CN101109496A - LED flat lamp and manufacturing method thereof - Google Patents
LED flat lamp and manufacturing method thereof Download PDFInfo
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- CN101109496A CN101109496A CNA2007100297041A CN200710029704A CN101109496A CN 101109496 A CN101109496 A CN 101109496A CN A2007100297041 A CNA2007100297041 A CN A2007100297041A CN 200710029704 A CN200710029704 A CN 200710029704A CN 101109496 A CN101109496 A CN 101109496A
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Abstract
The invention relates to a LED plate lamp and its manufacturing method. The manufacturing procedures are: making a base plate, installing a support, coating prime binder, installing a LED chip, welding wires, coating fluorescent powder and encapsulating the LED, etc. The LED plate lamp got by above procedures comprises a base plate, on which a plurality of accommodating holes are provided, surrounding each, a positive and a negative golden finger are provided; the LED plate lamp also comprises a plurality of electrically connected LED modules, each corresponding to an accommodating hole and comprising a support that is composed of a base and a bottom cup inserted in the accommodating hole; a LED chip is fixedly provide in the bottom cup, the positive and negative pole of the LED chip are corresponding to and electrically connected through conductive wires with the positive and negative pole surrounding the accommodating holes; on the LED chip, a layer of fluorescent powder is coated, on which a sealing layer is covered. By above method, the components can be firmly joined, and the processing is fast and massive production is possible; the light effect of the LED module in the LED plate lamp is not influenced, and the service life is long.
Description
Technical field
The present invention relates to LED (light emitting diode) photoelectric field technology, refer in particular to a kind of LED flat lamp and manufacture method thereof.
Background technology
As everyone knows, LED (light emitting diode) has advantages such as long, the high and low power consumption of light efficiency of life-span, and then is able to extensive use in illuminating industry; Now, along with advancing by leaps and bounds of science and technology, in the industry for further rational Application LED, make LED be tending towards the panelized development, for example can consult Chinese patent application 200510034909.X (LED flat head lamp) and Chinese patent ZL200620059140.7 (a kind of LED illumination module), at this above-mentioned each patent not added and give detailed description.
In view of the development of LED flat lamp, how to be laid in the LED snugly on the substrate and make LED illumination stable, do not influence the technical problem of LED light efficiency etc. again, demanding the dealer urgently must be faced with new challenges.
Summary of the invention
Main purpose of the present invention is to provide a kind of process LED flat lamp and manufacture method thereof easy, that stablize and can not influence the LED light efficiency.
For realizing above-mentioned purpose, the present invention takes following technical scheme:
A kind of manufacture method of LED flat lamp, its step is as follows:
1. make substrate: on substrate, offer a plurality of ccontaining embeddings hole, be provided with positive and negative two golden fingers in each ccontaining embedding hole on every side;
2. mounting bracket: the support that will have base cup structure vertically embeds in each embedding hole of substrate, and makes the bottom surface of the base of support near substrate;
3. put primer: the primer that modulates is clicked and entered in right amount in the end cup of each support;
4. led chip is installed: led chip is placed respectively on the primer of above-mentioned bracket bottom cup, send into baking in the baking box again, primer is solidified fully, and then utilize primer that led chip is fixed;
5. bonding wire: weld together with the positive and negative electrode of electric wire with the golden finger around the ccontaining embedding hole of the positive and negative electrode counterpart substrate of led chip;
6. dot fluorescent powder: with fluorescent material and glue hybrid modulation, in the end cup of then that the fluorescent material that modulates is an amount of substrate of clicking and entering above-mentioned bonding wire, make fluorescent material cover led chip fully, send into baking in the baking box at last, make fluorescent powder curing;
7. LED encapsulation: the epoxy resin that modulates is evenly splashed in the cup of each support and and cover fully, send in the baking box again and toast, and then make the LED flat board with electric wire.
