CN115289410A - Production process for improving uniformity of light spots and light colors of LED lamp - Google Patents
Production process for improving uniformity of light spots and light colors of LED lamp Download PDFInfo
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- CN115289410A CN115289410A CN202210960281.XA CN202210960281A CN115289410A CN 115289410 A CN115289410 A CN 115289410A CN 202210960281 A CN202210960281 A CN 202210960281A CN 115289410 A CN115289410 A CN 115289410A
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/90—Methods of manufacture
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/0015—Fastening arrangements intended to retain light sources
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V31/00—Gas-tight or water-tight arrangements
- F21V31/005—Sealing arrangements therefor
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V31/00—Gas-tight or water-tight arrangements
- F21V31/04—Provision of filling media
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V5/00—Refractors for light sources
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
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Abstract
The invention discloses a production process for improving light spot and light color uniformity of an LED lamp, belonging to the technical field of LED lamp production and comprising the following steps of: preparing production raw materials; according to the invention, by adopting a secondary sealing technology, when the LED lamp is treated, the light-transmitting cover is firstly adopted to be matched with the sealing resin for primary sealing, and then the sealing strip is matched with the LED lampshade for secondary sealing, so that the overall sealing effect of the LED lamp can be greatly improved, the internal sealing performance of the LED lamp can be kept for a long time after the LED lamp is used for a long time, the problem of poor light color uniformity is effectively solved, meanwhile, the overall light transmittance of the LED lamp is stably improved by adopting the light-transmitting cover, the mapping effect of light spots can be changed, the use quality of the LED lamp is improved, meanwhile, the size and the flatness of the LED mounting substrate are detected, the LED layout is planned according to the detection result, the illumination effect of the LED lamp can be effectively ensured, the problem of poor light color uniformity caused by different lamp source heights is avoided, and the LED lamp is suitable for popularization.
Description
Technical Field
The invention belongs to the technical field of LED lamp production, and particularly relates to a production process for improving light spot and light color uniformity of an LED lamp.
Background
The LED lamp is a common lamp body, mainly a lamp body which emits light through an internal LED lamp bead, is an electroluminescent semiconductor material chip, is solidified on a support by silver glue or white glue, then is connected with the chip and a circuit board by silver glue or gold threads, is sealed by epoxy resin at the periphery, plays a role in protecting an internal core wire, and is finally provided with a shell.
Chinese patent discloses (CN 105180010B) a production process of an LED lamp, which comprises preparing a kudzu rope for standby, splicing an arc-shaped rod, a circular ring and a lamp holder into a lamp holder, connecting the lamp holder and a mounting seat by a suspension rod, arranging a wire, mounting an LED bulb on the lamp holder, and finally connecting the mounting seat and the circular ring by the kudzu rope. The LED lamps and lanterns that provide among the above-mentioned technical scheme, its light in weight, can be fine and ancient ways' decoration characteristic suits, satisfy the design demand, and when the assembly, it is little to the damage of staff, in present LED lamp production process, encapsulation leakproofness control to the LED lamp is not high, the LED lamp that leads to follow-up production is after using a period, aqueous vapor in the outer environment can get into the lamp shade, cause the not relatively poor condition of the photochromic degree of different degrees, the mounted position of lamp pearl is not the parallel and level also can cause this type of condition in the LED production process simultaneously, in order to solve above-mentioned problem, need one kind to improve the production technology of LED lamp facula and photochromic uniformity urgently.
Disclosure of Invention
The invention aims to: the production process for improving the light spot and light color uniformity of the LED lamp is provided in order to solve the problems that in the current LED lamp production process, the sealing performance of the LED lamp is not controlled highly, so that after the LED lamp produced subsequently is used for a period of time, moisture in an external environment can enter a lampshade, the light color uniformity in different degrees is poor, and meanwhile, the situation can be caused due to the fact that the installation positions of lamp beads in the LED production process are not parallel and level.
