CN202259427U - Novel high-power LED (light emitting diode) encapsulating structure - Google Patents
Novel high-power LED (light emitting diode) encapsulating structure Download PDFInfo
- Publication number
- CN202259427U CN202259427U CN2011203833767U CN201120383376U CN202259427U CN 202259427 U CN202259427 U CN 202259427U CN 2011203833767 U CN2011203833767 U CN 2011203833767U CN 201120383376 U CN201120383376 U CN 201120383376U CN 202259427 U CN202259427 U CN 202259427U
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- China
- Prior art keywords
- light
- encapsulating structure
- wall
- led chip
- annular body
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/8592—Applying permanent coating, e.g. protective coating
Abstract
The utility model discloses a novel high-power LED (light emitting diode) encapsulating structure which comprises a base plate, an LED chip fixed on the base plate, and a ring-shaped wall body arranged at the periphery of the LED chip in a circling manner, wherein a light-transmitting piece is mounted at the top of the ring-shaped wall body, the light-transmitting piece is covered with a fluorescent powder thin film, the fluorescent powder thin film is covered with a light-transmitting guard plate, a fixing lid is arranged on the ring-shaped wall body in a sleeved manner so as to clamp the light-transmitting piece, the fluorescent powder thin film and the light-transmitting guard plate, a light outlet is formed at the top of the fixing lid, and the region of the light-transmitting guard plate, which corresponds to the light-transmitting guard plate inside the ring-shaped wall body, is exposed out of the light outlet. In the novel high-power LED encapsulating structure, the fluorescent powder thin film is adopted for replacing a traditional dispensing way so as to ensure that fluorescent powder can be far away from the LED chip, direction contact between the fluorescent powder and the LED chip is avoided, and light decay can be reduced; besides, compared with the traditional dispensing structure, the novel high-power LED encapsulating structure has the advantages that the thickness of the fluorescent powder thin film is even, the thickness and the dimension can be controlled accurately, the consistency is excellent, the launching efficiency is high, and light spots can be obviously improved.
Description
[technical field]
The utility model relates to a kind of LED structure, refers in particular to a kind of novel large-power LED encapsulating structure.
[background technology]
White light emitting diode (Lighting Emitting Diode) has the efficient height, and the life-span is long, and reliability is high, environmental protection and energy saving, and plurality of advantages such as applying flexible are the lighting source in the 4th generation by generally approving, have vast potential for future development.The acquisition of white light LEDs at present mainly contains three kinds of approach, and a kind of is on blue chip, to cover yttrium-aluminium-garnet (YAG:Ce3+) fluorescent material, and the blue light that utilizes blue chip to send is not absorbed part and receives the green-yellow light of blue-light excited ejaculation to mix the formation white light with fluorescent material; A kind of is to excite RGB three primary colors fluorescent powder colour mixture to form white light with the ultraviolet LED chip; Also having a kind of is that led chip with RGB sends RGB three primary colors light respectively, again through spacing color mixed formation white light.Comparatively ripe at present, business-like method is above-mentioned first kind of approach, and promptly blue-ray LED+(YAG:Ce3+) fluorescent material obtains white light.
In the preparation technology of large power white light LED, the coating of fluorescent material at present is still some powder mode mainly, after fluorescent material and used silica gel are mixed by a certain percentage, utilizes air pressure control mode point to be coated in around the led chip top reaches.Because there are difference of specific gravity in fluorescent material and used silica gel, this some powder mode can cause fluorescent material above led chip, to reach skewness all around, and led chip top fluorescent material sedimentary facies is to more; And less relatively all around, add that the difference of air pressure control also can cause the inconsistent of whole glue amount, will cause in the batch process like this; The colour temperature of white light LEDs is inconsistent; Discreteness is big, even occurs as hot spot defectives such as yellow circle or blue circle, influences the performance and the illuminating effect of white light LEDs.