2. above-mentioned～3. further increase cleaning and baking process between the step, wherein, the substrate that 2. installs support earlier in the step places in the ultrasonic wave that cleaning agent is housed, and cleans 5～10 minutes at normal temperatures; The interior baking of baking box of sending into 60～80 ℃ then got final product in 20～40 minutes.
5. above-mentioned～6. further increase some elargol and baking process between the step, wherein, after bonding wire craft is finished, the elargol that modulates is put bonding wire place in golden finger in right amount, send into 140～160 ℃ interior the baking 50～70 minutes of baking box then, elargol is solidified fully, so that bonding wire is fixed.
Oven temperature in above-mentioned 7. step is arranged between 120～150 ℃, and stoving time was at 7～9 hours.
Offer a plurality of pads in the lump on the substrate in above-mentioned 1. step.
A kind of LED flat lamp, it comprises
One substrate offers a plurality of ccontaining embeddings hole on this substrate, be provided with positive and negative two golden fingers around each ccontaining embedding hole;
The LED module of a plurality of mutual electrical connections, the corresponding ccontaining embedding hole of each LED module, this LED module comprises a support, and this support is made of base and end cup, and this end cup embeds in the above-mentioned ccontaining embedding hole; Be installed with a led chip in end cup, the positive and negative electrode around the corresponding ccontaining embedding of the positive and negative electrode of this led chip hole electrically connects through electric wire; On led chip, cover the layer of fluorescent powder layer, and be coated with a sealant that electric wire is covered fully at this phosphor powder layer.
This substrate is provided with pad; This substrate is rounded or square.
Between led chip and end cup, has the affixed layer of a primer.
Above-mentioned sealant is an epoxide resin material.
The present invention's advantage is: adopt said method can make members such as substrate, support, led chip and phosphor powder layer, resin-sealed layer be able to firm combination each other, its easy making process, can produce in batches, and the LED module light efficiency after the moulding is unaffected in the prepared LED flat lamp, and long service life.
Description of drawings
Fig. 1 is the schematic appearance of LED flat lamp of the present invention;
Fig. 2 is the cross-sectional schematic of LED flat lamp of the present invention;
Fig. 3 is the substrate schematic diagram of LED flat lamp of the present invention;
Fig. 4 is the support enlarged diagram of LED flat lamp of the present invention;
Fig. 5 is the schematic diagram of fabrication technology of LED flat lamp of the present invention;
Fig. 6 is the simple and easy schematic diagram of circuit of the present invention ();
Fig. 7 is the simple and easy schematic diagram of circuit of the present invention (two);
Fig. 8 is the simple and easy schematic diagram of circuit of the present invention (three);
Fig. 9 is the simple and easy schematic diagram of circuit of the present invention (four).
The specific embodiment
Below in conjunction with the accompanying drawing and the specific embodiment the present invention is further described.
As Fig. 1～shown in Figure 4, a kind of LED flat lamp comprises the LED module 2 of substrate 1 and a plurality of mutual electrical connections, wherein:
Substrate 1 structure that is square can also be circular certainly; On substrate 1, offer a plurality of ccontaining embeddings hole 11, be provided with positive and negative two golden fingers 12 around each ccontaining embedding hole 11, be provided with pad 13, be convenient to the subsequent detection operation at this substrate 1.
A plurality of LED modules 2, each LED module 2 corresponding ccontaining embedding hole 11, this LED module 2 comprises a support 21, and this support 21 is made of base 211 and end cup 212, and this end cup 212 embeds in the above-mentioned ccontaining embedding hole 11; By the affixed layer of primer 22 an affixed led chip 23, the positive and negative electrode of this led chip 23 electrically connects by the positive and negative electrode golden finger 12 around the electric wire 24 corresponding ccontaining embedding holes 11 in end cup 212; Cover layer of fluorescent powder layer 25 on led chip 23, and be coated with a sealant 26 that electric wire 24 is covered fully in 25 layers in this fluorescent material, sealing layer 26 is an epoxide resin material.