In order to achieve the purpose, the invention adopts the following technical scheme: a production process for improving light spot and light color uniformity of an LED lamp comprises the following steps:
s1, preparing production raw materials, including a bottom plate, an LED mounting substrate, a radiating fin, radiating oil, an LED light-emitting chip, an LED lampshade, a light-transmitting cover, silver colloid, a sealing strip and sealing resin;
s2, placing the LED mounting substrate on a grinding machine, controlling the rotating speed of the grinding machine to grind and polish the LED mounting substrate, and storing the processed LED mounting substrate;
s3, taking the LED lamp shade and the light-transmitting cover, placing the LED lamp shade and the light-transmitting cover on the bracket, introducing water into the LED lamp shade and the light-transmitting cover, and observing the states of the LED lamp shade and the light-transmitting cover;
s4, taking the LED mounting substrate, and detecting the surface flatness of the LED mounting substrate;
s5, measuring the size of the LED mounting substrate by using a measuring scale, and marking the mounting position of the LED light-emitting chip by using a marking pen according to different components;
s6, taking silver adhesive, and carrying out substrate adhesive dispensing at different point positions according to the points marked in the S5;
s7, taking the LED light-emitting chips, respectively installing the LED light-emitting chips on the dispensing substrates at different point positions, placing the LED light-emitting chips in a drying device, quickly drying the LED light-emitting chips, and cleaning the LED light-emitting chips after drying;
s8, mounting the LED mounting substrate on a bottom plate, taking a radiating fin, embedding the radiating fin in an adaptive clamping groove of the bottom plate, and uniformly smearing radiating oil on the surface of the LED mounting substrate;
s9, taking the light-transmitting cover, installing the light-transmitting cover on the bottom plate, coating sealing resin at the joint of the light-transmitting cover and the bottom plate to ensure the coating thickness, and placing the light-transmitting cover in a drying device for drying;
s10, after drying, taking the LED lampshade, carrying out final packaging, and adhering a sealing strip to the joint of the LED lampshade and the bottom plate by using super glue after packaging;
and S11, conducting a power-on test, packaging and warehousing.
As a further description of the above technical solution:
in the S1, raw production materials are prepared and comprise an LED mounting substrate, a radiating fin, radiating oil, an LED light-emitting chip, an LED lampshade, a light-transmitting cover, silver glue, a sealing strip and sealing resin, wherein the sealing resin is epoxy resin.
As a further description of the above technical solution:
and S2, placing the LED mounting substrate on a grinding machine, controlling the rotating speed of the grinding machine to be 1200-1600r/min, grinding and polishing the LED mounting substrate, and storing the processed LED mounting substrate.
As a further description of the above technical solution:
and S3, placing the LED lamp shade and the light-transmitting cover on the support, introducing water into the LED lamp shade and the light-transmitting cover, observing the states of the LED lamp shade and the light-transmitting cover, directly replacing a new batch of LED lamp shade and light-transmitting cover if the LED lamp shade and the light-transmitting cover are leaked, and directly placing the LED lamp shade and the light-transmitting cover into a drying device if the LED lamp shade and the light-transmitting cover are not leaked, so as to provide the temperature of 50-70 ℃ for rapid drying.
As a further description of the above technical solution:
and S4, taking the LED mounting substrate, detecting the surface flatness of the LED mounting substrate, if the detected flatness is qualified, continuing to use the LED mounting substrate, and if the detected flatness is unqualified, replacing a new batch of LED mounting substrates.
As a further description of the above technical solution:
and in the S5, the size of the LED mounting substrate is measured by using a measuring ruler, the mounting positions of the LED light-emitting chips are marked by using marking pens according to different components, and the distance between every two adjacent LED light-emitting chips is 5-8mm.
As a further description of the above technical solution:
and in the S6, taking the silver adhesive, carrying out substrate dispensing at different point positions according to the points marked in the S5, and controlling the thickness of the substrate dispensing to be 0.8-1.2mm.
As a further description of the above technical solution:
and S7, taking the LED light-emitting chips, respectively installing the LED light-emitting chips on the glue dispensing substrates at different point positions, placing the LED light-emitting chips in a drying device, controlling the temperature to 70-90 ℃ to rapidly dry the LED light-emitting chips, and cleaning the LED light-emitting chips by using hydrogen plasma after drying.
As a further description of the above technical solution:
and S8, installing the LED mounting substrate on the bottom plate, taking the radiating fins, embedding the radiating fins in the adaptive clamping grooves of the bottom plate in a clamping mode, uniformly coating the radiating oil on the surface of the LED mounting substrate, waiting for 10-15min, and waiting for the radiating oil to be naturally and uniformly dispersed on the LED mounting substrate.
As a further description of the above technical solution:
and S9, taking the light-transmitting cover, mounting the light-transmitting cover on the bottom plate, coating sealing resin at the joint of the light-transmitting cover and the bottom plate to ensure that the coating thickness is 1-2mm, and placing the light-transmitting cover in a drying device for drying.