As shown in Figure 5; Existing structural manufacturing process is a fixed L ED chip 101 on the microscope carrier 104 in pedestal 105, then fluorescent material 102 is directly evenly covered on the led chip 101, and in the outermost of led chip 101 lens 103 is set; When led chip 101 work; Will produce heat, the fluorescent material 102 that covers on the led chip 101 then can be because of the charing of turning black of being heated, and 102 in the fluorescent material after the charing directly remains on the led chip; Thereby reduced the luminous efficiency of led chip, caused the lifetime of whole element function.
[utility model content]
To LED encapsulating structure in the prior art exist bright dipping inhomogeneous, yellow circle is arranged, technological deficiency such as luminous efficiency is low, light decay is big, useful life is short, the purpose of the utility model be to provide a kind of go out light effect evenly, the LED encapsulating structure of little, the long service life of Wu Huangquan, light extraction efficiency height, light decay.
In order to reach above-mentioned technical purpose; The technical scheme that the utility model is taked is a kind of novel large-power LED encapsulating structure; The led chip and the ring that comprise substrate, be fixed on the substrate are located at led chip annular body of wall on every side, and the top of said annular body of wall is equipped with light transmission piece, is coated with fluorescent powder film on the said light transmission piece; Cover the printing opacity baffle on the said fluorescent powder film; One fixed cap is nested with on annular body of wall light transmission piece, fluorescent powder film and printing opacity baffle is clamped, and the top of said fixed cap is provided with light-emitting window, and the inner printing opacity baffle zone of the corresponding annular body of wall of said printing opacity baffle exposes to said light-emitting window.
The utility model adopts fluorescent powder film to replace traditional phosphor dot glue mode, makes fluorescent material away from led chip, has avoided fluorescent material directly to contact led chip, has reduced light decay, has prolonged the useful life of LED lamp; Simultaneously with respect to traditional some plastic structure; The thickness of the utility model employing fluorescent powder film is even and can accurately control its gauge; The efficient that is stimulated is high, and photochromic uniformity high conformity can avoid occurring the perhaps phenomenon of blue circle of yellow circle fully; Make the whole hot spot uniformity obtain remarkable improvement, and improved light extraction efficiency.
Preferably, the arranged outside of said annular body of wall has external screw thread, and the inboard of said fixed cap is provided with the internal thread that is complementary with said external screw thread, and said fixed cap is fixed on the annular body of wall through being threaded.
Preferably, said annular body of wall is embedded on the substrate.
Preferably, the bottom of said annular body of wall is provided with a plurality of location-plates, and corresponding a plurality of location-plates are provided with the holddown groove that a plurality of and said location-plate is complementary on the said substrate, and said location-plate is embedded in the holddown groove annular body of wall is fixed on the substrate.
Preferably, be provided with the sealing and fixing colloid in the said holddown groove, said location-plate is embedded in the holddown groove fastening through the sealing of sealing and fixing colloid.
Preferably, the substrate surface in the said annular body of wall and the inner surface of annular body of wall are provided with reflector layer.
Preferably, said reflector layer is reflective sheeting or reflecting coating.
Preferably, said led chip is many group led chip groups, and the adjacent mutual dislocation of respectively organizing between the led chip group is arranged.
Preferably, the surface of said printing opacity baffle is a rough surface.
Preferably, said led chip is a blue-light LED chip, and said fluorescent powder film is the yellow fluorescent powder film.
[description of drawings]
Shown in Figure 1 is the structural representation of the utility model substrate;
Shown in Figure 2 is the structural representation of the utility model annular body of wall;
Shown in Figure 3 is the utility model STRUCTURE DECOMPOSITION sketch map;
Shown in Figure 4 is the internal structure sketch map of the utility model;
Fig. 5 is the prior art constructions sketch map.
[embodiment]
Technical scheme for further detailed elaboration the utility model is elaborated below in conjunction with accompanying drawing.