As shown in Figure 5, the manufacture method of above-mentioned LED flat lamp is as follows:
(1) makes substrate 1: on substrate 1, offer a plurality of ccontaining embeddings hole 11, around each ccontaining embedding hole 11, be provided with positive and negative two golden fingers 12, and pad 13 is set on substrate 1; Make the back and detected substrate.
(2) mounting bracket 21: the support 21 that will have end cup 212 structures vertically embeds in each embedding hole 11 of substrates 1, and makes the bottom surface of the base 211 of support 21 near substrate 1;
(3) clean substrate 1: the substrate 1 that installs support 21 earlier places in the ultrasonic wave that cleaning agent is housed, and cleans 5～10 minutes at normal temperatures; The interior baking of baking box of sending into 60～80 ℃ then got final product in 20～40 minutes.
(4) some primer: the primer that modulates is clicked and entered in right amount formed the affixed layer 22 of primer in the end cup of each support;
(5) led chip 23 is installed: led chip 23 is placed respectively on the affixed layer 22 of primer of above-mentioned support 21 end cup 212, send into baking in the baking box again, primer is solidified fully, and then utilize primer that led chip 23 is fixing;
(6) bonding wire: weld together with the positive and negative electrode of electric wire 24 with the golden finger 12 around the ccontaining embedding hole 11 of the positive and negative electrode counterpart substrate 1 of led chip 23; Carry out Function detection then, it is that the DC positive source is connect the substrate positive terminal pad, and can the DC power cathode connect substrate negative terminal pad detection led chip and evenly light.
(7) some elargol and baking process wherein, after bonding wire craft is finished, put bonding wire place in golden finger with the elargol that modulates in right amount, sends in 140～160 ℃ the baking box baking then 50～70 minutes, elargol solidified fully, so that bonding wire is fixed.
(8) dot fluorescent powder: with fluorescent material and glue hybrid modulation, in the end cup of then that the fluorescent material that modulates is an amount of substrate of clicking and entering above-mentioned bonding wire, make fluorescent material cover led chip fully, send into baking in the baking box at last, make fluorescent powder curing form phosphor powder layer 25; Detect aberration.The DC positive source is connect the substrate positive terminal pad, and the DC power cathode connects the substrate negative terminal pad, and whether detect LED consistent by the aberration after lighting.
(9) LED encapsulation: the epoxy resin that modulates is evenly splashed in the cup of each support and and cover fully with electric wire, send into again and toasted in the baking box of being transferred between 120～150 ℃ 7～9 hours, form sealant 26, and then also make the LED flat lamp thereupon.Whether carry out burn-in test behind the finished product, wherein the dull and stereotyped finished product of LED was lighted LED24 hour by the correct electric mode that connects, it is good fully to detect its function.
In conjunction with Fig. 6～shown in Figure 9, it shows the circuit connection diagram between each LED module on four kinds of LED flat lamp again; Wherein Fig. 6 represents the mode of direct series LED module 2; Fig. 7 represents the mode of direct parallel connection LED module 2; Fig. 8 represents the identical LED module in several roads in parallel again after earlier several LED modules 2 being connected; Fig. 9 represents earlier the identical LED module in several roads of connecting again after single led module 2 parallel connections; The present invention's LED flat lamp circuit is not limited to above-mentioned four kinds, does not enumerate one by one at this.
Design focal point of the present invention is to adopt said method can make members such as substrate, support, led chip and phosphor powder layer, resin-sealed layer be able to firm combination each other, its easy making process, can produce in batches, and the LED module light efficiency after the moulding is unaffected in the prepared LED flat lamp, and long service life.
The above, it only is the preferred embodiment of a kind of LED flat lamp of the present invention and manufacture method thereof, be not that technical scope of the present invention is imposed any restrictions, so every foundation technical spirit of the present invention all still belongs in the scope of technical solution of the present invention any trickle modification, equivalent variations and modification that above embodiment did.