In summary, due to the adoption of the technical scheme, the invention has the beneficial effects that:
according to the method, a secondary sealing technology is adopted internally, when the LED lamp is treated, the light-transmitting cover is firstly matched with the sealing resin to carry out primary sealing, and then the sealing strip is matched with the LED lamp shade to carry out secondary sealing, so that the overall sealing effect of the LED lamp can be greatly improved, the internal sealing performance of the LED lamp can be kept for a long time after the LED lamp is used for a long time, the problem of poor light color uniformity is effectively solved, meanwhile, the light-transmitting cover is adopted to stably improve the overall light transmittance of the LED lamp, the mapping effect of light spots can be changed, the use quality of the LED lamp is improved, meanwhile, the size of an LED mounting substrate and a flattening body are detected, the LED layout is planned according to the detection result, the illumination effect of the LED lamp can be effectively ensured, the problem of poor light color uniformity caused by different lamp sources is avoided, and the method is suitable for popularization.
Drawings
FIG. 1 is a flow chart of a manufacturing process for improving uniformity of light spots and light color of an LED lamp.
Detailed Description
In order to make the technical solution better understood by those skilled in the art, the technical solution in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It should be apparent that the described embodiments are only some of the embodiments of the present application, and not all of the embodiments. All other embodiments obtained by a person skilled in the art based on the embodiments in the present application without making any creative effort belong to the protection scope of the present application.
In this application, the terms "mounted," "connected," "secured," and the like are to be construed broadly unless otherwise specifically stated or limited. For example, the connection can be fixed, detachable or integrated; can be mechanically or electrically connected; they may be directly connected or indirectly connected through an intermediate member, or they may be connected through the inside of two elements, or they may be connected only through surface contact or through surface contact of an intermediate member. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as the case may be.
Furthermore, the terms "first," "second," and the like, are used solely to distinguish one from another and are not to be construed as referring to or particular structures. The description of the terms "some embodiments," "other embodiments," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiments or examples is included in at least one embodiment or example of the application. In this application, the schematic representations of the terms used above are not necessarily intended to be the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, the various embodiments or examples and features of the various embodiments or examples described in this application can be combined and combined by those skilled in the art without conflicting.
Example 1
Referring to fig. 1, the present invention provides a technical solution: a production process for improving light spot and light color uniformity of an LED lamp comprises the following steps:
s1, preparing production raw materials including an LED mounting substrate, a radiating fin, radiating oil, an LED light-emitting chip, an LED lampshade, a light-transmitting cover, silver glue, a sealing strip and sealing resin, wherein the sealing resin is epoxy resin.
The LED mounting substrate may be a common circuit board, or may be a PCT resin board, which is not limited herein.
S2, placing the LED mounting substrate on a grinding machine, controlling the rotating speed of the grinding machine to be 1200r/min, grinding and polishing the LED mounting substrate, and storing the processed LED mounting substrate.
S3, placing the LED lamp shade and the light-transmitting cover on a support, introducing water into the LED lamp shade and the light-transmitting cover, observing the states of the LED lamp shade and the light-transmitting cover, directly replacing a batch of LED lamp shades and light-transmitting covers if the LED lamp shade and the light-transmitting cover are leaked, and directly placing the LED lamp shade and the light-transmitting cover into a drying device if the LED lamp shade and the light-transmitting cover are not leaked, so as to provide 50 ℃ temperature for rapid drying;
s4, taking the LED mounting substrate, detecting the surface flatness of the LED mounting substrate, if the detected flatness is qualified, continuing to use the LED mounting substrate, and if the detected flatness is unqualified, replacing a new batch of LED mounting substrates;
s5, measuring the size of the LED mounting substrate by using a measuring ruler, marking the mounting positions of the LED light-emitting chips by using marking pens according to different components, wherein the distance between every two adjacent LED light-emitting chips is 5mm;
s6, taking silver glue, carrying out substrate glue dispensing at different point positions according to the points marked in the S5, and controlling the thickness of the substrate glue dispensing to be 0.8mm;
s7, taking the LED light-emitting chips, respectively installing the LED light-emitting chips on the dispensing substrates at different point positions, placing the LED light-emitting chips in a drying device, controlling the temperature to 70 ℃ to rapidly dry the LED light-emitting chips, and cleaning the LED light-emitting chips by using hydrogen plasma after drying;
s8, mounting the LED mounting substrate on a bottom plate, taking a radiating fin, embedding the radiating fin in an adaptive clamping groove of the bottom plate in a clamping manner, uniformly coating radiating oil on the surface of the LED mounting substrate, waiting for 10min, and naturally and uniformly dispersing the radiating oil on the LED mounting substrate;
s9, taking the light-transmitting cover, installing the light-transmitting cover on the bottom plate, coating sealing resin at the joint of the light-transmitting cover and the bottom plate, ensuring the coating thickness to be 1mm, and placing the light-transmitting cover in a drying device for drying;
s10, after drying, taking the LED lampshade, carrying out final packaging, and adhering a sealing strip to the joint of the LED lampshade and the bottom plate by using a strong adhesive after packaging;
and S11, conducting a power-on test, packaging and warehousing.
