holes 42 is prepared. As the substrate 4, a SUS304 thin plate having a thickness of 0.1 mm, a width of 16 mm and a length of 300 mm is used. Further, elongated holes (length 1 mm, width 0.4 mm) are formed at 24 places on the center line of the base body 4 at intervals of 12.5 mm to form the through holes 42.

(Second step)
Next, as shown in FIG. 13B, the electric wire 8 consisting of a pair of the electric wire 8a for the anode and the electric wire 8b for the cathode is provided on the back surface side of the substrate 4. At this time, with respect to the electric wire 8a for the anode and the electric wire 8b for the cathode, each portion where the plurality of light emitting diodes 10 are mounted is once projected from the back surface side of the base body 4 through the through hole 42 to the front surface side of the base body 42. After that, it is bent so as to return to the back surface side of the substrate 4 through the through hole 42 again.

More specifically, two enameled wires (rectangular wire, thickness 0.15 mm, width 0.5 mm) are laid as a pair of electric wires 8 on the back surface side of the base body 4 with the center line of the base body 4 interposed therebetween. Then, 0.15 mm is projected to the surface of the substrate 4 through the through hole 42. Then, an epoxy adhesive is applied as an adhesive to a region surrounding the through hole 42 of the base 4 to fix the two electric wires 8 to the base 4.

(Third step)
Next, as shown in FIG. 13C, a silicone white resist is provided on the surface of the substrate 4 as the insulating film 6 with a thickness of 10 to 20 μm. As a coating method, various methods such as screen printing and spray coating can be used.

After that, the insulating coating (white resist and enamel) on a part (width 0.5 mm, length about 0.3 mm) of the pair of electric wires 8 protruding from the through hole 42 is removed by, for example, a router. In Example 6 of the present invention, since the coating thickness is smaller than the protruding amount of the electric wire 8, the location where the insulating coating is removed can be easily identified even after the insulating film 6 is provided.

(Fourth step)
Next, as shown in FIG. 13(d), solder paste was dispensed (48 places) as a connecting member to the place where the insulating film was removed, and 24 LED chips for flip chip mounting (length 0.8 mm, The width (0.3 mm) is used as the light emitting diode 10 and is mounted in a predetermined direction (the positive and negative electrodes are connected to one and the other of the pair of electric wires 8) at a position where the connecting member is dispensed. Then, the connection member is melted by using a reflow furnace to connect the light emitting diode 10 and the electric wire 8.

The electric wire 8 on the back surface side of the base 4 is provided with a protective element such as a Zener diode or a connector.

(Fifth step)
Next, as shown in FIG. 13E, the flux is washed, the bank portion 16 is formed of an epoxy-based transparent resin containing a white filler, and the silicone-based resin mixed with the YAG phosphor is used as the sealing member 14. Potting and curing.

Next, an example of a method for manufacturing the light emitting device shown in FIG. 7 will be described with reference to FIG. FIG. 14 is a partially enlarged view of the light emitting device showing the method for manufacturing the light emitting device according to the seventh embodiment of the invention. As shown in FIG. 14, the method for manufacturing the light emitting device according to Example 7 of the invention includes the following steps.

(First step)
First, as shown in FIG. 14A, a base 4 having a plurality of through holes 42 is prepared. As the substrate 4, a SUS304 thin plate having a thickness of 0.1 mm, a width of 16 mm and a length of 300 mm is used. Further, elongated holes (length 1 mm, width 0.4 mm) are formed at 24 places on the center line of the base body 4 at intervals of 12.5 mm to form the through holes 42.

(Second step)
Next, as shown in FIG. 14B, one enameled wire (rectangular wire, thickness 0.15 mm, width 0.5 mm) is laid on the center line of the base 4 on the back surface side of the base 4, 0.15 mm is projected through the through hole 42 to the surface of the substrate 4, and the projected portion is cut. Thereby, one enamel wire is separated into a plurality of electric wires 8 (electric wires 8a, electric wires 8b, electric wires 8c, electric wires 8d... ), and each electric wire 8 (electric wires 8a, electric wires 8b, electric wires 8c, electric wires 8d,... ..) one end and the other end project from the back surface side of the base body 4 to the front surface side of the base body 4 through the through holes 42.