Claims (10)
1. the manufacture method of a LED flat lamp, it is characterized in that: step is as follows
1. make substrate: on substrate, offer a plurality of ccontaining embeddings hole, be provided with positive and negative two golden fingers in each ccontaining embedding hole on every side;
2. mounting bracket: the support that will have base cup structure vertically embeds in each embedding hole of substrate, and makes the bottom surface of the base of support near substrate;
3. put primer: the primer that modulates is clicked and entered in right amount in the end cup of each support;
4. led chip is installed: led chip is placed respectively on the primer of above-mentioned bracket bottom cup, send into baking in the baking box again, primer is solidified fully, and then utilize primer that led chip is fixed;
5. bonding wire: weld together with the positive and negative electrode of electric wire with the golden finger around the ccontaining embedding hole of the positive and negative electrode counterpart substrate of led chip;
6. dot fluorescent powder: with fluorescent material and glue hybrid modulation, in the end cup of then that the fluorescent material that modulates is an amount of substrate of clicking and entering above-mentioned bonding wire, make fluorescent material cover led chip fully, send into baking in the baking box at last, make fluorescent powder curing;
7. LED encapsulation: the epoxy resin that modulates is evenly splashed in the cup of each support and and cover fully, send in the baking box again and toast, and then make the LED flat board with electric wire.
2. according to the manufacture method of the described a kind of LED flat lamp of claim 1, it is characterized in that: 2. above-mentioned～3. further increase cleaning and baking process between the step, wherein, the substrate that installs support in the first 2. step places in the ultrasonic wave that cleaning agent is housed, and cleans 5～10 minutes at normal temperatures; The interior baking of baking box of sending into 60～80 ℃ then got final product in 20～40 minutes.
3. according to the manufacture method of the described a kind of LED flat lamp of claim 1, it is characterized in that: 5. above-mentioned～6. further increase some elargol and baking process between the step, wherein, after bonding wire craft is finished, the elargol that modulates is put bonding wire place in golden finger in right amount, send into 140～160 ℃ interior the baking 50～70 minutes of baking box then, elargol is solidified fully, so that bonding wire is fixed.
4. according to the manufacture method of the described a kind of LED flat lamp of claim 1, it is characterized in that: the oven temperature in above-mentioned 7. step is arranged between 120～150 ℃, and stoving time was at 7～9 hours.
5. according to the manufacture method of the described a kind of LED flat lamp of claim 1, it is characterized in that: offer a plurality of pads in the lump on the substrate in above-mentioned 1. step.
6. a LED flat lamp that requires 1～5 any one manufacture method to make according to aforesaid right is characterized in that: comprise
One substrate offers a plurality of ccontaining embeddings hole on this substrate, be provided with positive and negative two golden fingers around each ccontaining embedding hole;
The LED module of a plurality of mutual electrical connections, the corresponding ccontaining embedding hole of each LED module, this LED module comprises a support, and this support is made of base and end cup, and this end cup embeds in the above-mentioned ccontaining embedding hole; Be installed with a led chip in end cup, the positive and negative electrode around the corresponding ccontaining embedding of the positive and negative electrode of this led chip hole electrically connects through electric wire; On led chip, cover the layer of fluorescent powder layer, and be coated with a sealant that electric wire is covered fully at this phosphor powder layer.
7. LED flat lamp according to claim 6 is characterized in that: this substrate is provided with pad.
8. according to claim 6 or 7 described LED flat lamp, it is characterized in that: this substrate is rounded or square.
9. LED flat lamp according to claim 6 is characterized in that: have the affixed layer of a primer between led chip and end cup.