In the embodiment, by adopting a secondary sealing technology, when the LED lamp is processed, the light-transmitting cover is firstly adopted to be matched with the sealing resin for primary sealing, and then the sealing strip is matched with the LED lamp shade for secondary sealing, so that the overall sealing effect of the LED lamp can be greatly improved, the internal sealing performance of the LED lamp can be maintained for a long time after the LED lamp is used for a long time, the problem of poor light color uniformity is effectively solved, meanwhile, the overall light transmittance of the LED lamp is stably improved by adopting the light-transmitting cover, the light spot mapping effect is changed, the use quality of the LED lamp is improved, meanwhile, the size and the flatness of the LED mounting substrate are detected, the LED layout with planning performance is performed according to the detection result, the illumination effect of the LED lamp can be effectively ensured, the problem of poor light color uniformity caused by different lamp source heights is avoided, and the LED lamp is suitable for popularization.
Example 2
Referring to fig. 1, the present invention provides a technical solution: a production process for improving light spot and light color uniformity of an LED lamp comprises the following steps:
s1, preparing production raw materials, including an LED mounting substrate, a radiating fin, radiating oil, an LED light-emitting chip, an LED lampshade, a light-transmitting cover, silver colloid, a sealing strip and sealing resin, wherein the sealing resin is epoxy resin;
s2, placing the LED mounting substrate on a grinding machine, controlling the rotating speed of the grinding machine to 1400r/min, grinding and polishing the LED mounting substrate, and storing the processed LED mounting substrate;
s3, placing the LED lamp shade and the light-transmitting cover on a support, introducing water into the LED lamp shade and the light-transmitting cover, observing the states of the LED lamp shade and the light-transmitting cover, directly replacing a batch of LED lamp shades and light-transmitting covers if the LED lamp shade and the light-transmitting cover are leaked, and directly placing the LED lamp shade and the light-transmitting cover into a drying device if the LED lamp shade and the light-transmitting cover are not leaked, so as to provide a temperature of 60 ℃ for rapid drying;
s4, taking the LED mounting substrate, detecting the surface flatness of the LED mounting substrate, if the detected flatness is qualified, continuing to use the LED mounting substrate, and if the detected flatness is unqualified, replacing a new batch of LED mounting substrates;
s5, measuring the size of the LED mounting substrate by using a measuring ruler, marking the mounting positions of the LED light-emitting chips by using marking pens according to different components, wherein the distance between every two adjacent LED light-emitting chips is 6mm;
s6, taking silver glue, carrying out substrate glue dispensing at different point positions according to the points marked in the S5, and controlling the thickness of the substrate glue dispensing to be 1.1mm;
s7, taking the LED light-emitting chips, respectively installing the LED light-emitting chips on the dispensing substrates at different point positions, placing the LED light-emitting chips in a drying device, controlling the temperature to 80 ℃ to rapidly dry the LED light-emitting chips, and cleaning the LED light-emitting chips by using hydrogen plasma after drying;
s8, mounting the LED mounting substrate on a bottom plate, taking a radiating fin, embedding the radiating fin in an adaptive clamping groove of the bottom plate in a clamping manner, uniformly coating radiating oil on the surface of the LED mounting substrate, waiting for 13min, and waiting for the radiating oil to be naturally and uniformly dispersed on the LED mounting substrate;
s9, taking the light-transmitting cover, installing the light-transmitting cover on the bottom plate, coating sealing resin at the joint of the light-transmitting cover and the bottom plate to ensure that the coating thickness is 2mm, and placing the light-transmitting cover in a drying device for drying;
s10, after drying, taking the LED lampshade, carrying out final packaging, and adhering a sealing strip to the joint of the LED lampshade and the bottom plate by using a strong adhesive after packaging;
and S11, conducting a power-on test, packaging and warehousing.