Then, one end and the other end of each protruding electric wire 8 (electric wire 8a, electric wire 8b, electric wire 8c, electric wire 8d...) Are folded toward the surface of the base 4, and the epoxy adhesive is applied to the through hole 42 of the base 4. Is applied as an adhesive 12 to the area surrounding the wire, and one end and the other end of each electric wire 8 (electric wire 8a, electric wire 8b, electric wire 8c, electric wire 8d...) Are fixed to the base body 4.

(Third step)
Next, as shown in FIG. 14C, a silicone-based white resist is applied as an insulating film 6 to the surface of the substrate 4 to a thickness of 10 to 20 μm and cured.

After that, an insulating coating on a part (width 0.5 mm, length about 0.3 mm) of one end and the other end of each electric wire 8 (electric wire 8a, electric wire 8b, electric wire 8c, electric wire 8d...) Protruding from the through hole 42. (White resist and enamel) are removed with a blade such as a router. In Example 7 of the present invention as well, as in Example 6 of the present invention, since the coating thickness is smaller than the protruding amount of the electric wire 8, it is possible to easily determine the location where the insulating coating is removed even after coating.

(Fourth step)
Next, as shown in FIG. 14(d), solder paste was dispensed as a connecting member (48 places) at the place where the insulating film was removed, and 24 LED chips for flip chip mounting (length 0.8 mm, The width of 0.3 mm is used as the light emitting diode 10 to a position where the connecting member is dispensed in a predetermined direction (one end of the electric wire 8 (for example, the electric wire 8a) having one positive and negative electrodes and the other end of the other electric wire 8 (for example, the electric wire 8b). Mount in the direction that they are respectively connected to and. Then, the connection member is melted by using a reflow furnace to electrically connect the light emitting diode 10 and the electric wire 8.

The electric wire 8 on the back surface side of the substrate 4 is provided with a protective element such as a Zener diode, a connector, or the like.

(Fifth step)
Next, as shown in FIG. 14(e), the flux is cleaned, and a circular bank portion 16 which surrounds the light emitting diode 10 in a plan view is formed of an epoxy-based transparent resin containing a white filler. Silicone resin mixed with YAG phosphor is potted inside 16 as the sealing member 14 and cured.

Next, an example of a method of manufacturing the light emitting device shown in FIG. 8 will be described with reference to FIG. FIG. 15 is a partial enlarged view of a light emitting device showing a method for manufacturing a light emitting device according to Example 8 of the present invention. As shown in FIG. 15, the method for manufacturing the light emitting device according to Example 8 of the present invention includes the following steps.

(First step)
First, as shown in FIG. 15A, a base 4 having a plurality of through holes 42 is prepared. As the substrate 4, a white polyphthalamide (PPA) plate having a thickness of 2 mm, a width of 16 mm and a length of 300 mm is used. In addition, circular holes in plan view (diameter of top surface is 3 mm, diameter of bottom surface is 1.4 mm) are formed at 24 positions on the center line of the base body 4 at intervals of 12.5 mm to form through holes 42.

(Second step)
Next, as shown in FIG. 15B, the electric wire 8 consisting of a pair of the electric wire 8a for the anode and the electric wire 8b for the cathode is provided on the back surface side of the substrate 4. At this time, the electric wire 8a for the anode and the electric wire 8b for the cathode are provided so as to cross the opening surface of the through hole 42 on the back surface side of the base body 4.

More specifically, two enameled wires (rectangular wire, thickness 0.15 mm, width 0.5 mm) are penetrated as a pair of electric wires 8 on the back surface side of the base body 4 with the center line of the base body 4 interposed therebetween. It is made to crawl across the opening surface of the hole 42. Then, an epoxy adhesive is applied to the base 4 as an adhesive to fix the two electric wires 8 to the base 4.