10. LED flat lamp according to claim 6 is characterized in that: above-mentioned sealant is an epoxide resin material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007100297041A CN101109496A (en) | 2007-08-14 | 2007-08-14 | LED flat lamp and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007100297041A CN101109496A (en) | 2007-08-14 | 2007-08-14 | LED flat lamp and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101109496A true CN101109496A (en) | 2008-01-23 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2007100297041A Pending CN101109496A (en) | 2007-08-14 | 2007-08-14 | LED flat lamp and manufacturing method thereof |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101894765A (en) * | 2010-05-24 | 2010-11-24 | 王进 | Manufacturing method of LED device |
| CN102130280A (en) * | 2010-12-31 | 2011-07-20 | 浙江名芯半导体科技有限公司 | LED (Light Emitting Diode) package solder joint structure and process |
| CN103162100A (en) * | 2011-12-08 | 2013-06-19 | 苏州市世纪晶源电力科技有限公司 | Method for integration packaging of alternating current or direct current light-emitting diode (LED) light source by formal structure LED chip |
| CN107559631A (en) * | 2017-08-16 | 2018-01-09 | 芜湖晶鑫光电照明有限公司 | A kind of LED flat lamp technological process of production |
| CN108591855A (en) * | 2018-05-17 | 2018-09-28 | 浙江安吉成新照明电器有限公司 | A kind of production technology of LED pendent lamps |
| CN111928127A (en) * | 2020-08-11 | 2020-11-13 | 浙江西兴光电科技有限公司 | Energy-saving lamp manufacturing process |
| CN112122194A (en) * | 2020-10-28 | 2020-12-25 | 海鹰企业集团有限责任公司 | Novel method for cleaning inner cavity of alarm probe |
| CN115289410A (en) * | 2022-08-11 | 2022-11-04 | 深圳市未林森科技有限公司 | Production process for improving uniformity of light spots and light colors of LED lamp |
-
2007
- 2007-08-14 CN CNA2007100297041A patent/CN101109496A/en active Pending
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101894765A (en) * | 2010-05-24 | 2010-11-24 | 王进 | Manufacturing method of LED device |
| CN101894765B (en) * | 2010-05-24 | 2013-07-17 | 东莞市莱硕光电科技有限公司 | Manufacturing method of LED device |
| CN102130280A (en) * | 2010-12-31 | 2011-07-20 | 浙江名芯半导体科技有限公司 | LED (Light Emitting Diode) package solder joint structure and process |
| CN103162100A (en) * | 2011-12-08 | 2013-06-19 | 苏州市世纪晶源电力科技有限公司 | Method for integration packaging of alternating current or direct current light-emitting diode (LED) light source by formal structure LED chip |
| CN107559631A (en) * | 2017-08-16 | 2018-01-09 | 芜湖晶鑫光电照明有限公司 | A kind of LED flat lamp technological process of production |
| CN108591855A (en) * | 2018-05-17 | 2018-09-28 | 浙江安吉成新照明电器有限公司 | A kind of production technology of LED pendent lamps |
| CN111928127A (en) * | 2020-08-11 | 2020-11-13 | 浙江西兴光电科技有限公司 | Energy-saving lamp manufacturing process |
| CN112122194A (en) * | 2020-10-28 | 2020-12-25 | 海鹰企业集团有限责任公司 | Novel method for cleaning inner cavity of alarm probe |
| CN112122194B (en) * | 2020-10-28 | 2022-08-12 | 海鹰企业集团有限责任公司 | Novel method for cleaning inner cavity of alarm probe |
| CN115289410A (en) * | 2022-08-11 | 2022-11-04 | 深圳市未林森科技有限公司 | Production process for improving uniformity of light spots and light colors of LED lamp |
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Owner name: DONGGUAN CITY STATE OPTICAL CO. Free format text: FORMER OWNER: XU ZHAOFENG Effective date: 20080704 |
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Effective date of registration: 20080704 Address after: Guangdong city of Dongguan province Dongcheng District Tongsha Shangyuan Village (Bayi Road) A on the third floor post encoding: 523000 Applicant after: Dongguan Bangchen Photoelectrc Co.,Ltd. Address before: Guangdong city of Dongguan province Dongcheng District Tongsha Shangyuan Village (Bayi Road) A on the third floor of Dongguan Bangchen photoelectric Co Ltd postal encoding: 523000 Applicant before: Xu Chaofeng |
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