In the embodiment, by adopting a secondary sealing technology, when the LED lamp is processed, the light-transmitting cover is firstly adopted to be matched with the sealing resin for primary sealing, and then the sealing strip is matched with the LED lamp shade for secondary sealing, so that the overall sealing effect of the LED lamp can be greatly improved, the internal sealing performance of the LED lamp can be maintained for a long time after the LED lamp is used for a long time, the problem of poor light color uniformity is effectively solved, meanwhile, the overall light transmittance of the LED lamp is stably improved by adopting the light-transmitting cover, the light spot mapping effect is changed, the use quality of the LED lamp is improved, meanwhile, the size and the flatness of the LED mounting substrate are detected, the LED layout with planning performance is performed according to the detection result, the illumination effect of the LED lamp can be effectively ensured, the problem of poor light color uniformity caused by different lamp source heights is avoided, and the LED lamp is suitable for popularization.
Example 3
Referring to fig. 1, the present invention provides a technical solution: a production process for improving light spot and light color uniformity of an LED lamp comprises the following steps:
s1, preparing production raw materials, including an LED mounting substrate, a radiating fin, radiating oil, an LED light-emitting chip, an LED lampshade, a light-transmitting cover, silver colloid, a sealing strip and sealing resin, wherein the sealing resin is epoxy resin;
s2, placing the LED mounting substrate on a grinding machine, controlling the rotating speed of the grinding machine to be 1600r/min, grinding and polishing the LED mounting substrate, and storing the processed LED mounting substrate;
s3, placing the LED lamp shade and the light-transmitting cover on a support, introducing water into the LED lamp shade and the light-transmitting cover, observing the states of the LED lamp shade and the light-transmitting cover, directly replacing a batch of LED lamp shades and light-transmitting covers if water leakage of the LED lamp shade and the light-transmitting cover is found, and directly placing the LED lamp shade and the light-transmitting cover into a drying device to provide a temperature of 70 ℃ for rapid drying if water leakage of the LED lamp shade and the light-transmitting cover is found;
s4, taking the LED mounting substrate, detecting the surface flatness of the LED mounting substrate, if the detected flatness is qualified, continuing to use the LED mounting substrate, and if the detected flatness is unqualified, replacing a new batch of LED mounting substrates;
s5, measuring the size of the LED mounting substrate by using a measuring ruler, marking the mounting positions of the LED light-emitting chips by using marking pens according to different components, wherein the distance between every two adjacent LED light-emitting chips is 8mm;
s6, taking silver glue, carrying out substrate glue dispensing at different point positions according to the points marked in the S5, and controlling the thickness of the substrate glue dispensing to be 1.2mm;
s7, taking the LED light-emitting chips, respectively installing the LED light-emitting chips on the dispensing substrates at different point positions, placing the LED light-emitting chips in a drying device, controlling the temperature to 90 ℃ to rapidly dry the LED light-emitting chips, and cleaning the LED light-emitting chips by using hydrogen plasma after drying;
s8, mounting the LED mounting substrate on a bottom plate, taking a radiating fin, embedding the radiating fin in an adaptive clamping groove of the bottom plate in a clamping manner, uniformly coating radiating oil on the surface of the LED mounting substrate, waiting for 15min, and waiting for the radiating oil to be naturally and uniformly dispersed on the LED mounting substrate;
s9, taking the light-transmitting cover, installing the light-transmitting cover on the bottom plate, coating sealing resin at the joint of the light-transmitting cover and the bottom plate, ensuring the coating thickness to be 2mm, and placing the light-transmitting cover in a drying device for drying;
s10, after drying, taking the LED lampshade, carrying out final packaging, and adhering a sealing strip to the joint of the LED lampshade and the bottom plate by using super glue after packaging;
and S11, electrifying, testing, packaging and warehousing.
In the embodiment, through including adopting the second grade sealing technique, when handling the LED lamp, adopt printing opacity cover cooperation sealing resin to carry out the primary seal earlier, adopt sealing strip and LED lamp shade cooperation to carry out the second grade to seal again, can promote the integral seal effect of this LED lamp greatly, make the LED lamp also can keep the internal seal nature for a long time after the live time is of a specified duration, thereby effectively solve the problem that photochromic homogeneity becomes poor, adopt the printing opacity cover to stably promote the whole light transmissivity of LED lamp simultaneously, thereby can change the mapping effect of facula, promote the LED lamp and use the quality, detect LED installation substrate size and flattening body simultaneously, carry out the LED overall arrangement of planning nature according to the testing result, can effectively guarantee the illuminating effect of LED lamp, avoid the photochromic homogeneity poor problem that produces because the lamp source height is different simultaneously, and is suitable for popularization.