(Third step)
Next, as shown in FIG. 15C, a part (width 0.5 mm, length 0.3 mm) of the pair of electric wires 8 on the opening surface of the through hole 42 is covered with an insulating coating (enamel), for example, a router. Then, as shown in FIG. 15C, a solder paste is dispensed as a connecting member at the location where the insulating film is removed, and an LED chip (having a length of 0.8 mm) having positive and negative electrodes formed on one main surface is dispensed. , Width 0.3 mm) is mounted as a light emitting diode 10 in a predetermined direction (the positive and negative electrodes are connected to one and the other of the pair of electric wires 8) at a position where the connecting member is dispensed. Then, the connection member is melted by using a reflow furnace to connect the light emitting diode 10 and the electric wire 8.

The electric wire 8 on the back surface side of the substrate 4 is provided with a protective element such as a Zener diode, a connector, or the like.

(Fourth step)
Next, as shown in FIG. 15D, after cleaning the flux, a silicone resin mixed with a YAG phosphor is potted as the sealing member 14 and cured.

In addition, although the rectangular wire is used as the electric wire 8 in the above-mentioned Examples 6, 7 and 8, it is also possible to use a round wire. In this case, by applying the lock stitch of the sewing machine using the upper thread and the lower thread, the electric wire 8 is passed through the through hole of the base body 4, and the tension and the thickness of the upper thread and the lower thread (enamel wire) are adjusted, The electric wire 8 can also be taken out from the through hole 42 of the base body 4 with a desired size. Specifically, the tension of the upper thread is made higher than that of the lower thread so that the electric wire 8 of the lower thread protrudes from the base 4. At this time, the length of the lower thread coming out of the base 4 can be adjusted by selecting the thickness and the tension of the upper thread.

Although the embodiments and examples of the present invention have been described above, these descriptions are only examples of the present invention, and the present invention is not limited to these descriptions.

4 Base 6 Insulation Film 8 Electric Wire 81 Coating 82 Core Wire 10 Light Emitting Diode 12 Adhesive 14 Sealing Member 16 Bank 18 Groove 20 Connection Member 22 Shorting Wire 42 Through Hole

Claims (10)

A substrate having a plurality of through holes,
A pair of electric wires provided on the back surface side of the base body and traversing the opening surfaces of the plurality of through holes,
A plurality of light emitting diodes provided in each of the plurality of through holes and mounted on the pair of electric wires,
A plurality of sealing members for sealing each of the plurality of light emitting diodes one by one ,
The pair of electric wires has a core wire and an insulating member that covers the core wire, and includes an exposed portion where the core wire is exposed from the insulating member at an opening surface of the through hole,
The light emitting device in which the light emitting diode is mounted on the exposed portion . The light emitting device according to claim 1, wherein the sealing member has a dome shape. The electric wire is
Has a longitudinal direction and a lateral direction in a plan view,
The light emitting device according to claim 1 , wherein a cross section parallel to the lateral direction has a rectangular shape. The light emitting device according to claim 1 , wherein the base is a resin film. The light emitting device according to any one of claims 1 to 4 , further comprising a protective element and/or a connector mounted on the pair of electric wires on the back surface side of the base body. Preparing a substrate having a plurality of through holes,
A step of providing a pair of electric wires across the opening surfaces of the plurality of through holes on the back surface side of the base body;
A step of providing a plurality of light emitting diodes mounted on the pair of electric wires in the plurality of through holes;
Have a, a step of providing a plurality of sealing members for sealing the plurality of light emitting diodes,
In the step of providing the light emitting diode , manufacturing of a light emitting device in which the core wire of the pair of electric wires is exposed from an insulating member of the pair of electric wires in the opening surface of the through hole, and the light emitting diode is mounted on the exposed core wire. Method. The method for manufacturing a light emitting device according to claim 6 , wherein in the step of providing the sealing member, the sealing member has a dome shape. The light emitting device according to claim 6 or 7 , wherein in the step of providing the pair of electric wires, the electric wires have a longitudinal direction and a lateral direction in a plan view, and a cross section parallel to the lateral direction has a rectangular shape. Production method. The method for manufacturing a light emitting device according to claim 6 , wherein in the step of preparing the base, the base is a resin film. The method of manufacturing a light emitting device according to any one of claims 6 9, further, the method of manufacturing the light emitting device having a step of mounting the pair of wire protection element and / or the connector in the back surface side of the substrate ..

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