Like Fig. 1, Fig. 2, Fig. 3, shown in Figure 4; The utility model discloses a kind of novel large-power LED encapsulating structure; It is characterized in that: the led chip 11 and the ring that comprise substrate 1, are fixed on the substrate 1 are located at led chip 11 annular body of wall 2 on every side; The top of said annular body of wall 2 is equipped with light transmission piece 30; Be coated with fluorescent powder film 3 on the said light transmission piece 30, cover a printing opacity baffle 4, one fixed caps on the said fluorescent powder film 3 and be nested with 5 and on annular body of wall 2, light transmission piece 30, fluorescent powder film 3 and printing opacity baffle 4 clamped; The top of said fixed cap 5 is provided with light-emitting window 51, and said printing opacity baffle 4 corresponding annular bodies of wall 2 inner printing opacity baffle zones expose to said light-emitting window 51.
The utility model adopts fluorescent powder film to replace traditional phosphor dot glue mode, makes fluorescent material away from led chip, has avoided fluorescent material directly to contact led chip, has reduced light decay, has prolonged the useful life of LED lamp; While is with respect to the structure of the heap shape fluorescent coating of conventional point glue formation; The thickness of the utility model employing fluorescent powder film is even and can accurately control its gauge; The efficient that is stimulated is high, and photochromic uniformity high conformity can avoid occurring the perhaps phenomenon of blue circle of yellow circle fully; Make the whole hot spot uniformity obtain remarkable improvement, and improved light extraction efficiency.
The arranged outside of the said annular body of wall 2 of the utility model has external screw thread 25, and the inboard of said fixed cap 5 is provided with the internal thread 51 that is complementary with said external screw thread 25, and said fixed cap 5 is fixed on through being threaded on the annular body of wall 2.In practical application, if find photochromic inconsistent phenomenon, also can fixed cap 5 reverse rotations be unloaded, change fluorescent powder film 3 again; As the phenomenon of dead lamp or stroboscopic appears, can fixed cap 5 be unloaded inspection line fault or change led chip 11 equally.
Certainly in order further to make it more firm, the later stage can be played the glue of a circle sealing at the bottom margin of fixed cap 5, to reach good sealing effectiveness.
The annular body of wall 2 of the utility model is embedded on the substrate 1; The mode of inlaying can adopt following structure; Can be provided with 4 location- plates 21,22,23,24 in the bottom of annular body of wall 2; Corresponding 4 location-plates are provided with holddown groove 12a, 12b, 12c, the 12d that a plurality of and said location- plate 21,22,23,24 is complementary on the said substrate 1, and said location- plate 21,22,23,24 is embedded in holddown groove 12a, 12b, 12c, the 12d annular body of wall 2 is fixed on the substrate.In order to make annular body of wall 2 more firm; Can preset part sealing and fixing colloid (not shown) in said holddown groove 12a, 12b, 12c, the 12d, said location- plate 21,22,23,24 is embedded in holddown groove 12a, 12b, 12c, the 12d fastening through the sealing of sealing and fixing colloid.
In order to make light farthest obtain utilizing, the substrate surface of the utility model in annular body of wall 2 is provided with reflector layer 6, is provided with reflector layer 7 at the inner surface of annular body of wall 2.This reflector layer 6 and reflector layer 7 are reflective sheeting or reflecting coating.
The said led chip 11 of the utility model is many group led chip groups; As shown in Figure 1; The utility model led chip 11 is four groups of led chip group 11a, 11b, 11c, 11d; The adjacent mutual dislocation of respectively organizing between the led chip group is arranged, and the mode that described dislocation is arranged is meant between the led chip of adjacent led chip group that the gap of corresponding its vertical distribution is provided with separately, and such mode can let the distance maximization between the led chip; The heat of led chip let the thermal source of led chip in limited space, scatter as much as possible, so that can make full use of substrate 1 quick heat radiating.The substrate 1 of the utility model is provided with anodal wire welding area 13a and negative pole wire welding area 13b, and is provided with fixing hole 14a, 14b in the position at diagonal angle.