Example 4
Referring to fig. 1, the present invention provides a technical solution: a production process for improving light spot and light color uniformity of an LED lamp comprises the following steps:
s1, preparing production raw materials including an LED mounting substrate, a radiating fin, radiating oil, an LED light-emitting chip, an LED lampshade, a light-transmitting cover, silver glue, a sealing strip and sealing resin, wherein the sealing resin is epoxy resin;
s2, placing the LED mounting substrate on a grinding machine, controlling the rotating speed of the grinding machine to be 1500r/min, grinding and polishing the LED mounting substrate, and storing the processed LED mounting substrate;
s3, placing the LED lamp shade and the light-transmitting cover on a support, introducing water into the LED lamp shade and the light-transmitting cover, observing the states of the LED lamp shade and the light-transmitting cover, directly replacing a batch of LED lamp shades and light-transmitting covers if water leakage of the LED lamp shade and the light-transmitting cover is found, and directly placing the LED lamp shade and the light-transmitting cover into a drying device to provide a temperature of 70 ℃ for rapid drying if water leakage of the LED lamp shade and the light-transmitting cover is found;
s4, taking the LED mounting substrate, detecting the surface flatness of the LED mounting substrate, if the detected flatness is qualified, continuing to use the LED mounting substrate, and if the detected flatness is unqualified, replacing a new batch of LED mounting substrates;
s5, measuring the size of the LED mounting substrate by using a measuring ruler, marking the mounting positions of the LED light-emitting chips by using marking pens according to different components, wherein the distance between every two adjacent LED light-emitting chips is 8mm;
s6, taking silver glue, carrying out substrate glue dispensing at different point positions according to the points marked in the S5, and controlling the thickness of the substrate glue dispensing to be 0.5mm;
s7, taking the LED light-emitting chips, respectively installing the LED light-emitting chips on the glue dispensing substrates at different point positions, placing the LED light-emitting chips in a drying device, controlling the temperature to 70 ℃ to rapidly dry the LED light-emitting chips, and cleaning the LED light-emitting chips by using hydrogen plasma after drying;
s8, mounting the LED mounting substrate on a bottom plate, taking a radiating fin, embedding the radiating fin in an adaptive clamping groove of the bottom plate in a clamping manner, uniformly coating radiating oil on the surface of the LED mounting substrate, waiting for 15min, and waiting for the radiating oil to be naturally and uniformly dispersed on the LED mounting substrate;
s9, taking the light-transmitting cover, installing the light-transmitting cover on the bottom plate, coating sealing resin at the joint of the light-transmitting cover and the bottom plate, ensuring the coating thickness to be 2mm, and placing the light-transmitting cover in a drying device for drying;
s10, after drying, taking the LED lampshade, carrying out final packaging, and adhering a sealing strip to the joint of the LED lampshade and the bottom plate by using super glue after packaging;
and S11, conducting a power-on test, packaging and warehousing.
In the embodiment, by adopting a secondary sealing technology, when the LED lamp is processed, the light-transmitting cover is firstly adopted to be matched with the sealing resin for primary sealing, and then the sealing strip is matched with the LED lamp shade for secondary sealing, so that the overall sealing effect of the LED lamp can be greatly improved, the internal sealing performance of the LED lamp can be maintained for a long time after the LED lamp is used for a long time, the problem of poor light color uniformity is effectively solved, meanwhile, the overall light transmittance of the LED lamp is stably improved by adopting the light-transmitting cover, the light spot mapping effect is changed, the use quality of the LED lamp is improved, meanwhile, the size and the flatness of the LED mounting substrate are detected, the LED layout with planning performance is performed according to the detection result, the illumination effect of the LED lamp can be effectively ensured, the problem of poor light color uniformity caused by different lamp source heights is avoided, and the LED lamp is suitable for popularization.
Example 5
Referring to fig. 1, the present invention provides a technical solution: a production process for improving light spot and light color uniformity of an LED lamp comprises the following steps:
s1, preparing production raw materials, including an LED mounting substrate, a radiating fin, radiating oil, an LED light-emitting chip, an LED lampshade, a light-transmitting cover, silver colloid, a sealing strip and sealing resin, wherein the sealing resin is epoxy resin;
s2, placing the LED mounting substrate on a grinding machine, controlling the rotating speed of the grinding machine to be 1800r/min, grinding and polishing the LED mounting substrate, and storing the processed LED mounting substrate;
s3, placing the LED lamp shade and the light-transmitting cover on a support, introducing water into the LED lamp shade and the light-transmitting cover, observing the states of the LED lamp shade and the light-transmitting cover, directly replacing a batch of LED lamp shades and light-transmitting covers if water leakage of the LED lamp shade and the light-transmitting cover is found, and directly placing the LED lamp shade and the light-transmitting cover into a drying device to provide a temperature of 70 ℃ for rapid drying if water leakage of the LED lamp shade and the light-transmitting cover is found;
s4, taking the LED mounting substrate, detecting the surface flatness of the LED mounting substrate, if the detected flatness is qualified, continuing to use, and if the detected flatness is unqualified, replacing a new batch of LED mounting substrates;
s5, measuring the size of the LED mounting substrate by using a measuring ruler, marking the mounting positions of the LED light-emitting chips by using marking pens according to different components, wherein the distance between every two adjacent LED light-emitting chips is 8mm;
s6, taking silver glue, carrying out substrate glue dispensing at different point positions according to the points marked in the S5, and controlling the thickness of the substrate glue dispensing to be 0.5mm;
s7, taking the LED light-emitting chips, respectively installing the LED light-emitting chips on the dispensing substrates at different point positions, placing the LED light-emitting chips in a drying device, controlling the temperature to 85 ℃ to rapidly dry the LED light-emitting chips, and cleaning the LED light-emitting chips by using hydrogen plasma after drying;
s8, mounting the LED mounting substrate on a bottom plate, taking a radiating fin, embedding the radiating fin in an adaptive clamping groove of the bottom plate in a clamping manner, uniformly coating radiating oil on the surface of the LED mounting substrate, waiting for 15min, and waiting for the radiating oil to be naturally and uniformly dispersed on the LED mounting substrate;
s9, taking the light-transmitting cover, installing the light-transmitting cover on the bottom plate, coating sealing resin at the joint of the light-transmitting cover and the bottom plate, ensuring the coating thickness to be 2mm, and placing the light-transmitting cover in a drying device for drying;
s10, after drying, taking the LED lampshade, carrying out final packaging, and adhering a sealing strip to the joint of the LED lampshade and the bottom plate by using super glue after packaging;
and S11, conducting a power-on test, packaging and warehousing.
In the embodiment, by adopting a secondary sealing technology, when the LED lamp is processed, the light-transmitting cover is firstly adopted to be matched with the sealing resin for primary sealing, and then the sealing strip is matched with the LED lamp shade for secondary sealing, so that the overall sealing effect of the LED lamp can be greatly improved, the internal sealing performance of the LED lamp can be maintained for a long time after the LED lamp is used for a long time, the problem of poor light color uniformity is effectively solved, meanwhile, the overall light transmittance of the LED lamp is stably improved by adopting the light-transmitting cover, the light spot mapping effect is changed, the use quality of the LED lamp is improved, meanwhile, the size and the flatness of the LED mounting substrate are detected, the LED layout with planning performance is performed according to the detection result, the illumination effect of the LED lamp can be effectively ensured, the problem of poor light color uniformity caused by different lamp source heights is avoided, and the LED lamp is suitable for popularization.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.