In order to reduce total reflection, the surface of the printing opacity baffle 4 of the utility model is set to rough surface, to improve the light extraction efficiency.
The led chip 11 of the utility model can be a blue-light LED chip, and said fluorescent powder film 3 is the yellow fluorescent powder film, and this moment, blue chip excited the yellow fluorescent powder film can send white light.
The above only with convenient explanation the utility model, in not breaking away from the creation spirit category of the utility model, knows this technological any simple modification and distortion that personnel did, still belongs to the protection range of the utility model.
Claims (10)
1. novel large-power LED encapsulating structure; It is characterized in that: the led chip and the ring that comprise substrate, are fixed on the substrate are located at led chip annular body of wall on every side; The top of said annular body of wall is equipped with light transmission piece; Be coated with fluorescent powder film on the said light transmission piece, cover the printing opacity baffle on the said fluorescent powder film, a fixed cap is nested with on annular body of wall light transmission piece, fluorescent powder film and printing opacity baffle is clamped; The top of said fixed cap is provided with light-emitting window, and the inner printing opacity baffle zone of the corresponding annular body of wall of said printing opacity baffle exposes to said light-emitting window.
2. a kind of novel large-power LED encapsulating structure according to claim 1; It is characterized in that: the arranged outside of said annular body of wall has external screw thread; The inboard of said fixed cap is provided with the internal thread that is complementary with said external screw thread, and said fixed cap is fixed on the annular body of wall through being threaded.
3. a kind of novel large-power LED encapsulating structure according to claim 2 is characterized in that: said annular body of wall is embedded on the substrate.
4. a kind of novel large-power LED encapsulating structure according to claim 3; It is characterized in that: the bottom of said annular body of wall is provided with a plurality of location-plates; Corresponding a plurality of location-plates are provided with the holddown groove that a plurality of and said location-plate is complementary on the said substrate, and said location-plate is embedded in the holddown groove annular body of wall is fixed on the substrate.
5. a kind of novel large-power LED encapsulating structure according to claim 4 is characterized in that: be provided with the sealing and fixing colloid in the said holddown groove, said location-plate is embedded in the holddown groove fastening through the sealing of sealing and fixing colloid.
6. according to each described a kind of novel large-power LED encapsulating structure of claim 1 to 5, it is characterized in that: the substrate surface in the said annular body of wall and the inner surface of annular body of wall are provided with reflector layer.
7. a kind of novel large-power LED encapsulating structure according to claim 6 is characterized in that: said reflector layer is reflective sheeting or reflecting coating.
8. a kind of novel large-power LED encapsulating structure according to claim 7 is characterized in that: said led chip is many group led chip groups, and the adjacent mutual dislocation of respectively organizing between the led chip group is arranged.
9. a kind of novel large-power LED encapsulating structure according to claim 8 is characterized in that: the surface of said printing opacity baffle is a rough surface.
10. a kind of novel large-power LED encapsulating structure according to claim 9 is characterized in that: said led chip is a blue-light LED chip, and said fluorescent powder film is the yellow fluorescent powder film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011203833767U CN202259427U (en) | 2011-09-30 | 2011-09-30 | Novel high-power LED (light emitting diode) encapsulating structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011203833767U CN202259427U (en) | 2011-09-30 | 2011-09-30 | Novel high-power LED (light emitting diode) encapsulating structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202259427U true CN202259427U (en) | 2012-05-30 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011203833767U Expired - Fee Related CN202259427U (en) | 2011-09-30 | 2011-09-30 | Novel high-power LED (light emitting diode) encapsulating structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202259427U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102324426A (en) * | 2011-09-30 | 2012-01-18 | 深圳市灏天光电有限公司 | Novel high-power light-emitting diode (LED) package structure |
-
2011
- 2011-09-30 CN CN2011203833767U patent/CN202259427U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102324426A (en) * | 2011-09-30 | 2012-01-18 | 深圳市灏天光电有限公司 | Novel high-power light-emitting diode (LED) package structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120530 Termination date: 20160930 |