Claims (10)
1. A production process for improving uniformity of light spots and light colors of an LED lamp is characterized by comprising the following steps: the method comprises the following steps:
s1, preparing production raw materials including a bottom plate, an LED mounting substrate, a radiating fin, radiating oil, an LED light-emitting chip, an LED lampshade, a light-transmitting cover, silver glue, a sealing strip and sealing resin;
s2, placing the LED mounting substrate on a grinding machine, controlling the rotating speed of the grinding machine to grind and polish the LED mounting substrate, and storing the processed LED mounting substrate;
s3, taking the LED lampshade and the light-transmitting cover, placing the LED lampshade and the light-transmitting cover on the bracket, introducing water into the LED lampshade and the light-transmitting cover, and observing the states of the LED lampshade and the light-transmitting cover;
s4, taking the LED mounting substrate, and detecting the surface flatness of the LED mounting substrate;
s5, measuring the size of the LED mounting substrate by using a measuring ruler, and marking the mounting position of the LED light-emitting chip by using a marking pen according to different components;
s6, taking silver adhesive, and carrying out substrate adhesive dispensing at different point positions according to the points marked in the S5;
s7, taking the LED light-emitting chips, respectively installing the LED light-emitting chips on the adhesive dispensing substrates at different point positions, placing the LED light-emitting chips in a drying device, quickly drying the LED light-emitting chips, and cleaning the LED light-emitting chips after the LED light-emitting chips are dried;
s8, mounting the LED mounting substrate on a bottom plate, taking a radiating fin, embedding the radiating fin in an adaptive clamping groove of the bottom plate in a clamping mode, and uniformly smearing radiating oil on the surface of the LED mounting substrate;
s9, taking the light-transmitting cover, installing the light-transmitting cover on the bottom plate, coating sealing resin at the joint of the light-transmitting cover and the bottom plate to ensure the coating thickness, and placing the light-transmitting cover in a drying device for drying;
s10, after drying, taking the LED lampshade, carrying out final packaging, and adhering a sealing strip to the joint of the LED lampshade and the bottom plate by using super glue after packaging;
and S11, electrifying, testing, packaging and warehousing.
2. The production process of claim 1, wherein in S1, raw production materials are prepared, the raw production materials include an LED mounting substrate, a heat sink, heat dissipation oil, an LED light emitting chip, an LED lampshade, a translucent cover, silver paste, a sealing strip, and a sealing resin, and the sealing resin is epoxy resin.
3. The production process for improving the uniformity of light spots and light colors of the LED lamp according to claim 1, wherein in S2, the LED mounting substrate is taken and placed on a grinding machine, the grinding machine is controlled to rotate at 1200-1600r/min to carry out grinding and polishing treatment on the LED mounting substrate, and the LED mounting substrate is stored after the treatment.
4. The production process for improving the uniformity of the light spots and the light colors of the LED lamp according to claim 1, wherein in the step S3, the LED lampshade and the translucent cover are taken and placed on the support, water is introduced into the LED lampshade and the translucent cover, the states of the LED lampshade and the translucent cover are observed, if the LED lampshade and the translucent cover leak water, a new batch of the LED lampshade and the translucent cover are directly replaced, and if the LED lampshade and the translucent cover do not leak water, the LED lampshade and the translucent cover are directly placed into the drying device, and the temperature of 50-70 ℃ is provided for rapid drying.
5. The production process according to claim 1, wherein in S4, the LED mounting substrate is taken, the surface flatness of the LED mounting substrate is detected, if the detected flatness is qualified, the LED mounting substrate is continuously used, and if the detected flatness is not qualified, a new batch of LED mounting substrates is replaced.
6. The production process of claim 1, wherein in S5, the dimension of the LED mounting substrate is measured by using a measuring ruler, and the mounting positions of the LED light-emitting chips are marked by scribing with marking pens according to different compositions, wherein the distance between adjacent LED light-emitting chips is 5-8mm.
7. The production process for improving the uniformity of light spots and light colors of the LED lamp according to claim 1, wherein in S6, silver paste is taken, the substrate is dispensed at different points according to the points marked in S5, and the thickness of the substrate is controlled to be 0.8-1.2mm.
8. The production process for improving the light spot and the light color uniformity of the LED lamp according to claim 1, wherein in the step S7, the LED light-emitting chips are taken and respectively installed on the dispensing substrates at different point positions, the dispensing substrates are placed in a drying device, the temperature is controlled to 70-90 ℃ for rapid drying, and after drying, hydrogen plasma is used for cleaning the LED light-emitting chips.
9. The production process for improving the uniformity of light spots and light colors of an LED lamp according to claim 1, wherein in S8, the LED mounting substrate is mounted on the bottom plate, the heat sink is taken, the heat sink is clamped and embedded in the adaptive clamping groove of the bottom plate, the heat sink oil is taken and uniformly smeared on the surface of the LED mounting substrate, and the process waits for 10-15min until the heat sink oil is naturally and uniformly dispersed on the LED mounting substrate.
10. The production process for improving the uniformity of light spots and light colors of the LED lamp according to claim 1, wherein in the step S9, the light-transmitting cover is taken and installed on the bottom plate, the joint of the light-transmitting cover and the bottom plate is coated with the sealing resin to ensure that the coating thickness is 1-2mm, and the coating is placed in the drying device for drying.
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